1954785-1 - Tyco Electronics

Application Specification

Surface Mount Technology

(SMT) and Through- Hole 114--13194

LOC B

1of 12

E2010 Tyco Electronics Corporation, Berwyn, PA

TE logo and Tyco Electronics are trademarks.

*Trademark. Other product names, logos, or company names might be trademarks of their respective owners.

TOOLING ASSISTANCE CENTER 1--800--722--1111

PRODUCT INFORMATION 1--800--522--6752

This controlled document is subject to change.

For latest revision and Regional Customer Service,

visit our website at www.tycoelectronics.com

Poke- In Connectors 03 MAR 10 Rev E

All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless

otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and

illustrations are for identification only and are not drawn to scale.

1. INTRODUCTION

This specification covers the requirements for application of SMT and Through--Hole Poke--In Connectors for

use on printed circuit (pc) board based LED strip lighting typically used for sign lighting. The connector

accommodates 18, 20, or 22 AWG solid copper wires; or 18 and 20 AWG prebond copper wires; or 18 AWG

stranded copper wires.

The low profile housing with flat top surface allows for vacuum pick--and--place application. The connector is

packaged in tape and reel packaging per EIA--481.

When corresponding with Tyco Electronics Personnel, use the terminology provided in this specification to

facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.

Figure 1

SMT Poke--In Connector

SMT Contact Tine

Poke--In Hole

for Wire

Through--Hole Poke--In Connector

Through--Hole

Contact Tine

Strip Length

Indicator

NOTE

Two--Position shown, One--position also available.

2. REFERENCE MATERIAL

2.1. Revision Summary

SUpdated document to corporate requirements

SChanged information in Paragraph 3.13

2.2. Customer Assistance

Reference product base part numbers 2008563 (One--Position SMT),1954097 (Two--Position SMT), 2008859

(One--Position Through--Hole), 2008106 (Two--Position Through--Hole), 1954785 (Sealed Two--Position SMT),

and product code L012 are representative of the SMT and Through--Hole Poke--In Connectors. Use of these

numbers will identify the product line and expedite your inquiries through a service network established to help

you obtain product and tooling information. Such information can be obtained through a local Tyco Electronics

Representative or, after purchase, by calling Product Information at the number at the bottom of this page.

2.3. Drawings

Customer drawings for product part numbers are available from the service network. If there is a conflict

between the information contained in the customer drawings and this specification or with any other technical

documentation supplied, call the Product Information number at the bottom of this page.

2.4. Manuals

Manual 402--40 is available from the service network. This manual provides information on various flux types

and characteristics along with the commercial designation and flux removal procedures. A checklist is included

in the manual as required for information on soldering problems.

NOTE

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E2 of 12 Tyco Electronics Corporation

2.5. Specifications

Product Specification 108--2284 provides product performance and test information for the Poke--In Connector;

and Design Objective 108--2284--2 provides expected product performance and test information for the Sealed

Poke--In Connector. Workmanship Specification 101--21 and Test Specification 109--11 provides solderability

requirements and evaluation methods.

3. REQUIREMENTS

3.1. Safety

Do not stack product shipping containers so high that the containers buckle or deform.

3.2. Limitations

The connectors are designed to operate in a temperature range of --40_to 105_C[--40_to 221_F]

3.3. Material

The housing is made of UL 94V--0 rated thermoplastic. The contacts are made of phosphorous bronze,

under--plated with nickel, and plated overall with tin.

3.4. Storage

A. Shelf Life

The connectors should remain in the shipping containers until ready for use to prevent deformation. The

connectors should be used on a first in, first out basis to avoid storage contamination that could adversely

affect performance.

B. Chemical Exposure

Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in

the contacts.

Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds

Amines Carbonates Nitrites Sulfur Nitrites Tartrates

3.5. Wire Selection and Preparation

These connectors will accept 18, 20, and 22 AWG solid copper wire; 18 and 20 AWG prebond copper

wire; and 18 AWG stranded copper wire. The table in Figure 2 provides wire selection for the Poke--In

Connectors. The wire strip length is 7.00 +1.00 mm for the poke--in cavity with an insulation diameter of

<2.10 mm. See Figure 3.

RECOMMENDED WIRE

18 AWG UL 1007--18 Solid

18 AWG UL 1007--18 (16) Prebond

18 AWG UL 1007--18 (16) Stranded

20 AWG UL 1007--20 Solid

20 AWG UL 1007--20 (7) Prebond

22 AWG UL 1007--22 Solid

Figure 2

If stranded wire is used, it must be 16 strands, if prebond wire is used, the strand count must be 16 strands or less.

When preparing stranded wire, it is recommended NOT to twist strands after stripping the insulation. The stranded

wire will insert best if the strands are straight (or slightly twisted) as the wire is manufactured.

NOTE

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E 3 of 12Tyco Electronics Corporation

Stranded Wire

(Acceptable)

Solid Wire

(Acceptable)

Strip

Length

Conductor

Insulation

Strip

Length

Figure 3

Stranded Wire

(Non-Acceptable)

Solid Wire

(Non-Acceptable)

Must be Cut 90

3.6. Wire Termination

The receptacles must be terminated according to the instructions packaged with the tooling.

A. Workmanship

The housing must not be damaged in any way. There shall be no bending of the contacts. There shall be no exposed

copper wire or broken or bent conductor strands.

B. Conductor Insertion

All wires must be pushed firmly inside the contact wire openings. The wires must be fully inserted so that

the wire insulation is inserted into and surrounded by the end of the housing. Refer to Figure 4.

C. Wire Termination Depth

The required wire termination depth is achieved when the wire, with insulation stripped to 7.00 +1.00 mm,

has bottomed in the connector housing. Refer to Figure 4.

Figure 4

Wires Bottomed in

Connector Housing Poke--In Connector (Typ) Wire Stop

Insulation Inside

Insulation Barrel

CAUTION

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E4 of 12 Tyco Electronics Corporation

3.7. Strain Relief

It is recommended that a means be provided to support the wire bundle extending away from the connector to

prevent inadvertent application of high force to the wire bundle from transmitting into the wire/connector

interface. When the wire/connector interface is expected to be exposed to a force greater than 22 N [5.0 lbs],

an external strain relief is recommended. An external strain relief is also recommended for 18 AWG

16--stranded wire. The suggested strain relief method is to use a cable tie and anchor. Refer to Figure 5.

Figure 5

Strain Relief (Cable Tie with Anchor)

Poke--In Connector (Typ)

20 mm Min.

Recommended

Cable Tie

2--160965--1

Recommended

Anchor

2--100691--1

3.8. PC Board

A. Material and Thickness

Common pc board materials may be used such as glass epoxy (FR--4 or G--10), Aluminum--clad pc

boards and flex circuits. The pc board thickness may vary to suit the end use thickness.

B. Tolerance

Maximum allowable bow of the pc board shall be 0.10 mm over the length of the connector.

Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space

between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and

would not provide long--term performance for the connector.

C. Pads

The pc board circuit pads must be solderable in accordance with Test Specification 109--11

(Test Method A, non--activated rosin flux).

D. Layout

The pc board layout must be designed using the dimensions provided on the customer drawing for the

specific connector. The recommended pc board layout is shown in Figure 6.

CAUTION

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E 5 of 12Tyco Electronics Corporation

Figure 6

7.10

1.00

2.00 (Typ)

3.50

2.00 (Ref)

15.00

4.00

SMT PC Board Layout

Through--Hole PC Board Layout

1.50 Plated Through--Hole (4 Plc)

9.20

4.00

3.00

E. PC Board Hole Dimensions

The finished hole size for through--hole applications must meet the dimensional requirements provided in

Figure 7.

Figure 7

2.00 Min Pad

Diameter

Drilled Hole Diameter

(As Required)

1.50 + 0.10 Dia of Finished

Hole After Plating

1.57 +0.18 Board

Thickness

Copper Thickness (As Required)

(Maximum Hardness of Copper to be

150 Knoop)

Tin Thickness

(As Required)

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E6 of 12 Tyco Electronics Corporation

3.9. Spacing

The connector is able to be placed side--by--side on the pc board when pads are placed on 4.0 mm centers.

SeeFigure8.

Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact

tines.

Figure 8

0.20--0.00 Min 0.20--0.00 Min

SMT Poke--In Connector Through--Hole Poke--In Connector

4.00

4.00 4.00

NOTE

Two--position shown, one--position dimensions are the same.

3.10. Connector Placement

A. SMT Connectors

This product is packaged in tape and reel packaging per EIA--481. Robotic/gripper placement requires

total equipment accuracy of 0.13 mm to locate the connector for insertion. This includes gripper and fixture

tolerances, as well as equipment repeatability. Insertion location will be programmed by a simple

pantograph/template system or software package. Optimally, the contact solder tines should be centered

on the pc board pads. However, slight misalignment is permissible for the performance classifications

specified in Association of Connecting Electronics Industries (IPC)--S--815, “General Requirements for

Soldering Electronic Interconnection.” See Figure 9.

PC Board

Optimum Placement of Contact

Solder Tine Centered on Circuit Pad

Contact Solder Tine Overhang

Permissible Per IPC--S--815

Figure 9

CAUTION

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E 7 of 12Tyco Electronics Corporation

B. Through- Hole Connectors

When placing connectors on the pc board, the contacts must be aligned and started into the matching

holes before seating the connector onto the pc board. After the connector is seated, the standoffs must be

flush to the pc board. Refer to Figure 10.

Figure 10

Standoffs Flush

with PC Board

PC Board

Poke--In Connector (Typ)

3.11. Soldering

Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts

according to the following. The connectors should be soldered using vapor phase reflow (VPR), double--sided,

non--focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should

conform to the Workmanship Specification 101--21 and IPC--S--815.

A. Flux Selection

Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will

depend on the type of pc board and other components mounted on the board. Additionally, the flux must

be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is

compatible with the connectors is provided in Figure 11.

COMMERCIAL DESIGNATION

FLUX T

PE ACTIVIT

RESIDUE KESTER ALPHA

Type RMA (Mildly Activated) Mild Noncorrosive 185/197 611

Figure 11

B. Connectors with SMT Contacts

1. Solderability

The pc board pads must be solderable in accordance with Test Specification 109--11 (Test Method A,

non--activated rosin flux) and all other requirements for surface mount contacts specified in this

document.

2. Solder Paste Characteristics

a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5

b. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.

c. Paste will be at least 80% solids by volume.

d. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).

e. Minimum viscosity of screen print shall be 5¢10% cp (centipoise).

f. Minimum viscosity of stencil print shall be 7.5¢10% cp (centipoise).

3. Solder Volume

Solder paste volumes are required as follows (calculated per 50% solids content). Paste volume may vary depending

on the composition.

NOTE

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E8 of 12 Tyco Electronics Corporation

Solder volume for each SMT Poke--In Connector must be according to the following:

1.75 mm3per contact solder tine

4. Stencil

The stencil aperture shall be determined by the circuit pad size and stencil thickness. It may be any

shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will

need a larger aperture to maintain the given volume of solder paste. See Figure 12.

The stencil layouts illustrated apply to the top (connector) side (unless otherwise noted) of the pc board. For any other

variations, refer to the pc board mounting configurations on the appropriate customer drawing to determine

modifications necessary to the solder stencils in Figure 12.

All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create

a short, or wick solder away from the solder tines, producing a weak solder joint.

If a hold--down aperture is required other than that specified, the design must ensure that the connector housing will

not sit on the solder deposit.

Figure 12

2.00 (Typ)

4.00 (Typ)

3.50 (Typ)

15.00

7.10

5. Solder Mask

Solder mask is recommended between all pads when soldering connectors with surface mount contacts

to minimize solder bridging between pads. The mask must not exceed the height of the pad by more

than 0.05 mm. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask

must be applied over the trace to prevent bridging and wicking of solder away from the contact solder

tines. Those most suitable are Liquid Photo Imageable and Dry Film.

Since the connector may rest on top of the solder mask, an excessively high mask will allow too much space between

the lead and pad for a good solder joint. A solder joint under these conditions would be weak and would not provide

long--term performance for the connector.

NOTE

CAUTION

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E 9 of 12Tyco Electronics Corporation

6. Process

Connectors with surface mount contacts should be soldered using vapor phase (VPR), double--sided,

non--focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with

the reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be

conducted under actual manufacturing conditions to ensure product and process compatibility. These

connectors will withstand the temperature and exposure time specified in Figure 13.

SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)

IR 220_C [428_F] 3 Minutes

Figure 13

The lead--free reflow profile is shown in Figure 14.

Figure 14

Reflow Zone

Time Above 217C

(90 Seconds Max)

40--70 Seconds Typ

Peak Temperature

235--255C

Soaking Zone

(2.0 Minutes Max)

60--90 Seconds Typ

Pre--Heating Zone

(2.0 --4.0 Minutes Max)

<2.5 C/Second

30 60 90 120 150 180 210 240 270 3000

Time (Seconds)

300C

250C

200C

150C

100C

50C

0C

Kester Lead- Free Reflow Profile

Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5

C. Connectors with Through- Hole Contacts

1. Solderability

All solder joints should conform to those specified in Workmanship Specification 101--21 and all other

requirements for through--hole contacts specified in this document

2. Process

Connectors with through--hole contacts can be soldered using wave soldering or equivalent soldering

techniques. It is recommended using lead--free or SN100C solder for these connectors. The temperature

and exposure time shall be as specified in Figure 15.

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E10 of 12 Tyco Electronics Corporation

SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)

Wave 260_C [500_F] 3 Seconds

Figure 15

D. Cleaning

After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the

solder and flux for recommended cleaning solvents. Common cleaning solvents that will not affect the

connectors or assemblies for the times and temperatures provided without any adverse effects on the

connector assembly are listed in Figure 16.

Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.

Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, Tyco

Electronics does not recommend them because of the harmful occupational and environmental effects. Both are

carcinogenic (cancer--causing) and Trichloroethylene is harmful to the earth’s ozone layer.

If you have a particular solvent that is not listed, contact Tyco Electronics Tooling Assistance Center or Product

Information at the number on the bottom of page 1.

CLEANER TIME

(

)

TEMPERATURES (Maximum)

NAME TYPE (Minutes) CELSIUS FAHRENHEIT

ALPHA 2110 Aqueous 1132 270

BIOACT EC--7 Solvent 5100 212

BUTYL CARBITOL Solvent 1Room Ambient

Isopropyl Alcohol Solvent 5100 212

KESTER 5778 Aqueous 5100 212

KESTER 5779 Aqueous 5100 212

LONCOTERGE 520 Aqueous 5100 212

LONCOTERGE 530 Aqueous 5100 212

Terpene Solvent Solvent 5100 212

Figure 16

E. Drying

Excessive temperatures may cause housing and plating degradation.

When drying cleaned assemblies and pc boards, temperatures to which the connectors are subject should

not exceed 220_C [492_F] for more than 3 minutes.

3.12. Checking Installed Connector

All solder joints should comply with Tyco Electronics Workmanship Specification 101--21. For typical fillets

for surface mount and through--hole tine requirements, refer to Figure 17.

DANGER

NOTE

CAUTION

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E11 of 12Tyco Electronics Corporation

Figure 17

Solder

Fillet

Pad Width

Pad

Length

SMT Poke--In Connector

Soldered on PC Board

PC Board (Ref)

Solder Joints

Evenly Formed

Around Contact

Tines

3.13. Replacement and Repair

The contacts and housings are not repairable. DO NOT use damaged or defective contacts or housings. DO

NOT remove the wire and re--terminate contacts.

4. QUALIFICATIONS

Poke--In Connectors are Component Recognized by Underwriters Laboratories, Inc. in File E28476, Volume

39, and have been Investigated to CSA International by UL.

5. TOOLING

5.1. Robotic Equipment

The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the

connectors. This includes gripper and fixture tolerances as well as equipment repeatability.

Automatic machine placement is recommended for connectors instead of manual placement with surface mount

contacts.

5.2. PC Board Support

For automatic machine placement, a pc board support must be used to prevent bowing of the pc board during

the placement of connectors. It should have flat surfaces with holes or a channel large enough and deep

enough to receive any protruding components. The pc board support must be customer made.

NOTE

SMT and Through- Hole Poke- In Connectors 114- 13194

Rev E12 of 12 Tyco Electronics Corporation

6. VISUAL AID

Figure 18 shows a typical application of Poke--in Connectors. This illustration should be used by production

personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be

inspected using the information in the preceding pages of this specification and in the instructional material

shipped with the product or tooling.

FIGURE 18. VISUAL AID

WIRES MUST BE

FULLY BOTTOMED

IN CONNECTOR

HOUSING

CABLE TIE AND ANCHOR

MUST BE CORRECTLY

PLACEDONWIRES

STANDOFFS MUST BE

SEATEDONPCBOARD

SOLDER FILLET MUST BE

FORMED EVENLY

AROUND SOLDER TINE

CONTACT TINE SHOULD

BE VISUALLY CENTERED

ON PAD

SOLDER MUST BE EVENLY

FORMED AROUND ALL CONTACT

SOLDER TINES WITH NO VISIBLE

SKIPS OR VOIDS

CONNECTOR HOUSING

MUST NOT BE DAMAGED

OR CRACKED