© 2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 03/25/16
Teccor® brand Thyristors
Standard Bidirectional SIDACs
Soldering Parameters
Reflow Condition Pb–Freeassembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60 – 180 secs
Average ramp up rate (Liquidus Temp)
(TL) to peak 5°C/second max
TS(max) to TL - Ramp-up Rate 5°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 5°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
Do not exceed 280°C
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
r
h
Ramp-upRamp-up
Ramp-down
am
-
Physical Specifications Reliability/Environmental Tests
Test Specifications and Conditions
High Temperature
Voltage Blocking
MIL-STD-750: Method 1040, Condition
A Rated VDRM (VAC-peak), 125°C, 1008
hours
Temperature Cycling
MIL-STD-750: Method 1051
-40°C to 150°C, 15-minute dwell, 100
cycles
Biased Temperature &
Humidity
EIA/JEDEC:JESD22-A101
80% min VBO (VDC),85°C,85%RH,1008
hours
High Temp Storage MIL-STD-750: Method 1031
150°C, 1008 hours
Low-Temp Storage -40°C, 1008 hours
Thermal Shock
MIL-STD-750: Method 1056
0°C to 100°C, 5-minute dwell,
10-second transfer, 10 cycles
Autoclave
(Pressure Cooker Test)
EIA/JEDEC:JESD22-A102
121°C,100%RH,2atm,168hours
Resistance to
Solder Heat
MIL-STD-750: Method 2031
260°C, 10 seconds
Solderability ANSI/J-STD-002:Category3
Lead Bend MIL-STD-750:Method2036,ConditionE
Terminal Finish 100% Matte Tin Plated / Pb-free Solder
Dipped
Body Material ULrecognizedepoxymeetingammability
classication94V-0
Lead Material Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long
way toward extending the operating life of the Thyristor.
Overheatingandsurgecurrentsarethemainkillersof
SIDACs. Correct mounting, soldering, and forming of the
leads also help protect against component damage.