21328-DSH-001-E Mindspeed Technologies®November 2009
Mindspeed Proprietary and Confidential
M21328 HD/SD and 2xHD-SDI Cable Driver
Applications
Serial Routing Switchers,
Production/Master Control Switchers
Distribution Amplifiers
Video Tape Recorders, ENG Edit decks, Cameras
Broadcast video applications
NLE's, MPEG Encoders/Decoders, format convertors etc.
Standards Compliance
SMPTE 292M, 259M, 344M, 424M
DVB-ASI
The M21328 is a high- speed, low-power, low-jitter cable drivers. It is designed to drive serial digital video data
through 75Ω coaxial cable typically used in SMPTE and DVB-ASI video applications. The M21328 cable driver is
optimized for performance from 143 Mbps up to 2970 Mbps. It has selectable slew rates for SD-SDI and HD-SDI
applications.
The typical output rise/f a ll time of the M21328 is 100 ps for HD and 2xHD rates . It h as a typical set sle w r ate of 60 0
ps at SD rates. The default output voltage swing is compliant with SMPTE 292M, 259M, 344M and 424M using a
750Ω ±1% resistor . The M21328 suppo rts a maximum single ended output s wing of 1600 mVp–p , when configured
appropriately.
The M21328 device is pac kaged in a new high perf ormance 4x4 mm MLF pac kage to simplify t he PCB and redu ce
package parasitics with resulting improvements in Output Return Loss (ORL). It is available in an RoHS compliant
package, that is backwards compatible with standard JEDEC SnPb processes.
The M21328 is pin compatible with the GS2978. It will also fit the footprint of the GS1578/1578A, but with the
added feature of an Output Disable control pin.
Functional Block Diagram
OUTPUT
BUFFER
RSET
SDI
M21328
CABLE DRIVER
INPUT
BUFFER
3.3V BIAS CIRCUITRY
AV
DD
SD/HD
SDO
SDO
SDI
DISABLE
Features
2xHD, HD and SD operation
800 mVp–p single ended output swing (typical)
1600 mVp–p maximum single ended output swing
SD/HD Slew Rate control
3.3V Supply
Low PDISS (144 mW @ 3.3V)
Extended temp. range: -10 to 85°C
RoHS package
Output disable
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Ordering Information
Part Number Data Rates Supported Package Operating Temperature
M21328G-12* 143–2970 Mbps 4x4 mm MLF—16pins (RoHS compliant) -10 °C to 85 °C
NOTES:
* Consult the price list for exact part number when ordering.
* The letter ‘G’ designator after the part number indicates a RoHS-compliant package. Refer to www.mindspeed.com for additional information.
Revision History
Revision Level Date Description
A Advance May 2007 Initial Release.
B Release July 2007 Added θJA (Junction to ambient Thermal Resistance) to Table 1-2.
C Release December 2007 Output disable pin added.
Revised package dimensions.
HD/2xHD rise/fall time max changed to 135 ps.
Overshoot changed to +/-10%.
D Release September 2008 Table 1-3, removed pin 6 from the “Not Connected” list.
Table 1-5, removed 1485 Mbps from pin 10 description.
Removed section on Moisture Sensitivity Level.
E Release November 2009 Updated for -12 part.
Added marking diagram.
M21328 Marking Diagram
32812
Lot #
Date and Country
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Table of Contents
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Table of Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.0 Product Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.2 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
1.3 DC Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
1.4 Input/Output Level Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
1.5 Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.5.1 Mechanical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.5.1.1 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
1.6 Manufactureability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.6.1 Electrostatic Discharge. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.6.2 Peak Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
1.7 Design Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
2.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.1.1 HD-SDI and SD-SDI Slew-rate Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.1.2 Output Amplitude Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
2.2 Pin Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.2.1 High-speed Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
2.2.2 High-speed Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
2.2.3 M21328 Pin List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
A.1 Glossary of Terms/Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
A.2 Reference Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
A.2.1 External . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
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List of Figures
Figure 1-1. Output Symbols Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Figure 1-2. M21328 Pin Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Figure 1-3. Package Drawing (4x4 mm MLF Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Figure 2-1. Typical Input Circuit—AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 2-2. Typical Input Circuit—DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 2-3. Typical Output Matching/Back-termination Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
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List of Tables
Table 1-1. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 1-2. Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 1-3. Power DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 1-4. CMOS Input Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 1-5. High-Speed Input Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 1-6. Cable Driver Output Electrical Specifications (SD/HD/2xHD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Table 2-1. Output Swing vs. Supply and Termination Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Table 2-2. Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Table 2-3. Power Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Table 2-4. High-speed Signal Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Table 2-5. Control Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
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1.0 Product Specification
1.1 Absolute Maximum Ratings
1.2 Recommended Operating Conditions
Table 1-1. Absolut e M ax imum Rati ng s
Symbol Parameter Minimum Maximum Units
VDD Power AVSS - 0.5 AVSS + 3.47 V
VIOAM Any I/O Pin AVSS - 0.5 AVDD + 0.5 V
TSTORE Storage Temperature -65 +150 °C
ESDHBML Human Body Model (low-speed) 2000 V
ESDHBMH Human Body Model (high-speed outputs) 2000 V
ESDCDM Charge Device Model 500 V
NOTE:
1. No Damage.
Table 1-2. Recommended Operating Conditions
Symbol Parameter Notes Minimum Typical Maximum Units
AVDD AVDD Power 1 3.3 V
AVSS AVSS Ground 0 V
TAAmbient Temperature -10 +85 °C
θJA Junction to ambient Thermal Resistance 61 °C/W
AVDD_TERM 75Ω Output Termination Voltage See Table 2-1.
NOTES:
1. ±5% is allowed from nominal supply.
Product Specification
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1.3 DC Electrical Specifications
1.4 Input/Output Level Specifications
Table 1-3. Power DC Electrical Specifications
Symbol Parameter Notes Minimum Typical Maximum Units
IDD Supply Current 1, 2 27 36 mA
IDDTERM Current in external termination resistors 1, 2, 3 22 mA
PDISSINT1 Power dissipation (AVDD = 3.3V, AVDDTERM = 3.3V) 1, 2, 5 144 mW
PDISSINT1 Power dissipation (AVDD = 3.3V, AVDDTERM = 5.0V) 1, 2, 5 181 mW
PDISSTOT1 Power dissipation (AVDD = 3.3V, AVDDTERM = 3.3V) 1, 2, 4 162 mW
PDISSTOT1 Power dissipation (AVDD = 3.3V, AVDDTERM = 5.0V) 1, 2, 4 199 mW
NOTES:
1. Recommended operating conditions—see Table 1-2.
2. 800 mV standard SMPTE swing, terminated as in Figure 2-3.
3. A portion of the power will be dissipated in the external 75OΩ termination (PEXT = VOD x ITERM).
4. PDISSTOT = AVDD x IDD + AVDDTERM x ITERM.
5. PDISSINT = PDISSTOT - PEXT.
Table 1-4. CMOS Input Electrical Specif ications
Symbol Parameter Notes Minimum Typical Maximum Units
VIH Input Logic High Voltage 1 0.75 x A VDD —AV
DD + 0.3 V
VIL Input Logic Low Voltage 1 0 0.25 x AVDD V
IIH Input Current (logic High) 1 -100 100 μA
IIL Input Current (logic Low) 1 -100 100 μA
NOTE:
1. Specified at recommended operating condition—see Table 1-2.
Product Specification
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Table 1-5. High-Speed Input Electri cal Specifications
Symbol Parameter Notes Minimum Typical Maximum Units
DRIN Input Bit Rate 1, 2 0 2970 Mbps
VID Input Differential Voltage (peak to peak) 1, 3, 4 100 2000 mV
VCM Input Common-Mode Voltage 1 1200 AVDD mV
VIH Maximum Input High Voltage 1 AVDD + 400 mV
VIL Minimum Input Low Voltage 1 1.2 V
RIN Single-ended input impedance 1 13.33 20 kΩ
NOTES:
1. Specified at recommended operation conditions—see Table 1-2.
2. Part is DC coupled at the input.
3. Example 1200 mVpp differential = 600 mVpp for each single-ended terminal.
4. Minimum input level defined as BER 10-12.
Product Specification
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Table 1-6. C able Driver Output Electrical Specifications (SD/HD/2 xHD)
Symbol Parameter Notes Minimum Typical Maximum Units
DROUT Output Bit Rates 1, 5 0 2970 Mbps
tr/tfSD Rise/Fall Time (20–80%) 1, 3, 5 400 600 800 ps
HD/2xHD Rise/Fall Time (20–80%) 1, 3, 5 100 135 ps
tr/tfMM Rise/fall mismatch (HD/2xHD Rate) 1, 2, 5 10 30 ps
Rise/fall mismatch (SD Rate) 1, 2, 5 40 100 ps
VOSingle-ended voltage swing range p–p 1, 2, 4, 5 500 800 1600 mV
VOTOL Swing Level output variation at 800 mVpp
[RSET = 750ohm ±1%] (Single-Ended) 1, 2, 3, 5 -7 +7 %
VOS Overshoot/Undershoot 1, 2, 5 -10 +10 %
JAOPP Additive Output Jitter (HD/2xHD rate) 1, 5, 8 20 30 ps
Additive Output Jitter (SD rate) 1, 5, 8 40 60 ps
DCDODuty Cycle Distortion (HD/2xHD Rate) 1, 2, 5, 6, 8 15 30 ps
Duty Cycle Distortion (SD Rate) 1, 2, 5, 6, 8 20 70 ps
S22 Output Return Loss (5 MHz to 1.5 GHz) 1, 2, 5, 7 15 dB
S22 Output Return Loss (5 MHz to 3.0 GHz) 1, 2, 5, 7 10 dB
NOTES:
1. Entire table specified at recommended operating condition with 400 mVP–P differential input—see Table 1-2.
2. Specification verified at 800 mVpp output with 1m cable on MSPD test board. System results may vary.
3. Rated at nominal SMPTE 800 mV output swing level (using a 750Ω ±1% resistor at RSET).
4. Output stage is an open collector differential pair, actual swing dependant on IC supply voltage and external termination voltage.
5. Into 75Ω back termination and 75Ω load and appropriate external termination voltage, see Table 2-1, Figure 2-3.
6. Duty Cycle Distortion (DCD) is defined as the difference in the intrinsic jitter at the 50% voltage level and the intrinsic jitter at the rising/falling
edge crossing point. If the rising/falling edge crossing point is at the 50% voltage level, then DCD = 0.
7. Measured under DC conditions that simulate AC coupling, VT = 3.3V.
8. Measured using a “1010” data pattern.
Product Specification
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Figure 1-1. Output Symbols Definition
VOD
trtf
VOH
VOL
JOPP
VOH: Average voltage high level
VOL: Average voltage low level
VOD: (VOH) – (VOL)
VOCM: Common Mode Voltage
JOPP: Output Jitter Peak-Peak
tr: 20-80% Rise Time
tf: 80-20% Fall Time
VOCM
NOTE: Waveform above is differential.
Product Specification
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1.5 Package Specification
1.5.1 Mechanical Description
1.5.1.1 Package Information
The M21328 is available in a 16 pin 4x4mm MLF IC package. The pin out is shown in Figure 1-2 and the package
drawing in Figure 1-3.
Figure 1-2. M21328 Pin Out
Top View
CENTER PAD
AV
16 15 14 13
5 6 7 8
1
2
4
3
12
11
9
10
SS
SD0
SD/HD
SD0
AVDD
SDI
SDI
AV SS
RSET
NC
NC
NC
NC
NC
NC
NC
DISABLE
Product Specification
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Figure 1-3. Package Drawing (4x4 mm MLF Package)
Product Specification
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1.6 Manufactureability
The values shown in this section may change; however, these are standard requirements.
1.6.1 Electrostatic Discharge
Tested per JESD22-A114. This device passes 2000V of ESD Human Body Model (HBM) testing.
Tested per JESD22-C101. This device passes 500V of ESD Charged Device Model (CDM) testing.
Tested per EIA/JESD78. This device passes 150mA of trigger current at 85°C during Latchup testing.
1.6.2 Peak Reflow Temperature
M21328G (RoHS compliant package): Peak reflow temperature is 260°C per JEDEC standards.
1.7 Design Considerations
See Digital Video Interfacing Application Note (212xx-APP-001-A) for guidance on the following:
Component Placement and Layout
Routing Considerations and Thermal Considerations
The M21328 consumes less pow er than legacy devices, therefore the M21328 will contribute less thermal energy
resulting in a lower operating temperature.
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2.0 Functional Description
2.1 Features
2.1.1 HD-SDI and SD-SDI Slew-rate Selection
The output slew rate of the M21328 is selectable to conform with the different SD-SDI, HD-SDI, and 2xHD
specifications. With SD/HD = Low, rise/fall time is typically 100 ps. The slew rate will vary depending on the output
matching network and connector used.
With SD/HD = High, for standard definition (143 to 540 Mbps) applications, the rise/fall time is typically 600 ps,
which is compliant with SMPE 259M and SMPTE 344M.
2.1.2 Output Amplitude Adjustment
A resistor connected to RSET pin is used to set the single ended output amplitude swing.
For SMPTE compliance, an external 75 0Ω ±1% resistor at RSET to AVDD is recommended for a swing level of
800mV within a toler ance that is less than ±1 0% which meets SMPTE requirements . The output amplitu de can also
be adjusted to range from 500 to 1600 mVpp single ended using the following formul a:
Output Swing = (600/RSET) [RSET in kΩ] (in mVpp, Single Ended)
The actual swing is set as a function of the IC supply volta ge, the external termination voltage and the limitations
are shown in Table 2-1. In applications where a lossy matching or splitting netw orks are used, the M21 328 offers
additional gain of up to 1600 mVpp swings, so the output after the lossy network can be SMPTE compliant.
Table 2-1. Output Swing vs. Supply and Termination Voltage
AVDD (V) AVDDTERM (V) Maximum Swing
(Single-ended mVp–p) Minimum Swing
(Single-ended mVp–p)
3.3V 3.3V 1200 mV 500 mV
3.3V 5.0V 1600 mV 500 mV
Functional Description
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2.2 Pin Definitions
2.2.1 High-speed Inputs
The M21328 is designe d to be operated with input signals as low as 100 mV or up to 2000 mV differential peak to
peak. The M21328 uses e xternal 50Ω input termination resistors to match 100Ω differential impedance transmission
lines for improved system level performance. The M21328 recommended input circuits are shown in Figure 2-1
and Figure 2-2.
Note that AC coupling is not required when the M21328 is driven by Mindspeed Broadcast video devices.
Figure 2-1. Typical Input Circuit—AC Coupled
Figure 2-2. Typical Input Circuit—DC Coupled
M21328
Tx Device
DDI
DDI
DDO
DDO
100 Ω
4.7
μ
F
4.7
μ
F
M21328
Tx Device
PCML Output Stage Connected to
Same AV
DD
as Cable Driver
DDI
DDI
DDO
DDO
100 Ω
Functional Description
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2.2.2 High-speed Outputs
The M21328 outpu t b uffer is an open collector b uffer that is designe d f or a re turn loss of 15 dB at SD and HD rat es
and 10 dB at 2xHD rates, using standard through-hole BNC connectors as typically employed in broadcast video
equipment. A typical output matching circuit is shown in Figure 2-3. The Output Return Loss (ORL) is dependent
on many factors such as the value and type of components used, PCB layout, PCB tr ace len gths , a nd type of PCB
di-electric, t herefore, the recomme ndations in the fi gure belo w should be used as starting gu idelines only. Diff erent
output matching network topologies and different component values will result in different ORL performance.
The M21328 has SD-SDI and HD-SDI rise/fall times that are typically faster than the legacy cable driver device s
but within the relevant SMPTE specification for additional margin in most designs. The faster output slew rate
results in a more open eye. The actu al maximum output of the part depends on the applied IC voltage as well as
the external termination v oltage for the load termination. The limitations are di scussed in Section 2.1.
Figure 2-3. Typical Output Matching/Back-termination Circuit
BNC
BNC
M21328
75Ω
75Ω
4.7 nH
4.7 nH
75Ω
75Ω
4.7 uF
4.7 uF
10 nF
AVDDTERM
ITERM
SDO
SDO
AVDD
IDD
Functional Description
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2.2.3 M21328 Pin List
Table 2-2. Interface Pins
Pin Name Pin # Function Default Type
RSET 4 Input control signal for setting the single-ended output swing amplitude.
Higher output swing levels or reduced variations with a ±1% tolerance external
resistor.
For 800mVp–p single-ended, a 750Ω ±1% resistor to AVDD is recommended.
Analog Input
Table 2-3. Power Pins
Pin Name Pin # Function Type
AVSS 3 Chip Ground Power
AVDD 9 Positive Supply Power
NC 5, 7, 8, 13, 14,
15, 16 Not Connected. Leave these pins floating. Do not connect to any supply, ground or logic level. NC
Center Pad Chip Ground Power
Table 2-4. High-speed Signal Pins
Pin Name Pin # Function Default Type
SDI/SDI 1, 2 Non-inverting and Inverting serial externally terminated inputs. I—High-speed
SDO/SDO 12, 11 Non-inverting and inverting serial unterminated data outputs to coaxia l cable. O—High-speed
Table 2-5. Control Pins
Pin Name Pin # Function Default Type
SD/HD 10 Input control signal to change the output slew rate.
SD/HD = High: Slow output slew rate for SD-SDI rate (143–540 Mbps).
SD/HD = Low: Fast output slew rate for HD and 2xHD-SDI rate.
Pull-up I—CMOS
DISABLE 6 A low disables the SDO/SDO outputs.
A high enables the SDO/SDO outputs. Pull-up I—CMOS
NOTES:
Internal pull-ups/pull-down s are 100 kΩ.
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Appendix
A.1 Glossary of Terms/Acronyms
BER Bit Error Rate
CD Cable Driver
CDA Cable Distribution Amplifier
CML Current Mode Logic
CMOS Complementary Metal Oxide Semiconductor
DPLL Digital Phase Locked Loop
DTV Digital Television
DVB Digital Video Broadcast
EMI Electro Magnetic Interference
EQ Equalizer or Equalization
GREEN Environmentally friendly
HD High Definition
HW Hardware
IC Integrated Circuit
ID Identifier
I/O Input/Output
MLF Micro Lead Frame package (also called QFN)
PCB Printed Circuit Board
ORL Output Return Loss
RoHS Restriction of Hazardous Substances
SD Standard Definition
SDI Serial Digital Input
SDO Serial Digital Output
SE Single Ended
SMPTE Society of Motion Picture and Television Engineers
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A.2 Reference Documents
A.2.1 External
The following external documents were referenced in this data sheet.
Application Notes fo r Surface Mount Assembly of Amkor’s MicroLeadFrame (MLF) Packages
Amkor Technology Thermal Test Report TT-00-06 (See http: //www.amkor.com for detailed information)
SMPTE 292M, SMPTE 259M, SMPTE 344M
ESI TR101 891 DVB Asynchronous Serial Interface (ASI)
www.mindspeed.com
General Information:
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Newport Beach, CA 92660
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