IP4352CX24/LF,135 - NXP SEMICONDUCTORS

1. Product profile

1.1 General description

The IP4352CX24 is a diode array designed to provide protection to downstream

components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.

The IP4352CX24 i ntegrates 9 p airs of rail-to-rail diodes, 15 resistors an d 12 Zener diodes

in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon

semiconductor technology.

These features make the IP4352CX24 ideal for applications requiring miniaturized

components, such as mobile phone handsets, cordless telephones and personal digital

devices.

1.2 Features and benefits

Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant)

All SD memory card channels have integrated ESD protection EMI and RF filters

ESD protection up to 15 kV at output terminals on 9 channels

Integrated EMI and RF filters with pull-up resistors on 5 channels

Integrated EMI and RF filters on 4 channels

SD card power supply pr ot ection

WLCSP with 0.4 mm pitch

Write protection with integrat ed car d de te ct bia sin g re sist or

Supports electrical card detection

Also available with diffe rent filter behavior and the same footprint as IP4350CX24

1.3 Applications

SD memory card interfaces in cellular and PCS mobile handsets

DECT handsets

Digital still and video cameras

Media players

Card readers

IP4352CX24

9-channel SD memory card interface filter with ESD protection

to IEC 61000-4-2 level 4

Rev. 02 — 3 May 2010 Product data sheet

Product data sheet Rev. 02 — 3 May 2010 2 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

2. Pinning information

2.1 Pinning

Fig 1. Pin configuration IP4 3 52C X2 4

Ta ble 1. Pinning

Pin Description

A1 DATA2: data line 2

A2 DATA3: data line 3

A3 GND_H: ground 1

A4 SDDATA2: secure digital data 2

A5 SDDATA3: secure digital data 3

B1 CD: card detect

B2 CMD: command

B3 not connected

B4 SDCD: secure digital card detect

B5 SDCMD: secure digital command

C1 DAT3_PD: data 3 pull-down

C2 WP: write protect

C3 DAT3_PU: data 3 pull-up

C4 SDWP: secure digital write protect

C5 VSD: supply voltage

D1 WP+CD: write protect and card detect

D2 CLK: clock

D3 GND_C: ground 2

D4 SDWP+CD: secure digital write protect and card detect

D5 SDCLK: secure digital clock

E1 DATA1: data line 1

001aaj78

24135

bump A1

index area

transparent top view,

solder balls facing down

Product data sheet Rev. 02 — 3 May 2010 3 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

3. Ordering information

4. Functional diagram

E2 DATA0: data line 0

E3 GND_C: ground 3

E4 SDDATA1: secure digital data 1

E5 SDDATA0: secure digital data 0

Ta ble 1. Pinning …continued

Pin Description

Table 2. Ordering information

Type number Package

Name Description Version

IP4352CX24/LF WLCSP24 wafer level chip-size package; 24 bumps (5 ×5 - B3) IP4352CX24

Fig 2. Schematic diag ram IP4 352 C X2 4

001aaj75

R15

R14R13R12R11

CLK

DAT3_PU

SDCLK

VSD

CMD SDCMD

DATA0 SDDATA0

DATA1 SDDATA1

DATA2 SDDATA2

DATA3 SDDATA3

CD SDCD

WP SDWP

WP+CD

R21

DAT3_PD

GND_H

SDWP+CD

GND_C

Product data sheet Rev. 02 — 3 May 2010 4 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

5. Limiting values

[1] Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the

specified level 4 (8 kV contact discharge).

6. Characteristics

[1] Guaranteed by design.

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VIinput voltage −0.5 +5.0 V

VESD electrostatic discharge voltage IEC 61000-4-2 level 4; output pins A4, A5, B4,

B5, C4, C5, D4, D5, E4, E5; pins A3, D3 and E3

connected to ground

contact discharge [1] −8+8kV

air discharge −15 +15 kV

IEC 61000-4-2 level 1; all other pins; pins A3, D3

and E3 connected to ground

contact discharge −2+2kV

air discharge −2+2kV

Pch channel power dissipation continuous power; Tamb =70°C-25mW

Ptot total power dissipation continuous power; Tamb = 70 °C - 100 mW

Tstg storage temperature −55 +150 °C

Treflow(peak) peak reflow temperature 10 s maximum - 260 °C

Tamb ambient temperature −30 +85 °C

Table 4. Channel characteristics

Tamb = 25

C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Rs(ch) channel series

resistance R1 to R9 ± 20 % 32 40 48 Ω

R11 to R14 ± 30 % 35 50 65 kΩ

R15 ± 30 % 10.5 15 19.5 kΩ

R21 ± 30 % 329 470 611 kΩ

Cch channel capacitance Vbias(DC) = 0 V; f = 1 MHz; pin DAT3_PU = 0 V;

pin DAT3_PD = 0 V; pin VSD = 0 V

SD card to I/O interface [1] --20pF

pins DAT3_PD, DAT3_PU and VSD [1] -30-pF

VBR breakdown voltage II = 1 mA 6--V

ILR reverse leakage current per channel; VI = 3V --100nA

Product data sheet Rev. 02 — 3 May 2010 5 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

[1] Performed on all high speed lines (channels including R1 to R9, see Figure 2).

7. Application information

7.1 Insertion loss

The insertion loss was measured with a test PCB utilizing laser-drilled micro-via holes

which connect the PCB ground plane to the ground pins.

The configuration for measuring insertion loss in a 50 Ω system is shown in Figure 3.

The frequency respo nse curves me asur ed on pin s A1 a nd A4, E1 and E4 an d C2 and C4

at frequencies up to 3 GHz are shown in Figure 4.

Table 5. Frequency response

Tamb = 25

C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

αil insertion loss all channels; Rgen = 50 Ω; RL = 50 Ω

f < 400 MHz - - 9 dB

400 MHz < f < 800 MHz 9 - - dB

800 MHz < f < 2.5 G Hz 13 - - dB

2.5 GHz < f < 6 GHz 28 32 - dB

Table 6. Time domain response

Measured using source with 0 V to 3 V steps and 20 % to 70 % LOW-to-HIGH limits; Tamb = 25

unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

High speed Rgen =50Ω; tr=t

f=2ns

[1]

trrise time RL = 20 pF || 100 kΩ-3.23.7ns

RL = 40 pF || 100 kΩ-4.46ns

tffall time RL = 20 p F || 100 kΩ-3.34.3ns

RL = 40 pF || 100 kΩ-5.57.5ns

Fig 3. Frequen cy response measuremen t con figuration

OUT

001aai75

50 Ω50 Ω

Vgen

DUT

TEST BOARD

Product data sheet Rev. 02 — 3 May 2010 6 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

7.2 Crosstalk

The crosstalk between adjacent channels within the IP4352CX24 for different channel

pairs was measured in a 50 Ω NetWork Analyzer (NWA) system.

The configuration for measuring crosstalk in a 50 Ω system is shown in Figure 5.

The crosstalk measured for five different pairs of channels is shown in Figure 6. In all

cases, all unused connections are te rminated with 50 Ω to ground.

(1) Pin A1 to A4.

(2) Pin E1 to E4.

(3) Pin C2 to C4.

Fig 4. Measured insertion loss magnitudes

001aaj787

f (MHz)

1 104

103

10 102

S21

(dB)

−80

−40

−20

−60

(3)

(2)

(1)

Fig 5. Crosstalk measurement configuration

OUT_2

001aai75

50 Ω50 Ω

Vgen

DUT

IN_1

OUT_1IN_2

TEST BOARD

50 Ω50 Ω

Product data sheet Rev. 02 — 3 May 2010 7 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

(1) Pins A1 and B4.

(2) Pins A1 and E4.

(3) Pins A2 and B5.

Fig 6. Measured crosstalk between different channels

001aaj788

f (MHz)

1 104

103

10 102

−10

αct

(dB)

−70

−30

−50 (1)

(2)

(3)

Product data sheet Rev. 02 — 3 May 2010 8 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

8. Package outline

Fig 7. Package outline IP4352CX24 (WLCSP24)

wlcsp24_5x5-b3_po

European

projection

LCSP24: wafer level chip-size package; 24 bumps (5 x 5 - B3)

bump A1

index area

detail X

12345

Table 7. Dimensions for Figure 7

Symbol Min Typ Max Unit

A 0.56 0.61 0.66 mm

A10.18 0.20 0.22 mm

A20.38 0.41 0.44 mm

b 0.21 0.26 0.31 mm

D 1.96 2.01 2.06 mm

E 1.97 2.02 2.07 mm

e 0.35 0.40 0.45 mm

e1-1.6-mm

Product data sheet Rev. 02 — 3 May 2010 9 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

9. Design and assembly recommendations

9.1 PCB design guidelines

For optimum performance it is recommended to use a Non-Solder Mask PCB Design

(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias

connecting the ground p ads to a buried ground-plane layer. This results in the lowest

possible ground inductance and provides the best hi gh frequency and ESD performance.

For this case, refer to Table 8 for the recommended PCB design parameters.

9.2 PCB assembly guidelines for Pb-free soldering

Table 8. Recommended PCB design parameters

Parameter Value or specification

PCB pad diameter 200 μm

Micro-via diameter 100 μm (0.004 inch)

Solder mask aperture diameter 370 μm

Copper thickness 20 μm to 40 μm

Copper finish AuNi

PCB material FR4

Table 9. Assembly recommendations

Parameter Value or specification

Solder screen aperture diameter 330 μm

Solder screen thickness 100 μm (0.004 inch)

Solder paste: Pb-free SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)

Solder to flux ratio 50 : 50

Solder reflow profile see Figure 8

The device is capable of withstanding at least three reflows of this profile.

Fig 8. Pb-free solder reflow profile

001aai94

reflow(peak)

250

230

217

(°C)

cooling rate

pre-heat

t (s)

Product data sheet Rev. 02 — 3 May 2010 10 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

10. Abbreviations

11. Revision history

Table 10. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Treflow(peak) peak reflow temperature 230 - 260 °C

t1time 1 soak time 60 - 180 s

t2time 2 time durin g T ≥250 °C- - 30 s

t3time 3 time durin g T ≥230 °C10 - 50 s

t4time 4 time during T > 217 °C30 - 150 s

t5time 5 - - 540 s

dT/dt rate of change of

temperature cooling rate - - −6°C/s

pre-heat 2.5 - 4.0 °C/s

Table 11. Abbreviations

Acronym Description

DECT Digital Enhanced Cordless Telecommunications

DUT Device Under Test

EMI ElectroMagnetic Interference

ESD ElectroStatic Discharge

FR4 Flame Retard 4

NSMD Non-Solder Mask PCB Design

PCB Printed-Circuit Board

PCS Personal Communication System

RoHS Restriction of Hazardous Substances

WLCSP Wafer-Level Chip-Scale Package

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4352CX24_2 20100503 Product data sheet - IP4352CX24_1

Modifications: •Features, Applications and Legal information updated.

•Figure 2: Zener diode symbol adde d.

•Figure 7: Package outline changed.

•Table 6: updated.

•Section 9: Soldering information changed.

IP4352CX24_1 20090813 Product data sheet - -

Product data sheet Rev. 02 — 3 May 2010 11 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

12. Legal information

12.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsisten cy or conf lict with the short data sheet, the

full data sheet shall pre va il.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 02 — 3 May 2010 12 of 13

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed produ ct cl aims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

12.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors IP4352CX24

9-channel SD memory card interface filter with ESD protection

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 3 May 2010

Document identifier: I P4352CX24_2

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

14. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Application information. . . . . . . . . . . . . . . . . . . 5

7.1 Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8

9 Design and assembly recommen dations . . . . 9

9.1 PCB design guidelines . . . . . . . . . . . . . . . . . . . 9

9.2 PCB assembly guidelines for Pb-free

soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10

11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13 Contact information. . . . . . . . . . . . . . . . . . . . . 12

14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13