Preliminary Data Sheet No. PD60083-K IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) SELF-OSCILLATING HALF BRIDGE Product Summary Features * * * * Output Power MOSFETs in half-bridge configuration High side gate drive designed for bootstrap operation Bootstrap diode integrated into package (HD type) Accurate timing control for both Power MOSFETs Matched delay to get 50% duty cycle Matched deadtime of 1.2us * Internal oscillator with programmable frequency f = VIN (max) 250V (IR51H(D)224) 400V (IR51H(D)320) 500V (IR51H(D)420) Duty Cycle 50% Deadtime 1.2s Rds(on) 1 1. 4 x ( RT + 75 ) x CT * 15.6V Zener clamped Vcc for offline operation * Half-bridge output is out of phase with RT * Micropower startup 1.1 (IR51H(D)224) 3.0 (IR51H(D)320) 3.6 (IR51H(D)420) PD (TA = 25oC) 2.0W Package Description The IR51H(D)XXX are complete high voltage, high speed, selfoscillating half-bridge circuits. Proprietary HVIC and latch immune CMOS technologies, along with the HEXFET(R) power MOSFET technology, enable ruggedized single package construction. The front-end features a programmable oscillator which functions similar to the CMOS 555 timer. The supply to the control circuit has a zener clamp to simplify offline operation. The output features two HEXFETs in a half-bridge configuration with an internally set deadtime designed for minimum cross-conduction in the half-bridge. Propagation delays for the high and low side 9-Lead SIP without leads 5 and 8 power MOSFETs are matched to simplify use in 50% duty cycle applications. The device can operate up to 500 volts. Typical Connection DC Bus VIN D1 IR51H(D)XXX 1 2 Vcc VB RT VIN CT VO 6 External Fast recovery diode D1 is not required for HD type 9 RT 3 7 CT 4 COM TO, LOAD COM www.irf.com 1 IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition VIN High voltage supply VB VO VRT VCT Icc IRT dV/dt PD RthJA TJ TS TL High side floating supply Half-bridge output RT voltage CT voltage Supply current (note 1) RT output current Peak diode recovery Package power dissipation @ TA +25C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) -224 -320 -420 Minimum Maximum Units - 0.3 - 0.3 - 0.3 Vo - 0.3 250 400 500 Vo +2.5 V -0.3 - 0.3 - 0.3 -- -5 -- -- -- -55 -55 -- VIN + 0.3 Vcc + 0.3 Vcc + 0.3 25 5 3.5 2.00 60 150 150 300 mA V/ns W oC/W oC NOTE 1: This IC contains a zener clamp structure between VCC and COM which has a nominal breakdown voltage of 15.6V. Please note that this supply pin should not be driven by a DC, low impedance power source greater than the VCLAMP specified in the Electrical Characteristics Section 2 www.irf.com IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) Recommended Operating Conditions The input/output logic timing diagram is shown in figure 1. For proper operation, the device should be used within the recommended conditions. Symbol Definition VB VIN High side floating supply absolute voltage High voltage supply VO ID Half-bridge output voltage Continuous drain current (TA = 25C) Maximum Units -224 -320 -420 Vo + 10 -- -- -- V -224 -320 -3.0 (note 2) -- -- Vo + Vclamp 250 400 500 VIN -420 -224 -320 -420 (TA = 85C) ICC TA Minimum 1.1 0.9 -- -- -- -- (note 3) -40 Supply current Ambient temperature 0.7 0.7 0.6 0.5 5 125 A mA C NOTE 2: Care should be taken to avoid switching conditions where the VS node flies inductively below ground by more than 5V. NOTE 3: Enough current should be supplied to the VCC lead of the IC to keep the internal 15.6V zener diode clamping the voltage at this lead. Dynamic Electrical Characteristics VBIAS (VCC, VBS) = 12V, TA = 25oC unless otherwise specified. Symbol Definition trr Reverse recovery time (MOSFET body diode) Qrr Reverse recovery charge (MOSFET body diode) D RT duty cycle www.irf.com -224 -320 -420 -224 -320 -420 Min. Typ. -- 200 270 240 -- -- -- -- -- -- 0.7 0.6 0.5 50 Max. -- -- -- -- -- -- -- Units Test Conditions ns C % IF=1.1A IF=900mA di/dt IF=700mA =100 IF=1.1A IF=900mA A/s IF=700mA fosc = 20 kHz 3 IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) Static Electrical Characteristics VBIAS (VCC, VB) = 12V, TA = 25oC unless otherwise specified. Symbol Definition VCCUV+ VCC supply undervoltage positive going Min. -- threshold V CCUV- VCC supply undervoltage negative going threshold I QCC Quiescent VCC supply current V CLAMP VCC zener shunt clamp voltage IQBS Quiescent VBS supply current lOS fOSC Offset supply leakage current Oscillator frequency ICT VCTUV VRT+ CT input current CT undervoltage lockout RT high level output voltage, VCC - RT VRT- RT low level output voltage VRTUV VCT+ VCT- RT undervoltage lockout, VCC - RT 2/3 VCC threshold 1/3 VCC threshold Rds(on) Static-drain-to-source on-resistance VSD 4 Diode forward voltage -224 -320 -420 -224 -320 -420 Typ. 8.4 Max. -- -- 8.0 -- V -- -- -- 300 15.6 30 A V -- -- -- 20 -- -- -- 50 -- -- 100 -- -- -- -- -- -- -- -- -- -- 0.001 100 20 200 20 200 100 8.0 4.0 1.0 -- -- -- -- -- -- -- -- -- 1.1 -- -- -- -- 1.8 3.0 -- -- -- -- -- -- -- 0.85 0.7 0.8 Units Test Conditions V A kHz VCC > VCCUV ICC = 5mA VB = VIN = 500V RT = 35.7 k CT = 1 nF RT = 7.04 k C T = 1 nF A mV Note 2 IRT = 100A IRT = -1mA IRT = 100A IRT = -1mA IRT = 100A kHz V IF=1.1A IF=900mA IF=700mA IF=1.1A IF=900mA IF=700mA di/dt =100 A/s www.irf.com IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) Functional Block Diagram V VIN B 6 D1 9 1 Vcc IRFCXXX IR2151 2 R H O V S L 3 C 7 VO T O IRFCXXX T 4 COM Fast recovery diode D1 is incorporated in IR51HDXXX only Lead Definitions Symbol Lead Description VCC Logic and internal gate drive supply voltage. An internal zener clamp diode at 15.6 V norminal is included to allow the VCC to be current fed directly from VIN typically by means of a high value resistor. Oscillator timing resistor output; a resistor is connected from RT to C T. RT is out of phase with the halfbridge output (VO). Oscillator timing capacitor input; a capacitor is connected from CT to COM in order to program the oscillator frequency according to the following equation: RT CT f = VB VIN VO COM www.irf.com 1 1. 4 x ( RT + 75 ) x CT CT PIN also invokes shutdown function (see note 2) where 75 is the effective impedence of the RT output stage. High side gate drive floating supply. For bootstrap operation a high voltage fast recovery diode is needed to feed from VCC to VB. (HD type circuits incorporate this diode). High voltage supply Half Bridge output Logic and low side of half bridge return 5 IR51H(D)224 IR51H(D)320 IR51H(D)420 (NOTE: For new designs, we recommend the IR53H(D)420-P) Lead Assignments 1 2 3 4 9 6 1 2 3 Vcc RT CT COM 6 7 9 VB VO VIN 7 4 9-Lead SIP without Leads 5 and 8 Vccuv+ V CLAMP Vcc RT CT V+ VO 0 Figure 1. Input/Output Timing Diagram 6 www.irf.com (NOTE: For new designs, we recommend the IR53H(D)420-P) IR51H(D)224 IR51H(D)320 IR51H(D)420 Case outline NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982 2. Controlling Dimension: INCH 3. Dimensions are shown in millimeters (inches) 9-Lead SIP w/o leads 5 and 8 WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 http://www.irf.com/ Data and specifications subject to change without notice. 5/14/2001 www.irf.com 7