F-213 MEC1-130-02-L-D-EM2 MEC1-120-02-F-D-EM2 (1,00 mm) .0394" MEC1-120-02-L-D-RA1-SL MEC1-RA, MEC1-EM SERIES RIGHT ANGLE/EDGE MOUNT SOCKETS SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC1-RA Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50" (1,27 m) Ni Current Rating: 1.5A per contact @ 80C (See website for details) Operating Temp Range: -55C to +125C Insertion Depth: (5,84 mm) .230" to (8,13 mm) .320" RoHS Compliant: Yes MEC1 Mates with: (1,60 mm) .062" card CARD SLOT POSITIONS PER ROW PLATING OPTION -02 = (1,60 mm) .062" thick card 05, 08, 20, 30, 40, 50, 60, 70 -F = Gold flash on contact, Matte Tin on tail -L = 10" (0,25 m) Gold on contact, Matte Tin on tail (11,68) (11,94) .460 .470 (8,89) .350 Processing: (1,00) .03937 (No. of Positions + 2) x (1,00) .03937 (1,24) .049 (1,78) .070 DIA (2,51) (1,27) .050 .099 (3,12) .123 APPLICATION RA1 SL APPLICATION SPECIFIC OPTION * Elevated body height * Non-polarized Call Samtec. (8,13) .320 (6,81) .268 01 D Note: Other Gold plating options available. Contact Samtec. (No. of Positions + 2) x (1,00) .03937 + (2,54) .100 (0,36) .014 02 Lead-Free Solderable: Yes SMT Lead Coplanarity: (0,10 mm) .004" max (05-40) (0,15 mm) .006" max (50-70) Note: While optimized for 50 applications, this connector with alternative signal/ground patterns may also perform well in certain 75 applications. Contact Samtec for further information. Note: Some sizes, styles and options are non-standard, non-returnable. 1 POSITIONS POLARIZED POSITIONS PER ROW 3, 4 05 5, 6 08 15, 16 20 21, 22 30 31, 32 40 41, 42 50 31, 32, 63 & 64 60 53, 54, 115 & 116 70 MEC1-RA Rated @ 3dB Insertion Loss* (0,64) 6,81 mm Stack Height .025 Single-Ended Signaling 4.5 GHz / 9 Gbps Differential Pair Signaling 5.5 GHz / 11 Gbps *Performance data includes effects of a non-optimized PCB. Complete test data available at www.samtec.com?MEC1-RA or contact sig@samtec.com Samtec recommends that pads on the mating board be Gold plated. SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC1-EM Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50" (1,27 m) Ni Operating Temp Range: -55C to +125C Insertion Depth: (5,84 mm) .230" to (8,13 mm) .320" RoHS Compliant: Yes Lead-Free Solderable: Yes 1 MEC1 Mates with: (1,60 mm) .062" card POSITIONS PER ROW PLATING OPTION -F 05, 08, 20, 30, 40, 50, 60, 70 = Gold flash on contact, Matte Tin on tail -L (No. of Positions + 2) x (1,00) .03937 + (12,45) .490 = 10" (0,25 m) Gold on contact, Matte Tin on tail 02 (6,81) .268 Note: Other Gold plating options available. Contact Samtec. 01 (No. of Positions + 2) x (1,00) .03937 Note: While optimized for 50 applications, this connector with alternative signal/ground patterns may also perform well in certain 75 applications. Contact Samtec for further information. Note: Some sizes, styles and options are non-standard, non-returnable. 02 (8,13) .320 (8,89) .350 (4,70) .185 (4,57) .180 (3,15) .124 (1,00) .03937 (0,36) .014 WWW.SAMTEC.COM (5,21) .205 (1,19) (0,38) .047 .015 D EM2 APPLICATION SPECIFIC OPTION * Edge mount leads for (0,80 mm) .031" thick board * Non-polarized Call Samtec. POSITIONS POLARIZED POSITIONS PER ROW 3, 4 05 5, 6 08 15, 16 20 21, 22 30 31, 32 40 41, 42 50 31, 32, 63 & 64 60 53, 54, 115 & 116 70