198
CM800HA-24H
Single IGBTMOD™ H-Series Module
800 Amperes / 1200 Volts
Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 (724) 925-7272
Absolute Maximum Ratings, Tj = 25 °C unless otherwise specified
Ratings Symbol CM800HA-24H Units
Junction Temperature Tj–40 to +150 °C
Storage Temperature Tstg –40 to +125 °C
Collector-Emitter Voltage (G-E SHORT) VCES 1200 Volts
Gate-Emitter Voltage VGES ±20 Volts
Collector Current IC800 Amperes
Peak Collector Current ICM 1600* Amperes
Diode Forward Current IF800 Amperes
Diode Forward Surge Current IFM 1600* Amperes
Power Dissipation Pd4800 Watts
Max. Mounting Torque M8 Terminal Screws – 95 in-lb
Max. Mounting Torque M6 Mounting Screws – 26 in-lb
Max. Mounting Torque M4 G-E Terminal Screws – 13 in-lb
Module Weight (Typical) – 1600 Grams
V Isolation VRMS 2500 Volts
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
Static Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 5.0 mA
Gate Leakage Current IGES VGE = VGES, VCE = 0V – – 0.5
µ
A
Gate-Emitter Threshold Voltage VGE(th) IC = 80mA, VCE = 10V 4.5 6.0 7.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 800A, VGE = 15V – 2.7 3.6 Volts
IC = 800A, VGE = 15V, Tj = 150°C – 2.4 – Volts
Total Gate Charge QGVCC = 600V, IC = 800A, VGS = 15V – 4500 – nC
Diode Forward Voltage VFM IE = 800A, VGS = 0V – – 3.5 Volts
* Pulse width and repetition rate should be such that device junction temperature rise is negligible.
Dynamic Electrical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Input Capacitance Cies – – 180 nF
Output Capacitance Coes VGE = 0V, VCE = 10V, f = 1MHz – – 64 nF
Reverse Transfer Capacitance Cres ––36nF
Resistive Turn-on Delay Time td(on) – – 500 ns
Load Rise Time trVCC = 600V, IC = 800A, – – 1200 ns
Switching Turn-off Delay Time td(off) VGE1 = VGE2 = 15V, RG = 4.2Ω – – 1000 ns
Times Fall Time tf––350ns
Diode Reverse Recovery Time trr IE = 800A, diE/dt = –1600A/
µ
s – – 250 ns
Diode Reverse Recovery Charge Qrr IE = 800A, diE/dt = –1600A/
µ
s – 5.9 –
µ
C
Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case Rth(j-c) Per IGBT – – 0.026 °C/W
Thermal Resistance, Junction to Case Rth(j-c) Per FWDi – – 0.058 °C/W
Contact Thermal Resistance Rth(c-f) Per Module, Thermal Grease Applied – – 0.018 °C/W