MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Features Rev. V2 Die Bump Pad Layout (bump side up) 802.11b/g and Bluetooth Applications Low Insertion Loss: 0.5 dB 2.4 GHz to 2.5 GHz band High Isolation: 32 dB Typical on RX Low Harmonics: <-70 dBc @ 20 dBm Flip-chip configuration RoHS* Compliant Description The MASW-009276-001DIE is a bumped GaAs pHEMT MMIC SP3T switch. Typical applications are WLAN (802.11 b/g) and Bluetooth applications. The MASW-009276-001DIE delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 GHz. This device is fabricated using a 0.5 micron gate length GaAs pHEMT process. The process features full passivation for performance and reliability. This die features SnAg(3.5%)Cu(1%) solder bumps for Wafer Level Chip Scale Package (WLCSP) applications. Die Bump Pad Configuration Ordering Information Name Description VC1 Voltage Control 1 BT Blue Tooth TX/RX Port GND Ground RX 2.5 GHz RX Port VC3 Voltage Control 3 Part Number Package TX 2.5 GHz TX Port MASW-009276-001D3K Die in 3000 piece reel VC2 Voltage Control 2 MASW-009276-002SMB Sample Board SP3T RFC Antenna Port Absolute Maximum Ratings 1,2 Parameter Absolute Maximum Input Power @ 3 V Control +32 dBm Input Power @ 5 V Control +35 dBm Operating Voltage +8 volts Operating Temperature -40C to +85C Storage Temperature -65C to +150C 1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM Technology does not recommend sustained operation near these survivability limits. 1 * Restrictions on Hazardous Substances, European Union Directive 2002/95/EC. M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Electrical Specifications3: TA = 25C, Z0 = 50 , Vc = 0 V / 3 V, Pin = 0 dBm Parameter Test Conditions Units Min. Typ. Max. Insertion Loss RFC to Tx/Rx/BT, 2.4 GHz dB -- 0.5 0.75 Isolation RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz dB dB dB 20 30 20 24 32 24 -- -- -- Return Loss 2.4 - 2.5 GHz dB -- 15 -- IP3 RFC to Tx/Rx/BT, 2.4 GHz, 20 dBm Total Power, 1MHz Spacing dBm -- 55 -- Input P1dB RFC to Tx, 2.4 GHz RFC to Rx, 2.4 GHz RFC to BT, 2.4 GHz dBm -- -- -- 32 28 32 -- -- -- Harmonics RFC to Tx 2.4 GHz, 20 dBm dBm -- -75 -- Switching Speed 50% control to 90% RF 50%control to 10% RF ns -- -- 165 25 -- -- Control Current |Vc| = 3 V A -- <1 10 3. External blocking capacitors on all RF ports. Recommended PCB Configuration Truth Table 4,5,6 VC1 VC2 VC3 RFC-BT RFC-TX RFC-RX 1 0 0 On Off Off 0 1 0 Off On Off 0 0 1 Off Off On 4. For positive voltage control, external DC blocking capacitors are required on all RF ports. 5. Differential voltage, V(state 1) - V(state 0), must be +2.7 V minimum and must not exceed +5 V. 6. 0 = 0 0.3 V, 1 = +2.7 V to +5 V. Handling Procedures Please observe the following precautions to avoid damage: Parts List Static Sensitivity Part Value Case Style C1 - C4 39 pF 0402 C5 - C7 1000 pF 0402 Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. 2 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Product Consistency Distribution Charts7 (on wafer RF test) LS L Process Capability Process Capability LS L P rocess D ata LS L 20 Target * S ample M ean 24.1799 P rocess D ata LS L 30 Target * S ample M ean 32.0545 O v erall C apability P pk 18 19 20 21 O v erall C apability 8.55 22 23 P pk 24 25 26 27 28 28 29 30 Tx and BT Isolation TX and BT Isolation (dB) (dB) Process Capability LB USL 31 32 33 34 35 Isolation (dB) RRX Isolation (dB) X 3.04 36 37 Process Capability LB P rocess D ata LB 0 Target * USL 0.75 S ample M ean 0.513984 38 USL P rocess D ata LB 0 Target * USL 2 S ample M ean 0.272007 O v erall C apability P pk O v erall C apability 2.64 P pk -0.0 0.1 0.2 0.3 0.4 0.5 0.6 Insertion (dB) (dB) Insertion Loss Loss - All Paths 0.7 0.00 0.28 3.69 0.56 0.84 1.12 1.40 1.68 Switch Current All Paths Current - All Paths(A) (uA) 1.96 7. Represents >5 wafers, tested per electrical specifications, probed directly on the die to the solder bump: T A = 25C, Z0 = 50 , VC = 0/3V, PIN = 0 dBm 3 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 Typical Performance Curves (plots = chip on board assembly) TX Isolation TX Insertion Loss 35 0.80 +25C -40C +85C 0.75 0.70 25 0.65 20 0.60 2.40 2.42 2.44 2.46 2.48 +25C -40C +85C 30 2.50 15 2.40 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) Frequency (GHz) RX Isolation RX Insertion Loss 0.75 35 0.70 30 0.65 25 +25C -40C +85C 0.60 20 +25C -40C +85C 0.55 2.40 2.42 2.44 2.46 2.48 2.50 15 2.40 2.42 Frequency (GHz) 2.44 2.46 2.48 2.50 Frequency (GHz) BT Isolation BT Insertion Loss 35 0.80 +25C -40C +85C 0.75 30 0.70 25 0.65 20 0.60 2.40 2.42 2.44 2.46 Frequency (GHz) 2.48 2.50 15 2.40 +25C -40C +85C 2.42 2.44 2.46 2.48 2.50 Frequency (GHz) 4 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Die Dimensions (Top and Side Views) Die Bump Pad Layout - Top View (bump side up) Rev. V2 PCB Top Metal / Solder Mask Die Bump Pad Layout - Bottom View (bump side down - as installed on board) 8. Orientation mark is only on material that is shipped in tape and reel. The mark is not available on die shipped on grip ring. 5 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MASW-009276-001DIE Bumped GaAs SP3T Switch for WLAN 1.0 - 4.0 GHz Rev. V2 M/A-COM Technology Solutions Inc. All rights reserved. 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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support