○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
. 1/19
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
www.rohm.com
AC/DC Drivers
PWM type DC/DC converter IC
Included 650V MOSFET
BM2PXX3F Series
●General
The PWM type DC/DC converter (BM2PXX3F) for
AC/DC provide an optimum system for all products
that include an electrical outlet.
BM2PXX3F supports both isolated and non-isolated
devices, enabling simpler design of various types of
low-power electrical converters.
BM2PXX3F built in a HV starter circuit that tolerates
650V, it contributes to low-power consumption.
With current detection resistors as external devices, a
higher degree of design freedom is achieved. Since
current mode control is utilized, current is restricted in
each cycle and excellent performance is demonstrated
in bandwidth and transient response.
The switching frequency is 65 kHz. At light load, the
switching frequency is reduced and high efficiency is
achieved.
A frequency hopping function is also on chip, which
contributes to low EMI.
We can design easily, because BM2PXX3F includes
the switching MOSFET.
●Features
PWM frequency : 65kHz
PWM current mode method
Burst operation when load is light
Frequency reduction function
Built-in 650V start circuit
Built-in 650V switching MOSFET
VCC pin under voltage protection
VCC pin overvoltage protection
SOURCE pin Open protection
SOURCE pin Short protection
SOURCE pin Leading-Edge-Blanking function
Per-cycle over current protection circuit
Soft start
Secondary Over current protection circuit
●Basic specifications
Operating Power Supply Voltage Range:
VCC: 8.9V to 26.0V
DRAIN: ～650V
Operating Current:
Normal Mode: BM2P053F: 0.60mA (Typ.)
BM2P093F: 0.50mA (Typ.)
Burst Mode: 0.40mA (Typ.)
Oscillation Frequency: 65kHz (Typ.)
Operating Temperature: - 40 oC to +105 oC
MOSFET ON Resistance: BM2P053F:4.0Ω (Typ.)
BM2P093F:8.5Ω (Typ.)
●Package W (Typ.) x D (Typ.) x H (Max.)
SOP8 5.00mm x 6.20mm x 1.71mm
●Applications
AC adapters and household appliances (vacuum
cleaners, humidifiers, air cleaners, air conditioners, IH
cooking heaters, rice cookers, etc.)
●Line Up
●Application circuit
AC
85-265Vac
FUSE
+
-
Filter Diode
Bridge
ERROR
AMP
１2 3
GND
N.C.N.C.
FB
VCC
4
5
DRAIN
SOURCE
678
Figure 1．Application circuit
Product
MOSFET ON resistor
BM2P053F
4.0Ω
BM2P093F
8.5Ω
Datashee
t
2/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
●Absolute Maximum Ratings（Ta=25C）
Parameter
Symbol
Rating
Unit
Conditions
Maximum applied voltage 1
Vmax1
-0.3～30
V
VCC
Maximum applied voltage 2
Vmax2
-0.3～6.5
V
SOURCE, FB
Maximum applied voltage 3
V max3
650
V
DRAIN
Drain current pulse
IDP
2.60
A
PW=10us, Duty cycle=1%
(BM2P053F)
Drain current pulse
IDP
1.30
A
PW=10us, Duty cycle=1%
(BM2P093F)
Drain current pulse 2
IDP2
4.00
A
(BM2P053F) (Note2)
Drain current pulse 2
IDP2
2.00
A
(BM2P093F) (Note2)
Allowable dissipation
Pd
563
mW
Operating
temperature range
Topr
-40 ～ +105
oC
MAX junction temperature
TJMAX
150
oC
Storage
temperature range
Tstr
-55 ～ +150
oC
(Note1) SOP8 : When mounted (on 70 mm × 70 mm, 1.6 mm thick, glass epoxy on single-layer substrate).
Reduce to 4.504 mW/C when Ta = 25C or above.
(Note2) It shows drain current while the built-in switching MOSFET is turning on (within 0.3 us) .
The condition is within 30 ms while VCCUVLO state is released .
< 0.3us
Drain
Current
Turn ON
IDP2
●Operating Conditions（Ta=25C）
Parameter
Symbol
Rating
Unit
Conditions
Power supply voltage range 1
VCC
8.9～26.0
V
VCC pin voltage
Power supply voltage range 2
VDRAIN
～650
V
DRAIN pin voltage
●Electrical Characteristics of MOSFET part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter
Symbol
Specifications
Unit
Conditions
Min
Typ
Max
[MOSFET Block]
Between drain and
source voltage
V(BR)DDS
650
-
-
V
ID=1mA / VGS=0V
Drain leak current
IDSS
-
-
100
uA
VDS=650V / VGS=0V
On resistance
RDS(ON)
-
4.0
5.5
Ω
ID=0.25A / VGS=10V
(BM2P053F)
On resistance
RDS(ON)
-
8.5
12.0
Ω
ID=0.25A / VGS=10V
(BM2P093F)
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BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
●Electrical Characteristics of Control IC part (Unless otherwise noted, Ta = 25C, VCC = 15 V)
Parameter
Symbol
Specifications
Unit
Conditions
Min
Typ
Max
[Circuit current]
Circuit current (ON) 1
ION1
410
600
790
μA
BM2P053F, FB=2.0V
(at pulse operation)
Circuit current (ON) 1
ION1
350
500
650
μA
BM2P093F, FB=2.0V
(at pulse operation)
Circuit current (ON) 2
ION2
-
400
500
μA
FB=0.0V(at burst operation)
[VCC protection function]
VCC UVLO voltage 1
VUVLO1
12.50
13.50
14.50
V
VCC rise
VCC UVLO voltage 2
VUVLO2
7.50
8.20
8.90
V
VCC drop
VCC UVLO hysteresis
VUVLO3
-
5.30
-
V
VUVLO3= VUVLO1- VUVLO2
VCC OVP voltage 1
VOVP1
26.0
27.5
29.0
V
VCC rises
Latch released VCC voltage
VLATCH
-
VUVLO2-0.5
-
V
VCC Recharge start voltage
VCHG1
7.70
8.70
9.70
V
VCC Recharge stop voltage
VCHG2
12.00
13.00
14.00
V
Latch mask time
TLATCH
50
100
150
us
Thermal shut down temperature
TSD
118
145
-
C
Control IC
[PWM type DCDC driver block]
Oscillation frequency 1
FSW1
60
65
70
KHz
FB=2.00V
Oscillation frequency 2
FSW2
20
25
30
KHz
FB=0.40V
Frequency hopping width 1
FDEL1
-
4.0
-
KHz
FB=2.0V
Hopping fluctuation frequency
FCH
75
125
175
Hz
Soft start time 1
TSS1
0.30
0.50
0.70
ms
Soft start time 2
TSS2
0.60
1.00
1.40
ms
Soft start time 3
TSS3
1.20
2.00
2.80
ms
Soft start time 4
TSS4
4.80
8.00
11.20
ms
Maximum duty
Dmax
68.0
75.0
82.0
%
FB pin pull-up resistance
RFB
23
30
37
kΩ
ΔFB / ΔCS gain
Gain
-
4.00
-
V/V
FB burst voltage
VBST
0.300
0.400
0.500
V
FB falls
FB voltage of
starting Frequency reduction mode
VDLT
1.100
1.250
1.400
V
FB OLP voltage 1a
VFOLP1A
2.60
2.80
3.00
V
Overload is detected (FB rise)
FB OLP voltage 1b
VFOLP1B
-
2.60
-
V
Overload is detected (FB drop)
FB OLP ON timer
TFOLP1
40
64
88
ms
FB OLP Start up timer
TFOLP1b
26
32
38
ms
FB OLP OFF timer
TFOLP2
358
512
666
ms
[Over current detection block]
Overcurrent detection voltage
VCS
0.380
0.400
0.420
V
Ton=0us
Overcurrent detection voltage SS1
VCS_SS1
-
0.100
-
V
0[ms] ~ TSS1[ms]
Overcurrent detection voltage SS2
VCS_SS2
-
0.150
-
V
TSS1 [ms] ~ TSS2 [ms]
Overcurrent detection voltage SS3
VCS_SS3
-
0.200
-
V
TSS2 [ms] ~ TSS3[ms]
Overcurrent detection voltage SS4
VCS_SS4
-
0.300
-
V
TSS3 [ms] ~ TSS4 [ms]
Leading Edge Blanking Time
TLEB
-
250
-
ns
Over current detection AC Voltage
compensation factor
KCS
12
20
28
mV/us
SOURCE pin
short protection voltage
VCSSHT
0.020
0.050
0.080
V
[Start circuit block]
Start current 1
ISTART1
0.100
0.500
1.000
mA
VCC= 0V
Start current 2
ISTART2
1.000
3.000
6.000
mA
VCC=10V
OFF current
ISTART3
-
10
20
uA
Inflow current from Drain pin
after UVLO released UVLO.
When MOSFET is OFF
Start current switching voltage
VSC
0.800
1.500
2.100
V
4/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
●PIN DESCRIPTIONS
Table 1 Pin Description
NO.
Pin Name
I/O
Function
ESD Diode
VCC
1
VCC
I
Power supply input pin
-
○
2
N.C.
-
-
-
-
3
N.C.
-
-
-
-
4
DRAIN
I/O
MOSFET DRAIN pin
-
-
5
SOURCE
I/O
MOSFET SOURCE pin
○
○
6
N.C.
-
-
-
-
7
GND
I/O
GND pin
○
-
8
FB
I
Feedback signal input pin
-
○
●I/O Equivalent Circuit Diagram
1
GND
2
FB
3N.C
5 SOURCE
6
VCC
VCC
7N.C.
GND
4DRAIN
8
N.C.
DRAIN
SOURCE
Internal MOSFET
Internal
Circuit
SOURCE Internal MOSFET
VREF
VREF
RFB
FB
Figure 2. I/O Equivalent Circuit Diagram
5/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
●Block Diagram
FeedBack
With
Isolation
VO
AC
FUSE
+
-
Filter Diode
Bridge
PWM Control
Leading Edge
Blanking
(typ=250ns)
VCC UVLO
13.5V
/ 8.2V
DRAIN
DRIVER
S
Q
R
+
-
Current
Limiter
PWM
Comparator
+
-
+
+
-
Burst
Comparator
GND
Slope
Compensation
VCC
FB
SOURCE
+
-
30k
+
-
OLP
Internal Block
+
-
VCC OVP
27.5V
4.0V
Cvcc
VH
Vs
CM
Rs
Soft Start AC Input
Compensation
OSC
(65kHz)
Frequency
Hopping
100us
Filter
1
864ms
Timer
MAX
DUTY
7
5
12V Clamp
Circuit
4.0V
Line Reg
4
4.0V
1M
Starter
10uA
Figure 3. Block Diagram
RS
VCC
DRAIN
6/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
●Description of Blocks
(1) Start circuit (DRIAN: 4pin)
This IC built in Start circuit (tolerates 650V). It enables to be low standby mode electricity and high speed starting.
After starting, consumption power is idling current ISTART3（typ=10uA） only.
Reference values of Starting time are shown in Figure-7. When Cvcc=10uF it can start less than 0.1 sec.
Figure4. Block diagram of start circuit
ISTART1
ISTART2
Vsc VUVLO1
10V
VCC Voltage[V]
ISTART3
0
Start Up Current [mA]
Figure 5. Start current vs VCC voltage Figure 6. Start time (reference value)
* Start current flows from the DRAIN pin
ex) Consumption power of start circuit only when the Vac=100V
PVH＝100V*√2*10uA=1.41mW
ex) Consumption power of start circuit only when the Vac=240V
PVH＝240V*√2*10uA=3.38mW
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 5 10 15 20 25 30 35 40 45 50
起動時間[sec]
Cvcc [uF]
+
-
VCCUVLO
VCC
Starter
Cvcc
DRAIN
FUSE
+
-
Diode
Bridge
SW1
AC
85-265Vac
7/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
(2) Start sequences
(Soft start operation, light load operation, and auto recovery operation during overload protection)
Start sequences are shown in Figure 7. See the sections below for detailed descriptions.
Vout
Switing
VH
VCC(1pin)
FB(8pin)
Soft
Start
64ms
Iout
Normal Load
Light LOAD
Within
32ms
VCC=8.2V
Over Load
Internal REF
Pull Up
Burst mode
A B CDE F G H I
Switching
stop
VCC=13.5V
FB OLP ON
Switching
Figure 7. Start sequences Timing Chart
A: Input voltage VH is applied
B: This IC starts operation when VCC pin voltage rises and VCC > VUVLO1 (13.5 V typ).Switching function starts when other
protection functions are judged as normal. Until the secondary output voltage becomes constant level, VCC voltage drops
because of the VCC consumption current. VCC recharge function start if VCC voltage < VCHG1 （8.7V typ）
C: With the soft start function, over current limit value is restricted to prevent any excessive rise in voltage or current.
D: When the switching operation starts, VOUT rises.The output voltage become to stable state, VCC voltage also become to
stable state through auxiliary winding.Please set the rated voltage within the TFOLP1b period (32ms typ) from VCC voltage
> VUVLO1.
E: During a light load, if it reaches FB voltage < VBST (= 0.4Vtyp), the IC starts burst operation to keep power consumption
low.During burst operation, it becomes low-power consumption mode.
F: When the FB Voltage＞VFOLP1A（=2.8V typ）, it becomes a overload operation.
G: When FB pin voltage keeps VFOLP1A (= 2.8V typ) at or above TFOLP1 (64ms typ), the overload protection function is triggered
and switching stops 64ms later. If the FB pin voltage becomes FB<VFOLP1B even once, the IC’s FB OLP timer is reset.
H: If the VCC voltage drops to VCC < VUVLO2 (8.2Vtyp) or below, restart is executed.
I: The IC’s circuit current is reduced and the VCC pin value rises. (Same as B)
8/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
(3) VCC pin protection function
BM2PXX3F built in VCC low voltage protection function VCCUVLO (Under Voltage Lock Out), over voltage protection
function VCC OVP (Over Voltage Protection) and VCC charge function that operates in case of dropping the VCC
voltage.VCC UVLO and VCC OVP monitor VCC pin and prevent VCC pin from destroying switching MOSFET at
abnormal voltage.
VCC charge function stabilizes the secondary output voltage by charging from the high voltage line by start circuit at
dropping the VCC voltage.
(3-1) VCC UVLO ／ VCC OVP function
VCCUVLO is auto recovery protection. VCCOVP is latch protection. Refer to the operation figure-8.
VCCOVP built in mask time TLATCH（typ=100us）.By this function, this IC masks pin generated surge etc.
This function operates detection in case of continuing VCC pin voltage > VOVP1 （typ=27.5V）
VUVLO1 VCC
Time
ON
OFF
Vovp1
OUT
Switching
VCHG1
VCC UVLO
ON
OFF
VCC OVP
OFF
ON
OFF
AB C D F
VH
G H I J
VUVLO2
A
Time
ON
VCC Charge
Function
ON
OFF
ON
VCHG2
E
VLATCH
K
Figure 8. VCC UVLO / OVP Timing Chart
A: DRAIN voltage input, VCC pin voltage starts rising.
B: VCC>VUVLO1, DC/DC operation starts
C: VCC< VCHG1, VCC charge function operates and the VCC voltage rises.
D: VCC > VCHG2, VCC charge function is stopped.
E: VCC > VOVP1, function is detected
F: VCC > VOVP1, continues TLATCH (typ =100us), switching is stopped by the VCCOVP function.
G: VH is OPEN.VCC Voltage is fall.
H: Same as C.
I: Same as D.
J: VCC<VUVLO2, Switching is stopped by the VCC UVLO function
K: VCC< VLATCH, released from latch
9/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
（3-2）VCC Charge function
After VCC charge function operates once the VCC pin >VUVLO1 and the DC/DC operation starts then the VCC pin
voltage drops to <VCHG1. At that time the VCC pin is charged from DRAIN pin through start circuit.
By this operation, BM2PXX2 doesn’t occur to start failure.
When VCC pin voltage rises to VCC >VCHG2, charge is stopped. The operations are shown in figure 9.
VCC
VUVLO1
VUVLO2
VCHG1
Switching
VH charge
charge charge
OUTPUT
voltage
VCHG2
charge charge
A B C D E F G H
VH
Figure 9. Charge operation VCC pin charge operation
A: DRAIN pin voltage rises, charge starts to VCC pin by the VCC charge function.
B: VCC > VUVLO1, VCC UVLO function releases, VCC charge function stops, DC/DC operation starts.
C: When DC/DC operation starts, the VCC voltage drops.
D: VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises...
E: VCC > VCHG2, VCC recharge function stops.
F: VCC < VCHG1, VCC recharge function operates and VCC pin voltage rises...
G: VCC > VCHG2, VCC recharge function stops.
H: After start of output voltage finished, VCC is charged by the auxiliary winding VCC pin stabilizes.
10/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
(4) DCDC driver (PWM comparator, frequency hopping, slope compensation, OSC, burst)
BM2PXX3F is current mode PWM control.
An internal oscillator sets a fixed switching frequency (65kHz typ).
BM2PXX3F is integrated switching frequency hopping function which changes the switching frequency to fluctuate as
shown in Figure 10 below.
The fluctuation cycle is 125 Hz typ.
65
Switching Frequency
[kHz]
69
125 Hz(8ms)
Time
61
62
63
64
66
68
67
500us
Figure 10. Frequency hopping function
Max duty cycle is fixed as 75% (typ) and MIN pulse width is fixed as 400 ns (typ).
With current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur.
As a countermeasure to this, BM2PXX3F is built in slope compensation circuits.
BM2PXX3F is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the
load is light.
FB pin is pull up by RFB (30 kΩ typ).
FB pin voltage is changed by secondary output voltage (secondary load power).
FB pin is monitored, burst mode operation and frequency detection start.
Figure 12 shows the FB voltage, and switching frequency, DCDC operation
・mode1: Burst operation
・mode2: Frequency reduction operation.
・mode3: Fixed frequency operation. (operate at the max frequency)
・mode4: Over load operation. (detect the over load state and stop the pulse operation)
X
Y
FB [V]
0.40V 1.25V
25kHz
65kHz
2.00V
mode1 mode2 mode3
2.80V
mode4
Figure 11. Switching operation state changes by FB pin voltage
11/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
(5) Over Current limiter
BM2PXX3F is built in Over Current limiter per cycle. If the SOURCE pin exceeds a certain voltage, switching is
stopped. It is also built in AC voltage compensation function. This is the function which compensates the maximum
power as the AC voltage’s change by increasing over current limiter with time.
Shown in figure-12, 13, and 14.
ON
OFF
OFF
[DC/DC]
@AC100V
Primary Peak Current
Iepak(DC)＝Constant
Iepak(AC)@Vin=100V
Iepak(AC)@Vin=240V
ON
OFF
OFF
[DC/DC]
@AC240V
65kHz(15.3us)
Tdelay
Tdelay
ON
OFF
OFF
[DC/DC]
@AC100V
Iepak(DC)= included conpensation
Tdelay
Iepak(AC)@Vin=100V
Iepak(AC)@Vin=240V
ON
OFF
OFF
[DC/DC]
@AC100V
65kHz(15.3us)
Primary Peak Current
Tdelay
Figure 12. No AC voltage compensation function Figure13. built-in AC compensation
voltage
Primary peak current is decided as the formula below.
Primary peak current: Ipeak = Vcs/Rs + Vdc/Lp*Tdelay
Vcs：Over current limiter voltage internal IC, Rs：Current detection resistance, Vdc input DC voltage, Lp：Primary
inductance,
Tdelay：delay time after detection of over current limiter
X
Y
Time [us]0.0 15.3us
0.400V
0.704V
7.6us
+20mV/us
0.552V
CS Limitter[V]
Figure 14. Over current limiter voltage
（6）L.E.B period
When the driver MOSFET is turned ON, surge current occurs at each capacitor component and drive current.
Therefore, because SOURCE pin voltage rises temporarily, the detection errors may occur in the over current limiter
circuit.
To prevent detection errors, DRAIN is switched from high to low and the SOURCE signal is masked for 250 ns by the
on-chip LEB (Leading Edge Blanking) function.
12/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
(7) SOURCE pin (5pin) short protection function
When the SOURCE pin (5pin) is shorted, BM2PXX3F is over heat.
BM2PXX3F built in short protection function to prevent destroying.
(8) SOURCE pin (5pin) open protection
If the SOURCE pin becomes OPEN, BM2PXX3F may be damaged.
To prevent to be damaged, BM2PXX3F built in OPEN protection circuit（auto recovery protection）.
(9) Output over load protection function （FB OLP Comparator）
The output overload protection function monitors the secondary output load status at the FB pin, and stops switching
when an overload occurs. In case of an overload, the output voltage is reduced and current no longer flows to the
photo coupler, so the FB pin voltage rises.
When the FB pin voltage > VFOLP1A (2.8 V typ) continuously for the period TFOLP1 (64ms typ), it is judged as an overload
and stops switching.
When the FB pin > VFOLP1A (2.8 V typ), if the voltage goes lower than VFOLP1B (2.6V typ) during the period TFOLP1 (64ms
typ), the overload protection timer is reset. The switching operation is performed during this period TFOLP1 (64ms typ).
At startup, the FB voltage is pulled up to the IC’s internal voltage, so operation starts at a voltage of VFOLP1A (2.8 V typ)
or above. Therefore, at startup the FB voltage must be set to go to VFOLP1B (2.6 V typ) or below during the period TFOLP1
(64ms typ), and the secondary output voltage’s start time must be set within the period TFOLP1 (64ms typ) following
startup of the IC.
Recovery from the once detection of FBOLP, after the period TFOLP2 (512 ms typ)
VCC
VUVLO 1
VUVLO 2
VCHG1
Switching
FB VFOLP 1A
64ms 64ms
512ms
VH
charge
chargecharge
512ms
VCHG 2
AB C D E F G H
Figure 15. Over load protection (Auto recovery)
A: The FBOLP comparator detects over load for FB>VFOLP1A
B: If the State of A continues for the period TFOLP1 (64ms typ), it is judged as an overload and stops switching after
64ms.
C: While switching stops for the over load protection function, the VCC pin voltage drops and VCC pin voltage
reaches < VCHG1, the VCC charge function operates so the VCC pin voltage rises.
D: VCC charge function stops when VCC pin voltage > VCHG2
E: If TFOLP2 （typ =512ms） go on from B point, Switching function starts on soft start.
F: If TFOLP1 (64ms typ) go on from E point to continues an overload condition (FB>VFOLP1A), Switching function stops at
F point.
G: While switching stops VCC pin voltage drops to < VCHG1, VCC charge function operates and VCC pin voltage rises.
H: If VCC pin (1pin) voltage becomes over VCHG2 by the VCC charge function, VCC charge function operation stops.
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TSZ22111・15・001
●Operation mode of protection circuit
Operation mode of protection functions are shown in table2.
Table2 Operation mode of protection circuit
Function
Operation mode
VCC Under Voltage Locked Out
Auto recovery
VCC Over Voltage Protection
Latch（with 100us timer）
TSD
Latch（with 100us timer）
FB Over Limited Protection
Auto recovery（with 64ms timer）
SOURCE Open Protection
Auto recovery
●Sequence
The sequence diagram is show in Fig-18.
All condition transits OFF Mode VCC<8.2V
Figure 16. The sequence diagram
VCC
>
13
.
5
V
Soft Start
1
ALL MODE
Time
>
2
.
0
ms
Soft Start
4
Time
>
8
.
0
ms
FB
<
0
.
40
V
Burst MODE
(
Pulse OFF
)
FB
>
0
.
40
V
Normal MODE
OFF MODE
OLP MODE
(
Pulse Stop
)
FB
>
2
.
80
V
FB
<
2
.
60
V
LATCH OFF MODE
(
Pulse Stop
)
Temp
>
145
℃
VCC
<
7
.
7
V
VCC
<
8
.
2
V
Time
>
0
.
5
ms
Soft Start
2
Time
>
1
.
0
ms
Soft Start
3
PULSE OFF
FB
>
2
.
80
V
(
64
ms
)
FBOLP
OFF TIMER
(
512
ms
)
SOURCE OPEN
(
Pulse Stop
)
OPEN
NORMAL
VCC>27.5V
14/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
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TSZ22111・15・001
● Thermal loss
The thermal design should set operation for the following conditions.
(Since the temperature shown below is the guaranteed temperature, be sure to take a margin into account.)
1. The ambient temperature Ta must be 105℃ or less.
2. The IC’s loss must be within the allowable dissipation Pd.
The thermal abatement characteristics are as follows.
(PCB: 70 mm × 70mm × 1.6 mm, mounted on glass epoxy single-layer substrate)
Figure 17. SOP8 Thermal Abatement Characteristics
0
100
200
300
400
500
600
700
800
900
1000
0 25 50 75 100 125 150
Pd[mW]
Ta[℃]
15/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
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TSZ22111・15・001
●Ordering Information
B
M
2
P
X
X
3
F
-
GE2
Product name
Package
F : SOP8
Packaging and
forming specification
E2: Embossed tape and reel
●Marking Diagram
Series
Part Number
BM2P053F
2P053
BM2P093F
2P093
SOP8 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
17/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
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TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting
the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the GND and supply lines of the digital and
analog blocks to prevent noise in the GND and supply lines of the digital block from affecting the analog block. Furthermore,
connect a capacitor to GND at all power supply pins. Consider the effect of temperature and aging on the capacitance value
when using electrolytic capacitors.
3. GND Voltage
Ensure that no pins are at a voltage below that of the GND pin at any time, even during transient condition.
4. GND Wiring Pattern
When using both small-signal and large-current GND traces, the two GND traces should be routed separately but connected to
a single GND at the reference point of the application board to avoid fluctuations in the small-signal GND caused by large
currents. Also ensure that the GND traces of external components do not cause variations on the GND voltage. The GND lines
must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of
the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a
70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and
copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The
electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one
power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of GND
wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC
to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off
completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static
discharge, GND the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging
the IC. Avoid nearby pins being shorted to each other especially to GND, power supply and output pin. Inter-pin shorts could be
due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge
deposited in between pins during assembly to name a few.
18/19
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TSZ22111・15・001
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely
low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this
way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC.
So unless otherwise specified, unused input pins should be connected to the power supply or GND line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or
transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as
applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided.
Figure 18. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and
the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should
always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period,
the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. The
IC should be powered down and turned ON again to resume normal operation because the TSD circuit keeps
the outputs at the OFF state even if the TJ falls below the TSD threshold.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit
is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications
characterized by continuous operation or transitioning of the protection circuit.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
19/19
BM2PXX3F Series
TSZ02201-0F2F0A200060-1-2
29.Nov.2018.Rev.010
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
date
Rev. No.
Revision Point
2012.07.19
001
New Release
2013.11.18
005
P7 An explanation for Figure7
P8 An explanation for VCC_UVLO/VCC_OVP function
An explanation for Figure8
P11 An explanation for Over Current limiter
P12 An explanation for Output over load protection function
An explanation for Figure15
P13 Table2
2015.02.23
006
P1 Package size
P16 Physical Dimension
2015.05.15
007
P13 Operation mode of protection circuit
P13 Sequence
2015.09.24
008
P7 An explanation of Start sequence
P8 An explanation of VCC pin protection function
P8 An explanation of VCC UVLO / VCC OVP function
P9 An explanation of VCC Charge function
P11 An explanation of Over Current Limiter
P12 An explanation of Output over load protection function
2017.03.07
009
P2 explanation of package power
P2 Format for Electrical Characteristics of MOSFET
P3 Format for Electrical Characteristics of Control IC
P3 An explanation of Thermal shut down temperature
P7 An explanation of Start sequences
P8 An explanation of Figure8
P9 An explanation of VCC pin protection function
P12 An explanation of OUTPUT over load protection function
2018.11.29
010
P1 Features and Basic specifications
P1 Application circuit
P2 An explanation of Absolute Maximum Ratings
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6.In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.Confirm that operation temperature is within the specified range described in the product specification.
9.ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
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will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
