M2S090T-FCS325I - MICROCHIP TECHNOLOGY

October 2014 I

SmartFusion2 System-on-Chip FPGAs Product Brief

Microsemi’s SmartFusion®2 SoC FPGAs integrate fourth generation flash-based FPGA fabric, an ARM® Cortex®-M3 processor, and

high-performance communications interfaces on a single chip. The SmartFusion2 family is the industry’s lowest power, most reliable

and highest security programmable logic solution. Sma rtFusion2 FPGAs offer up to 3.6X the gate density, up to 2X the performance

of previous flash-based FPGA families, and includes multiple memory blocks and multiply accumulate blocks for DSP processing.

The 166 MHz ARM Cortex-M3 processor is enhanced with an embedded trace macrocell (ETM), memory protection unit (MPU),

8 kbyte instruction cache, and additional peripherals, including controller area network (CAN), Gigabit Ethernet, and high speed

universal serial bus (USB). High sp eed serial interfaces include PCI EXPRESS® (PCIe®), 10 Gbps attachment unit interface (XAUI)

/ XGMII extended sublayer (XGXS) plus native serialization/deserialization (SERDES) communication, while double data rate 2

(DDR2)/DDR3 memory controllers provide high speed memory interfaces.

SmartFusion2 Family

Reliability

• Single Event Upset (SEU) Immune

– Zero FIT FPGA Configuration Cells

• Junction Temperature: 125°C – Military Temperature,

100°C – Industrial Temperature, 85°C – Commercial

Temperature

• Single Error Correct Double Error Detect (SECDED)

Protection on the Following:

– Ethernet Buffers

– CAN Message Buffers

– Cortex-M3 Embedded Scratch Pad Memory

(eSRAMs)

– USB Buffers

–PCIe Buffer

– DDR Memory Controllers with Optional SECDED

Modes

• Buffers Implemented with SEU Resistant Latches on the

Following:

– DDR Bridges (MSS, MDDR, FDDR)

– Instruction Cache

– MMUART FIFOs

– SPI FIFOs

• NVM Integrity Check at Power-Up and On-Demand

• No External Configuration Memory Required—Instant-

On, Retains Configuration When Powered Off

Security

• Design Security Features (Available on all Devices)

– Intellectual Property (IP) Protection Through Unique

Security Features and Use Models New to the PLD

Industry

– Encrypted User Key and Bitstream Loading,

Enabling Programming in Less-Trusted Locations

– Supply-Chain Assurance Device Certificate

– Enhanced Anti-Tamper Features

– Zeroization

Low Power

• Low Static and Dynamic Power

– Flash*Freeze Mode for Fabric

• Power as low as 13 mW/Gbps per lane for SERDES

devices

• Up to 50% lower total power than competing SoC

devices

High-Performance FPGA

• Efficient 4-Input LUTs with Carry Chains for High-

Performance and Low Power

• Up to 236 Blocks of Dual-Port 18 Kbit SRAM (Large

SRAM) with 400 MHz Synchronous Perfo rmance (512 x

36, 512 x 32, 1 kbit x 18, 1 kbit x 16, 2 kbit x 9, 2 kbit x 8,

4 kbit x 4, 8 kbit x 2, or 16 kbit x 1)

• Up to 240 Blocks of Three-Port 1 Kbit SRAM with 2

Read Ports and 1 Write Port (micro SRAM)

• High-Performance DSP Signal Processing

– Up to 240 Fast Mathblocks with 18 x 18 Signed

Multiplication, 17 x 17 Unsigned Multiplication and

44-Bit Accumulator

Product Brief

SmartFusion2 System-on-Chip F P GAs Product Brief

II Product Brief Revision 18

Microcontroller Subsystem (MSS)

• Hard 166 MHz 32-Bit ARM Cortex-M3 Processor

– 1.25 DMIPS/MHz

– 8 Kbyte Instruction Cache

– Embedded Trace Macrocel l (ETM)

– Memory Protection Unit (MPU)

– Single Cycle Multiplication, Hardware Divide

– JTAG Debug (4 wires), Serial Wire Debug (SWD,

2 Wires), and Serial Wire Viewer (SWV) Interfaces

• 64 KB Embedded SRAM (eSRAM)

• Up to 512 KB Embedded Nonvolatil e Memory (eNVM)

• Triple Speed Ethern et (TSE) 10/100/1000 Mbps MAC

• USB 2.0 High Speed On-The-Go (OTG) Controller with

ULPI Interface

• CAN Controller, 2.0B Compl iant, Conforms to ISO11898-1,

32 Transmit and 32 Receive Buffers

• Two Each: SPI, I2C, Multi-Mode UARTs (MMUART)

Peripherals

• Hardware Based Watchdog Timer

• 1 General Purpose 64-Bit (or two 32-bit) Timer(s)

• Real-T ime Calendar/Counter (RTC)

• DDR Bridge (4 Port Data R/W Buffering Bridge to DDR

Memory) with 64-Bit AXI Interface

• Non-Blocking, Multi-Layer AHB Bus Matrix Allowing Multi-

Master Scheme Supporting 10 Masters and 7 Slaves

• Two AHB-Lite/APB3 Interfaces to FPGA Fabric

(Master/Slave Capable)

• Two DMA Controllers to Offload Data Transactions from

the Cortex-M3 Processor

– 8-Channel Peripheral DMA (PDMA) for Data Transfer

Between MSS Peripherals and Memory

– High-Performance DMA (HPDMA) for Data Transfer

Between eSRAM and DDR Memories

Clocking Resources

• Clock Sources

– Up to Two High Precision 32 KHz to 20 MHz Main

Crystal Oscillator

– 1 MHz Embedded RC Oscillator

– 50 MHz Embedded RC Osci llator

• Up to 8 Clock Conditioning Circuits (CCCs) with Up to 8

Integrated Analog PLLs

– Output Clock with 8 Output Phases and 45° Phase

Difference (Multiply/Divide, and Delay Capabilities)

– Frequency: Input 1 MHz to 200 MHz, Output 20 MHz to

400 MHz

High Speed Serial Interfaces

• Up to 16 SERDES Lanes, Each Supporting:

– XGXS/XAUI Extension (To Implement a 10 Gbps

(XGMII) Ethernet PHY Interface)

– Native SERDES Interface Facili tates Implementation of

Serial RapidIO in Fabric or an SGMII Interface to the

Ethernet MAC in MSS

– PCI Express (PCIe) Endpoint Controller

x1, x2, x4 Lane PCI Express Core

Up to 2 Kbytes Maximum Payload Size

64-Bit/32-Bit AXI and 64-Bit/32-Bit AHB Master and

Slave Interfaces to the Application Layer

High Speed Memory Interfaces

• Up to 2 High Speed DDRx Memory Controllers

– MSS DDR (MDDR) and Fabric DDR (FDDR)

Controllers

– Supports LPDDR/DDR2/DDR3

– Maximum 333 MHz DDR Clock Rate

– SECDED Enable/Disable Feature

– Supports Various DRAM Bus Width Modes, x8, x9, x16,

x18, x32, x36

– Supports Command Reordering to Optimize Memory

Efficiency

– Supports Data Reordering, Returning Critical Word

First for Each Command

• SDRAM Support through the SMC_FIC and Additional Soft

SDRAM Memory Controller

Operating Voltage and I/Os

• 1.2 V Core Voltage

• Multi-Standard User I/Os (MSIO/MSIOD)

– LVTTL/LVCMOS 3.3 V (MSIO Only)

– LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V

– DDR (SSTL2_1, SSTL2_2)

– LVDS, MLVDS, Mini-LVDS, RSDS Differential

Standards

–PCI

– LVPECL (receiver only)

• DDR I/Os (DDRIO)

– DDR2, DDR3, LPDDR, SSTL2, SSTL18, HSTL

– LVCMOS 1.2V, 1.5V, 1.8V, 2.5V

• Market Leading Number of User I/Os with 5G SERDES

SmartFusion2 System-on-Chip FPGAs Product Brief

Product Brief Revision 18 III

SmartFusion2 SoC FPGA Block Diagram

Acronyms

AES Advanced Encryption Standard MMUART Multi-Mode UART

AHB Advanced High-Performance Bus MPU Memory Protection Unit

APB Advanced Peripheral Bus MSIO Multi-Standard I/O

AXI Advanced eXtensible Interface MSS Microcontroller Subsystem

COMM_BLK Communication Block PUF Physically Unclonable Function

DDR Double Data Rate SECDED Single Error Correct Double Error Detect

DPA Differential Power Analys is SEU Single Event Upset

ECC Ell iptic Curve Cryptography SHA Secure Hashing Algorithm

EDAC Error Detection and Correction SMC_FIC Soft Memory Controller

ETM Embedded Trace Macrocell TSE Triple Speed Ethernet (10/ 100/1000 Mbps)

FDDR DDR2/3 Controller in FPGA Fabric ULPI UTMI + Low Pin Interface

FIC Fabric Interface Controller UTMI USB 2.0 Transceiver Macrocell Interface

FIIC Fabric Interface Interrupt Controller WDT Watchdog Timer

HS USB OTG High Speed USB 2.0 On-The-Go XAUI 10 Gbps Att achment Unit Interface

IAP In-Application Programming XGMII 10 Gigabit Media Independent Interface

MACC Multiply-Accumulate XGXS XGMII Extended Sublayer

MDDR DDR2/3 Controller in MSS

SmartFusion2 System-on-Chip F P GAs Product Brief

IV Product Brief Revision 18

Table 1 • SmartFusion2 SoC FPGA Product Family

Features M2S005 M2S010(T) M2S025(T) M2S050(T) M2S090(T) M2S100(T) M2S150(T)

Logic/DSP

Maximum Logic Elements

(4LUT + DFF)* 6,060 12,084 27,696 56,340 86,316 99,512 146,124

Mathblocks (18x18) 11 22 34 72 84 160 240

Fabric Interface Controllers (FICs) 1 2 1 2

PLLs and CCCs 2 6 8

MSS

Cortex-M3 + Instruction cache Yes

eNVM (kbytes) 128 256 512

eSRAM (kbytes) 64

eSRAM (kbytes) Non-SECDED 80

CAN, 10/100/1000 Ethernet,

HS USB 1 each

Multi-Mod e UART, SPI, I2C, Timer 2 each

Fabric Memory

LSRAM 18K Blocks 10 21 31 69 109 160 236

uSRAM1K Blocks 11 22 34 72 112 160 240

Total RAM (kbits) 191 400 592 1314 2074 3040 4488

High Speed

DDR Controllers (Count x Width) 1x18 2x36 1x18 2x36

SERDES Lanes (T) 0 4 8 4 8 16

PCIe Endpoints 0 1 2 4

User I/Os

MSIO (3.3 V) 115 123 157 139 309 292 292

MSIOD (2.5 V) 28 40 40 62 40 106 106

DDRIO (2.5 V) 66 70 70 176 76 176 176

Total User I/O 209 233 267 377 425 574 574

Grades

Commercial (C), Industrial (I),

Military (M) C,I C,I,M

Note: *Total logic may vary base d on utilization of DSP and memori es in your design. Refer to the SmartFusion FPGA Fabric UG for

details.

*Feature availability is package d ependent, refer to Table 3.

SmartFusion2 System-on-Chip FPGAs Product Brief

Product Brief Revision 18 V

I/Os Per Package

Table 2 • I/Os per Package and Packag e Options

Package Options

Type FCS325 VF256 FCS536 VF400 FCV484 VQ144 FG484 FG676 FG896 FC1152

Pitch (mm) 0.5 0.8 0.5 0.8 0.8 0.5 1.0 1.0 1.0 1.0

Length x

Width (mm) 11x11 14x14 16x16 17x17 19x19 20x20 23x23 27x27 31x31 35x35

Device I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes

M2S005 161 - 171 - 84 - 209 -

M2S010 (T)3138 2195 484-233 4

M2S025 (T)3180 2138 2207 4267 4

M2S050 (T)3200 2207 4267 4 377 8

M2S090 (T)2,3 180 4 267 4 425 4

M2S100 (T)4574 8

M2S150 (T)4293 4 273¹ 4¹ 574 16

Notes:

1. Preliminary

2. 090 FCS325 is 11x13.5 package dimension

3. Mil Temp 010/025/050/090 are only available in the FG484 package

4. Mil Temp 100/150 devices are only available in the FC1152 package

Pin compatible to other devices in the same package.

5. The M2S090(T) device in the FC S/FCSG325 package is availabl e with an ordering code of XZ48. The XZ48 orde ring code pre-configures

the device for Auto Update mode. Minimum Order quantities apply, contact your local Microsemi sales office for details.

SmartFusion2 System-on-Chip F P GAs Product Brief

VI Product Brief Revision 18

Features per Device/Package Combination

Table 3 • Features per Device/Package Combination

Features

Package Devices MDDR FDDR Crystal

Oscillators

5G6

SERDES

Lanes PCIe

Endpoints USB

MSIO

(3.3 V

Max)

MSIOD

(2.5 V

Max)

DDRIO

(2.5 V

Max) Total

User I/O

VQ1445M2S005 – – 2 – – 1 52 9 23 84

M2S010 – – 2 – – 1 50 11 23 84

VF256

M2S005 –– 2 – – 11191230161

M2S010 (T) x181– 2 2 1 1 66 8 64 138

M2S025 (T) x181– 2 2 1 1 66 8 64 138

FCS325

M2S025 (T) x181– 2 2 1 1942264180

M2S050 (T) x182– 1 2 1 0902288200

M2S090 (T) x181– 2 4 2 1 104 12 64 180

VF400

M2S005 x181– 2 – – 1792864171

M2S010 (T) x181– 2 4 1 1993264195

M2S025 (T) x181– 2 4 1 1 111 32 64 207

M2S050 (T) x182– 1 4 1 0873288207

FCV4845M2S150 (T) x181x1812 4 4 1 TBD TBD TBD 273

FG484

M2S005 x181– 2 – – 1 115 28 66 209

M2S010 (T) x181– 2 4 1 1 123 40 70 233

M2S025 (T) x181– 2 4 1 1 157 40 70 267

M2S050 (T) x182– 1 4 1 0 105 40 122 267

M2S090 (T) x181– 2 4 2 1 157 40 70 267

FCS536 M2S150 (T) x181x1812 4 4 1 151 16 126 293

FG676 M2S090 (T) x181– 2 4 2 1 309 40 76 425

FG896 M2S050 (T) x364x3641 8 2 1 139 62 176 377

FC1152 M2S100 (T) x363x3632 8 2 1 292 106 176 574

M2S150 (T) x363x3632 16 4 1 292 106 176 574

Notes:

1. DDR supports x18, x16, x9, and x8 modes

2. DDR supports x18 and x16 modes

3. DDR supports x36, x32, x18, x16, x9, and x8 modes

4. DDR supports x36, x32, x18, and x16 modes

5. Preliminary

6. Maximum SERDES rate for Mil temp devices is 3.125 Gbps

SmartFusion2 System-on-Chip FPGAs Product Brief

Product Brief Revision 18 VII

Table 4 • Programming Interfaces Available

Package Devices JTAG SPI_0 Fl ash_GOLDEN_N System Controller SPI Port

VQ144 M2S005 Yes Yes No No

M2S010 Yes Yes No No

VF256 M2S005 Yes Yes Yes Yes

M2S010 (T) Yes Yes Yes No

M2S025 (T) Yes Yes Yes No

FCS325 M2S025 (T) Yes Yes No No

M2S050 (T) Yes Yes No No

M2S090 (T) Yes Yes No No

VF400 M2S005 Yes Yes Yes Yes

M2S010 (T) Yes Yes Yes Yes

M2S025 (T) Yes Yes Yes Yes

M2S050 (T) Yes No Yes Yes

FCV484 M2S150 (T) Yes Yes Yes Yes

FG484 M2S005 Yes Yes Yes Yes

M2S010 (T) Yes Yes Yes Yes

M2S025 (T) Yes Yes Yes Yes

M2S050 (T) Yes No Yes Yes

M2S090 (T) Yes Yes Yes Yes

FCS536 M2S150 (T) Yes Yes Yes Yes

FG676 M2S090 (T) Yes Yes Yes Yes

FG896 M2S050 (T) Yes No Yes Yes

FC1152 M2S100 (T) Yes Yes Yes Yes

M2S150 (T) Yes Yes Yes Yes

SmartFusion2 System-on-Chip F P GAs Product Brief

VIII Product Brief Revision 18

SmartFusion2 Ordering Information

Note: *M2S005 devices are not available with Tran sceivers or in the Military temperature grade

SmartFusion2 Military Temperature Devices

Table 5 • SmartFusion2 Design Security Military Temperature Device Offering

M2S010T-1FG484M M2S010T-1FGG484M

M2S025T-1FG484M M2S025T-1FGG484M

M2S050T-1FG484M M2S050T-1FGG484M

M2S090T-1FG484M M2S090T-1FGG484M

M2S100T-1FC1152M M2S100T-1FCG1152M

M2S150T-1FC1152M M2S150T-1FCG1152M

Note: Gold Wire bonds are available for the FG48 4 package by appending X399 to the part number when ordering, for

example: M2S090T-1FG484MX399

Speed Grade

Blank = PCIe Gen 1 Support Only

T = With Transceiver

Blank = No Transceiver

1 = 15 % Faster than STD, PCIe Gen 1 and Gen 2

M2S050 T FG

Part Number (Digits Indicate Thousands of LUTs)

Prefix

Package Type

VF =

=Very Fine Pitch Ball Grid Array (0.8 mm pitch)

896 I

Package Lead Count

Lead-Free Packaging

Application (Temperature Range)

Blank = Commercial (0°C to +85°C Junction Temperature)

I = Industrial (

–

40°C to +100°C Junction Temperature)

M = Military (–55°C to +125°C Junction Temperature)

Blank = Standard Packaging

G = RoHS-Compliant

M2S005

M2S010

M2S025

M2S090

M2S050

M2S100

M2S150

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

FC Flip Chip Ball Grid Array (1.0 mm pitch)

VQ = Plastic Quad Flat Pack Rectangular Package (0.5 mm pitch)

FCS Flip Chip Ball Grid Array (0.5 mm pitch)

FCV = Very Fine Pitch Flip Chip Ball Grid Array (0.8 mm pitch)

SmartFusion2 System-on-Chip FPGAs Product Brief

Product Brief Revision 18 IX

SmartFusion2 Device Status

Refer to the SmartFusion2 Datasheet for device status.

SmartFusion2 Datasheet and Pin Descriptions

The datasheet and pin descriptions are published separately:

SmartFusion2 Datasheet

SmartFusion2 Pin Descriptions

Marking Specification Details

Microsemi normally topside marks the full orde ring part number on each d evice. The figu re be low provide s th e de tails for

each character code present on Microsemi’s SmartFusion2 SoC FPGA devices.

Description:

• Device Name (M2XXXX): M2S for SmartFusion2 Devices

Example: M2S050

• Package (PK###): Available Package as below

PK: Package code:

FG(G): Fine Pitch BGA, 1.00 mm pitch

FC(G): Flip Chip Fine Pitch BGA with Metal LID on top, 1.00 mm pitch

FCV(G): Flip Chip Very Fine Pitch BGA with Metal LID on top, 0.8 mm pitch

FCS(G): Flip Chip Ultra Fine Pitch BGA with Metal LID on top, 0.5 mm pitch

VF(G): Very Fine Pitch BGA, 0.8 mm pitc h

VQ(G): Ultra Fine Pitch Thin Quad Flat Pack, 0.5 mm pitch

###: Number of Pins: Can be three or four digits. For example,144, 256, or 1152

• Wafer Lot (AAAAAAXX): Microsemi Wafer lot #

AAAAAA: Wafer lot number

XX: One or two characters revision code

• Speed Grade (-##): Speed Binning Number

Blank: Standard speed grade

-1: -1 Speed grade

Product Grade

Speed Grade

Package

Wafer Lot #

Country of Origin

Part Number Prefix

Date Code

Device Name

Customer Type

Number

SmartFusion2 System-on-Chip F P GAs Product Brief

X Product Brief Revision 18

• Product grade (Z): Product Grade; assigned as follows

C: Commercial

ES: Engineering Samples

I: Industrial

M: Military Temperature

PP: Pre Production

• Date Code (YYWW): Assembly Date Code

YY: Last two digits for seal year

WW: Work week the part was sealed

SS: Two blank spaces

%: Can be digital number or character for new product

• Customer Type Number: As specified on lot traveler

GW: Gold Wire bond

• Part number Prefix: Part number prefix, assigned as below

Blank: Non Transceivers

T: Transceivers

• Country of Origin (CCD): Assembly house country location

Country name: Country Code

China: CHN

Hong Kong: HKG

Japan: JPN

Korea, South: KOR

Philippines: PHL

Taiwan: TWN

Singapore: SGP

United States: USA

Malaysia: MYS

Revision 18 1-1

1 – SmartFusion2 Device Family Overview

Microsemi’s SmartFusion2 SoC FPGAs integrate fourth generation flash-based FPGA fabric, an ARM

Cortex-M3 processor, and high-performance communications interfaces on a single chip. The

SmartFusion2 FPGA is the industry’s lowest power, the most secure, and has the highest reliability of

any programmable logic solution. SmartFusion2 FPGAs offer up to 3.6X the gate density and up to 2X

the performance of previous flash-based FPGA families and includes multiple memory blocks and

multiply accumulate blocks for DSP processing. The 166 MHz ARM Cortex-M3 processor is enhanced

with ETM and 8 kbyte instruction cache, and ad ditional peripherals including CAN, Gigabit Ethernet, and

high speed USB. High speed serial interfaces enable PCIe, XAUI / XGXS plus native SERDES

communication while DDR2/DDR3 memory controllers provide high speed memory interfaces.

SmartFusion2 Chip Layout

Figure 1-1 • SmartFusion2 Chip Layout

MSS and

DDR

East I/Os

PLLs

West I/Os

PLLs

FPGA

Fabric

SERDES

uSRAM

(1 Kb)

Math

Blocks

LSRAM

(18 Kb)

SERDES

eNVM

Oscillators

System

Controller

Crystal

Fabric DDR

SmartFusion2 Device Family Overview

1-2 Revision 18

Reliability

SmartFusion2 flash-based fabric has zero FIT configuration rate due to its single event upset (SEU)

immunity, which is critical in reliability applications. The flash fabric also has the advantage that no

external configuration memory is required, making the device instant-on; it retains configuration when

powered off. To co mplement this unique FPGA capab ility, SmartFusion2 devices ad d reliability to many

other aspects of the device. Single Error Correct Double Error Detect (SECDED) protection is

implemented on the C ortex-M3 embedded scratch pad me mory, Ethernet, CAN and USB buffers, and is

optional on the DDR memory controllers. This means that if a one-bit error is detected, it will be

corrected. Errors of more than one bit are detected only and not corrected. SECDED error signals are

brought to the FPGA fabric to a llow the user to monitor th e status of these protected internal memories.

Other areas of the architecture are implemented with latches, which are more resistant to SEUs.

Therefore, no correction is needed in these locations: DDR bridges (MSS, MDDR, FDDR), instruction

cache and MMUART, SPI, and PCIe FIFOs.

Highest Security Devices

Building further on the intrinsic security benefits of flash nonvolatile memory technology, the

SmartFusion2 family incorporates essentially all the legacy security features that made the original

SmartFusion®, Fusion®, IGLOO®, and ProASIC®3 third-generation flash FPGAs and cSoCs the gold

standard for secure devices in the PLD industry. In addition, the fourth-generation flash-based

SmartFusion2 SoC FPGAs add many uniqu e design and data security features and use models new to

the PLD industry.

Design Security

Design security is protecting the intent of the owner of the design, such as keeping the design and

associated bitstream keys confidential, preventing design changes (insertion of Trojan Horses, for

example), and controlling the number of copies made throughout the device life cycle. Design security

may also be known as intellectual property (IP) protection. It is one aspect of anti-tamper (AT) protection.

Design security applies to the device from initial production, includes any updates such as in-the-field

upgrades, and can include decommissioning of the device at the end of its life, if desired. Good design

security is a prerequisite for good data security.

The following are the main design security features supported:

Table 1-1 • Design Security Features

Features M2S005 M2S090

M2S010 M2S100

M2S025 M2S150

M2S050

Software Memory Protection Unit (MPU) x x

FlashLock™ Passcode Security (256-bit) x x

Flexible security settings using flash lock-bits x x

Encrypted/Authenticated Design Key Loading x x

Symmetric Key Design Security (256-bit) x x

Design Key Verification Protocol x x

Encrypted/Authenticated Configuration Loading x x

Certificate-of-Conformance (C-of-C) x x

Back-Tracking Prevention (also known as, Versioning) x x

Device Certificate(s) (Anti-Counterfeiting) x x

SmartFusion2 System-on-Chip FPGAs Product Brief

Revision 18 1-3

Low Power

Microsemi’s flash-based FPGA fabric results in extremely low power design implementation with static

power as low as 7 mW. Flash*Freeze (F*F) technology provides an ultra-low power static mode

(Flash*Freeze mode) for SmartFusion2 devices, with power less than 7 mW for the largest device. F*F

mode entry retains all the SRAM and register information and the exit from F*F mode achieves rapid

recovery to active mode.

High-Performance FPGA Fabric

Built on 65 nm process technology, the SmartFusion2 FPGA fabric is composed of 4 building blocks: the

logic module, the large SRAM, the micro SRAM and the mathblock. The logic module is the basic logic

element and has advanced features:

• A fully permutable 4-input LUT (look-up table) optimized for lowest power

• A dedicated ca rry chain based on carry look-ahead technique

• A separate flip-flop which can be used independently from the LUT

The 4-input look-up table can be configured either to implement any 4-input combinatorial function or to

implement an arithmetic function where the LUT output is XORed with carry input to generate the sum

output.

Dual-Port Large SRAM (LSRAM)

Large SRAM (RAM1Kx18) is targeted for storing large memory for use with various operations. Each

LSRAM block can store up to 18,432 bits. Each RAM1Kx18 block contains two independent data ports:

Port A and Port B. The LSRAM is synchronous for both Read and Write operations. Operations are

triggered on the rising edge of the clock. The data output ports of the LSRAM have pipeline registers

which have control signals that are independent of the SRAM’s control signals.

Three-Port Micro SRAM (uSRAM)

Micro SRAM (RAM64x18) is the second type of SRAM which is embedded in the fabric of SmartFusion2

devices. RAM64x18 uSRAM is a 3-port SRAM; it has two read ports (Port A an d Port B) and one write

port (Port C). The two read ports are independent of each other and can perform Read operations in both

synchronous and asynchronous modes. The write port is always synchronous. The uSRAM block is

approximately 1 KB (1,152 bits) in size. These uSRAM blocks are primarily targeted for building

embedded FIFOs to be used by any embedde d fabric masters.

Features M2S005 M2S090

M2S010 M2S100

M2S025 M2S150

M2S050

Support for Configuration Variations x x

Fabric NVM and eNVM Integrity Tests x x

Information Services (S/N, Cert., USERCODE, and others) x x

Tamper Detection x x

Tamper Response (includes Zeroization) x x

ECC Public Key Design Security (384-bit) x

Hardware Intrinsic Design Key (SRAM-PUF) x

Table 1-1 • Design Security Features (continued)

SmartFusion2 Device Family Overview

1-4 Revision 18

Mathblocks for DSP Applications

The fundamental building block in any digital signal processing algorithm is the multiply-accumulate

function. SmartFusion2 FPGAs implement a custom 18 x18 Multiply-Accumulate (18 x18 MACC) block

for efficient implementation of complex DSP algorithms such as finite impulse response (FIR) filters,

infinite impulse response (IIR) filters, a nd fast Fourier transform (FFT) for fi ltering and image processi ng

applications.

Each mathblock has the following capabilities:

• Supports 18x18 signed mu ltiplicati ons natively (A[17:0] x B[17:0])

• Supports dot product; the multiplier computes:

(A[8:0] x B[17:9] + A[17:9] x B[8:0]) x 29

• Built-in addition, subtraction, and accumulatio n uni ts to combine multiplication results efficiently

In addition to the basic MACC function, DSP algorithms typically need small amounts of RAM for

coefficients and larger RAMs fo r data storage. SmartFusio n2 micro RAMs are idea lly suited to se rve the

needs of coefficient storage while the large RAMs are used for data storage.

Microcontroller Subsystem (MSS)

The microcontroller subsystem (MSS) contains a high-performance integrated Cortex-M3 processor,

running at up to 166 MHz. The MSS contains an 8 Kbyte instruction cache to provide low latency access

to internal eNVM and external DDR memory. The MSS provides multiple interfacing options to the FPGA

fabric in order to facilitate tight integration between the MSS and user logic in the fabric.

ARM Cortex-M3 Processor

The MSS uses the latest revision (r2p1) of the ARM Cortex-M3 processor. Microsemi’s implementation

includes the optional embedded trace ma crocell (ETM) features for easier development and debug a nd

the memory protection unit (MPU) for real-time operating system support.

Cache Controller

In order to minimize latency for instruction fetches when executing firmware out of off-chip DDR or

on-chip eNVM, an 8 kbyte, 4-way set associative instruction cache is implemented. This provides zero

wait state access for cache hits and is shared by both I and D code buses of the Cortex-M3 processor. In

the event of cache misses, cache lines are filled, replacing existing cache entries based on a least

recently used (LRU) algorithm.

There is a configurable option available to operate the cache in a locked mode, whereby a fixed segment

of code from either the DDR or eNVM is copied into the cache and locked there, so that it is not replaced

when cache misses occur. This would be used for performance-critical code.

It is also possible to disable the cache altogether, which is desirable in systems requiring very

deterministic execution times.

The cache is implemented with SEU tolerant latches .

DDR Bridge

The DDR bridge is a d ata bridge between four AHB bus masters and a single AXI bu s slave. The DDR

bridge accumulates AHB writes into write combining buffers prior to bursting out to external DDR

memory. The DDR bridge also includes read combining buffers, allowing AHB masters to efficiently read

data from the external DDR memory from a local buffer . The DDR bridge optimizes reads and writes from

multiple masters to a single external DDR memory. Data coherency rules between th e four masters and

the external DDR memory are implemented in hardware. The DDR bridge contains three write

combining / read buffers and one read buffer. All buffers within the DDR bridge are implemented with

SEU tolerant latches and are not subject to the single event upsets (SEUs) that SRAM exhibits.

SmartFusion2 devices implement three DDR bridges in the MSS, FDDR, and MDDR subsystems.

SmartFusion2 System-on-Chip FPGAs Product Brief

Revision 18 1-5

AHB Bus Matrix (ABM)

The AHB bus matrix (ABM) is a non-blocking, AHB-Lite multi-layer switch, supporting 10 master

interfaces and 7 slave interfaces. The switch decodes access attempts by masters to various slaves,

according to the memory map and security configurations. When multiple masters are attempting to

access a particular slave simultaneously, an arbiter associated with that slave decides which master

gains access, according to a config urable set of arbitration rules. These rules can be configured by the

user to provide different usage patterns to each slave. For example, a number of consecutive access

opportunities to the slave can be allocated to one particular master, to increase the likelihood of same

type accesses (all reads or all writes), which makes more efficient usage of the bandwidth to the slave.

System Registers

The MSS System registers are implemented as an AHB slave on the AHB bus matrix. This means the

Cortex-M3 processor or a soft master in the FPGA fabric may access the registers and therefore control

the MSS. The System registers can be initialized by user-defined flash configuration bits on power-up.

Each register also has a flash bit to ena ble write protecti ng the contents of the registers. This allows the

MSS system configuration to be reliably fixed for a given application.

Fabric Interface Controller (FIC)

The FIC block provides two separate interfaces between the MSS and the FPGA fabric: the MSS master

(MM) and fabric master (FM). Each of these interfaces can be configured to operate as AHB-Lite or

APB3. Depending on device density, there are up to two FIC blocks present in the MSS (FIC_0 and

FIC_1).

Embedded SRAM (eSRAM)

The MSS contains two blocks of 32 KB eSRAM, g iving a total of 64 KB. Having th e eSRAM arranged as

two separate blocks allows the user to take advantage of the Harvard architecture of the Cortex-M3

processor. For example, code could be located in one eSRAM, whil e data, such as the stack, could be

located in t he other.

The eSRAM is designed for Single Error Correct Double Error Detect (SECDED) protection. When

SECDED is disabled, the SRAM usually used to store SECDED data may be re used as an extra 16 KB

of eSRAM.

Embedded NVM (eNVM)

The MSS contains up to 512 KB of eNVM (64 bits wide). Accesses to the eNVM from the Cortex-M3

processor are cacheable.

DMA Engines

Two DMA engines are present in the MSS: high-performance DMA and peripheral DMA.

High-Performance DMA (HPDMA)

The high-performance DMA (HPDMA) engine provides efficient memory to memory data transfers

between an external DDR memory and internal eSRAM. This engine has two separate AHB-Lite

interfaces—one to the MDDR bridge and the other to the AHB bus matrix. All transfers by the HPDMA

are full word transfers.

Peripheral DMA (PDMA)

The peripheral DMA engine (PDMA) is tuned for offloading byte-intensive operations, involving MSS

peripherals, to and from the internal e SRAMs. Data transfers can also be targeted to user logic/RAM in

the FPGA fabric.

SmartFusion2 Device Family Overview

1-6 Revision 18

APB Configuration Bus

On every SmartFusion2 device, an APB configuration bus is present to allow the user to initialize the

SERDES ASIC blocks, the fabric DDR memory controller, an d user instantiated peri pherals in the FPGA

fabric.

Peripherals

A large number of communications and general purpose peripherals are implemented in the MSS.

USB Controller

The MSS contains a high speed USB 2.0 On-The-Go (OTG) controller with the following features:

• Operates either as the function controller of a high-speed / full-speed USB peripheral or as the

host/peripheral in point-to-point or multi-point communications with other USB functions.

• Complies with the USB 2.0 standard for high-speed functions and with the On-The-Go

supplement to the USB 2.0 specification.

• Supports OTG communications with one or more high-speed, full-speed, or low-speed devices.

TSE Ethernet MAC

The triple speed Ethernet (TSE) MAC supports IEEE 802.3 10/100/1000Mbps Ethernet operation. The

following PHY interfaces are directly supported by the MAC:

•GMII

•MII

•TBI

The Ethernet MAC hardware implements the following functions:

• 4 KB internal transmit FIFO and 8 KB internal receive FIFO

• IEEE 802.3X full-duplex flow control

• DMA of Ethernet frames between internal FIFOs and system memory (such as eSRAM or DDR)

• Cut-through operation

• SECDED protection on internal buffers

SGMII PHY Interface

SGMII mode is implemented by means of configuring the MAC for 10-bit interface (TBI) operation,

allocating one of the high-speed serial channels to SGMII, and by implementing custom logic in the

fabric.

10 Gbps Ethernet

Support for 10 Gbps Ethernet is achieved by programming the SERDES interface to XAUI mode. In this

mode, a soft 10G EMAC with XGMII interface can be directly connected to the SERDES interface.

Communication Block (COMM_BLK)

The COMM block provides a UART-like communications channel between the MSS and the system

controller. System services are initiated through the COMM block.

SPI

The serial peripheral interface controller is compliant with the Motorola SPI, Texas Instruments

synchronous serial, and National Semiconductor MICROWIRE™ formats. In addition, the SPI supports

interfacing to large SPI flash and EEPROM devices by way of the slave protocol engine. The SPI

controller supports both Master and Slave modes of operation.

The SPI controller embeds two 4×32 (depth × width) FIFOs for receive and transmit. These FIFOs are

accessible through Rx data and Tx data registers. Writing to the Tx data register causes the da ta to be

written to the transmit FIFO. This is emptied by transmit logic. Similarly, reading from the Rx data register

causes data to be read from the receive FIFO.

SmartFusion2 System-on-Chip FPGAs Product Brief

Revision 18 1-7

Multi-Mode UART (MMUART)

SmartFusion2 devices contain two identical multi-mode universal asynchronous/synchronous

receiver/transmitter (MMUART) peripherals that provide software compatibility with the popular 16550

device. They perform serial-to-parallel conversion on data originating from modems or other serial

devices, and perform parallel-to-serial conversion on data from the Cortex-M3 processor to these

devices.

The following are the main features supported:

• Fractional baud rate capability

• Asynchronous and synchronous operation

• Full programmable serial interface characteristics

– Data width is programmable to 5, 6, 7, or 8 bits

– Even, odd, or no-parity bit generation/detection

– 1,1½, and 2 stop bit generation

• 9-bit address flag capability used for multidrop addressing topologies

I2C

SmartFusion2 devices contain two identical master/slave I2C peripherals that perform serial to-parallel

conversion on data originating from serial devices, and perform parallel-to-serial conversion on data from

the ARM Cortex-M3 processor, or any other bus master, to these devices. The following are the main

features supported:

•I

2C v2.1

– 100 Kbps

– 400 Kbps

• Dual-slave addressing

•SMBus v2.0

•PMBus v1.1

Clock Sources: On-Chip Oscillators, PLLs, and CCCs

SmartFusion2 devices have two on-chip RC oscillators—a 1 MHz RC oscillator and a 50 MHz RC

oscillator—and up to two main crysta l oscillators (32 KHz–20 MHz). These are available to the user for

generating clocks to the on-chip resources and the logic built on the FPGA fabric array. The second

crystal oscillator available on the SmartFusion2 devi ces is dedicate d for RTC clocking. These oscillators

(except the RTC crystal oscillator) can be used in conjunction with the integrated user phase-locked

loops (PLLs) and fabric clock conditioning circuits (FAB_CCC) to generate clocks of varying frequency

and phase. In addition to being available to the user, these oscillators are also used by the system

controller, power-on reset circu itry, MSS during Flash*Freeze mode, and the RTC.

SmartFusion2 devices have up to eight fabric CC C (FAB_CCC) blocks and a dedicated PLL associ ated

with each CCC to provide flexible clocking to the FPGA fabric portion of the device. The user has the

freedom to use any of the eight PLLs and CCCs to generate the fabric clocks and the internal MSS clock

from the base fabric clock (CLK_ BASE). There is also a dedicate d CCC block fo r the MSS (MSS_CCC)

and an associated PLL (MPLL) for MSS clocking and de-skewing the CLK_BASE clock. The fabric

alignment clock controller (FACC), part of the MSS CCC, is responsible for generating various aligned

clocks required by the MSS for correct operation of the MSS blocks and synchronous communication

with the user logic in the FPGA fabric.

SmartFusion2 Device Family Overview

1-8 Revision 18

High Speed Serial Interfaces

SERDES Interface

SmartFusion2 has up to four 5 Gbps SERDES transceivers, each supporting the following:

• 4 SERDES lanes

• The native SERDES interface facilitates implementation of Serial RapidIO (SRIO) in fabric or an

SGMII interface for the Ethernet MAC in MSS

PCI Express (PCIe)

PCIe is a high speed, packet-based, point-to-point, low pin count, serial interconnect bus. The

SmartFusion2 family has two hard high-speed serial interface blocks. Each SERDES block contains a

PCIe system block. The PCIe system is connected to the SERDES block and following are the main

features supported:

• Supports x1, x2, and x4 lane configuration

• Endpoint configuration only

• PCI Express Base Specification Revision 2.0

• 2.5 and 5.0 Gbps compliant

• Embedded receive (2 KB), transmit (1 KB) and retry (1 KB) buffer dual-port RAM implementation

• Up to 2 kbytes maximum payload size

• 64-bit AXI or 32-bit AHB-Lite Master and Slave interface to the application layer

• 32-bit APB interface to access configuration and status registers of PCIe system

• Up to 3 x 64 bit base address registers

• 1 virtual channel (VC)

XAUI/XGXS Extension

The XAUI/XGXS extension allows the user to implem ent a 10 Gbps (XGMII) Ethernet PHY interface by

connecting the Ethernet MAC fabric in terface through an appropriate soft IP block in the fabric.

High Speed Memory Interfaces: DDRx Memory Controllers

There are up to three DDR subsystems, MDDR (MSS DDR) and FDDR (fabric DDR) present in

SmartFusion2 devices. Each subsystem consists of a DDR controller, PHY, and a wrapper. The MDDR

has an interface from the MSS and fabric, and FDDR provides an interface from the fabric.

The following are the main features supported by the FDDR and MDDR:

• Support for LPDDR, DDR2, and DDR3 memories

• Simplified DDR command interface to standard AMBA AXI/AHB interface

• Up to 667 Mbps (333 MHz double data rate) performance

• Supports 1, 2, or 4 ranks of memory

• Supports different DRAM bus width modes: x8, x9, x16, x18, x32, and x36

• Supports DRAM burst length of 2, 4, or 8 in full bus-width mode; supports DRAM burst length of 2,

4, 8, or 16 in half bus-width mode

• Supports memory densities up to 4 GB

• Supports a maximum of 8 memory banks

• SECDED enable/disable feature

• Embedded physical interface (PHY)

• Read and Write buffers in fully associative CAMs, configurable in powers of 2, up to 64 Reads

plus 64 Writes

SmartFusion2 System-on-Chip FPGAs Product Brief

Revision 18 1-9

• Support for dynamically changing clock frequency while in self-refresh

• Supports command reordering to optimize memory efficiency

• Supports data reordering, returning critical word first for each command

MDDR Subsystem

The MDDR subsystem has two interfaces to the DDR. One is an AXI 64-bit bus from the DDR bridge

within the MSS. The other is a mult iplexed interface from the FPGA fabric, which can be configured as

either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus,

which is used to initialize the majority of the internal registers within the MDDR subsystem after reset.

This APB configuration bus can be mastered by the MSS directly or by a master in the FPGA fabric.

Support for 3.3 V Single Data Rate DRAMs (SDR AM) can be obtained by usin g the SMC_FIC interface

in the MDDR subsystem. Users would then instantiate a soft AHB or AXI SDRAM memory controller in

the FPGA fabric and connect I/O ports to 3.3 V MSIO.

FDDR Subsystem

The FDDR subsystem has one interface to the DDR. This is a multiplexed interface from the FPGA

fabric, which can be configured as either a single AXI 64-bi t bus or two 32-bit AHB-Lite buses. There is

also a 16-bit APB configuration bus, which is used to initialize the ma jority of the internal registers within

the FDDR subsystem after reset. This APB configuration bus can be mastered by the MSS or a master in

the FPGA fabric.

SmartFusion2 Development Tools

Design Software

System designers can leverage the easy-to-use Libero®system-on-chip (SoC) software toolset for

designing SmartFusion2 devices. Libero SoC high lights include the following:

• System Builder for creation of system level architecture

• Synthesis, DS,P and debug support from Synopsys

• Simulation from Mentor Graphics

• Push-button design flow with power ana lysis and timing analysis

• SmartDebug for access to non-invasive probes with in SmartFusion2 devices

• Integrated firmware flows for SoftConsole (GNU/Eclipse), IAR®, and Keil™

• Operating system support includes uClinux™ from Emcraft Systems, FreeRTOS™, SAFERT OS ®

and uc/OS-III™ from Micrium.

For more information refer to Libero SoC,

Design Hardware

SmartFusion2 hardware is now available in a starter kit and development kit format. The starter kit is

recommended for initial evaluation and the development kit for full system design and prototyping.

SmartFusion2 Device Family Overview

1-10 Revision 18

IP Cores

SmartFusion2 SoC FPGAs contain an ARM Cortex-M3 processor and multiple peripherals hardcoded

into the device. In addition to these, Microsemi offers many soft peripherals that can be placed in the

FPGA fabric of the device. These include Core429, Core1553, CoreJESD204BRX/TX, CoreFRI,

CoreFFT, and many other DirectCores. Refer to IP Cores for more information.

Table 1-2 • SmartFusion2 Kits

SmartF usion2 Starter Kit

The SmartFusion2 Starter Kit provides a cost effective platform for

evaluation and development of a SmartFusion2 SoC FPGA based

solution. The kit utilizes a miniature mezzanine form factor system-on-

module, which integrates the SmartFusion2 device with 64 MB LPDDR,

16 MB SPI flash, and Ethernet PHY. The baseboa rd provid es easy to use

benchtop access to the SmartFusion2 SoC and interfaces.

SmartFusion2 Development Kit

The SmartFusion2 full feature development kit provides access to all

peripherals of the SmartFusion2 device, including use of the SERDES,

DDR, CAN, USB, and other embedded peripherals.

Application-specific daughtercards are also in development for use with

this kit.

The SmartFusion2 Motor Control Kit will support up to 6-axis motor

control and is currently in development This is used in conjunction with

the SmartFusion2 Devel opment Kit.

The SmartFusion2 Micro Power Manager (MPM) Daughtercard will be the

next revision in MPM system management platforms. This is used in

conjunction with the SmartFusion2 Deve lopment Kit.

Revision 18 2-1

2 – Product Brief Information

List of Changes1-V

The following table lists critical changes that were made in each revision of the SmartFusion2 Product

Brief.

Revision Changes Page

Revision 18

(October 2014) Ordering information added to Table 2 for the M2S090(T) device in the FCS/FCSG325

package. Trademark changed to the Register mark for ARM Cortex-M3. 1-V, 1-I

Revision 17

(August 2014) Upda ted Device Packages 005-VF256 and 150-FCS536 in Table 2–Table 4.1-V–1-VII

Revision 16

(June 2014) Updated Table 2, Table 3, and Table 4.1-V, 1-VI,

1-VII

Revision 15

(March 2014) Table 1 to Table 3 and "SmartFusion2 Ordering Information" were updated with

Military device data. Table 4 and Table 5 and the "Marking Specification Details"

section were added.

1-IV-1-VI

1-VIII,1-VII

1-VIII,1-IX

Revision 14

(Dec 2013) Tables 3-6 were combined into Table 3. Fabric Interface Controller features were

added to "SmartFusion2 SoC FPGA Product Family" table. Packages VQ144 and

FCV484 were added to Table 2 and Table 3.

1-VI,1-IV

1-V,1-VI

Revision 13

(Nov 2013) Data Security Feature sections, table and Device Status table were removed.

"SmartFusion2 SoC FPGA Block Diagram" was updated. N/A

1-III

Revision 12

(Oct 2013) Packages FCS325 and VF256 were added to Table 2. "SmartFusion2 Ordering

Information" on page 1-VIII was updated. Typo fixed on "SmartFusion2 SoC FPGA

Block Diagram" on page 1-III.

1-V,1-VIII

Revision 11

(Sept 2013) LSRAM x32/36 widths added. "SmartFusion2 SoC FPGA Product Family" table note

added referring to updates in Table 2 –Table 4 and Table 6. 1-IV

"SmartFusion2 Ordering Information" was updated. Part Numbers (tables 7 and 8)

were removed. "SmartFusion2 Device Status" table updated. 1-VIII

M2S090-FG676 and M2S005-VF400 package pinouts finalized. N/A

Revision 10

(June 2013) M2S005-FG484 package pinout I/O count finalized. Typos were corrected. N/A

Revision 9

(May 2013) A note regarding total logi c was added to Table 1 • SmartFusion2 SoC FP GA Product

Family.1-IV

"Design Security Features" and "Additional Security Features" tables were added to

show the security features supported. 1-2

Product Brief Information

2-2 Revision 18

Revision 8

(April 2013) The "SmartF usion2 SoC FPGA Block Dia gram" was revised to clarify the connections

between the Cortex-M3 processor and cache (SAR 45967). III

I/O counts were updated in Table 1 • SmartF usion2 SoC FPGA Product Family (SAR

46000). IV

I/O counts and devices were updated. The FG676 package was added to Table 2 •

I/Os per Package and Packa ge Opti on s (SAR 46000). V

"Features per Device/Package Combination" was divided into four new tables, Table 3

through Table 6 to accommodate new features for package/device combinations for

the FG676 package, for T and non-T devices (SAR 46000).

The status for M2S050T was changed from Advance to Preliminary in the

"SmartFusion2 Device Status" section (SAR 46967). IX

Revision 7

(Feb 2013) The SmartFusion2 product brief has been separated from the rest of the

SmartFusion2 datasheet. The "SmartFusion2 Development Tools " section has been

updated and is now part of the product brief (SAR 45184).

1-9

The M2S090 device is new. The product family tables and ordering i nformation have

been updated (SAR 45127). IV

Revision 6

(Feb 2013) The number of PLLs and CCCs for MS2025 was corrected from 4 to 6 (SAR 44480). IV

Revision 5

(Feb 2013) Table 1 • SmartFusion2 SoC FPGA Product Family and Table 2 • I/Os per Package

and Package Options were revised to correct I/O counts for M2S005/M2S025 and the

VF400 and FG484 packages (SAR 42618).

Junction temperature for military, industrial, and commercial SmartFusion2 SoC

FPGAs was added to the "Reliability" section. In the "Operating Voltage and I/Os"

section, "Market leading number of user I/Os with 5G SERDES" was added to the

(SAR 42618). LVTTL/LVCMOS 3.3 V was qualified as MSIO only and DDR was

removed from the list under DDRIOs (SAR 44652).

I, II

Table 3 • Features per Device/Package Combination is new (SARs 42618, 44414). VI

RMII was removed from as a supported PHY interface in the "TSE Ethernet MAC"

section (SAR 42618). 1-6

Revision Changes Page

SmartFusion2 System-on-Chip FPGAs Product Brief

Revision 18 2-3

Revision 4

(January 2013) The "SmartFusion2 Ordering Information" was revised to add Pre-Production as a

temperature range. Ambient temperature was corrected to junctio n temperature in the

defined temperature ranges. Sp eed grades were defined. Table 8 SmartFusion2 Valid

Lead-Free Part Numbers for Devices with Design Security is new (SAR 43648).

VIII, NA

The maximum payload size for PCIe was corrected from 256 bytes to "up to 2 kbytes"

(SAR 42215). II, 1-8

More information was included on SDRAM Support in the "High Speed Memory

Interfaces" section (SAR 42594). II

The phrase "with 16-bit PIPE interface (Gen1/Gen2)" was removed from the PCIe

bullet in the "High Speed Serial Interfaces" section (SAR 43851). II

In Table 1 • SmartFusion2 SoC FPGA Product Family, PCIe Endpoint x4 was

corrected to PCIe Endpoint x1, x2, x4 (SAR 43851). IV

The number of I/Os for M2S025 in the FG484 package was corrected from 267 to 289

in Table 2 • I/Os per Package and Package Options (SAR 42618). V

The Y Security designator was removed from "SmartFusion2 Ordering Information"

(SAR 42231). VIII

The "SGMII PHY Interface" section was revised to change "allocating o ne of the high-

speed serial channels to SGMII and by implementing custom logic in the fabric" to

"allocating one of the high-speed serial channels to and utilizing the CoreTBI

soft IP block" (SAR 43851).

1-6

The "PCI Express (PCIe)" section was corrected to state the SmartFusion2 family has

up to four high-speed serial interface blocks rather than two. The following bullets

were removed (SAR 43851):

• Intel’s PIPE interface (8-bit/16-bit) to interface between the PHY MAC and PHY

(SERDES)

• Fully compliant PHY PCS sub-layer (125/250 MHz)

1-8

"Support for SDRAM memories" was removed from the "High Speed Memory

Interfaces: DDRx Memory Controllers " section (SAR 42594). The text was corrected

to state there are up to three, rather than two, DDR subsystems (SAR 43851).

1-8

The "MDDR Subsystem" section was revised to explain that support for 3.3 V Single

Data Rate DRAMs (SDRAM) can be obtained by using the SMC_FIC interface (SAR

42594).

1-9

The "FDDR Subsystem" section was revised to remove the statement that the APB

configuration bus can be mastered by the MSS directly (SAR 42594). 1-9

The "SmartFusion2 Development Tools "chapter was revised to indicate that Libero

SoC includes SoftConsole (GNU/Eclipse) (SAR 41972). 1-9

Revision 3

(October 2012) The "SmartFusion2 SoC FPGA Block Diagram" was updated. Table 7 SmartFusion2

Valid Part Numbers for Devices with Design Security is new. III, N/A

Revision 2

(July 2012) Information was updated based on ongoing development of specifications. N/A

Revision 1

(June 2012) Information was reorganized and updated based on ongoing development of

specifications. N/A

Revision Changes Page

Product Brief Information

2-4 Revision 18

Datasheet Categories