This is information on a product in full production.
December 2018 DocID029436 Rev 4 1/25
IPS161H
Single high-side switch
Datasheet - production data
Features
RDS(on) = 0.060 Ω, IOUT = 0.7 A, VCC = 65 V
8 V to 60 V operating voltage range
Minimum output current limitation: 0.7 A
Non-dissipative short-circuit protection (cut-
off)
Programmable cut-off delay time using
external capacitor
Diagnostic signalization for: open load in off-
state, cut-off and junction thermal shutdown
Fast demagnetization of inductive load
Ground disconnection protection
VCC disconnection protection
Undervoltage lock-out
Designed to meet IEC 61131-2
PSSO12 package
Applications
Programmable logic control
Industrial PC peripheral input/output
Numerical control machines
SIL applications
Description
The IPS161H is a monolithic device which can
drive capacitive, resistive or inductive loads with
one side connected to ground; it is specifically
designed to match safety integrity level (SIL)
applications.
Built-in thermal shutdown protects the chip
against overtemperature and short-circuit. In
order to minimize the power dissipation when the
output is shorted, a non-dissipative short-circuit
protection (cut-off) is implemented, it limits both
the output average current value and,
consequently, the device overheating. The DIAG
common diagnostic pin reports the thermal
shutdown, open load in off-state and cut-off.
Cut-off delay time can be programmed by an
external capacitor.
PowerSSO12
Table 1. Device summary
Order code Package Packing
IPS161H
PowerSSO12
Tube
IPS161HTR Tape and reel
www.st.com
Contents IPS161H
2/25 DocID029436 Rev 4
Contents
1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.3 DIAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 CoD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.5 GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.6 VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Output logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 Undervoltage lock-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.2 Overtemperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.3 Cut-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.4 Open load in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.5 VCC disconnection protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.6 GND disconnection protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7 Active clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.1 PowerSSO12 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
DocID029436 Rev 4 3/25
IPS161H List of tables
25
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 5. Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 6. Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Switching (VCC = 24 V; 125 °C > TJ > -40 °C, RLOAD = 48 ) . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 9. Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 10. Output stage truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 11. Minimum cut-off delay for TAMB less than -20 °C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 12. PowerSSO12 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 13. Document revision history. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
List of figures IPS161H
4/25 DocID029436 Rev 4
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Pin connection (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. trise and tfall . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4. tPD(L-H) and tPD(H-L). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Current limitation and cut-off. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 6. Open load off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 7. VCC disconnection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 8. GND disconnection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. Active clamp equivalent principle schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 10. Fast demag waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 11. Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 °C . . . . . . 20
Figure 12. PowerSSO12 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 13. PowerSSO12 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
DocID029436 Rev 4 5/25
IPS161H Block diagram
25
1 Block diagram
Figure 1. Block diagram
*/
(/%
7DD
065
$P%
6OEFSWPMUBHF
EFUFDUJPO
7DD DMBNQ
0VUQVUDMBNQ
$VSSFOU MJNJUBUJPO
DVU PGG
0QFO MPBEJOPGGTUBUF
+VODUJPO
0WFSUFNQFSBUVSF
-PHJD JOUFSGBDF
%*"(
(*1(-.
Pin description IPS161H
6/25 DocID029436 Rev 4
2 Pin description
Figure 2. Pin connection (top view)
2.1 IN
This pin drives the output stage to pin OUT. IN pin has internal weak pull-down resistors,
see Table 8: Logic inputs on page 10.
2.2 OUT
Output power transistor is in high-side configuration, with active clamp for fast
demagnetization.
Table 2. Pin configuration
Number Name Function Type
1, 12, TAB VCC Device supply voltage Supply
2 IN Channel input Input
3 DIAG Common diagnostic pin both for thermal shutdown,
cut-off and open load Output open drain
4 CoD
Cut-off delay pin, cannot be left floating. Connected to
GND by 1 k resistor to disable the cut-off function.
Connect to a CCoD capacitor to set the cut-off delay
see Table 9: Protection and diagnostic on page 10.
Input
5, 6 NC Not connected
7 GND Device ground Ground
8, 9, 10, 11 OUT Channel power stage output Output
5" # 7 D D
7$$
*/
%*"(
$P%
/$
/$
065
065
065
065
7$$
(/%
(*1(-.
DocID029436 Rev 4 7/25
IPS161H Pin description
25
2.3 DIAG
This pin is used for diagnostic purpose and it is internally wired to an open drain transistor.
The open drain transistor is turned on in case of junction thermal shutdown, cut-off, or open
load in off-state.
2.4 CoD
This pin cannot be left floating and can be used to program the cut-off delay time tcoff, see
Table 9: Protection and diagnostic on page 10 through an external capacitor (CCoD). The cut-off
function can be completely disabled connecting the CoD pin to GND through 1 k resistor:
in this condition the output channel remains on in limitation condition, supplying the current
to the load until the input is forced LOW or the thermal shutdown threshold is triggered or
tcoff time elapses.
2.5 GND
IC ground.
2.6 VCC
IC supply voltage.
Absolute maximum ratings IPS161H
8/25 DocID029436 Rev 4
3 Absolute maximum ratings
Note: Absolute maximum ratings are those values beyond which damage to the device may occur.
Functional operation under these conditions is not implied. All voltages are referenced to
GND.
Note: Package mounted on a 2-layer application board with Cu thickness = 35 m, total
dissipation area = 1.5 cm2 connected by 6 vias.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
VCC Supply voltage -0.3 to 65 V
VOUT Output channel voltage VCC - Vclamp to VCC +0.3 V
IIN Input current -10 to +10 mA
VIN IN voltage VCC V
VCOD Output cut-off voltage pin 5.5 V
ICOD Input current on cut-off pin -1 to +10 mA
VDIAG Fault voltage VCC V
IDIAG Fault current -5 to +10 mA
ICC(1)
1. Verified on application board with Rth(ja) = 49 °C/W
Maximum DC reverse current flowing through the IC
from GND to VCC
-250 mA
IOUT Output stage current Internally limited
A
-IOUT(1) Maximum DC reverse current flowing through the IC
from OUT to VCC
5
EAS(1)
Single pulse avalanche energy
(TAMB = 125 °C, VCC = 24 V,
load = 48 )
3000 mJ
PTOT Power dissipation at TC = 25 °C(2)
2. [TJSD(MAX) - TC]/ Rth(JA).
Internally limited W
TSTG Storage temperature range -55 to 150 °C
TJJunction temperature -40 to 150
Table 4. Thermal data
Symbol Parameter Value Unit
Rth(JC) Thermal resistance junction-case 1
°C/W
Rth(JA) Thermal resistance junction-ambient 49
DocID029436 Rev 4 9/25
IPS161H Electrical characteristics
25
4 Electrical characteristics
8 V < VCC < 60 V; -40 °C < TJ < 125 °C, unless otherwise specified.
Table 5. Supply
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC Supply voltage - VUVON -60-
VUVON Undervoltage on threshold - 6.9 - 8 -
VUVOFF Undervoltage off threshold - 6.5 - 7.8 -
VUVH Undervoltage hysteresis - 0.15 0.5 -
IS
Supply current in off-state
VCC = 24 V - 300 500 A
VCC = 60 V - 350 600
Supply current in on-state
VCC = 24 V - 1 1.4
mA
VCC = 60 V - 1.4 1.8
ILGND GND disconnection output current VGND = VIN = VCC
VOUT = 0 V --1mA
Table 6. Output stage
Symbol Parameter Test conditions Min. Typ. Max. Unit
RDS(on) On-state resistance
VCC = 24 V,
IOUT = 0.5 A at TJ = 25 °C -60-
m
VCC = 24 V,
IOUT = 0.5 A at TJ = 125 °C - - 120
VOUT(OFF) Off-state output voltage VIN = 0 V and IOUT = 0 A - - 2 V
IOUT(OFF) Off-state output current
VCC = 24 V, VIN = 0 V,
VOUT = 0 V --3
AVCC = 60 V, VIN = 0 V,
VOUT = 0 V --10
IOUT(OFF-min) Off-state output current VIN = 0 V, VOUT = 4 V -35 - 0
Table 7. Switching (VCC = 24 V; 125 °C > TJ > -40 °C, RLOAD = 48 )
Symbol Parameter Test conditions Min. Typ. Max. Unit
trRise time
IOUT = 0.5 A Figure 3
-10-
s
tfFall time - 10 -
tPD(H-L) Propagation delay time off - 20 -
tPD(L-H) Propagation delay time on - 30 -
Electrical characteristics IPS161H
10/25 DocID029436 Rev 4
Figure 3. Timing in normal operation
Table 8. Logic inputs
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIL Input low level voltage - - - 0.8
VVIH Input high level voltage - 2.2 - -
VI(HYST) Input hysteresis voltage - - 0.4 -
IIN Input current
VCC = VIN = 36 V - - 200 A
VCC = VIN = 60 V - - 550
Table 9. Protection and diagnostic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Vclamp VCC active clamp ICC = 10 mA 65.5 68.5 71.5
V
Vdemag Demagnetization voltage IOUT = 0.5 A;
load = 1 mH VCC - 71.5 VCC - 71.5 VCC - 71.5
VOLoff
Open load (off- state) or
short to VCC detection
threshold
-2-4
tBKT Open load blanking time - - - 200 s
VDIAG Voltage drop on DIAG IDIAG = 4 mA - - 1 V
IDIAG DIAG pin leakage current
VCC 36 V - - 110 A
36 V VCC 60 V - - 180
ILIM Output current limitation VCC 32 V,
RLOAD 10 m0.7 - 1.7 A
DocID029436 Rev 4 11/25
IPS161H Electrical characteristics
25
tcoff Cut-off current delay time
Programmable by the external
capacitor on CoD pin. Cut-off is
disabled when CoD pin is
connected to GND through 1 k
resistor. TJ TJSD
50 x CCOD [nf] ± 35%(1)
s
tres
Output stage restart delay
time TJ TJSD 32 x tcoff [s] ± 40%
TJSD
Junction temperature
shutdown - 150 170 190
°C
TJHYST
Junction temperature
thermal hysteresis - - 15 -
1. The formula is guaranteed in the range 10 nF CCOD 100 nF.
Table 9. Protection and diagnostic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Output logic IPS161H
12/25 DocID029436 Rev 4
5 Output logic
Table 10. Output stage truth table
Operation IN OUT DIAG
Normal L
H
L
H
H
H
Cut-off L
H
L
L
L
L
Overtemperature L
H
L
L
L
L
Open load L
H
H (external pull-up
resistor is used)
H
L (external pull-up
resistor is used)
H
UVLO X
X
L
L
X
X
DocID029436 Rev 4 13/25
IPS161H Protection and diagnostic
25
6 Protection and diagnostic
The IC integrates several protections to ease the design of a robust application.
6.1 Undervoltage lock-out
The device turns off if the supply voltage falls below the turn-off threshold [VUV(off)]. Normal
operation restarts after VCC exceeds the turn-on threshold [VUV(on)]. Turn-on and turn-off
thresholds are defined in Table 5: Supply on page 9.
6.2 Overtemperature
The output stage turns off when its internal junction temperature (TJ) exceeds the shutdown
threshold TJSD. Normal operation restarts when TJ comes back below the reset threshold
(TJSD - TJHYST), see Table 9: Protection and diagnostic. The internal fault signal is set when
the channel is off due to thermal protection and it is reset when the junction triggers the
reset threshold. This same behavior is reported on DIAG pin.
6.3 Cut-off
The IC can limit the output current at the power stage by its embedded output current
limitation circuit.
This circuit continuously monitors the output current and, when load is increasing, at the
triggering of its activation threshold (1.8ATYP) it starts limiting to ILIM limitation level (see
Table 8): while current limitation is active the IC enters a high dissipation status.
The IPS161H implements the cut-off feature which limits the duration of the current
limitation condition.
The duration of the current limitation condition (Tcoff) can be set by a capacitor (CCoD)
placed between CoD and GND pins. The design rule for CCoD is:
tcoff[s] 35% = 50 x Ccod[nF]
The drift of +/-35% is guaranteed in the range of 10 nF < Ccod < 100 nF; lower capacitance
than 10 nF can be used.
If ILIM threshold is triggered, the output stage remains in the current limitation condition
(IOUT = ILIM) no longer than tcoff. If tcoff elapses, the output stage turns off and restarts after
the tres restart time.
Thermal shutdown protection has higher priority than cut-off:
IC is forced off if TJSD is triggered before tcoff elapses
If TJSD is triggered, IC is maintained off even after the tres has elapsed and until the TJ
decreases below TJSD - TJHYST
Protection and diagnostic IPS161H
14/25 DocID029436 Rev 4
Figure 4. Current limitation and cut-off
The fault condition is reported on the DIAG pin. The internal cut-off flag signal is latched at
output switch-off and released after the time tres, the same behavior is reported on DIAG
pin.
The status of the DIAG is independent on the IN pin status.
If CoD pin is connected to GND through 1 k resistor (cut-off feature disabled), when the
output channel triggers the limitation threshold, it remains on, in current limitation condition,
until the input becomes LOW or the thermal protection threshold is triggered.
In case of low ambient temperature conditions (TAMB < -20 °C) and high supply voltage
(VCC > 36 V) the cut-off function needs activating in order to avoid IC permanent damages.
The following table reports the suggested cut-off delay for the different operating voltage.
Table 11. Minimum cut-off delay for TAMB less than -20 °C
VCC [V] Cut-off delay [s] Cut-off capacitance [nF]
36-48 100 2.2
48-60 50 1
".
DocID029436 Rev 4 15/25
IPS161H Protection and diagnostic
25
6.4 Open load in off-state
The IPS161H provides the open load detection feature which detects if the load is
disconnected from the OUT pin. This feature can be activated by a resistor (RPU) between
OUT and VCC pins.
Figure 5. Open load off-state
In case of wire break and during the OFF state (IN = low), the output voltage VOUT rises
according to the partitioning between the external pull-up resistor and the internal resistance
of the IC (RI = 115 k).
The effect of the LED (if any) on the output pin has to be considered as well. In case of wire
break and during the ON state (IN = high), the output voltage VOUT is pulled up to VCC by
the low resistive integrated switch. If the load is not connected, in order to guarantee the
correct open load signalization it must result:
Equation 1
VOUT > VOLoff(max)
Referring to the circuit in Figure 5:
Equation 2
VOUT = VCC - RPU × IPU = VCC - RPU × (IRI + ILED + IRL)
".
Protection and diagnostic IPS161H
16/25 DocID029436 Rev 4
therefore:
Equation 3
If the load is connected, in order to avoid any false signalization of the open load, it must
result as follows:
Equation 4
VOUT < VOLoff(min)
By taking into account the circuit in Figure 5:
Equation 5
so:
Equation 6
The fault condition is reported on the DIAG pin and the fault reset occurs when load is
reconnected.
If the channel is switched on by IN pin, the fault condition is no longer detected.
When inductive load is driven, some ringing of the output voltage may be observed at the
end of the demagnetization. In fact, the load is completely demagnetized when ILOAD = 0 A
and the OUT pin remains floating until next turn-on. In order to avoid a fake signalization of
the open load event driving inductive loads, the open load signal is masked for tBKT
. So, the
open load is reported on the DIAG pin with a delay of tBKT and if the open load event is
triggered for more than tBKT
.
RPU
VCC min
VOLoff max
–
VOLoff max
RI
------------------------------ VOLoff max
VLED
–
RLED
--------------------------------------------------+
----------------------------------------------------------------------------------------------
VOUT VCC RPU IPU
–VCC RPU
VOUT
RI
--------------
–VOUT VLED
–
RLED
---------------------------------- VOUT
RL
--------------
++==
RPU
VCC max
VOLoff min
–
VOLoff min
RI
----------------------------- VOLoff min
VLED
–
RLED
------------------------------------------------- VOLoff min
RL
-----------------------------++
-------------------------------------------------------------------------------------------------------------------------------
DocID029436 Rev 4 17/25
IPS161H Protection and diagnostic
25
6.5 VCC disconnection protection
The IC is protected despite the VCC disconnection event. This event is intended as the
disconnection of the VCC wire from the application board, see Figure 6. When this condition
happens, the IC continues working normally until the voltage on the VCC pin is VUV(OFF).
Once the VUVOFF is triggered, the output channel is turned off independently on the input
status. In case of inductive load, if the VCC is disconnected while the output channel is still
active, the IC allows the discharge of the energy still stored in the inductor through the
integrated power switch.
Figure 6. VCC disconnection
".
Protection and diagnostic IPS161H
18/25 DocID029436 Rev 4
6.6 GND disconnection protection
GND disconnection is intended as the disconnection event of the application ground, see
Figure 7. When this event happens, the IC continues working normally until the voltage
between VCC and GND pins of the IC results VUVOFF
. The voltage on GND pin of the IC
rises up to the supply rail voltage level. In case of GND disconnection event, a current
(ILGND) flows through OUT pin. Table 8: Logic inputs on page 10 reports IOUT = ILGND for the
worst case of GND disconnection event in case of output shorted to ground.
Figure 7. GND disconnection
".
DocID029436 Rev 4 19/25
IPS161H Active clamp
25
7 Active clamp
Active clamp is also known as fast demagnetization of inductive loads or fast current decay.
When a high-side driver turns off an inductance, an undervoltage is detected on output.
The OUT pin is pulled down to Vdemag. The conduction state is modulated by an internal
circuitry in order to keep the OUT pin voltage at about Vdemag until the load energy has been
dissipated. The energy is dissipated both in IC internal switch and in load resistance.
Figure 8. Active clamp equivalent principle schematic
Figure 9. Fast demag waveforms
*
-0"%
U%&."(
*
065
7
*/
U
U0/
7
065
7
$$
7
$$
7
%&."(
U
U
__ _
".
Active clamp IPS161H
20/25 DocID029436 Rev 4
The demagnetization of inductive load causes a huge electrical and thermal stress to the IC.
The curve plotted below shows the maximum demagnetization energy that the IC can
support in a single demagnetization pulse with VCC = 24 V and TAMB = 125 °C. If higher
demagnetization energy is required then an external free-wheeling Schottky diode has to be
connected between OUT (cathode) and GND (anode) pins. Note that in this case the fast
demagnetization is inhibited.
Figure 10. Typical demagnetization energy (single pulse) at VCC = 24 V and TAMB = 125 °C
".
DocID029436 Rev 4 21/25
IPS161H Package information
25
8 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
8.1 PowerSSO12 package information
Figure 11. PowerSSO12 package outline
Package information IPS161H
22/25 DocID029436 Rev 4
Figure 12. PowerSSO12 recommended footprint
Table 12. PowerSSO12 package mechanical data
Symbol
Dimensions (mm)
Min. Typ. Max.
A 1.250 - 1.700
A1 0.000 - 0.100
A2 1.100 - 1.600
B 0.230 - 0.410
C 0.190 - 0.250
D(1)
1. Dimension D doesn't include mold flash protrusions or gate burrs. Mold flash protrusions or gate burrs don't
exceed 0.15 mm in total both side.
4.800 - 5.000
E 3.800 - 4.000
e - 0.800 -
H 5.800 - 6.200
h 0.250 - 0.55
L 0.400 - 1.270
k0d-8d
X 1.900 - 2.500
Y 3.600 - 4.200
ddd -0.100
DocID029436 Rev 4 23/25
IPS161H Package information
25
Figure 13. PowerSSO12 tape packing information [mm]
Figure 14. PowerSSO12 reel packing information [mm]
Revision history IPS161H
24/25 DocID029436 Rev 4
9 Revision history
Table 13. Document revision history
Date Revision Changes
10-Jun-2016 1 Initial release.
04-Oct-2016 2 Datasheet promoted from preliminary to production data.
22-Mar-2018 3
Updated Table 3: Absolute maximum ratings on page 8
(updated EAS parameter and value).
Minor modifications throughout document.
13-Dec-2018 4
Added Figure 13 and 14, amended Table 12, updated
Section 4 and Section 6.3. Changed Package image on cover
page.
DocID029436 Rev 4 25/25
IPS161H
25
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and
improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on
ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order
acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or
the design of Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
