MF0FCP2U10/DH - NXP Semiconductors

1. General description

1.1 Scope

This document specifies the products MF0FCP2U10 and MF0FCP2U11:

•The MF0FCP2U10/DH is the integrated circuit MF0ICU10 in the package

SOT732CA2.

•The MF0FCP2U11/DH is the integrated circuit MF0ICU11 in the package

SOT732CA2.

Therefore this document encompasses all information not covered by the specification of

the package and/or the functional specification of the integrated circuit:

•Detailed information on the package is given in the “specification FCP2 flip chip

package”.

•Functionality of the integrated circuit is described in the function al sp ec ifica tio n MF 0

IC U1.

2. Features

3. Applications

4. Ordering information

5. Functional description

5.1 Integrated circuit

Functionality of the integrated circuit is described in the “Functional specification

MF0 IC U1x“.

MF0 FCP2 U1

Flip chip package

Rev. 3.1 — 8 February 2007 Product data sheet

073631 PUBLIC

Table 1. Ordering information

Type number Package

Name Description Ordering Code

MF0FCP2U10/DH Hot laminated transport tape 12NC: 9352 725 94118

MF0FCP2U11/DH Hot laminated transport tape 12NC: 9352 725 96118

Product data sheet Rev. 3.1 — 8 February 2007 2 of 5

NXP Semiconductors MF0 FCP2 U1

Flip chip package

6. Limiting values

[1] Stresses above one or more of the limiting values may cause permanent damage to the device

[2] These are stress ratings only. Operation of the device at these or any other conditions above those given in

the Characteristics section of the specification is not implied

[3] Exposure to limiting values for extended periods may affect device reliability

[4] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima

[5] Storage & Processing Temperature: refer to Package Specification “FCP2 Flip Chip Package”

[6] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 kΩ

7. Characteristics

7.1 Electrical characteristics

Tjop= −25 to +70°C

[1] Stresses above one or more of the limiting values may cause permanent damage to the device

[2] These are stress ratings only. Operation of the device at these or any other conditions above those given in

the Characteristics section of the specification is not implied

[3] Exposure to limiting values for extended periods may affect device reliability

[4] Typical ratings are not guaranteed. These values listed are at room temperature

[5] Measured with an HP4258 LCR meter at 13.56 MHz

Table 2. Limiting values[1][2][3][4]

In accordance with the Absolute Maximum Rating System(IEC 134)

Symbol Parameter Conditions Min Max Unit

TOP Operating

temperature -25 70 °C

IIN Input Current 30 mA

TSTOR Storage temperature [5]

VESD ESD Voltage Level MIL883D, human

body [6] 2kV

peak

Table 3. Ch aracteristics [1][2][3][4]

Symbol Parameter Conditions Min Type Max Unit

FIN Input Frequency - 13.56 - MHz

CIN Input capacitance

between LA - LB for the

integrated circuit

MF0ICU10.

22°C, Cp-D,

13.56 MHz, 2 V [5] 14.85 17 20.13 pF

CIN Input capacitance

between LA - LB for the

integrated circuit

MF0ICU11.

22°C, Cp-D,

13.56 MHz, 2 V [5] 42.5 50 57.5 pF

tWEEPROM write time - 3.8 - ms

t RET EEPROM data retention Tamb ≤ 55°C 5--years

NWE EEPROM write

endurance 10000 - - cycles

Product data sheet Rev. 3.1 — 8 February 2007 3 of 5

NXP Semiconductors MF0 FCP2 U1

Flip chip package

8. Support information

For additional information, please visit: http://www.nxp.com

9. Revision history

Table 4. Revision history

Document ID Release date Data sheet status Change notice Supersedes

073610 June 2002 Initial version 1.0

073620 November 2002 Preliminary version 2.0

073630 October 2004 Product data sheet 3.0

073631 8 February 2007 Product data sheet 3.1

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate .

Product data sheet Rev. 3.1 — 8 February 2007 4 of 5

NXP Semiconductors MF0 FCP2 U1

Flip chip package

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short dat a sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

10.3 Disclaimers

General — In formation in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give an y represent ations or

warranties, expressed or impli ed, as to the accuracy or completeness of such

information and shall have no liability for th e co nsequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft ,

space or life support equipment, nor in applications where failure or

malfunction of a NXP Semiconducto rs product can reasonably b e expected to

result in personal injury, death or severe property or environmental damage.

NXP Semiconductors accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or applications and therefore

such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for il lustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ra tings System of IEC 60134) may cause pe rmanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other co nditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may af fect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pert aining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between inf ormation in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Not hing in this document may be interpret ed or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

10.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respective ow ners.

Mifare — is a trademark of NXP B.V.

11. Contact information

For additional information, please visit: http://www.nxp.com

For sales office addresses, send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors MF0 FCP2 U1

Flip chip package

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 February 2007

Document identifier: 073631

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Tables

Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .1

Table 2. Limiting values[1][2][3][4] . . . . . . . . . . . . . . . . . . . .2 Table 3. Characteristics [1][2][3][4] . . . . . . . . . . . . . . . . . . . 2

Table 4. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 3

13. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

1.1 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

5 Functional de scription . . . . . . . . . . . . . . . . . . . 1

5.1 Integrated Circuit . . . . . . . . . . . . . . . . . . . . . . . 1

6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 2

7.1 Electrical Characteristics . . . . . . . . . . . . . . . . . 2

8 Support information . . . . . . . . . . . . . . . . . . . . . 3

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 3

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 4

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 4

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

11 Contact in formation. . . . . . . . . . . . . . . . . . . . . . 4

12 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5