MF0 FCP2 U1 Flip chip package Rev. 3.1 -- 8 February 2007 Product data sheet 073631 PUBLIC 1. General description 1.1 Scope This document specifies the products MF0FCP2U10 and MF0FCP2U11: * The MF0FCP2U10/DH is the integrated circuit MF0ICU10 in the package SOT732CA2. * The MF0FCP2U11/DH is the integrated circuit MF0ICU11 in the package SOT732CA2. Therefore this document encompasses all information not covered by the specification of the package and/or the functional specification of the integrated circuit: * Detailed information on the package is given in the "specification FCP2 flip chip package". * Functionality of the integrated circuit is described in the functional specification MF0 IC U1. 2. Features 3. Applications 4. Ordering information Table 1. Ordering information Type number Package Description Ordering Code MF0FCP2U10/DH Name Hot laminated transport tape 12NC: 9352 725 94118 MF0FCP2U11/DH Hot laminated transport tape 12NC: 9352 725 96118 5. Functional description 5.1 Integrated circuit Functionality of the integrated circuit is described in the "Functional specification MF0 IC U1x". MF0 FCP2 U1 NXP Semiconductors Flip chip package 6. Limiting values Table 2. Limiting values[1][2][3][4] In accordance with the Absolute Maximum Rating System(IEC 134) Symbol Parameter TOP Operating temperature IIN Input Current Conditions TSTOR Storage temperature VESD ESD Voltage Level Min Max Unit -25 70 C 30 mA [5] [6] MIL883D, human body 2 kVpeak [1] Stresses above one or more of the limiting values may cause permanent damage to the device [2] These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied [3] Exposure to limiting values for extended periods may affect device reliability [4] This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima [5] Storage & Processing Temperature: refer to Package Specification "FCP2 Flip Chip Package" [6] MIL Standard 883-C method 3015; Human body model: C = 100 pF, R = 1.5 k 7. Characteristics 7.1 Electrical characteristics Tjop= -25 to +70C Table 3. Characteristics Symbol Parameter FIN Input Frequency [1][2][3][4] Conditions CIN Input capacitance between LA - LB for the integrated circuit MF0ICU10. 22C, Cp-D, 13.56 MHz, 2 V [5] CIN Input capacitance between LA - LB for the integrated circuit MF0ICU11. 22C, Cp-D, 13.56 MHz, 2 V [5] tW EEPROM write time t RET EEPROM data retention NWE EEPROM write endurance Tamb 55C Type Max Unit - 13.56 - MHz 14.85 17 20.13 pF 42.5 50 57.5 pF - 3.8 - ms 5 - - years 10000 - - cycles [1] Stresses above one or more of the limiting values may cause permanent damage to the device [2] These are stress ratings only. Operation of the device at these or any other conditions above those given in the Characteristics section of the specification is not implied [3] Exposure to limiting values for extended periods may affect device reliability [4] Typical ratings are not guaranteed. These values listed are at room temperature [5] Measured with an HP4258 LCR meter at 13.56 MHz 073631 Product data sheet Min (c) NXP B.V. 2007. All rights reserved. Rev. 3.1 -- 8 February 2007 2 of 5 MF0 FCP2 U1 NXP Semiconductors Flip chip package 8. Support information For additional information, please visit: http://www.nxp.com 9. Revision history Table 4. Revision history Document ID Release date Data sheet status 073610 June 2002 Initial version 1.0 073620 November 2002 Preliminary version 2.0 073630 October 2004 Product data sheet 3.0 073631 8 February 2007 Product data sheet 3.1 Modifications: Supersedes * The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. * Legal texts have been adapted to the new company name where appropriate. 073631 Product data sheet Change notice (c) NXP B.V. 2007. All rights reserved. Rev. 3.1 -- 8 February 2007 3 of 5 MF0 FCP2 U1 NXP Semiconductors Flip chip package 10. Legal information 10.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 10.2 Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 10.3 Disclaimers General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 10.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Mifare -- is a trademark of NXP B.V. 11. Contact information For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com 073631 Product data sheet (c) NXP B.V. 2007. All rights reserved. Rev. 3.1 -- 8 February 2007 4 of 5 MF0 FCP2 U1 NXP Semiconductors Flip chip package 12. Tables Table 1. Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .1 Limiting values[1][2][3][4] . . . . . . . . . . . . . . . . . . . .2 Table 3. Table 4. Characteristics [1][2][3][4] . . . . . . . . . . . . . . . . . . . 2 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 3 13. Contents 1 1.1 2 3 4 5 5.1 6 7 7.1 8 9 10 10.1 10.2 10.3 10.4 11 12 13 General description . . . . . . . . . . . . . . . . . . . . . . Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Functional description . . . . . . . . . . . . . . . . . . . Integrated Circuit . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Characteristics . . . . . . . . . . . . . . . . . Support information . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Legal information. . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information. . . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 1 2 2 2 3 3 4 4 4 4 4 4 5 5 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 8 February 2007 Document identifier: 073631