TSL2550 Ambient Light Sensor with SMBus Interface General Description The TSL2550 is a digital-output light sensor with a two-wire, SMBus serial interface. It combines two photodiodes and a companding analog-to-digital converter (ADC) on a single CMOS integrated circuit to provide light measurements over an effective 12-bit dynamic range with a response similar to that of the human eye. The TSL2550 is designed for use with broad wavelength light sources. One of the photodiodes (channel 0) is sensitive to visible and infrared light, while the second photodiode (channel 1) is sensitive primarily to infrared light. An integrating ADC converts the photodiode currents to channel 0 and channel 1 digital outputs. Channel 1 digital output is used to compensate for the effect of the infrared component of ambient light on channel 0 digital output. The ADC digital outputs of the two channels are used to obtain a value that approximates the human eye response in the commonly used unit of Lux. This device is intended primarily for use in applications in which measurement of ambient light is used to control display backlighting such as laptop computers, PDAs, camcorders, and GPS systems. Other applications include contrast control in LED signs and displays, camera exposure control, lighting controls, etc. The integrating conversion technique used by the TSL2550 effectively eliminates the effect of flicker from AC-powered lamps, increasing the stability of the measurement. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TSL2550, Ambient Light Sensor with SMBus Interface are listed below: Figure 1: Added Value of Using TSL2550 Benefits Features * Enables Operation in IR Light Environments * Patented Dual-Diode Architecture * Digital Interface Is Less Susceptible to Noise * Two-Wire SMBus Digital Interface * Enabling Low Active and Power-Down Modes Reduces Average Power Consumption * 1mW (typ) Active Power Mode * Reduces Board Space Requirements while Simplifying Designs * Available in 2.6mm x 3.8mm TMB or 5mm x 6.2mm SOIC (D) Packages ams Datasheet [v1-00] 2016-May-20 Page 1 Document Feedback TSL2550 - General Description * Converts Light Intensity to Digital Signal * Infrared Compensation to Approximate Human Eye Response * Companding A/D for Wide Dynamic Range * Rejects 50 Hz/60 Hz Lighting Ripple * Single Supply Operation (2.7 V to 5.5 V) * Power Down Mode * Low-Profile Surface-Mount Packages Functional Block Diagram The functional blocks of this device are shown below: Figure 2: TSL2550 Block Diagram Integrating A/D Converter Channel 0 Photodiode Channel 1 Photodiode V DD = 2.7 V to 5.5 V Control Logic Output Registers SMBCLK Two-Wire Serial Interface SMBData Page 2 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Pin Assignments Pin Assignments Figure 3: Package D 8-Lead SOIC (Top View) 8 SMBData VDD 1 NC 2 7 NC NC 3 6 NC 5 SMBCLK GND 4 Figure 4: Package T 4-Lead SMD (Top View) VDD 1 4 SMBData GND 2 3 SMBCLK Figure 5: Terminal Functions Terminal Type Description Name D Pkg No. T Pkg No. GND 4 2 SMBCLK 5 3 I SMBus serial clock input terminal -- clock signal for SMBus serial data. SMBData 8 4 I/O SMBus serial data I/O terminal -- serial data I/O for SMBus. VDD 1 1 ams Datasheet [v1-00] 2016-May-20 Power supply ground. All voltages are referenced to GND. Supply voltage. Page 3 Document Feedback TSL2550 - Absolute Maximum Ratings Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Figure 6: Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted) Symbol Parameter VDD Supply voltage (1) VO Digital output voltage range IO Digital output current I(SMBIN) TA TSTRG ESDHBM Min -0.3 Max Units 6 V +6 V 10 mA SMBus input/output current -1 20 mA Operating free-air temperature range -40 85 C Storage temperature range -40 85 C ESD tolerance, human body model Solder conditions in accordance with JEDEC J-STD-020A, maximum temperature (2) 2000 V 260 C Note(s): 1. All voltages are with respect to GND. 2. Package D only: The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds. Page 4 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Electrical Characteristics Electrical Characteristics Figure 7: Recommended Operating Conditions Symbol Parameter VDD Supply voltage Min Max Units 2.7 5.5 V 0 70 C 0.8 V TA Operating free-air temperature VIL SMBus input low voltage @ VDD = 3.3 V 5% VIH SMBus input high voltage @ VDD = 3.3 V 5% 2.1 SMBus operating frequency 10 f(SMBCLK) V 100 kHz Figure 8: Electrical Characteristics over Recommended Operating Free-Air Temperature Range (unless otherwise noted) Symbol Parameter Test Conditions IO = 50 A VOL SMBus output low voltage Typ Max Unit 0.01 V IO = 4 A Active, VSMBCLK and VSMDATA = VDD , VDD = 3.3 V 5% IDD Min 0.4 0.35 0.6 mA Power down, VSMBCLK and VSMDATA = VDD , VDD = 3.3 V 5% 10 A Supply current IIH High level input current VI = VDD 5 A IIL Low level input current VI = 0 -5 A ams Datasheet [v1-00] 2016-May-20 Page 5 Document Feedback TSL2550 - Electrical Characteristics Figure 9: Operating Characteristics at VDD = 3.3 V, TA = 25C (unless otherwise noted) (see Notes (1), (2), (3)) Parameter Test Conditions Channel Min Typ Max Ch0 1 Ch1 1 Unit Ee = 0 ADC count value standard mode p= 640 nm Ee Ch0 639 799 959 counts = 72 W/cm2 Ch1 p = 940 nm Ch0 2 Ee = 140 W/cm 85 511 Ch1 799 1039 703 Ch0 1 Ch1 1 Ee = 0 ADC count value extended mode p = 640 nm Ee Ch0 155 Ch1 16 Ch0 155 Ch1 139 counts = 72 W/cm2 p = 940 nm 2 Ee = 140 W/cm p = 640 nm, ADC count value ratio: Ch1/Ch0, standard mode Ee = 72 W/cm2 p = 940 nm, Ee = 140 W/cm2 Re Irradiance responsivity standard mode Rv Illuminance responsivity standard mode Page 6 Document Feedback 0.070 0.106 0.175 0.70 0.88 1.20 p = 640 nm Ch0 11.1 Ee = 72 W/cm2 Ch1 1.2 p = 940 nm Ch0 5.7 Ee = 140 W/cm2 Ch1 5 Ch0 2.8 Ch1 0.23 Ch0 19 Ch1 13 Fluorescent light source: 300 Lux counts/ (W/ cm2) counts/lux Incandescent light source: 50 Lux ams Datasheet [v1-00] 2016-May-20 TSL2550 - Electrical Characteristics Parameter (Sensor Lux) / (actual Lux), standard mode (4) Test Conditions Channel Min Typ Max Fluorescent light source: 300 Lux 0.65 1 1.35 Incandescent light source: 50 Lux 0.5 1 1.5 Unit Note(s): 1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible 640 nm LEDs and infrared 940 nm LEDs are used for final product testing for compatibility with high volume production. 2. The 640 nm irradiance E e is supplied by an AlInGaP light-emitting diode with the following characteristics: peak wavelength p = 640 nm and spectral halfwidth 1/2 = 17 nm. 3. The 940 nm irradiance E e is supplied by a GaAs light-emitting diode with the following characteristics: peak wavelength p = 940 nm and spectral halfwidth 1/2 = 40 nm. 4. The sensor Lux is calculated using the empirical formula shown on p. 11 of this data sheet based on measured Ch0 and Ch1 ADC count values for the light source specified. Actual Lux is obtained with a commercial luxmeter. The range of the (sensor Lux) / (actual Lux) ratio is estimated based on the variation of the 640 nm and 940 nm optical parameters. Devices are not 100% tested with fluorescent or incandescent light sources. ams Datasheet [v1-00] 2016-May-20 Page 7 Document Feedback TSL2550 - Electrical Characteristics Figure 10: AC Electrical Characteristics, VDD = 3.3 V, TA = 25C (unless otherwise noted) Symbol Parameter t(CONV) Conversion time, per channel, standard mode 400 ms t(CONV) Conversion time, per channel, extended mode 80 ms f(SMBCLK) t(BUF) Test Conditions Min Clock frequency Bus free time between start and stop condition Typ Max 100 Unit kHz 4.7 s 4 s 4.7 s 4 s t(HDSTA) Hold time after (repeated) start condition. After this period, the first clock is generated. t(SUSTA) Repeated start condition setup time t(SUSTO) Stop condition setup time t(HDDAT) Data hold time 300 ns t(SUDAT) Data setup time 250 ns t(LOW) SMBCLK clock low period 4.7 s t(HIGH) SMBCLK clock high period 4 s Detect clock/data low timeout 25 t(TIMEOUT) 35 ms tF Clock/data fall time 300 ns tR Clock/data rise time 1000 ns Ci Input pin capacitance 10 pF Page 8 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Parameter Measurement Information Parameter Measurement Information Figure 11: SMBus Timing Diagrams t(LOW) t(R) t(F) VIH SMBCLK VIL t(HDSTA) t(BUF) t(HIGH) t(SUSTA) t(HDDAT) t(SUSTO) t(SUDAT) VIH SMBDATA VIL P Stop Condition S S Start Condition Start P Stop t(LOWSEXT) SMBCLKACK SMBCLKACK t(LOWMEXT) t(LOWMEXT) t(LOWMEXT) SMBCLK SMBDATA Figure 12: SMBus Timing Diagram for Send Byte Format 1 9 1 9 SMBCLK SMBDATA A6 A5 A4 A3 A2 A1 A0 R/W Start by Master D6 D5 D4 D3 D2 D1 D0 ACK by TSL2550 Frame 1 SMBus Slave Address Byte ams Datasheet [v1-00] 2016-May-20 D7 ACK by Stop by TSL2550 Master Frame 2 Command Byte Page 9 Document Feedback TSL2550 - Parameter Measurement Information Figure 13: SMBus Timing Diagram for Receive Byte Format 1 9 1 9 SMBCLK SMBDATA A6 A5 A4 A3 A2 A1 A0 R/W Start by Master ACK by TSL2550 Frame 1 SMBus Slave Address Byte Page 10 Document Feedback D7 D6 D5 D4 D3 D2 D1 D0 NACK by Stop by Master Master Frame 2 Data Byte From TSL2550 ams Datasheet [v1-00] 2016-May-20 TSL2550 - Typical Operating Characteristics Typical Operating Characteristics Figure 14: Spectral Responsivity 1 Relative Responsivity 0.8 Channel 0 Photodiode 0.6 0.4 Channel 1 Photodiode 0.2 0 400 500 600 700 800 900 1000 1100 5.5 6 O Wavelength nm Figure 15: Normalized ADC Output vs. Supply Voltage 1.8 Normalized ADC Output 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 2.5 3 3.5 4 4.5 5 VDD Supply Voltage V ams Datasheet [v1-00] 2016-May-20 Page 11 Document Feedback TSL2550 - Principles Of Operation Principles Of Operation Analog-to-Digital Converter The TSL2550 contains an integrating analog-to-digital converter (ADC) that integrates a photodiode current. First it integrates channel 0 photodiode current and then it integrates channel 1 photodiode current. At the end of the conversion cycle for each channel, the conversion result is transferred to the appropriate channel 0 or channel 1 ADC register. The transfer is double-buffered to ensure that invalid data is not read during the transfer. After the data is transferred, the TSL2550 automatically begins the next conversion cycle. A VALID bit is used to indicate that data has been written to the ADC register after ADC is enabled. Interface to the ADC and control of other device functions is accomplished using the standard 2-wire System Management Bus (SMBus) interface. Both versions 1.1 and 2.0 of the SMBus are supported. The ADC has two operating modes: standard and extended. In standard mode, the integration time is 400 mS for each channel or 800 mS for both channel 0 and channel 1. Extended mode shortens the integration time by a factor of five with a corresponding decrease in responsivity of 5x. The extended range allows the device to operate at higher light levels, extending the overall dynamic range by a factor of five. Digital Interface The TSL2550 contains an 8-bit command register that can be written and read via the SMBus. The command register controls the overall operation of the device. There are two read-only registers that contain the latest converted value of each of the two ADC channels. The SMBus slave address is hardwired internally as 0111001 (MSB to LSB, A6 to A0). Both the send byte protocol and the receive byte protocol are implemented in the TSL2550. The send byte protocol allows single bytes of data to be written to the device (see Figure 16). The written byte is called the COMMAND byte. The receive byte protocol allows single bytes of data to be read from the device (see Figure 17). The receive data can be either the previously written COMMAND byte or the data from one of the ADC channels. In Figure 16 and Figure 17, the clear area represents data sent by the host and the shaded area represents data returned by the ambient light sensor or slave device. Page 12 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Principles Of Operation Figure 16: Send Byte Protocol 1 7 1 1 8 1 1 S Slave Address WR A Data Byte A P S = Start Condition P = Stop Condition Shaded = Slave Transmission Figure 17: Receive Byte Protocol 1 7 1 1 8 1 1 S Slave Address RD A Data Byte A P S = Start Condition ams Datasheet [v1-00] 2016-May-20 P = Stop Condition Shaded = Slave Transmission Page 13 Document Feedback TSL2550 - Principles Of Operation Command Register The command register is used primarily to: * Select which ADC register will be read during a read cycle * Switch the dynamic range of the device between standard and extended range modes * Power the device up for operation or power it down for minimum power consumption Figure 18 shows the six primary commands used to control the TSL2550. Figure 18: Command Summary Command Function 0x00h Power-down state 0x03h Power-up state/Read command register 0x1Dh Write command to assert extended range mode 0x18h Write command to reset or return to standard range mode 0x43h Read ADC channel 0 0x83h Read ADC channel 1 The content of the command register defaults to 0x00h when power is applied to the device, placing the device into the power-down mode. Once the TSL2550 is set to the standard range mode (0x18h) or the extended range mode (0x1Dh), the device remains in that mode until it is powered down or the mode is changed via the command register. The 0x03h command has two purposes: It is used to power up the device and can also be used to check that the device is communicating properly. The value returned during a read cycle should be 0x03h. Page 14 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Principles Of Operation ADC Register The TSL2550 contains two ADC registers (channel 0 and channel 1). Each ADC register contains two component fields that are used to determine the logarithmic ADC count value: CHORD bits and STEP bits. The CHORD bits correspond to the most significant portion of the ADC value and specifies a segment of the piece-wise linear approximation. The STEP bits correspond to the least significant portion of the ADC count value and specifies a linear value within a segment. CHORD and STEP bits all equal to 0 corresponds to a condition in which the light level is below the detection limit of the sensor. CHORD and STEP bits all equal to 1 corresponds to an overflow condition. Each of the two ADC value registers contain seven data bits and a valid bit as described in Figure 19. Figure 19: ADC Register Data Format Valid Chord Bits Step Bits B7 B6 B5 B4 B3 B2 B1 B0 VALID C2 C1 C0 S3 S2 S1 S0 Field Bits VALID 7 CHORD 6 to 4 CHORD number. STEP 3 to 0 STEP number. Description ADC channel data is valid. One indicates that the ADC has written data into the channel data register, since ADCEN was asserted in the COMMAND register. The specific ADC value register read depends on the last read command written to the command register, as described above and in the Operation section, below. The MSB of the ADC register (VALID bit B7) is used to indicate that data has been written to the ADC register after the device is powered up as described in Command Register section. Bits 6 through 0 contain the 7-bit code representing the ADC count value, which is proportional to a photodetector current. In this code, the ADC count value is represented by a piece-wise linear approximation to a log function. The transfer function is broken into 8 chords of 16 steps each. (This code is very similar to -law code used in audio compression -- it differs in that it does not have a sign bit and it is not inverted.) Figure 20 shows the relationship between the CHORD and STEP bits and the CHORD and STEP numbers and values. These are used to calculate the ADC count value. ams Datasheet [v1-00] 2016-May-20 Page 15 Document Feedback Figure 20: CHORD and STEP Numbers and Values vs Register Bits Chord Bits B6, B5, B4 C, Chord Number Chord Value (Note 1) Step Value (Note 2) 000 0 0 1 001 1 16 2 010 2 49 4 011 3 115 8 100 4 247 16 101 5 511 32 110 6 1039 64 111 7 2095 128 Step Bits B3, B2, B1, B0 S, Step Number 0000 0 0001 1 0010 2 0011 3 0100 4 0101 5 0110 6 0111 7 1000 8 1001 9 1010 10 1011 11 1100 12 1101 13 1110 14 1111 15 Note(s): 1. CHORD VALUE = INT (16.5 x ((2C) - 1)) 2. STEP VALUE = 2C Page 16 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Principles Of Operation The ADC count value is obtained by adding the CHORD VALUE and the product of the STEP NUMBER and STEP VALUE (which depends on CHORD NUMBER). ADC Count Value = ( ( Chord Value ) + ( Step Value ) x ( Step Number ) ) (EQ1) The ADC count value can also be expressed as a formula: (EQ2) c c ADC Coun t Value = ( INT ( 16.25 x ( 2 - 1 ) ) ) + ( S x ( 2 ) ) where: C is the CHORD NUMBER (0 to 7) S is the STEP NUMBER (0 to 15) as defined in Figure 20. Operation After applying VDD, the device will initially be in the power down state. To operate the device, issue an SMBus Send Byte protocol with the device address and the appropriate command byte to read ADC channel 0 or ADC channel 1 (see Figure 18). To obtain the conversion result, issue an SMBus Receive Byte protocol with the device address. The data byte received will correspond to the value in the ADC register (0 or 1) specified by the previous command. If a conversion has not been completed since power up (either through V DD or power up command), the valid bit will be 0, and the data will not be valid. If there is a valid conversion result available, the valid bit will be set (1), and the remaining 7 bits will represent valid data from the previously selected ADC register. Data may be read repeatedly from the currently selected ADC register, and although it will remain valid, the ADC register will not be updated until a new conversion completes for that channel (800 ms total since there are two serial 400 ms per channel conversion times in standard mode). Note also that the command register itself may be read, as a check to be sure that the device is communicating properly. To power down the device for reduced power consumption, issue an SMBus Send Byte protocol with the device address followed by 0 as indicated in Figure 18. ams Datasheet [v1-00] 2016-May-20 Page 17 Document Feedback TSL2550 - Application Information The TSL2550 is intended for use in ambient light detection applications, such as display backlight control, where adjustments are made to display brightness or contrast based on the brightness of the ambient light, as perceived by the human eye. Conventional silicon detectors respond strongly to infrared light, which the human eye does not see. This can lead to significant error when the infrared content of the ambient light is high, such as with incandescent lighting, due to the difference between the silicon detector response and the brightness perceived by the human eye. Application Information This problem is overcome in the TSL2550 through the use of two photodiodes. One of the photodiodes (channel 0) is sensitive to both visible and infrared light, while the second photodiode (channel 1) is sensitive primarily to infrared light. An integrating ADC converts the photodiode currents to channel 0 and channel 1 digital outputs. Channel 1 digital output is used to compensate for the effect of the infrared component of light on the channel 0 digital output. The ADC digital outputs from the two channels are used in a formula to obtain a value that approximates the human eye response in the commonly used Illuminance unit of Lux. For standard mode: (EQ3) Light Level ( lux ) ) = ( Ch0 - Ch1 ) x 0.39 x e 2 ( - 0.181R ) where: R = Ch1 Counts / (Ch0 Counts - Ch1 Counts) The formula above was obtained by optical testing with fluorescent and incandescent light sources. The light level calculated from the formula will be slightly higher than the actual light level for sunlight and will be slightly lower than the actual light level for composite fluorescent and incandescent light sources. Note(s): Please see ams application notes for additional information, including implementing a display brightness control system with the TSL2550, and for a simple implementation of the equation shown above suitable for use in embedded microcontrollers. Figure 21 contains a summary of the typical sensor outputs for several common light sources. Page 18 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Application Information Figure 21: Sensor Output Summary (Standard Mode) Light Source Illuminance (LUX) Channel 0 (Counts) Channel 1 (Counts) Ratio: CH1/CH0 LUX Per CH0 Count Fluorescent 297 831 68 0.082 0.36 Daylight (shade) 201 895 343 0.383 0.22 Incandescent 42 959 671 0.7 0.04 Light from 50 or 60 Hz sources, and especially fluorescent lighting, has a high harmonic content. Since the TSL2550 integrates the ambient light over an approximately 400 millisecond interval (per channel), this light ripple is typically reduced to less than 1/4 LSB. Power Supply Decoupling The power supply lines must be decoupled with a 0.1 F capacitor placed as close to the device package as possible. The bypass capacitor should have low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents caused by internal logic switching. ams Datasheet [v1-00] 2016-May-20 Page 19 Document Feedback TSL2550 - Application Information PCB Pad Layout Suggested PCB pad layout guidelines for the D package and T package are shown in Figure 22 and Figure 23. Figure 22: Suggested D Package PCB Layout 4.65 6.90 1.27 2.25 0.50 Note(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. Figure 23: Suggested T Package PCB Layout 2.90 1.50 1.00 0.90 Note(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice. Page 20 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Mechanical Data Mechanical Data Figure 24: Package D -- Plastic Small Outline IC Packaging Configuration PACKAGE D Plastic Small-Outline BOTTOM VIEW TOP VIEW PIN 1 PIN 1 6 1.27 SIDE VIEW 2.8 TYP CLEAR WINDOW NOTE B 8 0.510 0.330 END VIEW 0.50 0.25 5.00 4.80 45 5.3 MAX 0.88 TYP TOP OF SENSOR DIE A 1.75 1.35 DETAIL A 4.00 3.80 6.20 5.80 RoHS 0.25 0.19 Pb Green 1.27 0.41 0.25 0.10 Note(s): 1. All linear dimensions are in millimeters. 2. The center of the 1234 m by 282 m photo-active area is typically located in the center of the package in the long dimension and 269 m off center in the short dimension. 3. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55. 4. This drawing is subject to change without notice. ams Datasheet [v1-00] 2016-May-20 Page 21 Document Feedback TSL2550 - Mechanical Data Figure 25: Package T -- Four-Lead Surface Mount Device Packaging Configuration PACKAGE T Four-Lead Surface Mount Device TOP VIEW PHOTODIODE ACTIVE AREA LOCATION 1.46 0.28 PIN 1 PIN 4 0.67 1.50 1.23 0.55 SIDE VIEW 0.50 1.35 DETAIL A: TYPICAL PACKAGE TERMINAL 0.35 3.10 2 7 0.10 0.90 0.78 BOTTOM VIEW 0.78 A R 0.25 2.60 PIN 4 PIN 1 3.80 Pb RoHS Green Note(s): 1. All linear dimensions are in millimeters. 2. Terminal finish is gold. 3. Dimension tolerance is 0.15 mm. 4. This drawing is subject to change without notice. Page 22 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Mechanical Data Figure 26: Package D Carrier Tape SIDE VIEW Ko 2.11 0.10 [0.083 0.004] 0.292 0.013 [0.0115 0.0005] END VIEW TOP VIEW 1.50 8 0.1 [0.315 0.004] 4 0.1 [0.157 0.004] 2 0.05 [0.079 0.002] 1.75 0.10 [0.069 0.004] B 5.50 0.05 [0.217 0.002] 12 + 0.3 i 0.1 [0.472 + 0.12 i 0.004] A A B DETAIL A Ao DETAIL B 6.45 0.10 [0.254 0.004] Bo 5.13 0.10 [0.202 0.004] Note(s): 1. All linear dimensions are in millimeters [inches]. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing Ao, B o, and Ko are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 178 millimeters in diameter and contains 1000 parts. 5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. 7. This drawing is subject to change without notice. ams Datasheet [v1-00] 2016-May-20 Page 23 Document Feedback TSL2550 - Mechanical Data Figure 27: Package T Carrier Tape 0.30 0.050 2.10 SIDE VIEW 1.75 0.100 B 1.50 4 0.100 END VIEW 2 0.100 8 Typ TOP VIEW 12 0.100 5.50 0.100 1.50 R 0.20 TYP B A A DETAIL B DETAIL A 2.90 0.100 Ao 3.09 MAX R 0.20 TYP R 0.20 TYP 4.29 MAX 4.10 0.100 Bo 1.80 Ko Note(s): 1. All linear dimensions are in millimeters. 2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing Ao, B o, and Ko are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 178 millimeters in diameter and contains 1000 parts. 5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape. 7. This drawing is subject to change without notice. Page 24 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Manufacturing Information Manufacturing Information The D and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB substrate. The process, equipment, and materials used in these test are detailed below. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 28: TSL2550 Solder Reflow Profile Parameter Reference TSL2550D/TSL2550T Average temperature gradient in preheating 2.5C/s tsoak 2 to 3 minutes Time above 217C t1 Max 60 s Time above 230C t2 Max 50 s Time above Tpeak -10C t3 Max 10 s Tpeak 260C (-0C/5C) Soak time Peak temperature in reflow Temperature gradient in cooling Max -5C/s Figure 29: TSL2550D/TSL2550T Solder Reflow Profile Graph Tpeak Not to scale -- for reference only T3 T2 Temperature (5C) T1 Time (s) t3 t2 tsoak ams Datasheet [v1-00] 2016-May-20 t1 Page 25 Document Feedback TSL2550 - Manufacturing Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package molding compound. Package D To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken on the moisture-barrier bag. However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours or longer, it is recommended that the following procedures be used to ensure the package molding compound contains the smallest amount of absorbed moisture possible. For devices shipped in tubes: 1. Remove devices from tubes 2. Bake devices for 4 hours, at 90C 3. After cooling, load devices back into tubes 4. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re-baked for 4 hours, at 90C for a cumulative total of 12 hours (3 bakes for 4 hours at 90C). For devices shipped in carrier tape: 1. Bake devices for 4 hours, at 90C in the tape 2. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re-baked for 4 hours in tape, at 90C for a cumulative total of 12 hours (3 bakes for 4 hours at 90C). Page 26 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Manufacturing Information Package T To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under the following conditions: * Temperature Range: 5C to 50C * Relative Humidity: 60% maximum * Total Time: 6 months from the date code on the aluminized envelope--if unopened * Opened Time: 168 hours or fewer Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90C for 4 hours. ams Datasheet [v1-00] 2016-May-20 Page 27 Document Feedback TSL2550 - Ordering & Contact Information Ordering & Contact Information Figure 30: Ordering Information Ordering Code Package - Leads Device TA Package Designator Delivery Type Delivery Quantity TSL2550D SOIC-8 TSL2550 -40C to 85C D Tape & Reel 1000 pcs/reel TSL2550T T-4 TSL2550 -40C to 85C T Tape & Reel 1000 pcs/reel Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbaderstrasse 30 8141 Premstaetten Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Page 28 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - RoHS Compliant & ams Green Statement RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specified lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. ams Datasheet [v1-00] 2016-May-20 Page 29 Document Feedback TSL2550 - Copyrights & Disclaimer Copyrights & Disclaimer Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appearing in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein. ams AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG "AS IS" and any express or implied warranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of ams AG rendering of technical or other services. Page 30 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Document Status Document Status Document Status Product Preview Preliminary Datasheet Datasheet Datasheet (discontinued) ams Datasheet [v1-00] 2016-May-20 Product Status Definition Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Page 31 Document Feedback TSL2550 - Revision Information Revision Information Changes from 029L (2007-Oct) to current revision 1-00 (2016-May-20) Page Content of TAOS datasheet was updated to latest ams design Updated Key Benefits & Features 1 Updated Ordering Information 28 Note(s): 1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision. 2. Correction of typographical errors is not explicitly mentioned. Page 32 Document Feedback ams Datasheet [v1-00] 2016-May-20 TSL2550 - Content Guide Content Guide ams Datasheet [v1-00] 2016-May-20 1 1 2 General Description Key Benefits & Features Functional Block Diagram 3 4 5 9 11 Pin Assignments Absolute Maximum Ratings Electrical Characteristics Parameter Measurement Information Typical Operation Characteristics 12 12 12 14 15 17 Principles Of Operation Analog-to-Digital Converter Digital Interface Command Register ADC Register Operation 18 19 20 Application Information Power Supply Decoupling PCB Pad Layout 21 Mechanical Data 25 26 26 27 Manufacturing Information Moisture Sensitivity Package D Package T 28 29 30 31 32 Ordering & Contact Information RoHS Compliant & ams Green Statement Copyrights & Disclaimer Document Status Revision Information Page 33 Document Feedback