KAI-16000 IMAGE SENSOR
4872 (H) X 3248 (V) INTERLINE CCD IMAGE SENSOR
JUNE 14, 2013
DEVICE PERFORMANCE SPECIFICATION
REVISION 2.0 PS-0013
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 2
TABLE OF CONTENTS
Summary Specification ......................................................................................................................................................................................... 5
Description .................................................................................................................................................................................................... 5
Features ......................................................................................................................................................................................................... 5
Applications .................................................................................................................................................................................................. 5
Ordering Information ............................................................................................................................................................................................ 6
Device Description ................................................................................................................................................................................................. 7
Architecture .................................................................................................................................................................................................. 7
Pin Description and Physical Orientation .............................................................................................................................................. 8
Imaging Performance ............................................................................................................................................................................................ 9
Typical Operational Conditions................................................................................................................................................................ 9
Specifications................................................................................................................................................................................................ 9
KAI-16000-AAA...................................................................................................................................................................................... 10
KAI-16000-AXA ...................................................................................................................................................................................... 10
KAI-16000-CXA ...................................................................................................................................................................................... 10
Typical Performance Curves ............................................................................................................................................................................ 11
Monochrome with Microlens Quantum Efficiency ........................................................................................................................... 11
Monochrome without Microlens Quantum Efficiency .................................................................................................................... 11
Color with Microlens Quantum Efficiency .......................................................................................................................................... 12
Angular Quantum Efficiency .................................................................................................................................................................. 13
Monochrome with Microlens ............................................................................................................................................................. 13
Defect Definitions ................................................................................................................................................................................................ 14
Operational Conditions ........................................................................................................................................................................... 14
Specifications............................................................................................................................................................................................. 14
Defect Map............................................................................................................................................................................................. 14
Test Definitions ..................................................................................................................................................................................................... 15
Test Regions of Interest ......................................................................................................................................................................... 15
OverClocking ............................................................................................................................................................................................. 15
Tests ............................................................................................................................................................................................................. 16
Global Non-Uniformity ........................................................................................................................................................................ 16
Dark Field Defect Test ........................................................................................................................................................................ 16
Bright Field Defect Test ...................................................................................................................................................................... 16
Operation .................................................................................................................................................................................................................. 17
Absolute Maximum Ratings ................................................................................................................................................................... 17
Maximum Voltage Ratings Between Pins .......................................................................................................................................... 17
Power Up Sequence ................................................................................................................................................................................. 17
DC Bias Operating Conditions ............................................................................................................................................................... 18
AC Operating Conditions ........................................................................................................................................................................ 18
Clock Levels ........................................................................................................................................................................................... 18
Clock Line Capacitances ...................................................................................................................................................................... 19
Timing ......................................................................................................................................................................................................................... 20
Requirements and Characteristics ....................................................................................................................................................... 20
Main Timing – Continuous Mode .......................................................................................................................................................... 20
Frame Timing – Continuous Mode ....................................................................................................................................................... 21
Line Timing Continuous Mode............................................................................................................................................................... 22
Line Timing Single Output.................................................................................................................................................................. 22
Line Timing Double Output ............................................................................................................................................................... 22
Line Timing Detail Single Output ..................................................................................................................................................... 23
Line Timing Detail Edge Alignment ................................................................................................................................................. 23
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 3
Pixel Timing ................................................................................................................................................................................................ 24
Fast Line Dump Timing ............................................................................................................................................................................ 25
Electronic Shutter Timing ....................................................................................................................................................................... 26
Electronic Shutter Integration Time Definition ................................................................................................................................ 26
Storage and Handling .......................................................................................................................................................................................... 27
Storage Conditions................................................................................................................................................................................... 27
ESD ............................................................................................................................................................................................................... 27
Cover Glass Care and Cleanliness ......................................................................................................................................................... 27
Environmental Exposure ........................................................................................................................................................................ 27
Soldering Recommendations ................................................................................................................................................................ 27
Mechanical Drawings ........................................................................................................................................................................................... 28
Completed Assembly ............................................................................................................................................................................... 28
Cover Glass ................................................................................................................................................................................................. 30
Glass Transmission ................................................................................................................................................................................... 31
Quality Assurance and Reliability .................................................................................................................................................................. 32
Quality and Reliability ............................................................................................................................................................................. 32
Replacement .............................................................................................................................................................................................. 32
Liability of the Supplier ........................................................................................................................................................................... 32
Liability of the Customer ........................................................................................................................................................................ 32
Test Data Retention ................................................................................................................................................................................. 32
Mechanical .................................................................................................................................................................................................. 32
Life Support Applications Policy .................................................................................................................................................................... 32
Revision Changes................................................................................................................................................................................................... 33
MTD/PS-1027 ............................................................................................................................................................................................. 33
PS-0013 ....................................................................................................................................................................................................... 33
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 4
TABLE OF FIGURES
Figure 1: Sensor Architecture ...................................................................................................................................................................... 7
Figure 2: Package Pin Designations - Top View ....................................................................................................................................... 8
Figure 3: Monochrome with Microlens Quantum Efficiency.............................................................................................................. 11
Figure 4: Monochrome without Microlens Quantum Efficiency ....................................................................................................... 11
Figure 5: Color with Microlens Quantum Efficiency............................................................................................................................. 12
Figure 6: Monochrome with Microlens Angular Quantum Efficiency .............................................................................................. 13
Figure 7: Overclock Regions of Interest .................................................................................................................................................. 15
Figure 8: Main Timing - Continuous Mode .............................................................................................................................................. 20
Figure 10: Line Timing Single Output ...................................................................................................................................................... 22
Figure 11: Line Timing Dual Output ......................................................................................................................................................... 22
Figure 12: Line Timing Detail Single Output .......................................................................................................................................... 23
Figure 13: Line Timing Detail Edge Alignment ...................................................................................................................................... 23
Figure 14: Pixel Timing ................................................................................................................................................................................ 24
Figure 16: Electronic Shutter Timing ....................................................................................................................................................... 26
Figure 17: Integration Time Definition .................................................................................................................................................... 26
Figure 18: Completed Assembly (1 of 2) ................................................................................................................................................. 28
Figure 19: Completed Assembly (2 of 2) ................................................................................................................................................. 29
Figure 20: Glass Drawing ............................................................................................................................................................................. 30
Figure 21: Glass Transmission .................................................................................................................................................................... 31
KAI-16000 Image Sensor
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Summary Specification
KAI-16000 Image Sensor
DESCRIPTION
The KAI-16000 is an interline transfer CCD offering 16
million pixels at up to 3 frames per second through 2
outputs. This image sensor is organized into an array of
4,872 (H) x 3,248 (V) with 7.4 micron square pixels and
full 35mm optical format. As an interline transfer CCD,
the KAI-16000 includes additional features such as
progressive scan readout, electronic shutter, low noise,
high dynamic range, and blooming suppression. These
features make the KAI-16000 the perfect sensor for
applications in Industrial, Aerial, Security, and Scientific
markets.
FEATURES
16 Million pixel resolution
Electronic shutter
35mm Optical format
Progressive scan readout
High sensitivity
Fast Frame rate
>60 dB dynamic range
APPLICATIONS
Industrial
Aerial Photography
Security
Scientific
Parameter
Typical Value
Architecture
Interline CCD;
Progressive Scan
Total Number of Pixels
4960 (H) x 3324 (V) = 16.6M
Number of Effective Pixels
4904 (H) x 3280 (V) = 16.1M
Number of Active Pixels
4872 (H) x 3248 (V) = 15.8M
Pixel Size
7.4 μm (H) x 7.4 μm (V)
Active Image Size
36.1 mm (H) x 24.0 mm (H)
43.3 mm (diagonal)
Aspect Ratio
3:2
Number of Outputs
1 or 2
Saturation Signal
30,000 electrons
Output Sensitivity
30 μV/e
Quantum Efficiency KAI-16000-AXA
(500nm)
45%
Quantum Efficiency KAI-16000-CXA
R(630nm), G(540nm), B(470nm)
30%, 37%, 42%
Read Noise (f=30MHz)
16 electrons
Dark Current
< 0.5 nA/cm2
Dark Current Doubling Temperature
7 ºC
Dynamic Range
65 dB
Charge Transfer Efficiency
0.99999
Blooming Suppression
> 100X
Smear
< -80 dB
Image Lag
< 10 electrons
Maximum Data Rate
30 MHz per channel
Package
40 pin Pin Grid Array
Cover Glass
AR coated, 2 sides
All parameters above are specified at T = 40 °C
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 6
Ordering Information
Catalog
Number
Product Name
Description
Marking Code
KAI-16000-AAA-JR-B1
Monochrome, No Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Grade 1
KAI-16000-AAA
(Serial Number)
KAI-16000-AAA-JR-B2
Monochrome, No Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Grade 2
KAI-16000-AAA-JR-AE
Monochrome, No Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Engineering Grade
KAI-16000-AAA-JD-B1
Monochrome, No Microlens, PGA Package,
Sealed Clear Cover Glass with AR coating (2 sides), Grade 1
KAI-16000-AAA-JD-B2
Monochrome, No Microlens, PGA Package,
Sealed Clear Cover Glass with AR coating (2 sides), Grade 2
KAI-16000-AAA-JD-AE
Monochrome, No Microlens, PGA Package,
Sealed Clear Cover Glass with AR coating (2 sides), Engineering Grade
KAI-16000-AXA-JD-BX
Monochrome, Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Special Grade
KAI-16000-AXA
(Serial Number)
KAI-16000-AXA-JD-B1
Monochrome, Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Grade 1
KAI-16000-AXA-JD-B2
Monochrome, Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Grade 2
KAI-16000-AXA-JD-AE
Monochrome, Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Engineering Grade
KAI-16000-AXA-JR-B1
Monochrome, Special Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Grade 1
KAI-16000-AXA-JR-B2
Monochrome, Special Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Grade 2
KAI-16000-AXA-JR-AE
Monochrome, Special Microlens, PGA Package,
Taped Clear Cover Glass with AR coating (2 sides), Engineering Grade
KAI-16000-CXA-JD-B1
Color (Bayer RGB), Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Grade 1
KAI-16000-CXA
(Serial Number)
KAI-16000-CXA-JD-B2
Color (Bayer RGB), Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Grade 2
KAI-16000-CXA-JD-AE
Color (Bayer RGB), Special Microlens, PGA Package,
Clear Cover Glass with AR coating (both sides), Engineering Grade
See Application Note Product Naming Convention for a full description of the naming convention used for Truesense
Imaging image sensors. For reference documentation, including information on evaluation kits, please visit our web
site at www.truesenseimaging.com.
Please address all inquiries and purchase orders to:
Truesense Imaging, Inc.
1964 Lake Avenue
Rochester, New York 14615
Phone: (585) 784-5500
E-mail: info@truesenseimaging.com
Truesense Imaging reserves the right to change any information contained herein without notice. All information
furnished by Truesense Imaging is believed to be accurate.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 7
Device Description
ARCHITECTURE
Figure 1: Sensor Architecture
There are 40 light shielded gray rows followed 3280 photoactive rows and finally 4 more light shielded gray rows. The
first 16 and the last 16 photoactive rows are buffer rows giving a total of 3248 lines of image data.
In the single output mode all pixels are clocked out of the Video L output in the lower left corner of the sensor. The
first 12 empty pixels of each line do not receive charge from the vertical shift register. The next 28 pixels receive
charge from the left light shielded edge followed by 4904 photosensitive pixels and finally 28 more light shielded
pixels from the right edge of the sensor. The first 16 and last 16 photosensitive pixels are buffer pixels giving a total of
4872 pixels of image data.
In the dual output mode the clocking of the right half of the horizontal CCD is reversed. The left half of the image is
clocked out Video L and the right half of the image is clocked out Video R. For the Video L each row consists of 12
empty pixels followed by 28 light shielded pixels followed by 2452 photosensitive pixels. For the Video R each row
consists of 12 empty pixels followed by 28 light shielded pixels followed by 2452 photosensitive pixels. When
reconstructing the image, data from Video R will have to be reversed in a line buffer and appended to the Video L data.
The gray rows are not entirely dark and so should not be used for a dark reference level. Use the dark columns on the
left or right side of the image sensor as a dark reference.
Of the dark columns, the first and last dark columns should not be used for determining the zero signal level. Some
light does leak into the first and last dark columns.
4872 (H) x 3248 (V)
Active Pixels
GG
R
BGG
R
B
GG
R
B
GG
R
B
Pixel
1,1
16 Buffer Rows
16 Buffer Rows
40 Gray Rows
16 Buffer Columns
16 Buffer Columns
28 Black Columns
28 Black Columns
12 Dummy Pixels
12 Dummy Pixels
Dual
Output
or
Video L Video R
12 28 16 4872 16 28
Single
12 28 16 2436 2436 16 28 12
Fast Line Dump Left - 2480
4 Gray Rows
Fast Line Dump Right - 2480
KAI-16000 Image Sensor
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PIN DESCRIPTION AND PHYSICAL ORIENTATION
Figure 2: Package Pin Designations - Top View
Pin
Name
Description
Pin
Name
Description
1
VOUTL
Video Output, Left
40
FDGL
Fast Line Dump Gate, Left
2
VDDL
Vdd, Left
39
RDL
Reset Drain, Left
3
GND
Ground
38
SUB
Substrate
4
RESETL
Reset Gate, Left
37
GND
Ground
5
HLASTL
Horizontal Clock, Last Stage, Left
36
V1
VCCD Gate 1, Phase 2
6
H2BL
Horizontal Clock, Phase 2, Barrier, Left
35
V5
VCCD Gate 5, Phase 2
7
H1BL
Horizontal Clock, Phase 1, Barrier, Left
34
V9
VCCD Gate 9, Phase 2
8
H1SL
Horizontal Clock, Phase 1, Storage, Left
33
V3
VCCD Gate 3, Phase 2
9
H2SL
Horizontal Clock, Phase 2, Storage, Left
32
V7
VCCD Gate 7, Phase 2
10
ESD
ESD Protection Disable
31
V11
VCCD Gate 11, Phase 2
11
GND
Ground
30
V2
VCCD Gate 2, Phase 1
12
H2SR
Horizontal Clock, Phase 2, Storage, Right
29
V6
VCCD Gate 6, Phase 1
13
H1SR
Horizontal Clock, Phase 1, Storage, Right
28
V10
VCCD Gate 10, Phase 1
14
H1BR
Horizontal Clock, Phase 1, Barrier, Right
27
V4
VCCD Gate 4, Phase 1
15
H2BR
Horizontal Clock, Phase 2, Barrier, Right
26
V8
VCCD Gate 8, Phase 1
16
HLASTR
Horizontal Clock, Last Stage, Right
25
V12
VCCD Gate 12, Phase 1
17
RESETR
Reset Gate, Right
24
GND
Ground
18
GND
Ground
23
SUB
Substrate
19
VDDR
Vdd, Right
22
RDR
Reset Drain, Right
20
VOUTR
Video Output, Right
21
FDGR
Fast Line Dump Gate, Right
Pixel 1,1
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
KAI-16000 Image Sensor
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Imaging Performance
TYPICAL OPERATIONAL CONDITIONS
Unless otherwise noted, the Specifications are measured using the following conditions.
Description
Condition
Notes
Frame Time
908 msec
1
Horizontal Clock Frequency
20 MHz
Light Source
Continuous red, green and blue illumination centered at 450, 530 and 650
nm
2,3
Operation
Nominal operating voltages and timing
Notes:
1. Electronic shutter is not used. Integration time equals frame time.
2. LEDs used: Blue: Nichia NLPB500, Green: Nichia NSPG500S and Red: HP HLMP-8115.
3. For monochrome sensor, only green LED used.
SPECIFICATIONS
Description
Symbol
Min.
Nom.
Max.
Units
Temperature
Tested At (°C)
Notes
Sample
Plan7
Global Non-Uniformity
n/a
2.5
5.0
%rms
27, 40
1
Die
Maximum Photoresponse
Nonlinearity
NL
n/a
2
%
2, 3
Design
Maximum Gain Difference Between
Outputs
G
n/a
10
%
2, 3
Design
Max. Signal Error due to
Nonlinearity Dif.
NL
n/a
1
%
2, 3
Design
Horizontal CCD Charge Capacity
HNe
100
ke-
Design
Vertical CCD Charge Capacity
VNe
50
ke-
27, 40
Die
Photodiode Charge Capacity
PNe
28
30
ke-
27, 40
4
Die
Horizontal CCD Charge Transfer
Efficiency
HCTE
0.99999
n/a
Design
Vertical CCD Charge Transfer
Efficiency
VCTE
0.99999
n/a
Design
Photodiode Dark Current
Ipd
n/a
40
350
e/p/s
40
Die
Photodiode Dark Current
Ipd
n/a
0.01
0.1
nA/cm2
40
Die
Vertical CCD Dark Current
Ivd
n/a
400
1711
e/p/s
40
Die
Vertical CCD Dark Current
Ivd
n/a
0.12
0.5
nA/cm2
40
Die
Dark Current Doubling
Temperature
T
n/a
7
n/a
°C
Design
Image Lag
Lag
n/a
<10
50
e-
Design
Antiblooming Factor
Xab
100
300
n/a
Design
Vertical Smear
Smr
n/a
-80
-75
dB
Design
Read Noise
ne-T
16
e-rms
5
Design
Dynamic Range
DR
65
dB
5, 6
Design
Output Amplifier DC Offset
Vodc
4
9.5
14
V
27, 40
Die
Output Amplifier Bandwidth
F-3db
140
MHz
Design
Output Amplifier Impedance
ROUT
100
130
200
Ohms
27, 40
Die
Output Amplifier Sensitivity
V/N
30
μV/e-
Design
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 10
KAI-16000-AAA
Description
Symbol
Min.
Nom.
Max.
Units
Temperature
Tested At (°C)
Notes
Sample
Plan7
Peak Quantum Efficiency
QEmax
11
n/a
%
Design
Peak Quantum Efficiency
Wavelength
λQE
n/a
500
n/a
nm
Design
KAI-16000-AXA
Description
Symbol
Min.
Nom.
Max.
Units
Temperature
Tested At (°C)
Notes
Sample
Plan7
Peak Quantum Efficiency
QEmax
45
n/a
%
Design
Peak Quantum Efficiency
Wavelength
λQE
n/a
500
n/a
nm
Design
KAI-16000-CXA
Description
Symbol
Min.
Nom.
Max.
Units
Temperature
Tested At (°C)
Notes
Sample
Plan7
Peak Blue
Quantum Green
Efficiency Red
QEmax
42
37
30
n/a
n/a
n/a
%
Design
Peak Blue
Quantum Green
Efficiency Red
Wavelength
λQE
n/a
n/a
n/a
470
540
630
n/a
n/a
n/a
nm
Design
n/a: not applicable
Notes:
1. Per color
2. Value is over the range of 10% to 90% of photodiode saturation.
3. Value is for the sensor operated without binning
4. The operating of the substrate voltage, VAB, will be marked on the shipping container for each device. The value of Vab is
set such that the photodiode charge capacity is 30,000 electrons.
5. At 30 MHz.
6. Uses 20LOG(PNe/ ne-T)
7. “Die” indicates a parameter that is measured on every sensor during the production testing. “Design” designates a
parameter that is quantified during the design verification activity.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 11
Typical Performance Curves
MONOCHROME WITH MICROLENS QUANTUM EFFICIENCY
Figure 3: Monochrome with Microlens Quantum Efficiency
MONOCHROME WITHOUT MICROLENS QUANTUM EFFICIENCY
Figure 4: Monochrome without Microlens Quantum Efficiency
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
300 400 500 600 700 800 900 1000 1100
Absolute Quantum Efficiency
Wavelength (nm)
Measured with AR
coated cover glass
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
300 400 500 600 700 800 900 1000 1100
Absolute Quantum Efficiency
Wavelength (nm)
Measured without AR
coated cover glass
KAI-16000 Image Sensor
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COLOR WITH MICROLENS QUANTUM EFFICIENCY
Figure 5: Color with Microlens Quantum Efficiency
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
400 500 600 700 800 900 1000 1100
Absolute Quantum Efficiency
Wavelength (nm)
Red Green Blue
Measured without AR
coated cover glass
KAI-16000 Image Sensor
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ANGULAR QUANTUM EFFICIENCY
For the curves marked “Horizontal”, the incident light angle is varied in a plane parallel to the HCCD.
For the curves marked “Vertical”, the incident light angle is varied in a plane parallel to the VCCD.
Monochrome with Microlens
Figure 6: Monochrome with Microlens Angular Quantum Efficiency
0
10
20
30
40
50
60
70
80
90
100
-30 -20 -10 0 10 20 30
Relative Quantum Efficiency (%)
Angle (degress)
Vertical
Horizontal
KAI-16000 Image Sensor
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Defect Definitions
OPERATIONAL CONDITIONS
All defect tests performed at tint = tframe = 908 msec
SPECIFICATIONS
Description
Definition
Class X Monochrome
with Microlens Only
Class 1
Class 2
Monochrome
Class 2
Color
Notes
Major dark field
defective bright pixel
Defect ≥ 245 mV
150
150
300
300
2
Major bright field
defective dark pixel
Defect ≥ 15%
Minor dark field
defective bright pixel
Defect ≥ 126 mV
1500
1500
3000
3000
3
Cluster defect
A group of 2 to “N”
contiguous major
defective pixels, but no
more than “W” adjacent
defects horizontally
0
30
N=20
W=4
30
N=20
W=4
30
N=20
W=4
1, 2
Column defect
A group of more than 10
contiguous major
defective pixels along a
single column
0
0
4
15
1, 2
Notes:
1. Column and cluster defects are separated by no less than two (2) pixels in any direction (excluding single pixel defects).
2. Tested at 27 °C and 40 °C.
3. Tested at 40 °C.
Class X sensors are offered strictly “as available”. Truesense Imaging cannot guarantee delivery dates. Please call for availability.
Defect Map
The defect map supplied with each sensor is based upon testing at an ambient (27 °C) temperature. Minor point
defects are not included in the defect map. All defective pixels are reference to pixel 1,1 in the defect maps.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 15
Test Definitions
TEST REGIONS OF INTEREST
Active Area ROI: Pixel (1, 1) to Pixel (4872, 3248)
Only the active pixels are used for performance and defect tests.
OVERCLOCKING
The test system timing is configured such that the sensor is overclocked in both the vertical and horizontal directions.
See Figure 7 for a pictorial representation of the regions.
Figure 7: Overclock Regions of Interest
Pixel 1,1
Vertical Overclock
Horizontal Overclock
H
V
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 16
TESTS
Global Non-Uniformity
This test is performed with the imager illuminated to a level such that the output is at 70% of saturation
(approximately 630 mV). Prior to this test being performed the substrate voltage has been set such that the charge
capacity of the sensor is 900 mV. Global non-uniformity is defined as
Signal Area Active Deviation Standard Area Active
* 100 Uniformity-Non Global
Units: %rms
Active Area Signal = Active Area Average – Horizontal Overclock Average
Dark Field Defect Test
This test is performed under dark field conditions. The sensor is partitioned into 384 sub regions of interest, each of
which is 203 by 203 pixels in size. In each region of interest, the median value of all pixels is found. For each region of
interest, a pixel is marked defective if it is greater than or equal to the median value of that region of interest plus the
defect threshold specified in the “Defect Definitions” section.
Bright Field Defect Test
This test is performed with the imager illuminated to a level such that the output is at approximately 630mV. Prior to
this test being performed the substrate voltage has been set such that the charge capacity of the sensor is 900mV. The
average signal level of all active pixels is found. The bright and dark thresholds are set as:
Dark defect threshold = Active Area Signal * threshold
Bright defect threshold = Active Area Signal * threshold
The sensor is then partitioned into 384 sub regions of interest, each of which is 203 by 203 pixels in size. In each region
of interest, the average value of all pixels is found. For each region of interest, a pixel is marked defective if it is
greater than or equal to the median value of that region of interest plus the bright threshold specified or if it is less
than or equal to the median value of that region of interest minus the dark threshold specified.
Example for major bright field defective pixels:
Average value of all active pixels is found to be 630 mV
Dark defect threshold: 630mV * 15% = 95 mV
Bright defect threshold: 630mV * 15% = 95 mV
Region of interest #1 selected. This region of interest is pixels 1, 1 to pixels 203, 203.
o Median of this region of interest is found to be 630 mV.
o Any pixel in this region of interest that is ≥ (630+95 mV) 725 mV in intensity will be marked defective.
o Any pixel in this region of interest that is ≤ (630-95 mV) 535 mV in intensity will be marked defective.
All remaining 384 sub regions of interest are analyzed for defective pixels in the same manner.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 17
Operation
ABSOLUTE MAXIMUM RATINGS
Absolute maximum rating is defined as a level or condition that should not be exceeded at any time per the
description. If the level or the condition is exceeded, the device will be degraded and may be damaged.
Description
Symbol
Minimum
Maximum
Units
Notes
Operating Temperature
TOP
-50
70
°C
1
Humidity
RH
5
90
%
2
Output Bias Current
Iout
0.0
-40
mA
3
Off-chip Load
CL
10
pF
Notes:
1. Noise performance will degrade at higher temperatures.
2. T=25 ºC. Excessive humidity will degrade MTTF.
3. Total for both outputs. Current is -20 mA for each output. Avoid shorting output pins to ground or any low impedance
source during operation. Amplifier bandwidth increases at higher current and lower load capacitance at the expense of
reduced gain (sensitivity). Operation at these values will reduce MTTF.
MAXIMUM VOLTAGE RATINGS BETWEEN PINS
Description
Minimum
Maximum
Units
Notes
RL, RR, H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR,
H2SR, HLASTL, HLASTR to ESD
0
17
V
Pin to Pin with ESD Protection
-17
17
V
1
VDDL, VDDR to GND
0
25
V
Notes:
1. Pins with ESD protection are: RL, RR, H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR, H2SR, HLASTL, and HLASTR
POWER UP SEQUENCE
1. Substrate
2. ESD Protection Disable
3. All other clocks and biases
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 18
DC BIAS OPERATING CONDITIONS
Description
Symbol
Pins
Minimum
Nominal
Maximum
Units
Maximum DC
Current (mA)
Notes
Reset Drain
RD
RDL, RDR
+11.5
+12.0
+12.0
V
Output Amplifier Supply
VDD
VDDL, VDDR
+14.5
+15.0
+15.5
V
4
Ground
GND
GND
0.0
0.0
0.0
V
Substrate
SUB
SUB
+8.0
VAB
+16.0
V
1, 5
ESD Protection Disable
ESD
ESD
-9.25
-9.0
-8.75
V
2
Output Bias Current
Iout
VOUTL, VOUTR
-5.0
-10.0
mA
3
Notes:
1. The operating of the substrate voltage, VAB, will be marked on the shipping container for each device. The value of Vab is
set such that the photodiode charge capacity is 30,000 electrons.
2. VESD must be at least 1 V more negative than H1_lo and H2_lo during sensor operation AND during camera power turn on.
3. An output load sink must be applied to Vout to activate output amplifier.
4. The maximum DC current is for one output unloaded. This is the maximum current that the first two stages of one output
amplifier will draw. This value is with Vout disconnected.
5. Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions
AC OPERATING CONDITIONS
Clock Levels
Description
Pins
Symbol
Minimum
Nominal
Maximum
Units
Notes
Vertical CCD Clock High
V1, V3, V5, V7, V9. V11
V_2hi
+8.5
+9.0
+9.5
V
Vertical CCD Clocks Midlevel
V1, V2, V3, V4, V5, V6,
V7, V8, V9, V10, V11,
V12
V_1mid, V_2mid
-0.2
0.0
+0.2
V
Vertical CCD Clocks Low
V1, V2, V3, V4, V5, V6,
V7, V8, V9, V10, V11,
V12
V_1lo, V_2lo
-9.5
-9.0
-8.5
V
Horizontal CCD Clocks Amplitude
H1SL, H1BL, H2SL,
H2BL, H1SR, H1BR,
H2SR, H2SR
H_amp
+4.5
+5.0
+5.5
V
Horizontal CCD Clocks Low
H1SL, H1BL, H2SL,
H2BL, H1SR, H1BR,
H2SR, H2SR
H_lo
-5.0
-4.5
-4.0
V
Horizontal Last CCD Amplitude
HLASTL, HLASTR
HLAST_amp
+4.5
+5.0
+5.5
V
Horizontal Last CCD Low
HLASTL, HLASTR
HLAST_lo
-5.0
-4.5
-4.0
V
Reset Clock Amplitude
RESETL, RESETR
R_amp
+4.5
+5.0
+5.5
V
Reset Clock Low
RESETL, RESETR
R_lo
-3.5
-3.0
-2.5
V
Electronic Shutter Voltage
SUB
Vshutter
+44
+48
+52
V
1
Fast Dump High
FDL, FDR
FD_hi
+4.5
+5.0
+5.5
V
Fast Dump Low
FDL, FDR
FD_lo
-9.5
-9.0
-8.5
V
Notes:
1. Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions
The figure below shows the DC bias (SUB) and AC clock (Vshutter) applied to the SUB pin. Both the DC bias and AC clock are
referenced to ground.
SUB
Vshutter
GND GND
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 19
Clock Line Capacitances
Clocks
Capacitance
Units
Notes
Vertical CCD Phase 1 to GND
108
nF
1, 3
Vertical CCD Phase 2 to GND
118
nF
1, 4
Vertical CCD Phase 1 to Vertical CCD Phase 2
56
nF
3, 4
H1S to GND
27
pF
2
H2S to GND
27
pF
2
H1B to GND
13
pF
2
H2B to GND
4
pF
2
H1S to H2B and H2S
13
pF
2
H1B to H2B and H2S
13
pF
2
H2S to H1B and H1S
13
pF
2
H2B to H1B and H1S
13
pF
2
HLAST to GND
20
pF
2
RESET to GND
10
pF
FD to GND
20
pF
Notes:
1. Gate capacitance to GND is voltage dependent. Value is for nominal VCCD clock voltages.
2. For nominal HCCD clock voltages, these values are for half of the imager (H1SL, H1BL, H2SL, H2BL and H1BINL or H1SR,
H1BR, H2SR, H2BR and H1BINR).
3. Vertical CCD Phase 1: V2, V4, V6, V8, V10, V12
4. Vertical CCD Phase 2: V1, V3, V5, V7, V9, V11
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 20
Timing
REQUIREMENTS AND CHARACTERISTICS
Description
Symbol
Minimum
Nominal
Maximum
Units
Notes
VCCD to HCCD Delay
THD
4
6
μs
VCCD Transfer Time
TVCCD
4
6
μs
HCCD to VCCD Delay
THL
50
ns
Photodiode transfer time
TV3rd
10
12
μs
VCCD Pedestal time
T3P
200
600
μs
VCCD Delay
T3D
12
20
μs
VCCD Delay Before Pedestal
TDEL
50
ns
VCCD Delay Before 1st Line
TD1L
10
60
μs
Reset Pulse time
TR
3.25
ns
VCCD to HCCD Delay – Shutter
THDS
6
μs
Shutter Pulse time
TS
4
μs
Shutter Pulse delay
TSD
1.5
μs
HCCD Clock Period
TH
33.3
ns
VCCD rise/fall time
TVR
0.2
μs
Fast Dump Gate Leading Delay
TFDL
0.5
μs
Fast Dump Gate Trailing Delay
TFDT
0.5
μs
VCCD Line Clock Leading Edge Delay
TVL
0.2
0.3
0.4
μs
VCCD Line Clock Trailing Edge Delay
TVT
0.0
0.2
0.4
μs
MAIN TIMING – CONTINUOUS MODE
Figure 8: Main Timing - Continuous Mode
Repeat for 3324
Lines
Line Timing
Vertical Frame
Timing
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 21
FRAME TIMING – CONTINUOUS MODE
V1, V3, V5,
V7, V9, V11
V2, V4, V6,
V8, V10, V12
H1SL, H1BL,
H1SR, H2BR
H2SL, H2BL,
H2SR, H1BR
HLASTL,
HLASTR
V_2lo
V_2mid
V_1lo
V_1mid
V_2hi
T3P T3D
TD1L
TDEL
TV3rd
H_lo
H_lo
H_amp
H_amp
HLAST_lo
HLAST_amp
Figure 9: Framing Timing
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 22
LINE TIMING CONTINUOUS MODE
Line Timing Single Output
Figure 10: Line Timing Single Output
Line Timing Double Output
Figure 11: Line Timing Dual Output
TVCCD
TL
THD
R
2
1
pixel count
39
11
12
13
14
40
41
42
43
4941
4942
4943
4945
4946
4971
4972
44
4944
4970
V2, V4, V6,
V8, V10, V12
V1, V3, V5,
V7, V9, V11
H1SL, H1BL,
H1SR, H2BR
H2SL, H2BL,
H2SR, H1BR
HLASTL, HLASTR
2483
2484
2485
2487
2488
2491
2492
2486
2490
2489
TVCCD
TL
THD
R
2
1
pixel count
39
11
12
13
14
40
41
42
43
44
V2, V4, V6,
V8, V10, V12
V1, V3, V5,
V7, V9, V11
H1SL, H1BL,
H1SR, H1BR
H2SL, H2BL,
H2SR, H2BR
HLASTL, HLASTR
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 23
Line Timing Detail Single Output
TVCCD
THD
THL
V2, V4, V6,
V8, V10, V12
V1, V3, V5,
V7, V9, V11
H1SL, H1BL,
H1SR, H2BR
H2SL, H2BL,
H2SR, H1BR
HLASTL, HLASTR
H_lo
H_lo
H_amp
H_amp
HLAST_lo
HLAST_amp
V_2lo
V_2mid
V_1lo
V_1mid
Figure 12: Line Timing Detail Single Output
Line Timing Detail Edge Alignment
Figure 13: Line Timing Detail Edge Alignment
Low 0%
10%
High 100%
90%
50%
V1, V3,
V5, V7,
V9, V11
V2, V4,
V6, V8,
V10, V12
TVL TVT
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 24
PIXEL TIMING
HLAST_lo
HLAST_amp
H_lo
H_amp
H_lo
H_amp
R_lo
R_amp
H1SL, H1BL,
H1SR, H2BR
H2SL, H2BL,
H2SR, H1BR
HLASTL, HLASTR
RR, RL
TR
Figure 14: Pixel Timing
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 25
FAST LINE DUMP TIMING
H1SL, H1BL,
H1SR, H2BR
V2, V4, V6,
V8, V10, V12
V1, V3, V5,
V7, V9, V11
FDR,
FDL
FD_lo
FD_hi
TVCCD
TFDL TFDT
THD
TVCCD TVCCD
Figure 15: Fast Line Dump Timing
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 26
ELECTRONIC SHUTTER TIMING
H1SL, H1BL,
H1SR, H2BR
H2SL, H2BL,
H2SR, H1BR
HLASTL, HLASTR
V2, V4, V6,
V8, V10, V12
V1, V3, V5,
V7, V9, V11
SUB
GND
VSUB
VES
THDS
TSD
TS
Figure 16: Electronic Shutter Timing
ELECTRONIC SHUTTER INTEGRATION TIME DEFINITION
Integration Time
VShutter
VSUB
V1, V3, V5,
V7, V9, V11
Figure 17: Integration Time Definition
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 27
Storage and Handling
STORAGE CONDITIONS
Description
Symbol
Minimum
Maximum
Units
Notes
Temperature
T
-55
80
°C
1
Humidity
RH
5
90
%
2
Notes:
1. Long-term exposure toward the maximum
temperature will accelerate color filter degradation.
2. T=25 ºC. Excessive humidity will degrade MTTF.
ESD
1. This device contains limited protection against
Electrostatic Discharge (ESD). ESD events may
cause irreparable damage to a CCD image sensor
either immediately or well after the ESD event
occurred. Failure to protect the sensor from
electrostatic discharge may affect device
performance and reliability.
2. Devices should be handled in accordance with
strict ESD procedures for Class 0 (<250V per
JESD22 Human Body Model test), or Class A
(<200V JESD22 Machine Model test) devices.
Devices are shipped in static-safe containers and
should only be handled at static-safe
workstations.
3. See Application Note Image Sensor Handling Best
Practices for proper handling and grounding
procedures. This application note also contains
workplace recommendations to minimize
electrostatic discharge.
4. Store devices in containers made of electro-
conductive materials.
COVER GLASS CARE AND CLEANLINESS
1. The cover glass is highly susceptible to particles
and other contamination. Perform all assembly
operations in a clean environment.
2. Touching the cover glass must be avoided.
3. Improper cleaning of the cover glass may
damage these devices. Refer to Application Note
Image Sensor Handling Best Practices.
ENVIRONMENTAL EXPOSURE
1. Extremely bright light can potentially harm CCD
image sensors. Do not expose to strong sunlight
for long periods of time, as the color filters
and/or microlenses may become discolored. In
addition, long time exposures to a static high
contrast scene should be avoided. Localized
changes in response may occur from color
filter/microlens aging. For Interline devices, refer
to Application Note Using Interline CCD Image
Sensors in High Intensity Visible lighting
Conditions.
2. Exposure to temperatures exceeding maximum
specified levels should be avoided for storage
and operation, as device performance and
reliability may be affected.
3. Avoid sudden temperature changes.
4. Exposure to excessive humidity may affect
device characteristics and may alter device
performance and reliability, and therefore should
be avoided.
5. Avoid storage of the product in the presence of
dust or corrosive agents or gases, as
deterioration of lead solderability may occur. It is
advised that the solderability of the device leads
be assessed after an extended period of storage,
over one year.
SOLDERING RECOMMENDATIONS
1. The soldering iron tip temperature is not to
exceed 370 °C. Higher temperatures may alter
device performance and reliability.
2. Flow soldering method is not recommended.
Solder dipping can cause damage to the glass
and harm the imaging capability of the device.
Recommended method is by partial heating using
a grounded 30 W soldering iron. Heat each pin
for less than 2 seconds duration.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 28
Mechanical Drawings
COMPLETED ASSEMBLY
Figure 18: Completed Assembly (1 of 2)
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 29
Figure 19: Completed Assembly (2 of 2)
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 30
COVER GLASS
Figure 20: Glass Drawing
1. Multi-Layer Anti-Reflective Coating on 2 sides:
3. Substrate - Schott D263T eco or Equivalent
2. Dust, Scratch specification - 20 microns max.
NOTES:
Double Sided Reflectance:
4. Epoxy: NCO-150HB
Range (nm)
450 -630 nm < 1%
630 -680 nm < 2%
Thickness: 0.002" - 0.005"
420 -450 nm < 2%
Coat Both Sides
Chamfer 0.008" [0.20] (Typ.
8 plcs.)
Epoxy: NC0-150 HB
Thk. 0.002" - 0.005"
Chamfer 0.020" [0.50] (Typ. 4 plcs.)
0.020R [0.50] (Typ. 8 plcs.)
Ref. AR coat area
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 31
GLASS TRANSMISSION
Figure 21: Glass Transmission
0
10
20
30
40
50
60
70
80
90
100
200 300 400 500 600 700 800 900
Wavelength (nm)
Transmission (%)
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 32
Quality Assurance and Reliability
QUALITY AND RELIABILITY
All image sensors conform to the specifications stated in this document. This is accomplished through a combination
of statistical process control and visual inspection and electrical testing at key points of the manufacturing process,
using industry standard methods. Information concerning the quality assurance and reliability testing procedures and
results are available from Truesense Imaging upon request. For further information refer to Application Note Quality
and Reliability.
REPLACEMENT
All devices are warranted against failure in accordance with the Terms of Sale. Devices that fail due to mechanical and
electrical damage caused by the customer will not be replaced.
LIABILITY OF THE SUPPLIER
A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the
customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale.
LIABILITY OF THE CUSTOMER
Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the
device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall
be the responsibility of the customer.
TEST DATA RETENTION
Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2
years after date of delivery.
MECHANICAL
The device assembly drawing is provided as a reference.
Truesense Imaging reserves the right to change any information contained herein without notice. All information
furnished by Truesense Imaging is believed to be accurate.
Life Support Applications Policy
Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without
the specific written consent of Truesense Imaging, Inc.
KAI-16000 Image Sensor
www.truesenseimaging.com Revision 2.0 PS-0013 Pg 33
©Truesense Imaging Inc., 2013. TRUESENSE is a registered trademark of Truesense Imaging, Inc.
Revision Changes
MTD/PS-1027
Revision Number
Description of Changes
1.0
Initial release
2.0
Added Monochrome Sealed Cover Glass Part Numbers to the Ordering Information page.
3.0
Added reference to Website for acquiring related documentation
Corrected number of dummy pixels. Changed from 13 dummy pixels to 12 dummy pixels.
Clock Line Capacitances, corrected Note 4 from Vertical CCD Clock Phase 1 to Vertical CCD Clock Phase 2
Corrected number of dummy pixels in Line Timing figures. Changed from 13 dummy pixels to 12 dummy pixels.
Line Timing Edge Alignment – updated vertical CCD clock designations
Fast Line Dump Timing – updated vertical CCD clock designations
Electronic Shutter Integration Time Definition – updated vertical CCD clock designation
Storage and Handling Section
o Updated item 3 in ESD section
o Updated item 3 in Cover Glass Care and Cleanliness section
4.0
Added Monochrome, Microlens, Taped Cover Glass Part Numbers to the Ordering Information page.
5.0
Corrected Reset Low nominal and minimum values. The values were swapped.
Added the note “Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions”
to the following sections
o DC Bias Operating Conditions
o AC Operating Conditions
o Storage and Handling
Changed cover glass material to D263T eco or equivalent
6.0
Added Monochrome, Microlens, Sealed MAR cover glass Class X part number to Ordering Information table
Added Monochrome, Microlens, Sealed MAR cover glass Class X defect definition to the Defect Definitions table
PS-0013
Revision Number
Description of Changes
1.0
Initial release with new document number, updated branding and document template
Updated Storage and Handling and Quality Assurance and Reliability sections
2.0
The completed assembly drawing was updated to clarify the placement of the sensor in the package. The location of the
sensor in the package has not changed. The drawing was updated only to clarify the sensor location.