KAI-16000 IMAGE SENSOR 4872 (H) X 3248 (V) INTERLINE CCD IMAGE SENSOR JUNE 14, 2013 DEVICE PERFORMANCE SPECIFICATION REVISION 2.0 PS-0013 KAI-16000 Image Sensor TABLE OF CONTENTS Summary Specification ......................................................................................................................................................................................... 5 Description .................................................................................................................................................................................................... 5 Features ......................................................................................................................................................................................................... 5 Applications .................................................................................................................................................................................................. 5 Ordering Information ............................................................................................................................................................................................ 6 Device Description ................................................................................................................................................................................................. 7 Architecture .................................................................................................................................................................................................. 7 Pin Description and Physical Orientation .............................................................................................................................................. 8 Imaging Performance ............................................................................................................................................................................................ 9 Typical Operational Conditions................................................................................................................................................................ 9 Specifications................................................................................................................................................................................................ 9 KAI-16000-AAA...................................................................................................................................................................................... 10 KAI-16000-AXA ...................................................................................................................................................................................... 10 KAI-16000-CXA ...................................................................................................................................................................................... 10 Typical Performance Curves ............................................................................................................................................................................ 11 Monochrome with Microlens Quantum Efficiency ........................................................................................................................... 11 Monochrome without Microlens Quantum Efficiency .................................................................................................................... 11 Color with Microlens Quantum Efficiency .......................................................................................................................................... 12 Angular Quantum Efficiency .................................................................................................................................................................. 13 Monochrome with Microlens ............................................................................................................................................................. 13 Defect Definitions ................................................................................................................................................................................................ 14 Operational Conditions ........................................................................................................................................................................... 14 Specifications............................................................................................................................................................................................. 14 Defect Map............................................................................................................................................................................................. 14 Test Definitions ..................................................................................................................................................................................................... 15 Test Regions of Interest ......................................................................................................................................................................... 15 OverClocking ............................................................................................................................................................................................. 15 Tests ............................................................................................................................................................................................................. 16 Global Non-Uniformity ........................................................................................................................................................................ 16 Dark Field Defect Test ........................................................................................................................................................................ 16 Bright Field Defect Test ...................................................................................................................................................................... 16 Operation .................................................................................................................................................................................................................. 17 Absolute Maximum Ratings ................................................................................................................................................................... 17 Maximum Voltage Ratings Between Pins .......................................................................................................................................... 17 Power Up Sequence ................................................................................................................................................................................. 17 DC Bias Operating Conditions ............................................................................................................................................................... 18 AC Operating Conditions ........................................................................................................................................................................ 18 Clock Levels ........................................................................................................................................................................................... 18 Clock Line Capacitances ...................................................................................................................................................................... 19 Timing ......................................................................................................................................................................................................................... 20 Requirements and Characteristics ....................................................................................................................................................... 20 Main Timing - Continuous Mode .......................................................................................................................................................... 20 Frame Timing - Continuous Mode ....................................................................................................................................................... 21 Line Timing Continuous Mode............................................................................................................................................................... 22 Line Timing Single Output.................................................................................................................................................................. 22 Line Timing Double Output ............................................................................................................................................................... 22 Line Timing Detail Single Output ..................................................................................................................................................... 23 Line Timing Detail Edge Alignment ................................................................................................................................................. 23 www.truesenseimaging.com Revision 2.0 PS-0013 Pg 2 KAI-16000 Image Sensor Pixel Timing ................................................................................................................................................................................................ 24 Fast Line Dump Timing ............................................................................................................................................................................ 25 Electronic Shutter Timing ....................................................................................................................................................................... 26 Electronic Shutter Integration Time Definition ................................................................................................................................ 26 Storage and Handling .......................................................................................................................................................................................... 27 Storage Conditions................................................................................................................................................................................... 27 ESD ............................................................................................................................................................................................................... 27 Cover Glass Care and Cleanliness ......................................................................................................................................................... 27 Environmental Exposure ........................................................................................................................................................................ 27 Soldering Recommendations ................................................................................................................................................................ 27 Mechanical Drawings ........................................................................................................................................................................................... 28 Completed Assembly ............................................................................................................................................................................... 28 Cover Glass ................................................................................................................................................................................................. 30 Glass Transmission ................................................................................................................................................................................... 31 Quality Assurance and Reliability .................................................................................................................................................................. 32 Quality and Reliability ............................................................................................................................................................................. 32 Replacement .............................................................................................................................................................................................. 32 Liability of the Supplier ........................................................................................................................................................................... 32 Liability of the Customer ........................................................................................................................................................................ 32 Test Data Retention ................................................................................................................................................................................. 32 Mechanical.................................................................................................................................................................................................. 32 Life Support Applications Policy .................................................................................................................................................................... 32 Revision Changes................................................................................................................................................................................................... 33 MTD/PS-1027 ............................................................................................................................................................................................. 33 PS-0013 ....................................................................................................................................................................................................... 33 www.truesenseimaging.com Revision 2.0 PS-0013 Pg 3 KAI-16000 Image Sensor TABLE OF FIGURES Figure 1: Sensor Architecture ...................................................................................................................................................................... 7 Figure 2: Package Pin Designations - Top View....................................................................................................................................... 8 Figure 3: Monochrome with Microlens Quantum Efficiency..............................................................................................................11 Figure 4: Monochrome without Microlens Quantum Efficiency .......................................................................................................11 Figure 5: Color with Microlens Quantum Efficiency.............................................................................................................................12 Figure 6: Monochrome with Microlens Angular Quantum Efficiency ..............................................................................................13 Figure 7: Overclock Regions of Interest ..................................................................................................................................................15 Figure 8: Main Timing - Continuous Mode ..............................................................................................................................................20 Figure 10: Line Timing Single Output ......................................................................................................................................................22 Figure 11: Line Timing Dual Output .........................................................................................................................................................22 Figure 12: Line Timing Detail Single Output ..........................................................................................................................................23 Figure 13: Line Timing Detail Edge Alignment ......................................................................................................................................23 Figure 14: Pixel Timing ................................................................................................................................................................................24 Figure 16: Electronic Shutter Timing .......................................................................................................................................................26 Figure 17: Integration Time Definition ....................................................................................................................................................26 Figure 18: Completed Assembly (1 of 2) .................................................................................................................................................28 Figure 19: Completed Assembly (2 of 2) .................................................................................................................................................29 Figure 20: Glass Drawing.............................................................................................................................................................................30 Figure 21: Glass Transmission ....................................................................................................................................................................31 www.truesenseimaging.com Revision 2.0 PS-0013 Pg 4 KAI-16000 Image Sensor Summary Specification KAI-16000 Image Sensor DESCRIPTION The KAI-16000 is an interline transfer CCD offering 16 million pixels at up to 3 frames per second through 2 outputs. This image sensor is organized into an array of 4,872 (H) x 3,248 (V) with 7.4 micron square pixels and full 35mm optical format. As an interline transfer CCD, the KAI-16000 includes additional features such as progressive scan readout, electronic shutter, low noise, high dynamic range, and blooming suppression. These features make the KAI-16000 the perfect sensor for applications in Industrial, Aerial, Security, and Scientific markets. FEATURES 16 Million pixel resolution Parameter Typical Value Architecture Interline CCD; Progressive Scan Total Number of Pixels 4960 (H) x 3324 (V) = 16.6M Number of Effective Pixels 4904 (H) x 3280 (V) = 16.1M Number of Active Pixels 4872 (H) x 3248 (V) = 15.8M Pixel Size 7.4 m (H) x 7.4 m (V) Active Image Size 36.1 mm (H) x 24.0 mm (H) 43.3 mm (diagonal) Electronic shutter 35mm Optical format Progressive scan readout Aspect Ratio 3:2 High sensitivity Number of Outputs 1 or 2 Saturation Signal 30,000 electrons Output Sensitivity 30 V/e Quantum Efficiency KAI-16000-AXA (500nm) 45% Quantum Efficiency KAI-16000-CXA R(630nm), G(540nm), B(470nm) 30%, 37%, 42% Industrial Read Noise (f=30MHz) 16 electrons Aerial Photography Dark Current < 0.5 nA/cm2 Security Dark Current Doubling Temperature 7 C Dynamic Range 65 dB Scientific Charge Transfer Efficiency 0.99999 Blooming Suppression > 100X Smear < -80 dB Image Lag < 10 electrons Maximum Data Rate 30 MHz per channel Package 40 pin Pin Grid Array Fast Frame rate >60 dB dynamic range APPLICATIONS Cover Glass AR coated, 2 sides All parameters above are specified at T = 40 C www.truesenseimaging.com Revision 2.0 PS-0013 Pg 5 KAI-16000 Image Sensor Ordering Information Catalog Number Product Name 4H0856 KAI-16000-AAA-JR-B1 Monochrome, No Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Grade 1 4H0857 KAI-16000-AAA-JR-B2 Monochrome, No Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Grade 2 4H0858 KAI-16000-AAA-JR-AE Monochrome, No Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Engineering Grade 4H2001 KAI-16000-AAA-JD-B1 Monochrome, No Microlens, PGA Package, Sealed Clear Cover Glass with AR coating (2 sides), Grade 1 4H2002 KAI-16000-AAA-JD-B2 Monochrome, No Microlens, PGA Package, Sealed Clear Cover Glass with AR coating (2 sides), Grade 2 4H2003 KAI-16000-AAA-JD-AE Monochrome, No Microlens, PGA Package, Sealed Clear Cover Glass with AR coating (2 sides), Engineering Grade 4H2226 KAI-16000-AXA-JD-BX Monochrome, Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Special Grade 4H0850 KAI-16000-AXA-JD-B1 Monochrome, Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Grade 1 4H0851 KAI-16000-AXA-JD-B2 Monochrome, Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Grade 2 4H0852 KAI-16000-AXA-JD-AE Monochrome, Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Engineering Grade 4H2109 KAI-16000-AXA-JR-B1 Monochrome, Special Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Grade 1 4H2110 KAI-16000-AXA-JR-B2 Monochrome, Special Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Grade 2 4H2111 KAI-16000-AXA-JR-AE Monochrome, Special Microlens, PGA Package, Taped Clear Cover Glass with AR coating (2 sides), Engineering Grade 4H0853 KAI-16000-CXA-JD-B1 Color (Bayer RGB), Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Grade 1 4H0854 KAI-16000-CXA-JD-B2 Color (Bayer RGB), Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Grade 2 4H0855 KAI-16000-CXA-JD-AE Color (Bayer RGB), Special Microlens, PGA Package, Clear Cover Glass with AR coating (both sides), Engineering Grade Description Marking Code KAI-16000-AAA (Serial Number) KAI-16000-AXA (Serial Number) KAI-16000-CXA (Serial Number) See Application Note Product Naming Convention for a full description of the naming convention used for Truesense Imaging image sensors. For reference documentation, including information on evaluation kits, please visit our web site at www.truesenseimaging.com. Please address all inquiries and purchase orders to: Truesense Imaging, Inc. 1964 Lake Avenue Rochester, New York 14615 Phone: (585) 784-5500 E-mail: info@truesenseimaging.com Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 6 KAI-16000 Image Sensor Device Description ARCHITECTURE 4 Gray Rows or Dual Output Pixel 1,1 B G B G G R G R 12 Dummy Pixels 4872 (H) x 3248 (V) Active Pixels 28 Black Columns G R 16 Buffer Rows 40 Gray Rows Fast Line Dump Left - 2480 Video L Single B G G R 16 Buffer Columns 16 Buffer Columns 12 Dummy Pixels 28 Black Columns 16 Buffer Rows B G 12 28 16 12 28 16 Fast Line Dump Right - 2480 4872 2436 2436 Video R 16 28 16 28 12 Figure 1: Sensor Architecture There are 40 light shielded gray rows followed 3280 photoactive rows and finally 4 more light shielded gray rows. The first 16 and the last 16 photoactive rows are buffer rows giving a total of 3248 lines of image data. In the single output mode all pixels are clocked out of the Video L output in the lower left corner of the sensor. The first 12 empty pixels of each line do not receive charge from the vertical shift register. The next 28 pixels receive charge from the left light shielded edge followed by 4904 photosensitive pixels and finally 28 more light shielded pixels from the right edge of the sensor. The first 16 and last 16 photosensitive pixels are buffer pixels giving a total of 4872 pixels of image data. In the dual output mode the clocking of the right half of the horizontal CCD is reversed. The left half of the image is clocked out Video L and the right half of the image is clocked out Video R. For the Video L each row consists of 12 empty pixels followed by 28 light shielded pixels followed by 2452 photosensitive pixels. For the Video R each row consists of 12 empty pixels followed by 28 light shielded pixels followed by 2452 photosensitive pixels. When reconstructing the image, data from Video R will have to be reversed in a line buffer and appended to the Video L data. The gray rows are not entirely dark and so should not be used for a dark reference level. Use the dark columns on the left or right side of the image sensor as a dark reference. Of the dark columns, the first and last dark columns should not be used for determining the zero signal level. Some light does leak into the first and last dark columns. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 7 KAI-16000 Image Sensor PIN DESCRIPTION AND PHYSICAL ORIENTATION 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pixel 1,1 1 2 3 4 5 Figure 2: Package Pin Designations - Top View Pin Name Description Pin Name Description 1 VOUTL Video Output, Left 40 FDGL Fast Line Dump Gate, Left 2 VDDL Vdd, Left 39 RDL Reset Drain, Left 3 GND Ground 38 SUB Substrate 4 RESETL Reset Gate, Left 37 GND Ground 5 HLASTL Horizontal Clock, Last Stage, Left 36 V1 VCCD Gate 1, Phase 2 6 H2BL Horizontal Clock, Phase 2, Barrier, Left 35 V5 VCCD Gate 5, Phase 2 7 H1BL Horizontal Clock, Phase 1, Barrier, Left 34 V9 VCCD Gate 9, Phase 2 8 H1SL Horizontal Clock, Phase 1, Storage, Left 33 V3 VCCD Gate 3, Phase 2 9 H2SL Horizontal Clock, Phase 2, Storage, Left 32 V7 VCCD Gate 7, Phase 2 10 ESD ESD Protection Disable 31 V11 VCCD Gate 11, Phase 2 11 GND Ground 30 V2 VCCD Gate 2, Phase 1 12 H2SR Horizontal Clock, Phase 2, Storage, Right 29 V6 VCCD Gate 6, Phase 1 13 H1SR Horizontal Clock, Phase 1, Storage, Right 28 V10 VCCD Gate 10, Phase 1 14 H1BR Horizontal Clock, Phase 1, Barrier, Right 27 V4 VCCD Gate 4, Phase 1 15 H2BR Horizontal Clock, Phase 2, Barrier, Right 26 V8 VCCD Gate 8, Phase 1 16 HLASTR Horizontal Clock, Last Stage, Right 25 V12 VCCD Gate 12, Phase 1 17 RESETR Reset Gate, Right 24 GND Ground 18 GND Ground 23 SUB Substrate 19 VDDR Vdd, Right 22 RDR Reset Drain, Right 20 VOUTR Video Output, Right 21 FDGR Fast Line Dump Gate, Right www.truesenseimaging.com Revision 2.0 PS-0013 Pg 8 KAI-16000 Image Sensor Imaging Performance TYPICAL OPERATIONAL CONDITIONS Unless otherwise noted, the Specifications are measured using the following conditions. Description Condition Frame Time 908 msec Horizontal Clock Frequency 20 MHz Light Source Continuous red, green and blue illumination centered at 450, 530 and 650 nm Operation Nominal operating voltages and timing Notes: 1. 2. 3. Notes 1 2,3 Electronic shutter is not used. Integration time equals frame time. LEDs used: Blue: Nichia NLPB500, Green: Nichia NSPG500S and Red: HP HLMP-8115. For monochrome sensor, only green LED used. SPECIFICATIONS Description Symbol Global Non-Uniformity Min. Nom. Max. Units Temperature Tested At (C) Notes Sample 7 Plan n/a 2.5 5.0 %rms 27, 40 1 Die Maximum Photoresponse Nonlinearity NL n/a 2 % 2, 3 Design Maximum Gain Difference Between Outputs G n/a 10 % 2, 3 Design Max. Signal Error due to Nonlinearity Dif. NL n/a 1 % 2, 3 Design Horizontal CCD Charge Capacity HNe 100 ke- Vertical CCD Charge Capacity VNe 50 ke- 27, 40 Photodiode Charge Capacity PNe 28 30 ke- 27, 40 Horizontal CCD Charge Transfer Efficiency HCTE 0.99999 n/a Design Vertical CCD Charge Transfer Efficiency VCTE 0.99999 n/a Design Photodiode Dark Current Ipd n/a 40 350 e/p/s 40 Die Photodiode Dark Current Ipd n/a 0.01 0.1 nA/cm2 40 Die Vertical CCD Dark Current Ivd n/a 400 1711 e/p/s 40 Die Vertical CCD Dark Current Ivd n/a 0.12 0.5 nA/cm2 40 Die Dark Current Doubling Temperature T n/a 7 n/a C Design - Design Design Die 4 Image Lag Lag n/a <10 50 Antiblooming Factor Xab 100 300 n/a Vertical Smear Smr n/a -80 -75 Read Noise ne-T 16 e-rms 5 Design Dynamic Range DR 65 dB 5, 6 Design Output Amplifier DC Offset Vodc Output Amplifier Bandwidth F-3db Output Amplifier Impedance ROUT Output Amplifier Sensitivity V/N www.truesenseimaging.com 4 9.5 14 140 100 130 30 e Die Design dB V Design 27, 40 MHz 200 Ohms V/e- Die Design 27, 40 Die Design Revision 2.0 PS-0013 Pg 9 KAI-16000 Image Sensor KAI-16000-AAA Description Symbol Min. Temperature Tested At (C) Notes Sample 7 Plan Nom. Max. Units 11 n/a % Design Design Peak Quantum Efficiency QEmax Peak Quantum Efficiency Wavelength QE n/a 500 n/a nm Symbol Min. Nom. Max. Units 45 n/a % Design Design KAI-16000-AXA Description Temperature Tested At (C) Notes Sample 7 Plan Peak Quantum Efficiency QEmax Peak Quantum Efficiency Wavelength QE n/a 500 n/a nm Symbol Min. Nom. Max. Units 42 37 30 n/a n/a n/a % Design 470 540 630 n/a n/a n/a nm Design KAI-16000-CXA Description Peak Quantum Efficiency Blue Green Red Peak Quantum Efficiency Wavelength Blue Green Red QEmax QE n/a n/a n/a Temperature Tested At (C) Notes Sample 7 Plan n/a: not applicable Notes: 1. 2. 3. 4. 5. 6. 7. Per color Value is over the range of 10% to 90% of photodiode saturation. Value is for the sensor operated without binning The operating of the substrate voltage, VAB, will be marked on the shipping container for each device. The value of Vab is set such that the photodiode charge capacity is 30,000 electrons. At 30 MHz. Uses 20LOG(PNe/ ne-T) "Die" indicates a parameter that is measured on every sensor during the production testing. "Design" designates a parameter that is quantified during the design verification activity. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 10 KAI-16000 Image Sensor Typical Performance Curves MONOCHROME WITH MICROLENS QUANTUM EFFICIENCY Absolute Quantum Efficiency 0.50 Measured with AR coated cover glass 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 300 400 500 600 700 800 900 1000 1100 Wavelength (nm) Figure 3: Monochrome with Microlens Quantum Efficiency MONOCHROME WITHOUT MICROLENS QUANTUM EFFICIENCY Absolute Quantum Efficiency 0.14 Measured without AR coated cover glass 0.12 0.10 0.08 0.06 0.04 0.02 0.00 300 400 500 600 700 800 900 1000 1100 Wavelength (nm) Figure 4: Monochrome without Microlens Quantum Efficiency www.truesenseimaging.com Revision 2.0 PS-0013 Pg 11 KAI-16000 Image Sensor Absolute Quantum Efficiency COLOR WITH MICROLENS QUANTUM EFFICIENCY 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 Measured without AR coated cover glass 400 500 600 700 800 900 1000 1100 Wavelength (nm) Red Green Blue Figure 5: Color with Microlens Quantum Efficiency www.truesenseimaging.com Revision 2.0 PS-0013 Pg 12 KAI-16000 Image Sensor ANGULAR QUANTUM EFFICIENCY For the curves marked "Horizontal", the incident light angle is varied in a plane parallel to the HCCD. For the curves marked "Vertical", the incident light angle is varied in a plane parallel to the VCCD. Monochrome with Microlens 100 Vertical 90 Relative Quantum Efficiency (%) 80 70 60 50 Horizontal 40 30 20 10 0 -30 -20 -10 0 10 20 30 Angle (degress) Figure 6: Monochrome with Microlens Angular Quantum Efficiency www.truesenseimaging.com Revision 2.0 PS-0013 Pg 13 KAI-16000 Image Sensor Defect Definitions OPERATIONAL CONDITIONS All defect tests performed at tint = tframe = 908 msec SPECIFICATIONS Class X Monochrome with Microlens Only Class 1 Class 2 Monochrome Class 2 Color Notes 150 150 300 300 2 Defect 126 mV 1500 1500 3000 3000 3 Cluster defect A group of 2 to "N" contiguous major defective pixels, but no more than "W" adjacent defects horizontally 0 30 N=20 W=4 30 N=20 W=4 30 N=20 W=4 1, 2 Column defect A group of more than 10 contiguous major defective pixels along a single column 0 0 4 15 1, 2 Description Definition Major dark field defective bright pixel Defect 245 mV Major bright field defective dark pixel Defect 15% Minor dark field defective bright pixel Notes: 1. 2. 3. Column and cluster defects are separated by no less than two (2) pixels in any direction (excluding single pixel defects). Tested at 27 C and 40 C. Tested at 40 C. Class X sensors are offered strictly "as available". Truesense Imaging cannot guarantee delivery dates. Please call for availability. Defect Map The defect map supplied with each sensor is based upon testing at an ambient (27 C) temperature. Minor point defects are not included in the defect map. All defective pixels are reference to pixel 1,1 in the defect maps. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 14 KAI-16000 Image Sensor Test Definitions TEST REGIONS OF INTEREST Active Area ROI: Pixel (1, 1) to Pixel (4872, 3248) Only the active pixels are used for performance and defect tests. OVERCLOCKING The test system timing is configured such that the sensor is overclocked in both the vertical and horizontal directions. See Figure 7 for a pictorial representation of the regions. H Horizontal Overclock Pixel 1,1 V Vertical Overclock Figure 7: Overclock Regions of Interest www.truesenseimaging.com Revision 2.0 PS-0013 Pg 15 KAI-16000 Image Sensor TESTS Global Non-Uniformity This test is performed with the imager illuminated to a level such that the output is at 70% of saturation (approximately 630 mV). Prior to this test being performed the substrate voltage has been set such that the charge capacity of the sensor is 900 mV. Global non-uniformity is defined as Active Area Standard Deviation Global Non - Uniformity 100 * Active Area Signal Units: %rms Active Area Signal = Active Area Average - Horizontal Overclock Average Dark Field Defect Test This test is performed under dark field conditions. The sensor is partitioned into 384 sub regions of interest, each of which is 203 by 203 pixels in size. In each region of interest, the median value of all pixels is found. For each region of interest, a pixel is marked defective if it is greater than or equal to the median value of that region of interest plus the defect threshold specified in the "Defect Definitions" section. Bright Field Defect Test This test is performed with the imager illuminated to a level such that the output is at approximately 630mV. Prior to this test being performed the substrate voltage has been set such that the charge capacity of the sensor is 900mV. The average signal level of all active pixels is found. The bright and dark thresholds are set as: Dark defect threshold = Active Area Signal * threshold Bright defect threshold = Active Area Signal * threshold The sensor is then partitioned into 384 sub regions of interest, each of which is 203 by 203 pixels in size. In each region of interest, the average value of all pixels is found. For each region of interest, a pixel is marked defective if it is greater than or equal to the median value of that region of interest plus the bright threshold specified or if it is less than or equal to the median value of that region of interest minus the dark threshold specified. Example for major bright field defective pixels: Average value of all active pixels is found to be 630 mV Dark defect threshold: 630mV * 15% = 95 mV Bright defect threshold: 630mV * 15% = 95 mV Region of interest #1 selected. This region of interest is pixels 1, 1 to pixels 203, 203. o Median of this region of interest is found to be 630 mV. o Any pixel in this region of interest that is (630+95 mV) 725 mV in intensity will be marked defective. o Any pixel in this region of interest that is (630-95 mV) 535 mV in intensity will be marked defective. All remaining 384 sub regions of interest are analyzed for defective pixels in the same manner. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 16 KAI-16000 Image Sensor Operation ABSOLUTE MAXIMUM RATINGS Absolute maximum rating is defined as a level or condition that should not be exceeded at any time per the description. If the level or the condition is exceeded, the device will be degraded and may be damaged. Description Symbol Minimum Maximum Units Notes Operating Temperature TOP -50 70 C 1 Humidity RH 5 90 % 2 Output Bias Current Iout 0.0 -40 mA 3 10 pF Off-chip Load Notes: 1. 2. 3. CL Noise performance will degrade at higher temperatures. T=25 C. Excessive humidity will degrade MTTF. Total for both outputs. Current is -20 mA for each output. Avoid shorting output pins to ground or any low impedance source during operation. Amplifier bandwidth increases at higher current and lower load capacitance at the expense of reduced gain (sensitivity). Operation at these values will reduce MTTF. MAXIMUM VOLTAGE RATINGS BETWEEN PINS Description RL, RR, H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR, H2SR, HLASTL, HLASTR to ESD Pin to Pin with ESD Protection VDDL, VDDR to GND Notes: 1. Minimum Maximum Units 0 17 V -17 17 V 0 25 V Notes 1 Pins with ESD protection are: RL, RR, H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR, H2SR, HLASTL, and HLASTR POWER UP SEQUENCE 1. Substrate 2. ESD Protection Disable 3. All other clocks and biases www.truesenseimaging.com Revision 2.0 PS-0013 Pg 17 KAI-16000 Image Sensor DC BIAS OPERATING CONDITIONS Description Symbol Reset Drain Pins Minimum Nominal Maximum Units Maximum DC Current (mA) Notes RD RDL, RDR +11.5 +12.0 +12.0 V Output Amplifier Supply VDD VDDL, VDDR +14.5 +15.0 +15.5 V Ground GND GND 0.0 0.0 0.0 V Substrate SUB SUB +8.0 VAB +16.0 V 1, 5 -9.25 -9.0 -8.75 V 2 -5.0 -10.0 mA 3 ESD Protection Disable ESD ESD Output Bias Current Iout VOUTL, VOUTR Notes: 1. 2. 3. 4. 5. 4 The operating of the substrate voltage, VAB, will be marked on the shipping container for each device. The value of Vab is set such that the photodiode charge capacity is 30,000 electrons. VESD must be at least 1 V more negative than H1_lo and H2_lo during sensor operation AND during camera power turn on. An output load sink must be applied to Vout to activate output amplifier. The maximum DC current is for one output unloaded. This is the maximum current that the first two stages of one output amplifier will draw. This value is with Vout disconnected. Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions AC OPERATING CONDITIONS Clock Levels Description Pins Symbol Minimum Nominal Maximum Units Vertical CCD Clock High V1, V3, V5, V7, V9. V11 V_2hi +8.5 +9.0 +9.5 V Vertical CCD Clocks Midlevel V1, V2, V3, V4, V5, V6, V7, V8, V9, V10, V11, V12 V_1mid, V_2mid -0.2 0.0 +0.2 V Vertical CCD Clocks Low V1, V2, V3, V4, V5, V6, V7, V8, V9, V10, V11, V12 V_1lo, V_2lo -9.5 -9.0 -8.5 V Horizontal CCD Clocks Amplitude H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR, H2SR H_amp +4.5 +5.0 +5.5 V Horizontal CCD Clocks Low H1SL, H1BL, H2SL, H2BL, H1SR, H1BR, H2SR, H2SR H_lo -5.0 -4.5 -4.0 V Horizontal Last CCD Amplitude HLASTL, HLASTR HLAST_amp +4.5 +5.0 +5.5 V Horizontal Last CCD Low HLASTL, HLASTR HLAST_lo -5.0 -4.5 -4.0 V Reset Clock Amplitude RESETL, RESETR R_amp +4.5 +5.0 +5.5 V Reset Clock Low RESETL, RESETR R_lo -3.5 -3.0 -2.5 V Electronic Shutter Voltage SUB Vshutter +44 +48 +52 V Fast Dump High FDL, FDR FD_hi +4.5 +5.0 +5.5 V Fast Dump Low FDL, FDR FD_lo -9.5 -9.0 -8.5 V Notes: 1. Notes 1 Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions The figure below shows the DC bias (SUB) and AC clock (Vshutter) applied to the SUB pin. Both the DC bias and AC clock are referenced to ground. Vshutter SUB GND www.truesenseimaging.com GND Revision 2.0 PS-0013 Pg 18 KAI-16000 Image Sensor Clock Line Capacitances Clocks Capacitance Units Notes Vertical CCD Phase 1 to GND 108 nF 1, 3 Vertical CCD Phase 2 to GND 118 nF 1, 4 Vertical CCD Phase 1 to Vertical CCD Phase 2 56 nF 3, 4 H1S to GND 27 pF 2 H2S to GND 27 pF 2 H1B to GND 13 pF 2 H2B to GND 4 pF 2 H1S to H2B and H2S 13 pF 2 H1B to H2B and H2S 13 pF 2 H2S to H1B and H1S 13 pF 2 H2B to H1B and H1S 13 pF 2 HLAST to GND 20 pF 2 RESET to GND 10 pF FD to GND 20 pF Notes: 1. 2. 3. 4. Gate capacitance to GND is voltage dependent. Value is for nominal VCCD clock voltages. For nominal HCCD clock voltages, these values are for half of the imager (H1SL, H1BL, H2SL, H2BL and H1BINL or H1SR, H1BR, H2SR, H2BR and H1BINR). Vertical CCD Phase 1: V2, V4, V6, V8, V10, V12 Vertical CCD Phase 2: V1, V3, V5, V7, V9, V11 www.truesenseimaging.com Revision 2.0 PS-0013 Pg 19 KAI-16000 Image Sensor Timing REQUIREMENTS AND CHARACTERISTICS Description Symbol Minimum Nominal VCCD to HCCD Delay THD 4 6 Maximum Units s VCCD Transfer Time TVCCD 4 HCCD to VCCD Delay THL Photodiode transfer time TV3rd VCCD Pedestal time 6 s 50 ns 10 12 s T3P 200 600 s VCCD Delay T3D 12 20 s VCCD Delay Before Pedestal TDEL 50 ns VCCD Delay Before 1st Line TD1L 60 s Reset Pulse time 10 TR 3.25 ns THDS 6 s Shutter Pulse time TS 4 s Shutter Pulse delay TSD 1.5 s HCCD Clock Period TH 33.3 ns VCCD rise/fall time TVR 0.2 s Fast Dump Gate Leading Delay TFDL 0.5 s Fast Dump Gate Trailing Delay TFDT 0.5 VCCD Line Clock Leading Edge Delay TVL 0.2 0.3 0.4 s VCCD Line Clock Trailing Edge Delay TVT 0.0 0.2 0.4 s VCCD to HCCD Delay - Shutter Notes s MAIN TIMING - CONTINUOUS MODE Vertical Frame Timing Line Timing Repeat for 3324 Lines Figure 8: Main Timing - Continuous Mode www.truesenseimaging.com Revision 2.0 PS-0013 Pg 20 KAI-16000 Image Sensor FRAME TIMING - CONTINUOUS MODE V2, V4, V6, V8, V10, V12 V_1mid V_1lo T3P T3D V_2hi V1, V3, V5, V7, V9, V11 V_2mid TD1L TV3rd V_2lo TDEL H_amp H1SL, H1BL, H1SR, H2BR H_lo H_amp H2SL, H2BL, H2SR, H1BR H_lo HLAST_amp HLASTL, HLASTR HLAST_lo Figure 9: Framing Timing www.truesenseimaging.com Revision 2.0 PS-0013 Pg 21 KAI-16000 Image Sensor LINE TIMING CONTINUOUS MODE Line Timing Single Output TL V2, V4, V6, V8, V10, V12 V1, V3, V5, V7, V9, V11 TVCCD THD H1SL, H1BL, H1SR, H2BR H2SL, H2BL, H2SR, H1BR HLASTL, HLASTR 4970 4971 4972 4941 4942 4943 4944 4945 4946 39 40 41 42 43 44 11 12 13 14 pixel count 1 2 R Figure 10: Line Timing Single Output Line Timing Double Output TL V2, V4, V6, V8, V10, V12 V1, V3, V5, V7, V9, V11 TVCCD THD H1SL, H1BL, H1SR, H1BR H2SL, H2BL, H2SR, H2BR HLASTL, HLASTR 2483 2484 2485 2486 2487 2488 2489 2490 2491 2492 39 40 41 42 43 44 11 12 13 14 pixel count 1 2 R Figure 11: Line Timing Dual Output www.truesenseimaging.com Revision 2.0 PS-0013 Pg 22 KAI-16000 Image Sensor Line Timing Detail Single Output V_1mid V2, V4, V6, V8, V10, V12 V_1lo V_2mid V1, V3, V5, V7, V9, V11 TVCCD THL V_2lo THD H_amp H1SL, H1BL, H1SR, H2BR H_lo H_amp H2SL, H2BL, H2SR, H1BR H_lo HLAST_amp HLASTL, HLASTR HLAST_lo Figure 12: Line Timing Detail Single Output Line Timing Detail Edge Alignment V2, V4, V6, V8, V10, V12 TVL TVT High 100% 90% 50% 10% V1, V3, V5, V7, V9, V11 Low 0% Figure 13: Line Timing Detail Edge Alignment www.truesenseimaging.com Revision 2.0 PS-0013 Pg 23 KAI-16000 Image Sensor PIXEL TIMING H_amp H1SL, H1BL, H1SR, H2BR H_lo H_amp H2SL, H2BL, H2SR, H1BR H_lo HLAST_amp HLASTL, HLASTR HLAST_lo TR R_amp RR, RL R_lo Figure 14: Pixel Timing www.truesenseimaging.com Revision 2.0 PS-0013 Pg 24 KAI-16000 Image Sensor FAST LINE DUMP TIMING FD_hi FDR, FDL FD_lo TFDL V1, V3, V5, V7, V9, V11 TFDT TVCCD TVCCD TVCCD V2, V4, V6, V8, V10, V12 THD H1SL, H1BL, H1SR, H2BR Figure 15: Fast Line Dump Timing www.truesenseimaging.com Revision 2.0 PS-0013 Pg 25 KAI-16000 Image Sensor ELECTRONIC SHUTTER TIMING VES TS SUB VSUB GND TSD THDS V2, V4, V6, V8, V10, V12 V1, V3, V5, V7, V9, V11 H1SL, H1BL, H1SR, H2BR H2SL, H2BL, H2SR, H1BR HLASTL, HLASTR Figure 16: Electronic Shutter Timing ELECTRONIC SHUTTER INTEGRATION TIME DEFINITION V1, V3, V5, V7, V9, V11 Integration Time VShutter VSUB Figure 17: Integration Time Definition www.truesenseimaging.com Revision 2.0 PS-0013 Pg 26 KAI-16000 Image Sensor Storage and Handling ENVIRONMENTAL EXPOSURE STORAGE CONDITIONS Description Temperature Humidity Notes: 1. 2. Symbol Minimum Maximum Units Notes T -55 80 C 1 RH 5 90 % 2 Long-term exposure toward the maximum temperature will accelerate color filter degradation. T=25 C. Excessive humidity will degrade MTTF. ESD 1. This device contains limited protection against Electrostatic Discharge (ESD). ESD events may cause irreparable damage to a CCD image sensor either immediately or well after the ESD event occurred. Failure to protect the sensor from electrostatic discharge may affect device performance and reliability. 2. Devices should be handled in accordance with strict ESD procedures for Class 0 (<250V per JESD22 Human Body Model test), or Class A (<200V JESD22 Machine Model test) devices. Devices are shipped in static-safe containers and should only be handled at static-safe workstations. 3. See Application Note Image Sensor Handling Best Practices for proper handling and grounding procedures. This application note also contains workplace recommendations to minimize electrostatic discharge. 4. Store devices in containers made of electroconductive materials. COVER GLASS CARE AND CLEANLINESS 1. The cover glass is highly susceptible to particles and other contamination. Perform all assembly operations in a clean environment. 2. Touching the cover glass must be avoided. 3. Improper cleaning of the cover glass may damage these devices. Refer to Application Note Image Sensor Handling Best Practices. www.truesenseimaging.com 1. Extremely bright light can potentially harm CCD image sensors. Do not expose to strong sunlight for long periods of time, as the color filters and/or microlenses may become discolored. In addition, long time exposures to a static high contrast scene should be avoided. Localized changes in response may occur from color filter/microlens aging. For Interline devices, refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible lighting Conditions. 2. Exposure to temperatures exceeding maximum specified levels should be avoided for storage and operation, as device performance and reliability may be affected. 3. Avoid sudden temperature changes. 4. Exposure to excessive humidity may affect device characteristics and may alter device performance and reliability, and therefore should be avoided. 5. Avoid storage of the product in the presence of dust or corrosive agents or gases, as deterioration of lead solderability may occur. It is advised that the solderability of the device leads be assessed after an extended period of storage, over one year. SOLDERING RECOMMENDATIONS 1. The soldering iron tip temperature is not to exceed 370 C. Higher temperatures may alter device performance and reliability. 2. Flow soldering method is not recommended. Solder dipping can cause damage to the glass and harm the imaging capability of the device. Recommended method is by partial heating using a grounded 30 W soldering iron. Heat each pin for less than 2 seconds duration. Revision 2.0 PS-0013 Pg 27 KAI-16000 Image Sensor Mechanical Drawings COMPLETED ASSEMBLY Figure 18: Completed Assembly (1 of 2) www.truesenseimaging.com Revision 2.0 PS-0013 Pg 28 KAI-16000 Image Sensor Figure 19: Completed Assembly (2 of 2) www.truesenseimaging.com Revision 2.0 PS-0013 Pg 29 KAI-16000 Image Sensor COVER GLASS Coat Both Sides 0.020R [0.50] (Typ. 8 plcs.) Chamfer 0.020" [0.50] Ref. AR coat area (Typ. 4 plcs.) Epoxy: NC0-150 HB Thk. 0.002" - 0.005" Chamfer 0.008" [0.20] 8 plcs.) (Typ. NOTES: 1. Multi-Layer Anti-Reflective Coating on 2 sides: Double Sided Reflectance: Range (nm) 420 - 450 nm < 2% 450 - 630 nm < 1% 630 - 680 nm < 2% 2. Dust, Scratch specification - 20 microns max. 3. Substrate - Schott D263T eco or Equivalent 4. Epoxy: NCO-150HB Thickness: 0.002" - 0.005" Figure 20: Glass Drawing www.truesenseimaging.com Revision 2.0 PS-0013 Pg 30 KAI-16000 Image Sensor GLASS TRANSMISSION 100 90 80 Transmission (%) 70 60 50 40 30 20 10 0 200 300 400 500 600 700 800 900 Wavelength (nm ) Figure 21: Glass Transmission www.truesenseimaging.com Revision 2.0 PS-0013 Pg 31 KAI-16000 Image Sensor Quality Assurance and Reliability QUALITY AND RELIABILITY All image sensors conform to the specifications stated in this document. This is accomplished through a combination of statistical process control and visual inspection and electrical testing at key points of the manufacturing process, using industry standard methods. Information concerning the quality assurance and reliability testing procedures and results are available from Truesense Imaging upon request. For further information refer to Application Note Quality and Reliability. REPLACEMENT All devices are warranted against failure in accordance with the Terms of Sale. Devices that fail due to mechanical and electrical damage caused by the customer will not be replaced. LIABILITY OF THE SUPPLIER A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer. Product liability is limited to the cost of the defective item, as defined in the Terms of Sale. LIABILITY OF THE CUSTOMER Damage from mishandling (scratches or breakage), electrostatic discharge (ESD), or other electrical misuse of the device beyond the stated operating or storage limits, which occurred after receipt of the sensor by the customer, shall be the responsibility of the customer. TEST DATA RETENTION Image sensors shall have an identifying number traceable to a test data file. Test data shall be kept for a period of 2 years after date of delivery. MECHANICAL The device assembly drawing is provided as a reference. Truesense Imaging reserves the right to change any information contained herein without notice. All information furnished by Truesense Imaging is believed to be accurate. Life Support Applications Policy Truesense Imaging image sensors are not authorized for and should not be used within Life Support Systems without the specific written consent of Truesense Imaging, Inc. www.truesenseimaging.com Revision 2.0 PS-0013 Pg 32 KAI-16000 Image Sensor Revision Changes MTD/PS-1027 Revision Number Description of Changes 1.0 Initial release 2.0 Added Monochrome Sealed Cover Glass Part Numbers to the Ordering Information page. 3.0 Added reference to Website for acquiring related documentation Corrected number of dummy pixels. Changed from 13 dummy pixels to 12 dummy pixels. Clock Line Capacitances, corrected Note 4 from Vertical CCD Clock Phase 1 to Vertical CCD Clock Phase 2 Corrected number of dummy pixels in Line Timing figures. Changed from 13 dummy pixels to 12 dummy pixels. Line Timing Edge Alignment - updated vertical CCD clock designations Fast Line Dump Timing - updated vertical CCD clock designations Electronic Shutter Integration Time Definition - updated vertical CCD clock designation Storage and Handling Section o Updated item 3 in ESD section o Updated item 3 in Cover Glass Care and Cleanliness section 4.0 Added Monochrome, Microlens, Taped Cover Glass Part Numbers to the Ordering Information page. 5.0 Corrected Reset Low nominal and minimum values. The values were swapped. Added the note "Refer to Application Note Using Interline CCD Image Sensors in High Intensity Visible Lighting Conditions" to the following sections o DC Bias Operating Conditions o AC Operating Conditions o Storage and Handling Changed cover glass material to D263T eco or equivalent 6.0 Added Monochrome, Microlens, Sealed MAR cover glass Class X part number to Ordering Information table Added Monochrome, Microlens, Sealed MAR cover glass Class X defect definition to the Defect Definitions table PS-0013 Revision Number Description of Changes 1.0 Initial release with new document number, updated branding and document template Updated Storage and Handling and Quality Assurance and Reliability sections 2.0 The completed assembly drawing was updated to clarify the placement of the sensor in the package. The location of the sensor in the package has not changed. The drawing was updated only to clarify the sensor location. www.truesenseimaging.com (c)Truesense Imaging Inc., 2013. TRUESENSE is a registered trademark of Truesense Imaging, Inc. Revision 2.0 PS-0013 Pg 33