IP4286CZ6-TTY,125 - NXP Semiconductors

1. Product profile

1.1 General description

The devices are designed to protect the capacitive loads of In put/Output (I/O) ports

(such as USB 2.0, Ethernet, Digital Visual Interface (DVI), etc.) from being damaged by

ElectroStatic Discharge ( ESD).

To provide ESD protection to downstream signal and supply components, the devices

incorporate four pairs of ultra low capacitance rail-to-rail diodes plus two Zener diodes.

This provides protection against contact discharge voltages as high as ±8kV in

accordance with IEC 61000-4-2, level 4.

The ESD protection is independent of the supply voltage due to the rail-to-rail diodes

being connec te d to a Ze n er di od e .

The devices are fabricated using monolithic silicon technology and integrate four ultra low

capacitance rail-to-rail ESD protectio n diodes plus two Zener diodes.

1.2 Features and benefits

Pb-free and Restr ictio n of Haza rd ou s Sub stances (RoHS) complian t

IEC 61000-4-2, level 4, ±8 kV contact discharge compliant ESD protection

Four input ESD rail-to-rail protection diodes with ultra low input capacitance of 0.6 pF

maximum

Low-voltage clamping due to integrated Zener diodes

1.3 Applications

General-purpose do wnstream ESD protection high-frequency analog signals and

high-speed serial data transmission for ports inside:

PC/Notebook USB 2.0/IEEE 1394 ports

Cellular phone and Personal Communication System (PCS) mobile handsets

Digital Visual Interface (D VI)

High-Definition Multimedia Interfaces (HDMI)

Cordless telephones

Wireless data (WAN/LAN) systems

MID (Mobile Internet Device) and PMP (Portable Media Player)

IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

Rev. 2 — 1 September 2010 Product data sheet

Product data sheet Rev. 2 — 1 September 2010 2 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

2. Pinning information

3. Ordering information

Table 1. Pinning

Pin Description Simplified outline Graphic symbol

IP4286CZ6-TBF (SOT886)

1 ESD protection for I/O signals

XSON6

2 ground

3 ESD protection for I/O signals

4 ESD protection for I/O signals

5 ground

6 ESD protection for I/O signals

IP4286CZ6-TTY (SOT363)

1 ESD protection for I/O signals

SC-88

2 ground

3 ESD protection for I/O signals

4 ESD protection for I/O signals

5 ground

6 ESD protection for I/O signals

bottom view

321

456

018aaa04

654

123

132

018aaa04

654

123

Table 2. Ordering information

Type number Package

Name Description Version

IP4286CZ6-TBF XSON6 plastic extremely thin small outline package; no leads;

6 terminals; body 1 ×1.45 ×0.5 mm SOT886

IP4286CZ6-TTY SC-88 plastic surface-mounted package; 6 leads SOT363

Product data sheet Rev. 2 — 1 September 2010 3 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

4. Limiting values

5. Characteristics

[1] Guaranteed by design.

[2] Route differential pairs to pins 1 and 6, and to pins 3 and 4 for optimal parasitic symmetry.

[3] Pins 1 and 6, and pins 3 and 4 to ground.

[4] Pins 1, 3, 4 and 6 to ground.

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VESD electrostatic discharge

voltage IEC 61000-4-2, level 4,

contact discharge -±8kV

Tstg storage temperature −55 +125 °C

VIinput voltage −0.5 +5.5 V

Table 4. Characteristics

Tamb = 25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

C(I/O-GND) input/output to

ground capacitance VI=3.3V; f=1MHz [1][2][3] -0.6-pF

ILR reverse leakage current VI=3.0V [4] - - 100 nA

C(zd-GND) Ze ner diode to

ground capacitance [1] -20-pF

VBRzd Zener dio de

breakdown voltage Itest =1mA [1] 6- 9V

VFforward voltage - 0.7 - V

Product data sheet Rev. 2 — 1 September 2010 4 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

6. Application information

6.1 Typical application

The devices are capable of protecting both USB data lines of a USB 2.0 port from ESD,

and are optimized to protect two USB 2.0 ports simultaneously.

A typical application is shown in Figure 1.

All protection pins (1, 3, 4 and 6) can be swapped to protect any signal line.

Fig 1. Application diagram for protec tion of two USB ports

IP4286CZ6

VBUS

D−

D+

GND

VBUS

D−

D+

GND

018aaa04

Product data sheet Rev. 2 — 1 September 2010 5 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

7. Package outline

Fig 2. Package outline SOT886 (XSON6/MO-252)

terminal 1

index area

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT886 MO-252

SOT88

04-07-15

04-07-22

DIMENSIONS (mm are the original dimensions)

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

0 1 2 mm

scale

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

UNIT

mm 0.25

0.17

1.5

1.4

0.35

0.27

max b E

1.05

0.95

Dee

0.40

0.32

0.50.6

A(1)

max

0.5 0.04

6×

(2)

4×

(2)

Product data sheet Rev. 2 — 1 September 2010 6 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

Fig 3. Package outline SOT363 (SC-88)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT363 SC-88

wBM

pin 1

index A

detail X

vMA

0 1 2 mm

scale

132

456

Plastic surface-mounted package; 6 leads SOT36

UNIT A1

max bpcDEe1HELpQywv

mm 0.1 0.30

0.20

2.2

1.8

0.25

0.10

1.35

1.15 0.65

1.3 2.2

2.0 0.2 0.10.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

0.25

0.15

1.1

0.8

04-11-08

06-03-16

Product data sheet Rev. 2 — 1 September 2010 7 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

8. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

8.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

8.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperatur e profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orie ntation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

8.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 2 — 1 September 2010 8 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

8.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 4) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 5 and 6

Moisture sensitivity precautions, as indicated on the packing, must be respe cted at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 4.

Table 5. SnPb eutectic process (from J-STD-0 20C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 6. Lead-free pr ocess (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 2 — 1 September 2010 9 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

For further informa tion on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

MSL: Moisture Sensitivity Level

Fig 4. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 2 — 1 September 2010 10 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

9. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

IP4286CZ6-TBF_TTY v.2 20100901 Product data sheet - IP4286CZ6_1

Modifications: •Type number IP4286CZ6-TTD deleted.

•Table 1 “Pinning”: amended.

•Table 3 “Limiting values”: amended.

•Table 4 “Characteristics”: amended.

•Figure 1: updated.

•Section 10 “Legal information”: updated.

IP4286CZ6_1 200 90420 Objective data sheet - -

Product data sheet Rev. 2 — 1 September 2010 11 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidenta l ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 1 September 2010 12 of 13

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors IP4286CZ6-TBF; IP4286CZ6-TTY

Integrated 4-channel ESD protection

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 September 2010

Document identifier: IP4286CZ6-TBF_TTY

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

5 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Application information. . . . . . . . . . . . . . . . . . . 4

6.1 Typical application . . . . . . . . . . . . . . . . . . . . . . 4

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Soldering of SMD packages . . . . . . . . . . . . . . . 7

8.1 Introduction to soldering . . . . . . . . . . . . . . . . . . 7

8.2 Wave and reflow soldering . . . . . . . . . . . . . . . . 7

8.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 7

8.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . . 8

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

11 Contact information. . . . . . . . . . . . . . . . . . . . . 12

12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13