DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Page 1 of 7
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
Chip LayoutFeatures
Low Operating Voltage: 5V
33.8 dBm Output IP3 @ 850 MHz
3.3 dB Noise Figure @ 850 MHz
23.1 dB Gain @ 850 MHz, 19.5 dB @ 6 GHz
18.2 dBm P1dB @ 850 MHz
Low Performance Variation Over Temperature
100% DC On-Wafer Testing
ESD Protection on All Die: >1000V HBM
Low Thermal Resistance: <100ºC/Watt
PA Driver Amp, IF Amp, LO Buffer Amp
Cellular, PCS, GSM, UMTS
Wireless Data and SATCOM
Transmit and Receive Functions
CATV
Applications
Typical Performance
Notes: 1. Performance in Mimix eval board, Vs = 5 V, Id = 70 mA Typ., Rbias = 10 , Zs = Zl = 50 , OIP3 tone spacing = 1 MHz, Pout per tone = 6 dBm.
2. Values reflect performance in recommended application circuit.
3. Only on-wafer DC test is done. Devices are not tested for RF performance.
850 MHz 1950 MHz 2400 MHz 3500 MHz 6000 MHz
UnitsMax.Typ.Min. Max.Typ.Min. Max.Typ.Min. Max.Typ.Min.Temperature (ºC)Parameter
Small Signal Gain
Output P1dB
Output IP3
Noise Figure
Operating Current
Input Return Loss
Output Return Loss
Pout @ -45 dBc, ACP
IS-95, 9 Forward Channels
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
+25
-40 to +85
22.1
22.0
17.2
16.9
32.3
31.8
65
59
11
10
16
15
23.1
23.1
18.2
18.2
33.8
33.8
3.3
3.3
70
70
15
15
23
23
12
12
24.1
24.2
4.1
4.5
75
79
21.0
20.9
16.7
16.3
31.4
30.9
65
59
11
10
11
10
22.0
22.0
17.7
17.7
32.9
32.9
3.6
3.6
70
70
16
16
16
16
12
12
23.0
23.1
4.4
4.8
75
79
20.8
20.7
16.7
16.3
30.2
29.7
65
59
11
10
11
10
21.8
21.8
17.7
17.7
31.7
31.7
3.7
3.7
70
70
15
15
16
16
22.8
22.9
4.5
4.9
75
79
21.0
21.0
17.0
17.0
27.6
27.6
3.8
3.8
70
70
11
11
16
16
dB
dB
dBm
dBm
dBm
dBm
dB
dB
mA
mA
dB
dB
dB
dB
dBm
dBm
Max.Typ.Min.
19.5
19.5
12.0
12.0
20.3
20.3
4.6
4.6
70
70
7.5
7.5
13
13
Max Device Voltage
Max Device Current
Max Device Dissipated Power
RF Input Power
Storage Temperature
Junction Temperature
Operating Temperature
Thermal Resistance
ESD (HBM)
+6.0 V
130 mA
0.65 W
+17 dBm
-55ºC to 150ºC
150ºC
-40ºC to +85ºC
85º C/W
1000 V
Absolute Maximum Ratings
Description
The CGB7017-BD is a Darlington Configured, high dynamic range,
utility gain block amplifier. Designed for applications operating
within the DC to 8.0 GHz frequency range, Mimixs broadband,
cascadable, gain block amplifiers are ideal solutions for transmit,
receive and IF applications.
These MMIC amplifiers are available in bare die form. Mimix's
InGaP HBT technology and an industry low thermal resistance
offers a thermally robust and reliable gain block solution.
The InGaP HBT die have extra pads to enable thorough DC
testing. This unique test capability and the inclusion of ESD
protection on all die, significantly enhances the quality, reliability
and ruggedness of these products.
With a single bypass capacitor, optional RF choke and two DC
blocking capacitors, this gain block amplifier offers significant
ease of use in a broad range of applications.
Operation of this device above any of these parameters may cause
permanent damage.
June 2007 - Rev 15-Jun-07
Noise Figure Vs Frequency
2.5
3
3.5
4
4.5
5
5.5
6
6.5
02468
Frequency (GHz)
Noise Figure (dB)
25 C
-40 C
85 C
|S21| Vs Frequency
12
14
16
18
20
22
24
26
012345678
Frequency (GHz)
|S21| (dB)
25 C
-40 C
85 C
|S11| Vs Frequency
-20
-16
-12
-8
-4
012345678
Frequency (GHz)
|S11| (dB)
25 C
-40 C
85 C
|S12| Vs Frequency
-30
-28
-26
-24
-22
-20
-18
012345678
Frequency (GHz)
|S22| (dB)
25 C
-40 C
85 C
|S22| Vs Frequency
-26
-22
-18
-14
-10
-6
012345678
Frequency (GHz)
|S22| (dB)
25 C
-40 C
85 C
Page 2 of 7
Typical S-Parameter and Noise Performance
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
June 2007 - Rev 15-Jun-07
P1dB Vs Frequency
6
8
10
12
14
16
18
20
012345678
Frequency (GHz)
P1dB (dBm)
25 C
-40 C
85 C
OIP3 Vs Frequency
14
18
22
26
30
34
38
012345678
Frequency (GHz)
OIP3 (dBm)
25 C
-40 C
85 C
1 MHz separation,
6 dBm/tone
ACP @ 850 MHz Vs Pout
9 Channels Forward, 750 kHz Offset, 30 kHz BW
-60
-55
-50
-45
-40
-35
-30
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
Linearity Performance - Base Station ACP – IS-95 Alt1 Ch. Pwr @ 850 MHz Vs Pout
9 Channels Forward, 1.98 MHz Offset, 30 kHz BW
-85
-75
-65
-55
-45
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
ACP @ 1950 MHz Vs. Pout
9 Forward Channels, 885 kHz Offset
30 kHz BW
-65
-55
-45
-35
-25
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
Alt1 Ch. Pwr @ 1950 MHz Vs Pout
9 Channels Forward, 1.25 MHz Offset
12.5 kHz BW
-75
-65
-55
-45
-35
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
ACP @ 2140 MHz Vs Pout
WCDMA, 3GPP TM1, 1 Channel, 64 DPCH
-55
-50
-45
-40
-35
-30
-25
-20
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
Alt. Ch. Pwr @ 2140 MHz Vs Pout
WCDMA, 3GPP TM1, 1 Channel, 64 DPCH
-65
-60
-55
-50
-45
-40
4 8 12 16 20
Pout (dBm)
ACP (dBc)
25 C
-40 C
85 C
Page 3 of 7
Typical Power and Linearity Performance
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
June 2007 - Rev 15-Jun-07
Page 4 of 7
Typical Scattering Parameters (Vd = +4.5V, Icc = 74 mA, T = 23°C, device in a 50 ohm system)
Frequency S11 S21 S12 S22
(MHz) (Mag) (Ang) (Mag) (Ang) (Mag) (Ang) (Mag) (Ang)
100 0.039 -164 15.58 175 0.054 -1 0.017 -130
200 0.043-152 15.51 170 0.055 -2 0.026 -124
300 0.051 -144 15.45 164 0.055 -4 0.036 -120
400 0.058 -140 15.37 159 0.055 -5 0.046 -119
500 0.066 -136 15.27 154 0.055 -6 0.055 -119
600 0.075 -134 15.17 149 0.055 -7 0.065 -120
700 0.084 -134 15.06 144 0.055 -8 0.074 -122
800 0.094 -134 14.93139 0.056 -10 0.083-123
900 0.103-134 14.81 134 0.056 -11 0.092 -124
1000 0.113-134 14.68 130 0.057 -12 0.101 -126
1100 0.122 -135 14.54 125 0.057 -14 0.109 -128
1200 0.131-136 14.40 120 0.057 -15 0.116 -130
1300 0.140 -137 14.25 115 0.058 -16 0.123-132
1400 0.148 -139 14.08 110 0.059 -18 0.130-134
1500 0.156 -140 13.93106 0.059 -19 0.137-136
1600 0.164 -142 13.77 101 0.060 -21 0.143-138
1700 0.172 -144 13.61 96 0.060 -22 0.149 -140
1800 0.181 -145 13.44 92 0.061 -24 0.155 -142
1900 0.190 -147 13.28 87 0.062 -25 0.160 -144
2000 0.197 -149 13.12 830.062 -27 0.166 -146
2100 0.204 -151 12.96 78 0.063-29 0.171 -147
2200 0.211 -15312.80 74 0.064 -30 0.177 -149
2300 0.218 -155 12.64 69 0.065 -32 0.180 -151
2400 0.225 -157 12.49 65 0.065 -34 0.185 -153
2500 0.231 -159 12.33 60 0.066 -36 0.190 -154
2600 0.237 -162 12.19 56 0.067 -37 0.194 -156
2700 0.243-164 12.04 52 0.068 -39 0.199 -158
2800 0.248 -167 11.89 47 0.069 -41 0.203-160
2900 0.254 -169 11.75 430.070 -430.206 -162
3000 0.260 -171 11.61 39 0.070 -45 0.211 -163
3100 0.265 -17311.49 35 0.072 -47 0.216 -165
3200 0.269 -176 11.3831 0.073-49 0.222 -167
3300 0.274 -179 11.27 26 0.074 -51 0.227 -169
3400 0.279 178 11.17 22 0.075 -530.231 -171
3500 0.285 175 11.07 18 0.076 -55 0.236 -173
3600 0.289 17310.97 14 0.077 -57 0.242 -175
3700 0.293169 10.89 10 0.078 -59 0.248 -178
3800 0.296 166 10.81 6 0.079 -61 0.254 179
3900 0.299 162 10.731 0.080 -64 0.259 176
4000 0.303159 10.66 -30.082 -66 0.264 174
4100 0.306 155 10.58 -7 0.083-68 0.268 171
4200 0.307 151 10.52 -11 0.084 -70 0.274 168
4300 0.308 147 10.46 -15 0.086 -730.279 164
4400 0.309 142 10.42 -20 0.087 -75 0.283160
4500 0.310 138 10.36 -24 0.089 -78 0.287 157
4600 0.312 133 10.32 -28 0.090 -80 0.292 153
4700 0.313128 10.28 -33 0.091 -830.297 149
4800 0.312 122 10.24 -37 0.093-86 0.302 145
4900 0.313117 10.22 -41 0.095 -89 0.307 140
5000 0.314 110 10.19 -46 0.096 -91 0.311 135
Continues Next Page. S-Parameter Data Files are available online at: www.mimixbroadband.com
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
June 2007 - Rev 15-Jun-07
Page 5 of 7
Typical Scattering Parameters (Vd = +4.5V, Icc = 74 mA, T = 23°C, device in a 50 ohm system)
Frequency S11 S21 S12 S22
(MHz) (Mag) (Ang) (Mag) (Ang) (Mag) (Ang) (Mag) (Ang)
5100 0.315 104 10.15 -51 0.098 -94 0.314 130
5200 0.316 97 10.13-55 0.100 -97 0.319 125
5300 0.317 91 10.11 -60 0.101 -100 0.324 120
5400 0.319 8310.08 -65 0.103-104 0.330 114
5500 0.32375 10.05 -69 0.105 -107 0.335 108
5600 0.329 67 10.03-74 0.106 -110 0.341 101
5700 0.337 59 9.99 -79 0.108 -114 0.347 95
5800 0.346 51 9.96 -84 0.109 -117 0.354 88
5900 0.355 42 9.90 -90 0.110 -121 0.361 81
6000 0.367 33 9.84 -95 0.112 -125 0.369 73
6100 0.384 24 9.76 -100 0.113-129 0.378 66
6200 0.401 15 9.66 -106 0.113-133 0.386 58
6300 0.420 7 9.56 -111 0.114 -1370.397 51
6400 0.441 -2 9.43-117 0.115 -141 0.408 43
6500 0.463-10 9.29 -1230.115 -145 0.421 35
6600 0.487 -19 9.13-128 0.114 -149 0.43527
6700 0.513-26 8.93-134 0.114 -1530.448 19
6800 0.537-34 8.73-140 0.113-158 0.462 12
6900 0.561 -42 8.50 -145 0.112 -162 0.477 4
7000 0.586 -49 8.27 -151 0.110 -166 0.492 -3
7100 0.609 -56 8.00 -157 0.109 -170 0.505 -11
7200 0.632-637.72 -162 0.106 -174 0.518 -18
7300 0.652 -70 7.44 -168 0.104 -178 0.531 -25
7400 0.670 -76 7.17 -1730.102 178 0.542 -31
7500 0.688 -82 6.88 -178 0.099 174 0.554 -38
7600 0.703-88 6.59 176 0.096 170 0.565 -44
7700 0.718 -94 6.31 171 0.094 167 0.575 -49
7800 0.730 -99 6.02 166 0.091 1630.584 -55
7900 0.741 -104 5.76 162 0.089 160 0.592 -60
8000 0.749 -109 5.50 157 0.086 157 0.599 -65
8100 0.757 -114 5.24 152 0.0831530.607 -70
8200 0.766 -119 5.00 148 0.081 151 0.613-75
8300 0.772 -1234.75 144 0.078 148 0.619 -80
8400 0.776 -128 4.53139 0.076 145 0.625 -84
8500 0.779 -1324.33 135 0.074 142 0.629 -88
8600 0.782 -136 4.13131 0.072 139 0.633 -92
8700 0.783-140 3.93127 0.069 137 0.638 -95
8800 0.786 -144 3.75 1230.067 134 0.642 -99
8900 0.787 -147 3.58 120 0.065 132 0.644 -103
9000 0.786 -151 3.42 116 0.064 130 0.647 -106
9100 0.785 -155 3.27 112 0.062 128 0.650 -109
9200 0.784 -158 3.13109 0.060 126 0.652 -112
9300 0.783-162 2.99 105 0.059 1230.654 -115
9400 0.781 -165 2.86 102 0.057 121 0.656 -118
9500 0.777 -168 2.74 98 0.056 119 0.658 -121
9600 0.773-171 2.62 95 0.055 117 0.660 -124
9700 0.769 -175 2.51 91 0.054 115 0.661 -127
9800 0.765 -178 2.41 88 0.0531130.663-129
9900 0.762 179 2.31 85 0.052 112 0.664 -132
10000 0.756 176 2.21 81 0.051 110 0.665 -134
S-Parameter Data Files are available online at: www.mimixbroadband.com
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
June 2007 - Rev 15-Jun-07
Page 6 of 7
Note: This schematic represents the topology of the application circuit recommended by Mimix.
Recommended Bias Resistor Values for ID = 78 mA
Supply Voltage (Vs) 5V 7V 8V 10V
Rbias (1206 1/4W) 10 38
52
——
Rbias (1210 1/2W)
Note: Rbias provides DC bias stability over temperature.
81
2
RF IN
Vs
RF
OUT
C1 C2
uuuu
L1
R Bias = (Vs - Vd) / Id
4
3
1
Vd
R1 C3
C4
Application Circuit
CGB7017-SC Gain Vs Temp and Frequency
17
18
19
20
21
22
23
0 1000 2000 3000 4000 5000 6000
Frequency (MHz)
Small Signal Gain (dB)
-40C
25C
85C
Typical Gain Performance
Ref Designator Value
C1, C2, C3
C4
L1
L1
L3
R1
R2 (1/4W)
1000 pF
1.0 F
56 nH
470 nH
6.8 nH
R Bias = (Vs - Vd) / Id
75
Note: Contact factory for matching
recommendations if flat gain is required
from 2 to 6 GHz.
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
Bonding Configuration
Physical Dimensions
June 2007 - Rev 15-Jun-07
Page 8 of 8
DC-8.0 GHz InGaP HBT MMIC
Matched Gain Block Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice. ©2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
CGB7017-BD
Handling and Assembly Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body
and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1)
Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b)
support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided in
the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any component
of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices
need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick. Microstrip substrates should be brought
as close to the die as possible. The mounting surface should be clean and flat. If using conductive epoxy, recommended
epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in a nitrogen atmosphere per manufacturer's cure
schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die. An epoxy fillet should be visible around
the total die periphery. For additional information please see the Mimix "Epoxy Specifications for Bare Die" application note.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold
bond pads. The recommended wire bonding procedure uses Gold 0.025 mm (0.001") diameter ball bonds. Aluminum wire
should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may be used providing the
ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds should be made
from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering Description
CGB7017-BD-000V RoHS compliant die packed in vacuum release gel paks
June 2007 - Rev 15-Jun-07