BFG310/XR - NXP Semiconductors

1. Product profile

1.1 General description

NPN silicon planar epitaxial transistor in a 4-pin dual-emitter SOT143R plastic package.

1.2 Features and benefits

High power gain

Low noise figure

High transition frequency

Gold metallization ensures excellent reliability

1.3 Applications

Intended for Radio Frequency (RF) front end application s in the GHz range, such as:

analog and digital cellular telephones

cordless telephones (Cordless Telephone (CT), Personal Communication

Network (PCN), Digital Enhanced Cordless Telecommunications (DECT), etc.)

radar detectors

pagers

Satellite Antenna TeleVision (SATV) tuners

repeater amplifiers in fiber-optic systems

1.4 Quick reference data

BFG310/XR

NPN 14 GHz wideband transistor

Rev. 2 — 15 September 2011 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCBO collector-base voltage open emitter - - 15 V

VCEO collector-emitter voltage open base - - 6 V

ICcollector current (DC) - - 10 mA

Ptot total power dissipation Tsp 145 C[1] --60mW

hFE DC current gain IC=5mA; V

CE =3V;

Tj=25C60 100 200

CCBS collector-base

capacitance VCB = 5 V; f = 1 MHz;

emitter grounded - 0.17 0.3 pF

fTtransition frequency IC=5mA; V

CE =3V;

f=1GHz; T

amb =25C-14-GHz

Product data sheet Rev. 2 — 15 September 2011 2 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

[1] Tsp is the temperature at the soldering point of the collector pin.

2. Pinning information

3. Ordering information

4. Marking

[1] * = p: made in Hong Kong.

MSG maximum stable gain IC=5mA; V

CE =3V;

f=1.8GHz; T

amb =25C-18-dB

s212insertion power gain IC=5mA; V

CE =3V;

f=1.8GHz; T

amb =25C;

ZS=Z

L=50

-14-dB

NF noise figure s=opt; IC=1mA;

VCE =3V; f=2GHz -1-dB

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Table 2. Pinning

Pin Description Simplified outline Symbol

1 collector

2emitter

3base

4emitter

sym086

2, 4

Tabl e 3. Ordering i nfo rmation

Type number Package

Name Description Version

BFG310/XR SC-61AA plastic surface mounted package; reverse pinning;

4 leads SOT143R

Table 4. Marking codes

Type number Marking code[1]

BFG310/XR S1*

Product data sheet Rev. 2 — 15 September 2011 3 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

5. Limiting values

[1] Tsp is the temperature at the soldering point of the collector pin.

6. Thermal characteristics

[1] Tsp is the temperature at the soldering point of the collector pin.

7. Characteristics

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VCBO collector-base voltage open emitter - 15 V

VCEO collector-emitter voltage open base - 6 V

VEBO emitter-base voltage open collector - 2 V

ICcollector current (DC) - 10 mA

Ptot total power dissipation Tsp 145 C[1] -60mW

Tstg storage temperature 65 +175 C

Tjjunction temperature - 175 C

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-sp) thermal resistance from junction to solder point Tsp 145 C[1] 530 K/W

Table 7. Characteristics

Tj=25



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

ICBO collector-base cut-off current IE=0A; V

CB =5V - - 15 nA

hFE DC current gain IC=5mA; V

CE = 3 V 60 100 200

CCBS collector-base capacitance VCB = 5 V; f = 1 MHz; emitter grounded - 0.17 0.3 pF

CCES collector-emitter capacitance VCE = 5 V; f = 1 MHz; base grounded - 0.28 - pF

CEBS emitter-base capacitance VEB = 0.5 V; f = 1 MHz; collector grounded - 0.22 - pF

fTtransition frequency IC=5mA; V

CE = 3 V; f = 1 GHz;

Tamb =25C-14-GHz

MSG maximum stable gain IC=5mA; V

CE = 3 V; f = 1.8 GHz;

Tamb =25C-18-dB

s212insertion power gain IC=5mA; V

CE =3V; T

amb =25C;

ZS=Z

L=50

f = 1.8 GHz - 14 - dB

f=3GHz - 11 - dB

NF noise figure s=opt; IC=1mA; V

CE =3V; f=2GHz - 1 - dB

PL(1dB) output power at 1 dB gain

compression IC=5mA; V

CE = 3 V; f = 1.8 GHz;

Tamb =25C; ZS=Z

L=50

-1.8-dBm

IP3 third order intercept point IC=5mA; V

CE = 3 V; f = 1.8 GHz;

Tamb =25C; ZS=Z

L=50

-8.5-dBm

Product data sheet Rev. 2 — 15 September 2011 4 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

Fig 1. Power derating curve Fig 2. Collector current as a function of

collector-emitter voltage; typical values

IC=0mA; f=1MHz. I

C=5mA; V

CE =3V.

Fig 3. Collector-base capacitance as a function of

collector-base voltage; typical values Fig 4. Gain as a function of frequency; typical values

Tsp (°C)

0 20015050 100

001aac169

Ptot

(mW)

001aac170

(V)

0653142

(mA) I

= 120 μA

100 μA

80 μA

40 μA

20 μA

60 μA

VCB (V)

054231

001aac171

CCBS

(pF)

0.17

0.16

0.19

0.18

0.20

0.15

001aac172

(dB)

f (MHz)

10 104

103

102

MSG

s21 2

Product data sheet Rev. 2 — 15 September 2011 5 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

VCE =3V; I

C=5mA; Z

o=50.

Fig 5. Common emitter input reflection coefficient (s11); typical values

VCE =3V; I

C=5mA.

Fig 6. Common emitter forward transmission coefficient (s21); typical values

001aac173

90°

−90°

0.50.2

+0.2

−5

−2

−0.2

+0.5

−0.5

−1

110 0

0.2

0.6

0.4

0.8

1.0

−45°−135°

45°135°

180°0°

3 GHz 40 MHz

001aac174

90°

−90°

−45°−135°

45°135°

0°

180°20 16 12 8 4

40 MHz

3 GHz

Product data sheet Rev. 2 — 15 September 2011 6 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

VCE =3V; I

C=5mA.

Fig 7. Common emitter reverse transmission coefficient (s12); typical values

VCE =3V; I

C=5mA; Z

o=50.

Fig 8. Common emitter output reflection co efficient (s22); typical values

001aac175

90°

−90°

−45°−135°

45°135°

0°

180°0.5 0.4 0.3 0.2 0.1 40 MHz

3 GHz

001aac176

90°

−90°

0.50.2

+0.2

−5

−2

−0.2

+0.5

−0.5

−1

110 0

0.2

0.6

0.4

0.8

1.0

−45°−135°

45°135°

180°0°

3 GHz

40 MHz

Product data sheet Rev. 2 — 15 September 2011 7 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

8. Application information

Table 8. SPICE parameters of the BFG310 DIE

Sequence Parameter Value Unit

1 IS 16.17 aA

2BF 210-

3NF 1-

4VAF 50V

5IKF 59.83mA

6ISE 1.726fA

7NE 2.114-

8BR 6-

9NR 1-

10 VAR 2.3 V

11 IKR 10 A

12 ISC 0 aA

13 NC 1.5 -

14 RB 3.6 

15 RE 2.1 

16 RC 1.6 

17 CJE 115.6 fF

18 VJE 866.3 mV

19 MJE 0.285 -

20 CJC 68.18 fF

21 VJC 601 mV

22 MJC 0.123 -

23 XCJC 1 -

24 FC 0.7 -

25 TF 8.3 ps

26 XTF 10 -

27 VTF 1000 V

28 ITF 150 mA

29 PTF 0 deg

30 TR 0 ns

31 KF 0 -

32 AF 1 -

33 TNOM 25 C

34 EG 1.014 eV

35 XTB 0 -

36 XTI 8 -

37 Q1.AREA 1 -

Product data sheet Rev. 2 — 15 September 2011 8 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

Fig 9. Package equivalent circuit of SOT143R

Table 9. List of components; see Figure 9

Designation Value Unit

CCB 17 fF

CBE 84 fF

CCE 191 fF

C_base_pad 67 fF

C_emitter_pad 142 fF

LB0.95 nH

LE0.40 nH

L10.12 nH

L20.21 nH

L30.06 nH

BJT1

C_base_pad

CCB

CHIP

CBE

CCE

C_emitter_pad

001aac155

Product data sheet Rev. 2 — 15 September 2011 9 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

9. Package outline

Fig 10. Package outline SOT143R (SC-61AA)

UNIT A

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 1.1

0.9

max

0.1

0.88

0.78

0.15

0.09

3.0

2.8

1.4

1.2

HEywvQ

2.5

2.1 0.55

0.25 0.45

0.25

1.9

1.7

0.1 0.10.2

0.48

0.38

DIMENSIONS (mm are the original dimensions)

SOT143R SC-61AA 04-11-16

06-03-16

0 1 2 mm

scale

Plastic surface-mounted package; reverse pinning; 4 leads SOT143R

vMA

detail X

Product data sheet Rev. 2 — 15 September 2011 10 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

10. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Ch ang e notice Supersedes

BFG310_XR v.2 20110915 Product data sheet - BFG310_XR v.1

Modifications: •The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

•Legal texts have been adapted to the new company name where appropriate.

•Package outline drawings have been updated to the latest version.

BFG310_XR v.1

(9397 750 14244) 20050202 Product data sheet - -

Product data sheet Rev. 2 — 15 September 2011 11 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulat ive liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expect ed

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liabil ity related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cu stomer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress rating s only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the obj ective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 2 — 15 September 2011 12 of 13

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qua lified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ pro duct specifications.

11.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BFG310/XR

NPN 14 GHz wideband transistor

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 September 2011

Document identifier: BFG310_XR

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Applic ation information. . . . . . . . . . . . . . . . . . . 7

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Contact information. . . . . . . . . . . . . . . . . . . . . 12

13 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13