66956-004LF - FCI - Product.Network

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

1 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

1.0 Objective

This specification defines the performance, test, quality and reliability requirements of the Gold Plated

Contact Bergcon PV Vertical and Horizontal Connector product. This product can be Lead Free and

meets the requirements of the European Union Directive of Restrictions for Hazardous Substances

(Directive 2002/95/EC).

2.0 Scope

This specification is applicable to the termination characteristics of the PV Connector family of products

which provides interconnection of printed wiring boards in low power applications. The connectors only

provide the female half of the interconnection and are designed for mating with single or double rows of

.025 inch square pins, free standing or in headers on .100 or .150 inch centers.

3.0 General

This document is composed of the following sections:

Paragraph Title

1.0 OBJECTIVE

2.0 SCOPE

3.0 GENERAL

4.0 APPLICABLE DOCUMENTS

5.0 REQUIREMENTS

5.1 Qualification

5.2 Material

5.3 Finish

5.4 Design and Construction

6.0 ELECTRICAL CHARACTERISTICS

7.0 MECHANICAL CHARACTERISTICS

8.0 ENVIRONMENTAL CONDITIONS

9.0 QUALITY ASSURANCE PROVISIONS

9.1 Equipment Calibration

9.2 Inspection Conditions

9.3 Sample Quantity and Description

9.4 Acceptance

9.5 Qualification Testing

9.6 Re-Qualification Testing

10.0 REFERENCE DOCUMENTS

11.0 NOTES & DEFINITIONS

TABLE 1 QUALIFICATION TESTING MATRIX

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

2 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

4.0 Applicable Documents

4.1 Specifications- N/A

4.2 Military Standards

MIL-STD-202 Test methods for electronic and electrical component parts.

MIL-STD-275 Printed Wiring for Electronic Equipment

MIL-M-14- Molding Plastic and Molded Plastic Parts, Thermosettings

MIL-F-14256 Flux, Soldering , Liquid (Rosin Base), Activated

MIL-M-20693 Plastic Molding Material, Polyamide (Nylon)

MIL-M-24519 Molding Plastics, Polyester , Thermoplastic

MIL-G-45204 Gold Plating, Electro deposited

MIL-C-45662 Calibration System Requirements

MIL-F-55110 Printed Wiring Boards

4.3 Federal Specifications

QQ-N-290 Nickel Plating (Electro deposited)

QQ-S-571 Solder: Lead Alloy, and Tin Lead Alloy and Tin Alloy; Flux Cored Ribbon and

Wire and Solid Form.

QQ-B-613 Brass, Leaded and Non Leaded

4.4 Other Standards and Specifications

4.4.1 UL94- Test for Flammability of Plastic Materials.

4.4.2 EIA 364 Electrical Connector/Socket Test Procedures Including Environmental

Classifications.

4.4.3 ASTM B –122 Copper - Nickel –Tin Alloy, Copper-Nickel –Zinc Alloy (Nickel Silver),

and Copper-Nickel Alloy Plate, Sheet, Strip and Rolled Bar.

ASTM B-194 Copper-Beryllium Alloy Plate, Sheet, Strip and Rolled Bar

4.4.4 ANSI-J-002 Test condition A

4.5 FCI Specifications

4.5.1 BUS-02-055 Plastic Resin Selection

BUS-02-056 Metal Selection

BUS-02-057 Plating Selection Guidelines

BUS-03-302 Sulfide Vapor Test

BUS-03-405 Insertion / Withdrawal Force Measurement

BUS-03-601 Current Rating / 30 Deg. C Temperature Rise

BUS-19-122 Solder Joint Reliability Test procedure for Surface Mount Connectors

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

3 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

4.6 FCI Lab Reports - Supporting Data

ZA5-2625 Lead Free Plating investigation

5.0 Requirements

5.1 Qualification

Connectors furnished under this specification shall be capable of meeting the qualification test

requirements specified herein.

5.2 Material

The material for each component shall be as specified herein or equivalent. Reference BUS-02-

055; BUS-02-056.

Metalic Parts:

5.2.1 Contact Body: The body shall be one-half hard (H01) brass alloy UNS C26000 in

accordance with QQ-B-613, or quarter hard ( H01 Temper ) Copper-Nickel-Tin alloy UNS

C72500 in accordance with ASTM B-122.

5.2.2 Contact Spring: The spring shall be ( TH02 Temper ) heat-treated beryllium copper alloy

UNS 17200 in accordance with ASTM B-194.

Insulator Housing :

All housing material shall be rated flame retardant 94V-1 or better in accordance with UL-94.

5.2.3 The housing shall be glass filled Nylon ( Type 6-6 ) in accordance with MIL-M-20693, or,

5.2.4 The housing shall be filled diayll phthalate in accordance with MIL-M-14, Type SDGF or

5.2.5 The housing shall be glass filled polyester ( Type GPT-15F or GPT-30 F ) in accordance

with MIL-M-24519, or

5.2.6 The housing shall be filled phenolic in accordance with MIL-M-14, Type MFH, or

5.2.7 The housing shall be glass filled PPS Type GST-40 F in accordance with MIL-M-24519B9

(EC), or

5.2.8 The housing shall be 45% glass filled High Temperature Nylon ( PPA ).

Other Plastic:

5.2.9 Insulator Bar ( Optional ): The bar shall be unfilled Nylon in accordance with MIL-M-

20693, Composition A, Type 1

5.3 Finish : The finish for applicable components shall be as specified herein or equivalent. Reference

BUS- 02-057.

5.3.1 Contact Body : The body shall be plated in the contact area with 15 micro-inches

(minimum) (150-200 Knoop Hardness) gold per MIL-G-45204, Type II, Grade C over 50

micro-inches (minimum) nickel per QQ-N-290, Class 3, or

5.3.2 The body shall be plated in the contact area with 30 micro-inches (minimum) gold per MIL-

G-45204, Type II, Grade C over 50 micro-inches (minimum) nickel per QQ-N-290, Class

2, or

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

4 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

5.3.3 The body shall be plated in the contact area with 40 micro-inches (minimum) (150-200

Knoop Hardness) gold per MIL-G-45204, Type II, Grade C over 50 micro-inches

(minimum) nickel per QQ-N-290, Class 2. or

5.3.4 The body shall be plated in the contact area with 50 micro-inches (minimum) gold per MIL-

G-45204, Type II, Grade C over 50 micro-inches (minimum) nickel per QQ-N-290, Class 2.

5.3.5 Contact Spring:

The spring shall be plated with gold flash per MIL-G-45204.

5.3.6 Solder-tail:

The solder-tail will be plated with 3 micro-inches (minimum) gold flash over 50 micro-

inches (minimum) nickel, except for the vertical card connector with 30 micro-inches gold

in the contact area. The 30 micro-inch gold vertical card connector will have 100 micro-

inches (minimum) Tin Lead ( 93% ) over 50 micro-inches nickel on the solder-tail. Or will

have 100-160 microinches pure tin.

5.4 Design And Construction

Connectors shall be of the design, construction, and physical dimensions specified on the

applicable product drawing. The connector shall be a multi-piece assembly having one or two rows

of contacts with solder-tail terminations for installation in 0.035 inch diameter holes in a 1/16 thick

printed wiring board. The female end of the contact shall interface with 0.025 inch square pins on

0.100 or 0.150 inch centers, as appropriate

5.4.1 Mating: The connector shall be capable of mating and unmating by hand without the

use of special tools within the specified temperature range.

5.4.2 Workmanship: Connectors shall be uniform in quality and shall be free from burrs,

scratches, cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that will

adversely affect life or serviceability.

5.4.3 Inter-change ability: The connector shall be capable of mating with any appropriately

constituted male connector of the same population without degradation in performance.

6.0 Electrical Characteristics:

6.1 Contact Resistance, Low Level (LLCR) - The low level contact resistance shall not

exceed the following when measured in accordance with EIA 364-23.

The following details shall apply:

a. Method of Connection - Attach current and voltage leads as shown

in Figure _1__.

b. Test Voltage - 20 milli-volts DC max open circuit.

c. Test Current – 1.0 milli-amperes DC ( Not to exceed 100 milli-amperes )

d. Sample Size – 20 % of connector population.

6.2 Contact Resistance, Specified Current - The contact resistance at a specified current shall not

exceed _(See Table 2 ) milli-ohms and milli-ohms after environmental exposure when measured

in accordance with EIA 364-06. The following details shall apply:

a. Method of Connection - Attach current and voltage leads as shown

in FIGURE __1__.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

5 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

b. Test Current __1__ amperes DC.

c. Sample size – 20 % of connector population

TABLE 2 – CONTACT RESISTANCE

-----------------------------------------------------

Horizontal – 10 maximum milli-ohms initial

Horizontal – 15 maximum milli-ohms after environmental exposure

Vertical ------10 maximum milli-ohms initial

Vertical ------15 maximum milli-ohms after environmental exposure

6.3 Insulation Resistance - The insulation resistance of the unmated connector shall not be less than

50,000 meg-ohms after environmental exposure ( 5,000 meg-ohms after humidity ) when

measured in accordance with EIA 364-21. The following details shall apply:

a. Test Voltage - _500 __ volts DC.

b. Electrification Time - 2 minutes, unless otherwise specified.

c. Points of Measurement - Between adjacent contacts and opposing contact positions for 20

percent of connector population.

6.4 Dielectric Withstanding Voltage - There shall be no evidence of arc-over, insulation breakdown, or

excessive leakage current (> 1 milli-ampere) when (unmated ) connectors are tested in

accordance with EIA 364-20. The following details shall apply:

a. Test Voltage – (See Table 3 ) volts (DC RMS or AC, 60Hz).

b. Test Duration - 60 seconds.

c. Test Condition - 1 (760 Torr - sea level).

d. Points of Measurement - Between adjacent and opposing contact positions for 20 % of

connector population.

TABLE 3 – DIELECTRIC WITHSTANDING VOLTAGE

-------------------------------------------------------------------------------

Contact Spacing (inch) Withstanding Voltage

( volts, RMS at 60 Hz )

0.100 1,250

0.150 1,500

6.5 Current Rating - The temperature rise above ambient shall not exceed 30 deg C at any point in the

system when all contacts are powered at _2.0_ ampere(s) or one contact is powered at _3.0__

amperes. The following details shall apply:

a. Ambient Conditions - Still air at 25 degrees C.

b. Reference - BUS-03-601.

6.6 Capacitance – The specification requirement shall be satisfied when evaluated in accordance with

MIL-STD-202 Method 305. The following details shall apply:

a. Specification requirement __< 2.0_ pF (indicate < or > )

b. Sample documentation (Define application and provide drawings)

c. Sample test conditions

Frequency 100 khz (default 1 mhz)

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

6 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

Amplitude ___volts (default 1 volt)

d. Sample size 20 % of connector population

e. Unmated Connector

7.0 Mechanical Characteristics

7.1 Mating / Unmating Force - The force to mate a receptacle connector and compatible header with

.025 square pins shall not exceed ( See Table 4 ) grams per contact times the number of contacts.

( FIGURE 2) The following details shall apply:

a. Cross Head Speed - 1 inch per minute.

b. Lubrication - ____N/A_______.

c. Utilize free floating fixtures.

d. Reference - EIA 364-13.

7.2 Individual Contact Insertion/Withdrawal Force - The insertion force shall not exceed ( See Table 4 )

grams when a maximum gauge is inserted. After three insertions with a maximum gauge, the

withdrawal force shall not be less than ( See Table 4 ) grams when measured using a minimum

gauge. See FIGURE _3_ for gauge descriptions. Gauges should be cleaned after each test cycle

with a soft eraser or equivalent non -abrasive material to remove any plating build-up. Gages

should not be lubricated. Testing shall be in accordance with Berg Test Specification BUS-03-405.

TABLE 4 – FORCES VS SPRING THICKNESS

------------------------------------------------------------------

Spring Thickness Individual Contact Force - - Grams Force / Contact In Composite

(mils ) Insertion (max ) Withdrawal ( min ) Connector (grams Max )

3.0 200 30 200

3.5 & 4.0 300 40 300

4.8 450 50 450

7.3 Contact Retention – ( Vertical Card Connector Only )

Individual contacts shall withstand an axial load of 2 pounds minimum applied at a rate of 0.2

inches/minute without dislodging from the housing cavity. Reference EIA 364-29.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

7 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

7.4 Terminal Strength – Individual contact tails in the un-terminated connector shall withstand without

fracture a bend of 45 degrees when tested in accordance with MIL-STD-202, Method 211. The

following

details shall apply:

a. Direction of bend : Normal to the width of the tail.

b. Number of Cycles : 2

c. Sample size : 10 % of connector population

8.0 Environmental Conditions

After exposure to the following environmental conditions in accordance with the specified test

procedure and/or details, the product shall show no physical damage and shall meet the electrical

and mechanical requirements per paragraphs 6.0 and 7.0 as specified in the Table 1 test

sequences. Unless specified otherwise, assemblies shall be mated during exposure.

8.1 Thermal Shock - EIA 364-32.

a. Number of Cycles - __25__ 1 hour cycles

b. Temperature Range - Between _-55_ and _+130_ deg C ( -55 to + 105 for nylon insulators)

c. Time at Each Temperature - 60 minutes

d. Transfer Time - 5 minutes, maximum

e. Unmated Connector

8.2 Humidity, Steady State - EIA 364-31, Method II.

a. Relative Humidity - 95%

b. Temperature - +40 deg C

c. Test Condition - A (96 hours)

d. Unmated Connector

8.3 High Temperature Life - EIA 364-17.

a. Test Temperature - 100 deg C ( + 75 deg C for Nylon insulators )

b. Test Duration – 250 hours

c. Operating conditions : Rated current through all contacts of terminated connector. Duty

Cycle : 45 minutes ON and 15 minutes OFF.

8.4 Hydrogen Sulfide (H2S) - BUS-03-302

a. Duration - 48 hours

b. Temperature - 40 deg C

c. Test Vessel - 9000 milli-liter glass desiccator

d. Test Medium : 3 PPM H2S in air

8.5 Salt Spray - EIA 364-26

a. Salt Solution - 5% by weight

b. Test Condition – B (48 hours)

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

8 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

8.6 Vibration Sinusoidal - EIA 364-28

a. Test Condition – III

b. Vibration Amplitude - 0.06" DA or +/-15G

c. Frequency Range - 10 to 2000 hertz

d. Sweep Time and Duration - 20 minutes per sweep, 4 hours along each of three orthogonal

axes

(12 hours total)

e. Mounting - Rigidly mount assemblies. See Figure 4

f. No discontinuities greater than 1 microsecond

8.7 Mechanical Shock - EIA 364-27

a. Condition - A (50G, 11 millisecond half-sine)

b. Shocks - 3 shocks in both directions along each of three

orthogonal axes (18 total)

c. Mounting - Rigidly mount assemblies ( See Figure 4 )

d. No discontinuities greater than 1 microsecond.

8.8 Durability – After the number of mating cycles of Bergstik II, 30 micro-inch thick gold plated header

on .100 centerline, the individual contact withdrawal force shall not be less than value in grams in

Table 4 and the contact resistance shall not exceed the value specified in Table 2.

TABLE 5 - DURABILITY

------------------------------------

Gold Plating Spring Thickness Mating Cycles

(Thickness u-inch) (mils)

15 3.5 50

15 3.0 50

30 3.5 250

30 3.0 250

40 3.5 250

40 3.0 250

50 3.5 250

50 3.0 250

8.9 Solderability - ANSI-J-002, Test Condition A

a. Steam aging –1—hours (suspended 2 inches above boiling distilled water for 60 minutes)

b. Contact areas evaluated shall meet the ANSI-J-002 requirements.

c. Number of samples: 20

d. Acceptable coverage: 95% minimum of .100 length from the tip

e. Solder : 60/40 Tin-Lead in accordance with QQ-S-571, Type S

f. Flux: Type A in accordance with MIL-F-14256

g. Flux Immersion Time: Terminal dipped and allowed to set 60 seconds

h. Solder Dwell Time: Terminal held immediately above solder for 10 seconds then immersed for

3 seconds.

i. Solder temperature: 232 +/- 5 deg. C

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

9 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

8.10 Resistance to Solder Heat - EIA 364-56

a. Test Condition – E

b. Immersion depth: To within .040 +/- .015 of insulator

c. There shall be no evidence of physical or mechanical damage

8.11 Resistance to Solvents - EIA 364-11

a. Solvent - Alcohol

b. Solvent Temperature - 25 deg C

c. Immersion Time - 2 minutes

d. Number of Immersions – 2

9.0 QUALITY ASSURANCE PROVISIONS

9.1 Equipment Calibration

All test equipment and inspection facilities used in the performance of any test shall

be maintained in a calibration system in accordance with MIL-C-45662 and ISO 9000.

9.2 Inspection Conditions

Unless otherwise specified herein, all inspections shall be performed under the following

ambient conditions:

a. Temperature: 25 +/- 5 deg C

b. Relative Humidity: 30% to 60%

c. Barometric Pressure: Local ambient

9.3 Sample Quantity And Description

9.4 Samples:

Qualification Inspection shall be performed on eight (8) of the largest population connectors of the type

for which qualification under this specification is desired.

9.5 Preparation of Samples:

Printed Wiring Test Board:

Four (4) test boards conforming to the applicable requirements of MIL-P-55110 and MIL-STD-275

shall be prepared as shown in Figure 5.

Mating Headers:

Four (4) mating headers of the appropriate population and configuration and conforming to the

requirements of Figure 2 shall be prepared.

Sample Mounting :

Four connectors ( one per board ) shall be installed in, and hand soldered to , the test boards ; a flux

more active than type A, in accordance with MIL-F-14256 may be used to insure that the solder joint

does not contribute any degradation.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

10 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

TABLE 6 – SAMPLE CONFIGURATION

-------------------------------------------------------------

Sample No. Terminated Mating Header Required

---------------- ----------------- ----------------------------------

1 - 2 NO NO

3 - 6 YES YES

7 - 8 NO NO

9.4 Acceptance

9.4.1 Electrical and mechanical requirements placed on test samples as indicated in paragraphs

6.0 and 7.0 shall be established from test data using appropriate statistical techniques or

shall otherwise be customer specified, and all samples tested in accordance with this

product specification shall meet the stated requirements.

9.4.2 Failures attributed to equipment, test set up, or operator error shall not disqualify the product.

If product failure occurs, corrective action shall be taken and samples resubmitted for

qualification.

9.5 Qualification Testing

Qualification testing shall be performed on sample units produced with equipment and procedures normally

used in production. The test sequence shall be as shown in Table 1.

9.6 Requalification Testing

If any of the following conditions occur, the responsible product engineer shall initiate re-qualification

testing consisting of all applicable parts of the qualification test matrix, Table 1.

a. A significant design change is made to the existing product which impacts the product form, fit or

function.

Examples of significant changes shall include, but not be limited to, changes in the plating material

composition or thickness, contact force, contact surface geometry, insulator design, contact base

material, or contact lubrication requirements.

b. A significant change is made to the manufacturing process which impacts the product form, fit or

function.

c. A significant event occurs during production or end use requiring corrective action to be taken relative

to the product design or manufacturing process.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

11 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

TABLE 1 – QUALIFICATION TESTING

TEST GROUP

1 2 3 4 5 6 7 8

TEST PAR

A.

TEST SEQUENCE

Examination of Product

5.4 1

8

1

8

1

14

1

16

1

14

1

11

1

5

1

3

Contact Resistance

Low Level

6.1

3

6

10

13

10

13

15

8

10

11

13

8

10

Contact Resistance 6.2 2 5 5 4

5 7 7 6

9 9

12 11

Insulation Resistance 6.3 3 3

Dielectric Withstanding

Voltage

6.4 6 6 8

Current Rating 6.5

Capacitance 6.6 4

Mating Force 7.1 3 3 3

Insertion / Withdrawal

Force

7.2 2 2 2

Contact Retention VCC 7.3 7 4

7

Terminal Strength 7.4 2

Thermal Shock 8.1 5 5 7

Humidity, Steady State 8.2 2 2 4

Hi Temperature Life 8.3 11

Hydrogen Sulfide 8.4 12 9 7

Salt Spray 8.5 14 12 9

Vibration 8.6 6 6

Mechanical Shock 8.7 4 4

Durability 8.8 8 5

Solderability 8.9 3

Res. to Soldering Heat 8.10 4

Resistance to Solvents 8.11 2

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

12 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

10.0 Reference Documents : N/A

11.0 Notes and Definitions

Insulator Bar

The bar, available as an option in a double row horizontal connector, prohibits contact between the tip of a

pin,mated with a bottom row terminal, and the tail of the upper row terminal immediately above

Total Mating Force

The higher population connectors may, because of their size, prohibit manual mating or un-mating of the

header with its header. This condition represents a human limitation and not necessarily a connector

malfunction. ( See 7.1 )

Contact Resistance

Differences in contact resistances between various terminal configurations represent changes in the bulk

resistance due to longer lengths of current paths; correction for these differences in bulk resistance will

permit comparison of results for different styles of terminal. ( See 6.1 & 6.2 )

Termination

The type of printed wiring board and the geometry of its land areas will affect this parameter; for this reason,

this sample has not been terminated. ( See Figure 5 )

Alloy 725 Solderability

Efforts to provide >95% solderability using mildy active fluxes with this alloy have proven futile. This

coverage is possible with more active fluxes, but they present corrosion problems if not adequately removed

by cleaning.(See 8.9 )

Lubrication of Card Connectors

All gold plated contact systems have been found to be improved by suitable lubrication which enhance

durability and lower insertion forces. The PV’s in this product are not lubricated during manufacture. After

the soldering and cleaning operation, it is advisable to lubricate the connector system if durability and low

insertion forces are important to the application. The recommended lubrication is Nye 176 oil as a 5%

solution in a vanishing type solution. This mixture may be applied by brushing, sponging, dipping or spraying.

It can be applied to either the card connector or the pin field with equal effectiveness. The preferred method

is to dip the pin field in the , mixture and then allow the vanishing solution to evaporate; this is the most

economical method for using the lubricant. If this is not possible, then an absorbent brush or roller may be

used to apply the liquid to the pins.

The roller can also be used to apply lubricant to the card connector itself. Another method is to dip a pin field

in

the solution and transfer it immediately to the card connector, inserting just enough to deposit a small droplet

on each contact .

The connector can be dipped into a container but care must be taken not to transfer an excessive amount of

lubricant. The lead-in window s of the connector should be touched to the surface and the mixture will wick

up into the contact area. The excess liquid should be blown off.

It is vital that commercial “ contact cleaner-lubricants “ not be used, as these materials have virtually no

lubricants in them and the cleaning action will cause immediate severe wear and increase the insertion force

as much as three times normal.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

13 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

FIGURE 1-CONTACT RESISTANCE

* PROBE POSITIONED AT PIN TO BOARD AND TERMINAL TO BOARD SOLDER CONNECTION

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

14 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

FIGURE 2- MATING HEADER

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

15 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

FIGURE 3- INSERTION/ WITHDRAWAL FORCE GAGE

DIMENSIONS-INCH

Gage A Tol. B Tol.

Min. .0240 + .0000

- .0002

.25 +/- .001

Max. .0260 + .0002

- .000

.25 +/-.0001

Material: M2 steel, hacksaw blade or shim stock at. 64 Rockwell grind working surface in direction of polish.

Polish: To accomplish a 4u “ finish, use 400 grit paper with Metadi fluid as lubricant or equivalent method to obtain

4 u “ finish

Clean gage as follows before each use:

A. Wash surface with Freon or equivalent and dry with clean cotton. DO NOT TOUCH SURFACE WITH

FINGERS.

B. Scour surface with pink Pearl eraser.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

16 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

FIGURE 4- SHOCK & VIBRATION FIXTURING

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

17 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

FIGURE 5 – PRINTED WIRING BOARD

NOTES:

1. X=.100 +- .005. or .150 +-.005

2. Datum –A- located as best average position of front row holes.

3. Datum –B- located through average center-line of first hole(s).

4. Board to be 2 ounce, single-side, copper clad, glass filled epoxy 0.062 +- 0.010 think.

5. Land areas to be plated with solder 100 to 300 micro inches thick.

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

NUMBER

BUS-12-009

TYPE

PRODUCT SPECIFICATION

TITLE PAGE REVISION

18 of 18 N

AUTHORIZED BY DATE

Bergcon ™ Printed Wiring Board Connector Cold Plated

A.LUGO 4/09/08

CLASSIFICATION

UNRESTRICTED

Copyright FCI

Form E-3334

Rev F

GS-01-001

REVISION RECORD

REV PAGE DESCRIPTION EC # DATE

F ALL

Retype spec and add "150-200 Knoop Hardness" to 3.3.1.1

and 3.3.1.3 14788 05/19/88

G ALL Reformat spec and change one-half hard brass to one-quarter

hard brass in 3.2.1.1; add 3.3.2 "Soldertail" information

V02103 12/21/90

H 1, 9, 11,

17, 21,

23

Add Requalification Testing to 1.0 Delete Quality

Conformance and Acceptance Inspection from 1.0; Delete

3.5.7 and "Best estimate paragraph from 3.6.3; Change

Mating Cycles in Table IV; Replace 4.4 with Requalification

section Delete Table VII, Table VIII, Table IX; Change 5.5 to

reflect no lubrication of parts during manufacture, replace

Freon with Trichloroethane as lubricant

V01412 02/27/91

J 15 Change 3.7.9 (a) to "G" procedure. Change 3.7.10 (a) to

Trichloroethane 1.1.1

K 3 Add 3.2.2.5 Spelling change in 3.2.2.2 V60508 5/13/96

L ALL Add HTN Nylon Housing material & update spec per Bus-01-

059

V00744 11/01/00

M 1,4 Add lead free information M06-0266 7/11/06

N 1,11 Delete colums 9,10,11 in table 1 , on page 11 M08-0100 8/09/08

PDM: Rev:N Released .STATUS: Printed: Nov 28, 2010

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  66527-020  66527-025  66527-040  66527-040LF  66527-065  66956-005  66953-016LF  66527-020LF  66951-008LF
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