AP22815 / AP22615
SINGLE CHANNEL POWER DISTRIBUTION SWITCH WITH OUTPUT OVP
Description
The AP22815/615 is a 3A single-channel current-limited high-side
power switch with output OVP optimized for USB and other hot-
swap
applications, which must
have overvoltage protection from output to
protection the system. The AP22815/615 complies with
USB
standards and is available with both polarities of Enable input.
AP22815 supports fixed current-
limited feature, while AP22615
equips adjustable current-
limited feature optimized for applications
that require precision current limiting support. It s upports
USB PD3.0
fast role-
swap function. The output voltage could recovery to USB
valid voltage range within 110µs during USB PD fast role-swap event.
The device has fast short-circuit and output overvoltage
response
time for improved overall system robustness. Both TSOT25
and
TSOT26 packages integrate discharge circ uitry inside OUT pin.
They
provide a complete protection solution for a
pplications subject to
heavy capacitive loads and the prospec
t of short circuit, and offer
output overvoltage prot ection, reverse-current protection
, overcurrent,
overtemperature and short-
circuit protec tion, as well as controlled rise
time and undervoltage lockout functionality. A 7ms
deglitch capability
on the open-drain flag output prevents false overcurrent, overvoltage
,
and overtemperature reporting and does not require any
external
components.
The AP22815 is avai l abl e i n a st andard green TSOT25 packages with
RoHS compliant. The AP22615
is available in a standard Green
TSOT26 packages with RoHS compliant.
Features
• Input Voltage Range: 3.0V ~ 5.5V
• 40mΩ On-Resistance
• Built-in Soft-Start with 2.1ms Typical Rise Time
• Fault Report (FL G) wit h Blanking Time (7ms typ)
• Accurate Adjustabl e Current Lim it, 0. 4A ~ 4.0A (AP22615 Only)
• ESD Protection: 2KV HBM, 200V MM
• Active Low or Active High Enable
• Protection
Output Overvoltage with Auto Recovery
Overcurrent with Aut o Recovery
Short-Circuit with A uto Recovery
Overtemperature with A ut o Recovery
• Output Reverse Voltage/Current Protection
• Fast Role Swap Function
• Thermally Eff ici ent Low Profil e Pack age
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
• Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
Pin Assignme nts
Applications
• Integrated Load Swi tches in Ultrabook PC
• Power Up/Down Sequencing in Ultrabook PC
• Notebook, Netbook, Tablet PC, Set-Top Box
• SSD (Solid State Drives)
• Consumer Electronics
• USB Charger
• Te lecom Syst ems
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 1 of 17
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AP22815 / AP22615
Typical Applicat ions C ircuit
1uF
IN
GND
EN
OUT
ON
100uF
Power Supply
3.0V to 5.5V
0.1uF
OFF
FLG
Load
10k
Active-High Enabled Example
1uF
IN
GND
EN
OUT
ON
100uF
Power Supply
3.0V to 5.5V
0.1uF
OFF
FLG
Load
10k
Active-High Enabled Example
ISET R
LIM
6K
Note: Applying a 1µF input capacitor leads to a large VIN spike, so it is recommended to use a 10µF capacitor instead.
AP22815
AP22615
6.8K
AP22815 / AP22615
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AP22815 / AP22615
Pin Descriptions
AP22615
Pin Name Pin function
TSOT26
1 1 OUT Voltage Output Pin
2 2 GND Ground Pin of the Circuitry
3 3 FLG
Overcurrent and Overtem perat ure Fault Report;
Open-Drain Flag is Active Low W hen Triggered.
4 4 EN Enable Input. Enable Input (Acti ve Low or Acti ve Hi g h).
NC 5 ISET A P22815 : NC pin
AP22615 : Set OCP current by attaching resistor. The current limit:
ILIM (A)=6800/RLIM(Ω)
5 6 IN Voltage Input Pin
Functional Block D iagram
Thermal
Sense
FLG
OUT
GND
IN
EN
UVLO
Current
Limit
Current
Sense
Deglitch
Discharge
Control
Driver
ISET
(AP22615)
Voltage
Sense
OVP
AP22815 / AP22615
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AP22815 / AP22615
Absolute Maximum Rati ngs (@ TA = +25°C, unless otherwise specified.) (Note 4)
Symbol
Parameter
Ratings
Units
ESD HBM
Human Body ESD Protection
2000
V
ESD MM
Machine Model ESD Protection
200
V
VIN
Input Voltage
-0.3 to 6.0
V
VOUT
Output Voltage (VOUT to GND, VOUT to VIN)
-0.3 to 28
V
V
EN
Enable Voltage -0.3 to (V
IN
+0.3) V
V
ISET
ISET Voltage -0.3 to (V
IN
+0.3) V
I
L
Load Current Internal Limited A
TJ(max)
Maximum Juncti on Temperat ure
150
°C
TST
Storage Temperature
-65 to +150
°C
RΘJA Thermal Resistance, Junction to Ambient
TSOT25
85
°C/W
TSOT26
80
RΘJC Thermal Resistance, Junction to Case
TSOT25
32
°C/W
TSOT26
30
Note: 4. Stresses greater than the Absolute Max imum Ratings specified above may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
5. RϴJA and RϴJC are measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7.
Recommended Operating Conditions (Note 5)
Symbol
Parameter
Min
Max
Unit
VIN
Input Voltage
3.0
5.5
V
IOUT
Output Current, 4.0V ≤ Vin ≤ 5.5V
0
3
A
Output Current, 3.0V ≤ Vin < 4.0V
0
1.5
A
VIL
EN Input Logic Low Voltage
0
0.4
V
RLIM
Current-Limit T hreshol d Resist or Range (1% Initi al Tol eranc e) 1.94 6.8 kΩ
VOUT
Output Voltage 0 23 V
VIH
EN Input Logic High Voltage
1.2
VIN
V
TA
Operating Ambient Temperature
-40
+85
°C
Note: 5. Refer to the typical application circuit.
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 4 of 17
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AP22815 / AP22615
Electrical Characteristics (Vin = 5.0v @ TA = +25°C, CIN = 1µF, CL = 100nF, unless otherwise specifi ed. )
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VUVLO Input UVLO VIN Rising 2.1 2.5 2.9 V
ΔVUVLO Input UVLO Hysteresis VIN Decreasing — 180 — mV
ISHDN Input Shutdown Current
Disabled, OUT = Open (Discharge Current Incl uded)
— 0.1 10 µA
IQ Input Q ui escent Current Enabled, OUT = Open — 300 — µA
ILEAK Input Leakage Current
Disabled, OUT Grounded
— 0.1 1 µA
IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at O UT — 0.5 15 µA
Disabled, VIN = 0V, VOUT = 20V, IREV at OUT — 0.5 30 µA
RDS(ON) Switch On-Resistance AP22815 VIN = 5.0V , IOUT = 1 A — 40 50 mΩ
ILIMIT Overload Current Limit
(AP22815) VIN = 5V, VOUT = 4V 3.1 3.6 4.2 A
(AP22615) VIN = 5V, VOUT = 4V, RLIM = 1.94K 3.1 3.6 4.2 A
(AP22615)
VIN = 5V,
VOUT =4V RLIM = 6.8K 0.75 1 — A
ISHORT Short-Circ uit Current Limi t
Enabled, Output Short to Ground
— 1 — A
TSHORT Short-Circuit Response Time VIN = 5 V, No Load — 5 — µs
VIL EN Input Logic Low Voltage VIN = 5V — — 0.4 V
VIH EN Input Logic High Voltage VIN = 5V 1.2 — — V
ILEAK-EN E N I nput Leakage VIN = 5V, VEN = 0V and 5.5V — 1 2 µA
ILEAK-O Output Leakage Current Disabl ed, V OUT = 0V — 0.5 1 µA
TD(ON) Output Turn-On Delay Time CL = 10µF, R LOAD = 10Ω @ VIN = 5V (Figure 1) — 2.2 — ms
TR Output Turn-On Rise Time CL = 10µF, RLOAD = 10 Ω @ VIN = 5V (Figure 1) 1.0 1.9 3.5 ms
TD(OFF) Output Turn-Off Delay Time CL = 10µF, RLOAD = 10Ω @ VIN = 5V (Figure 1) — 0.02 — ms
TF
Output Turn-Off Fall Time
CL = 10µF, RLOAD = 10Ω @ VIN = 5V (Figure 1)
—
0.2
—
ms
RFLG FLG Output FET On-Resistance IFLG = 10mA — 40 60 Ω
IFOH FLG Off Current VFLG = 5V — 0.01 1 µA
TBlank FLG Blanking Time
Assertion or Deassertion due to Overvoltage, Overcurrent,
and Overtemperat ure Condition 2 7 20 ms
RDIS Discharge Resistance VIN = 5V, Disabled, VOUT = 1V — 100 — Ω
TSHDN Thermal Shutdown Threshold
Enabled
— 140 — °C
THYS Thermal Shutdown Hysteresis
—
— 35 — °C
VOV_TRIP
Output OVP Lockout VOUT Risi ng Threshol d 5.5 5.7 5.9 V
VOUT Falling Threshold — 5.6 — V
OUTHYS O ut put OVP Hysteresis — — 0.1 — V
TOVP OVP Response Time IOUT=0.5A, CL =1µF, VOUT from 5.5V t o 6V — 1 — µs
VRVP
Reverse-Voltage Comparator Trip
Point VOUT - VIN — 65 — mV
AP22815 / AP22615
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AP22815 / AP22615
Typical Perform ance C h aract eristics
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50%50%
TR
10%
90%
TF
VEN
90%
VOUT
TD(ON)
10%
TD(OFF)
50%50%
TR
10%
90%
TF
Figure 1 Voltage Waveforms
AP22815 / AP22615
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AP22815 / AP22615
Typi cal Perfo rmance Char act eristics (cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Turn-on Time vs. Input Voltage Turn-off Time vs. Input Voltage
Rise Time vs. Input Voltage Fall Time vs. Input Voltage
0
1
2
3
4
5
3.0 3.5 4.0 4.5 5.0 5.5
Turn-on Time(ms)
Input Volta g e(V)
CL=10µF
RLOAD=10Ω
0
10
20
30
40
50
3.0 3.5 4.0 4.5 5.0 5.5
Turn-off Time(μs)
Input Volta g e(V)
CL=10µF
R
LOAD
=10Ω
0
1
2
3
4
5
3.0 3.5 4.0 4.5 5.0 5.5
Rise Tim e(m s)
Input Volta g e(V)
CL=10µF
RLOAD=10Ω
0.0
0.1
0.2
0.3
0.4
0.5
3.0 3.5 4.0 4.5 5.0 5.5
Fall T ime( ms)
Input Volta g e(V)
CL=10µF
RLOAD=10Ω
AP22815 / AP22615
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AP22815 / AP22615
Typi cal Perfo rmance Char act eristics (cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Input Quiescent Current vs. Temperature Input Shutdown Curren t vs. Temperature
RDS(ON) vs. Output Cur rent RDS(ON) vs. Temperature
0
100
200
300
400
500
600
-40 -15 10 35 60 85
Input Quiescent Current (μA)
Temperature(°C)
V
IN
=5V
Enabled
OUT=open
0.0
0.2
0.4
0.6
0.8
1.0
-40 -15 10 35 60 85
Input Shutdown Current (μA)
Temperature(°C)
VIN=5V
Disabled
OUT=open
0
10
20
30
40
50
60
70
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0
RDS(ON) (mΩ)
Output Curren t(A)
VIN=5V
0
10
20
30
40
50
60
70
80
-40 -15 10 35 60 85
RDS(ON) (mΩ)
Temperature(°C)
VIN=5V
I
OUT
=1A
AP22815 / AP22615
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AP22815 / AP22615
Typi cal Perfo rmance Char act eristics (cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Input Leakage Current vs. Temperature Under Voltage Lockout vs. Temperature
Short-Circuit Output Current vs. Temperature Reverse-Voltage Comparator Trip vs. Temperature
0.0
0.2
0.4
0.6
0.8
1.0
-40 -15 10 35 60 85
Input Leakage Current (μA)
Temperature(°C)
VIN=5V
Disabled
OUT grounded
2.0
2.2
2.4
2.6
2.8
3.0
-40 -15 10 35 60 85
Undervoltage Lockout(V)
Temperature(
℃
)
UVLO F alling
UVLO R is ing
0.0
0.5
1.0
1.5
2.0
-40 -15 10 35 60 85
Short-Circuit Current Limit (A)
Temperature(°C)
VIN=5V, Enabled
Output short to gr ound
0
20
40
60
80
100
-40 -15 10 35 60 85
Reverse-Voltage Comparator Trip (mV)
Temperature(°C)
V
OUT
- V
IN
AP22815 / AP22615
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AP22815 / AP22615
Typi cal Perfo rmance Char act eristics (cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Reverse Leakage Current vs. Temperature Reverse Leakage Current vs. Temperature
RLIMIT vs. Over Load Current Limit Over Load C u rrent Limit vs. Temperature
0
10
20
30
40
50
-40 -15 10 35 60 85
Reverse Leakage Current ( nA)
Temperature(°C)
VIN=0V
Disabled
VOUT=5V
I
REV
at OUT
0.0
0.2
0.4
0.6
0.8
1.0
-40 -15 10 35 60 85
Reverse Leakage Current ( μA)
Temperature(°C)
VIN=0V
Disabled
VOUT=20V
I
REV
at OUT
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0246810 12 14 16 18
Over Load Current Limit (A)
RLIMIT (kΩ)
AP22615
VIN=5V, VOUT=4V
1
2
3
4
5
6
-40 -15 10 35 60 85
Over Load Current Limit (A)
Temperature(
℃
)
AP22815
VIN=5V, VOUT=4V
AP22815 / AP22615
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AP22815 / AP22615
Typi cal Perfo rmance Char act eristics (cont.) (TA = +25°C, VIN = 5V, CIN = 1μF, CL = 0.1μF, unless otherwise specified.)
Device Enabled Into Short-Circuit Inrush Current
EN
5V/div
I
OUT
1A/div
V
IN
=5V
OUT grounded
1ms/div
I
IN
1A/div
1ms/div
CL=1μF
CL=100μF
CL=220μF
EN
5V/div
V
IN
=5V
RLOAD=1.66Ω
CL=470μF
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 11 of 17
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AP22815 / AP22615
Appli cation Information
Input and Output Capacitors
It is required to place a 1μF X7R or X5R ceramic bypass capacitor between IN and GND—close to the devic e. It is recommended to place a high-
value capacitor (10μF or 47μF) close to input pin when the output transient load is heavy. This precaution reduces power-supply transients t hat can
cause ringing on the input.
Connecting a minimum 100μF low ESR electrolytic or tantalum capacitor (or 22μF MLCC) between OUT and GND is also required for hot-plug
applications, which is required to bypass the output with a 0.1μF ceramic capacitor that improves the immunity of the device to short-circuit
transients. The bulky 100μF or larger capacitors help reduce output droop voltage when a device is plugged in. When abnormal short-circuit
conditi on happens, these capac itors can also reduc e output negative voltage due to parasitic i nductive effect and avoid device damage.
Note that without the bypass capacitors, an output short can cause ringing on the input. If the voltage is over the maximum voltage rating, it will
destroy the internal cont rol circuitry even t he durat i on is short.
FLG Response
When an overcurrent, overtemperature, or out overvoltage shutdown condition is encountered, the FLG open-drain output goes active low after a
nominal 7ms deglitch timeout. The FLG output remains low until both overcurrent and overtemperature or out overvoltage conditions are removed.
Connecting a heavy capacit ive load to the output of the device can cause a momentary overcurrent condition, which does not tr igger the FLG due
to the 7ms deglitch timeout. The AP22815/AP22615 is designed to eliminate false overcurrent reporting without the requirement of external
components to remove unwanted pulses.
When Vin operates below 4V, the lower Vin voltage results in hi gher equivalent Ron and can pot ential l y cause the FLG signal to be triggered at a
higher output current.
Overcurrent and Short-Circuit Protection
An internal-sensing FET is employed to check for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistanc e of the c urrent path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload condit ions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP22815/AP22615 senses t he short -circuit and immediately clam ps output current to a certain saf e level.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher c urrent can
flow for a very short period of time before the current limit function can react. After the current limit function has tripped, the device switches into
current limiting mode, and the current is clamped at ILIMIT or ISHORT.
In the third condition, t he load is gradually increased beyond the recommended operating current. The current is permitt ed to rise until the current-
limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP22815/AP22615 i s capable of delivering current up to the
current-limit threshold without damaging the device. Once the threshold is reached, the device switches into its current limiting mode and is set at
ILIMIT.
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP22815/AP22615 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excess i ve power dis si pat i on i n an overcurrent or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to c ool down approximat ely +35°C before the switch turns back on. The switch continues to cycle in this manner unt il the load fault or input
power is removed. The FLG open-drain output is asserted when an overtemperature shutdown or overcurrent occurs with 7ms deglitch.
When Vin operates below 4V, the lower Vin voltage results i n hi gher equivalent Ron and might potentially cause the chip to enter thermal cycling
conditi on by higher output current.
AP22815 / AP22615
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AP22815 / AP22615
Appli cation Information (continued)
ON/OFF Input Operator
The EN input al lows the output current to be s witched on and off using a GPI O compatible input. The high signal (switch on) must be at least 1.2V
and the low signal (switch off) no higher than 0.4V. This pin should not be left fl oating. It is advisable to hold the EN signal low when applying or
removing power.
Undervoltage Loc kout (UVLO)
Undervoltage lock out functi on (UVLO) keeps t he internal power switc h from being turned on until the power supply has reac hed at least 2.5V, even
if the switc h is enabl ed. Whenever t he i nput voltage falls bel ow approximately 2.3V, the power switch is quickly turned off. This fac ilitates the design
of hot-inserti on systems where it is not possible to turn off the power switch before input power is remov ed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implement ation is activated and offers a resistive discharge path for the external storage c apacitor. This is designed for discharging any residue of
the output voltage when either no external output res istance or load resistance is present at the output.
Output Reverse-Voltage/Current Protection
The output reverse-voltage protection turns off the MOSFET switch whenever the output voltage is higher than the input voltage by 65mV, and the
MOSFET switch turns on when output reverse-voltage conditions is removed. When reverse-voltage is lower than 65mV, the reverse current is
regulated at approximately 350mA. When the reverse current continuously increases and the reverse voltage is larger than 65mV, the reverse-
voltage protecti on is triggered.
Fast Role-Swap Function
The AP22615 & AP22815 integrate the fast rol e-s wap functi on, which makes Vout recovery to 4.75V within 150μs during Vout drops from high
voltage to low. When EN is high, Vin is valid, and Vout is higher than Vin by 65 mV, the device works at reverse block m ode, power FET is off and
standby for FRS. Once Vout drops lower than Vin, power FET is turned on in 150μs.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and RDS(ON), the power dissipat i on can be calculated by:
PD = RDS(ON) × I2
Finally, calculate the junction temperature: TJ = PD × RϴJA + TA
Where:
• TA = Ambient temperature °C
• RϴJA = Thermal resistance
• PD = Total power dissipation
Board Layout Instruction
Placing input and output capacitors, 1μF and 0.1μF+100μF respectively, close and next to the device pins must be implemented to minimize the
effects of parasi tic inductance. For best performance, all trace lengths must be kept as short as possible. The i nput and output P CB traces must be
as wide as possible. Use a ground plane to enhance the power dissipation capability of the device.
AP22815 / AP22615
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AP22815 / AP22615
Ordering Information
AP22615X XX-X
PackingPackage
WT: TSOT25
WU: TSOT26 -7 : Tape & Reel
Enable
A : Active High
B : Active Low
AP22815X XX-X
Part Number Package Code Packaging
7” Tape and Reel
Quantity
Part Number Suffix
AP22815A
WT
TSOT25
3000/Tape & Reel
-7
AP22815B
WT
TSOT25
3000/Tape & Reel
-7
AP22615A
WU
TSOT26
3000/Tape & Reel
-7
AP22615B
WU
TSOT26
3000/Tape & Reel
-7
Marking Information
(1) TSOT25
1 2 3
5
7
4
XX Y W X
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Green
( Top View )
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
(2) TSOT26
123
6
7
4
XX YW X
XX : Identification code
W : Week : A~Z : 1~26 week;
X : A~Z : Green
( Top View )
Y : Year 0~9
a~z : 27~52 week; z represents
52 and 53 week
5
Part Number
Package Type
Identification Code
AP22815AWT-7
TSOT25
P5
AP22815BWT-7 TSOT25 P6
Part Number
Package Type
Identification Code
AP22615AWU-7
TSOT26
P7
AP22615BWU-7
TSOT26
P8
AP22815 / AP22615
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AP22815 / AP22615
Package Ou t lin e Dim en sio ns (All dimensions in mm.)
Please see http://www.diodes.com/package-outlines.html for the latest version.
(1) TSOT25
TSOT25
Dim
Min
Max
Typ
A
—
1.00
—
A1
0.01
0.10
—
A2
0.84
0.90
—
b
0.30
0.45
—
c
0.12
0.20
—
D
—
—
2.90
E
—
—
2.80
E1
—
—
1.60
e
0.95 BSC
e1
1.90 BSC
L
0.30
0.50
—
L2
0.25 BSC
θ
0°
8°
4°
θ1
4°
12°
—
All Dimensions in mm
(2) TSOT26
TSOT26
Dim
Min
Max
Typ
A
—
1.00
—
A1
0.010
0.100
—
A2
0.840
0.900
—
D
2.800
3.000
2.900
E
2.800 BSC
E1
1.500
1.700
1.600
b
0.300
0.450
—
c
0.120
0.200
—
e
0.950 BSC
e1
1.900 BSC
L
0.30
0.50
—
L2
0.250 BSC
θ
0°
8°
4°
θ1
4°
12°
—
All Dimensions in mm
D
E1
E1/2
e1
E
E/2
e
A
A2
A1
Seating Plane
0
L2
L
Gauge Plane
01( 4x)
01( 4x)
c
b
Seating Plane
D
E1
E1/2
e1
E
E/2
e
A
A2
A1
Seating Plane
0
L2
L
Gauge Plane
01( 4x)
01( 4x)
c
b
Seating Plane
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 15 of 17
www.diodes.com December 2018
© Diodes Incorporated
AP22815 / AP22615
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
(1) TSOT25
Dimensions
Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
(2) TSOT26
Dimensions
Value (in mm)
C
0.950
X
0.700
Y
1.000
Y1
3.199
Y1
C
X
Y
Y1
C
X
Y
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 16 of 17
www.diodes.com December 2018
© Diodes Incorporated
AP22815 / AP22615
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAW S OF ANY JURISDICT ION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark ri ghts, nor the rights of others. Any Customer or user of this document or products descri bed herein in such applic ations shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harml ess against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporat ed products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirect l y, any claim of personal injury or death associat ed with such unintended or unauthorized appl i cat i on.
Products desc ribed herein may be covered by one or more United S tates, international or f oreign patents pending. Product names an d ma rkings
noted herein may also be covered by one or more United States, international or f orei gn trademarks.
This document is written in English but may be translated into multiple languages f or reference. Only the English version of this document is the
final and determinative f orm at released by Diodes I ncorporat ed.
LIFE SU PP O R T
Diodes Inc orporated products are s pecifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Off icer of Diodes I ncorporat ed. As us ed herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perf orm when properly used in accordance with inst ruct i ons for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectivenes s.
Customers repres ent that they have all necessary expertise i n the safety and regulatory ramif ications of their life support devices or syste m s, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safet y-related requi rements concerni ng their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representati ves against any dam ages arising out of the use of Diodes Incorporat ed products i n such safety-cri tical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
www.diodes.com
AP22815 / AP22615
Document number: DS41022 Rev. 4 - 2 17 of 17
www.diodes.com December 2018
© Diodes Incorporated