CM1457-06CP - ON Semiconductor

April, 2011 − Rev. 5

1Publication Order Number:

CM1457/D

CM1457

Praetorian lll) 4-, 6-,

8-Channel EMI Filter Array

with ESD Protection

Description

The CM1457 is an inductor-based (L-C) EMI filter array with ESD

protection, which integrates four, six, or eight filters in a CSP form

factor with 0.40 mm pitch. Each EMI filter channel of the CM1457 is

implemented with the component value of 6 pF − 35 nH – 4.7 pF −

35 nH – 1.8 pF. The cut-off frequency at −3 dB attenuation is

300 MHz and can be used in applications where the data rates are as

high as 160 Mbps, while providing greater than −35 dB attenuation

over the 800 MHz to 2.7 GHz frequency range. The parts include ESD

diodes on every I/O pin and provide a high level of protection against

electrostatic discharge (ESD). The ESD protection diodes connected

to the external filter ports are designed and characterized to safely

dissipate ESD strikes of ±15 kV, which is beyond the maximum

requirement of the IEC61000−4−2 international standard.

This device is particularly well suited for wireless handsets, mobile

LCD modules and PDAs because of its small package format and

easy-to-use pin assignments. In particular, the CM1457 is ideal for

EMI filtering and protecting data and control lines for the LCD display

and camera interface in mobile handsets.

The CM1457 incorporates OptiGuardt which results in improved

reliability at assembly. It is manufactured with a 0.40 mm pitch and

0.25 mm CSP solder ball to provide up to 28% board space savings vs.

competing CSP devices with 0.50 mm pitch and 0.30 mm CSP solder

ball.

Features

•Four, Six or Eight Channels of EMI Filtering

•±15 kV ESD Protection (IEC 61000−4−2, Contact Discharge) at

External Pins

•Greater than −40 dB of Attenuation at 1 GHz

MIL−STD−883 International ESD Standard

•Chip Scale Package (CSP) with 0.40 mm Pitch and 0.25 mm CSP

Solder Ball which Features Extremely Low Parasitic Inductance

for Optimum Filter and ESD Performance

•OptiGuardtCoating for Improved Reliability at Assembly

•These Devices are Pb−Free and are RoHS Compliant

Applications

•LCD and Camera Data Lines in Mobile Handsets

•I/O Port Protection for Mobile Handsets, Notebook Computers,

PDAs, etc.

•EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook

Computers

•Wireless Handsets

•Handheld PCs/PDAs

•LCD and Camera Modules

MARKING DIAGRAM

Device Package Shipping†

ORDERING INFORMATION

http://onsemi.com

CM1457−04CP CSP−10

(Pb−Free)

3500/Tape & Reel

N57 = CM1457−04CP

N57 = CM1457−06CP

N57 = CM1457−08CP

w/yww/yyww = date code

N57 yww

CM1457−06CP CSP−15

(Pb−Free)

3500/Tape & Reel

CM1457−06

15−Bump CSP

N57 yyww

CM1457−08

20−Bump CSP

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

WLCSP15

CP SUFFIX

CASE 567BR

WLCSP20

CP SUFFIX

CASE 567BV

BLOCK DIAGRAM

6 pF

35 nH

Cn*

(External

Pins)

An*

(Internal

Pins)

GND

(Pins

B1−B4)

CM1457−08CP CSP−20

(Pb−Free)

3500/Tape & Reel

N57 w

CM1457−04

10−Bump CSP

WLCSP10

CP SUFFIX

CASE 567BJ

1.8 pF

4.7 pF

35 nH

CM1457

http://onsemi.com

PACKAGE / PINOUT DIAGRAMS

Bottom View

(Bumps Up View)

Top View

(Bumps Down View)

CM1457−08CP

20−Bump CSP

C1 C2

A1 A2

C3 C4

A3 A4

Orientation

Marking

Orientation

Marking +

123 56748

C5 C6

A5 A6

C7 C8

A7 A8

CM1457−06CP

15−Bump CSP

C1 C2

A1 A2

C3 C4

A3 A4

Orientation

Marking

Orientation

Marking +

123 564

C5 C6

A5 A6

CM1457−04CP

10−Bump CSP

C1 C2

A1 A2

C3 C4

A3 A4

Orientation

Marking

A+

1234

Orientation

Marking

Table 1. PIN DESCRIPTIONS

Pin Number

Pin Description

Pin Number

Pin Description

−04 −06 −08 −04 −06 −08

A1 A1 A1 Filter #1 (Internal) C1 C1 C1 Filter #1 (External)

A2 A2 A2 Filter #2 (Internal) C2 C2 C2 Filter #2 (External)

A3 A3 A3 Filter #3 (Internal) C3 C3 C3 Filter #3 (External)

A4 A4 A4 Filter #4 (Internal) C4 C4 C4 Filter #4 (External)

−A5 A5 Filter #5 (Internal) −C5 C5 Filter #5 (External)

−A6 A6 Filter #6 (Internal) −C6 C6 Filter #6 (External)

− − A7 Filter #7 (Internal) − − C7 Filter #7 (External)

− − A8 Filter #8 (Internal) − − C8 Filter #8 (External)

B1, B2 B1−B3 B1−B4 GND

CM1457

http://onsemi.com

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

DC current per Inductor 15 mA

DC Package Power Rating 0.5 W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range −40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Typ Max Units

LTOT Total Channel Inductance 70 nH

RTOT Total Channel DC Resistance 45 W

CTOT_0V Total Channel Capacitance, 0 V bias 0 V dc; 1 MHz, 30 mV rms 20 24 pF

CTOT_2.5V Total Channel Capacitance, 2.5 V bias 2.5 V dc; 1 MHz,

30 mV rms

12.5 pF

VST Stand−off Voltage I = 10 mA5.5 V

ILEAK Diode Leakage Current VIN = +3.3 V 0.1 0.5 mA

VSIG Signal Clamp Voltage

Positive Clamp

Negative Clamp

ILOAD = 10 mA

ILOAD = −10 mA

5.6

−1.5

6.8

−0.8

9.0

−0.4

VESD In−system ESD Withstand Voltage

a) Contact Discharge per IEC 61000−4−2 standard,

Level 4 (External Pins)

b) Contact Discharge per IEC 61000−4−2 standard,

Level 4 (Internal Pins)

(Notes 2 and 3)

±15

±2

fCCut−off Frequency

ZSOURCE = 50 W, ZLOAD = 50 W300

MHz

1. TA = 25°C unless otherwise specified.

2. ESD applied to input and output pins with respect to GND, one at a time.

3. Unused pins are left open.

APPLICATION INFORMATION

Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by

ON Semiconductor.

CM1457

http://onsemi.com

PERFORMANCE INFORMATION

FREQUENCY (MHz)

INSERTION LOSS

3 10 100 1000 2000 6000

0dB

−10 dB

−20 dB

−30 dB

−40 dB

−50 dB

Figure 1. Insertion Loss vs. Frequency (0 V Bias)

FREQUENCY (MHz)

INSERTION LOSS

310 100 1000 2000 6000

0dB

−10 dB

−20 dB

−30 dB

−40 dB

−50 dB

Figure 2. Insertion Loss vs. Frequency (2.5 V Bias)

CM1457

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PACKAGE DIMENSIONS

WLCSP10, 1.67x1.05

CASE 567BJ−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X DIM

MIN MAX

0.54

MILLIMETERS

D1.67 BSC

b0.24 0.29

eD 0.400 BSC

0.69

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

10X b

123

0.05 C

0.17 0.24

1.05 BSC

eE 0.347 BSC

PITCH

0.25

10X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.35

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.42 REF

RECOMMENDED

A1 PACKAGE

OUTLINE

0.35

456

eD/2

ÉÉÉÉ

OptiGuard Option

CM1457

http://onsemi.com

PACKAGE DIMENSIONS

WLCSP15, 2.47x1.05

CASE 567BR−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X DIM

MIN MAX

0.54

MILLIMETERS

D2.47 BSC

b0.24 0.29

eD 0.400 BSC

0.69

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

15X b

123

0.05 C

0.17 0.24

1.05 BSC

eE 0.347 BSC

PITCH

0.25

15X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.35

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.42 REF

RECOMMENDED

A1 PACKAGE

OUTLINE

0.35

456 789

eD/2

ÉÉÉÉÉÉ

OptiGuard Option

CM1457

http://onsemi.com

PACKAGE DIMENSIONS

WLCSP20, 3.27x1.05

CASE 567BV−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X DIM

MIN MAX

0.54

MILLIMETERS

D3.27 BSC

b0.24 0.29

eD 0.400 BSC

0.69

ÈÈ

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

20X b

123

0.05 C

0.17 0.24

1.05 BSC

eE 0.347 BSC

PITCH

0.25

20X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.40

0.35

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.42 REF

RECOMMENDED

A1 PACKAGE

OUTLINE

0.35

456 789 101112

eD/2

ÉÉÉÉÉÉÉÉ

OptiGuard Option

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

CM1457/D

OptiGuardt is a trademark of Semiconductor Components Industries, LLC.

Praetorian lll® is a registered trademark of Semiconductor Components Industries, LLC.

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