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Page <1> V1.025/02/13
Surface Mount Zener Diode
Maximum Ratings:
Ratings at 25°C unless otherwise specied.
Features:
Planar Die Construction
500mW Power Dissipation On Ceramic PCB
General Purpose, Medium Current
Ideally Suited For Automated Assembly Processes
Applications:
Zener diode
Ultra-small surface mount package
SOD-123
Characteristic Symbol Value Unit
Forward voltage at IF=10mA VF0.9 V
Power dissipation Pd500 mW
Thermal resistance, junction to ambient air RθjA 305 °C/W
Junction and storage temperature range Tj, Tstg -65 to +150 °C
Note :
Device mounted on ceramic PCB 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2.
Short duration test pulse used to minimize self-heating effect.
When provided, otherwise, parts are provided with date code only, and type number identications appears on reel only.
f = 1kHz.
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Surface Mount Zener Diode
Typical Characteristics:
Ta = 25°C unless otherwise specied.
Part
Number
Marking
Code
Zener Voltage Range Max. Zener
Impedance
Max.
Reverse
Current
Temperature
Coefcient of
zener voltage
@ IZTC mV/°C
Test
Current
IZTC
VZ@IZT IZT ZZT@IZT ZZK@IZK IZK IR@VR
Nom.(V) Min.(V) Max.(V) mA mA μA VMin. Max. mA
BZT52C5
V1-7-F W8 5.1 4.8 5.4 5 60 480 1 2 2 -2.7 1.2 5
Electrical Characteristics:
Ratings at 25°C unless otherwise specied.
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Page <3> V1.025/02/13
Surface Mount Zener Diode
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Page <4> V1.025/02/13
Surface Mount Zener Diode
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
Part Number Table
Description Part Number
Surface Mount Zener Diode BZT52C5V1-7-F
Soldering Footprint:
Package Information:
Device Package Shipping
BZT52C5V1-7-F SOD-123 3,000 / Tape & Reel
Dimensions : Millimetres
Package Outline:
Plastic surface mounted package
SOD-123
Dim. Min. Max.
A 1.4 1.8
B 2.55 2.85
C1.15 Typ.
D 0.5 0.6
E 0.3 0.4
H 0.02 0.1
J0.1 Typ.
K 3.55 3.85
Dimensions : Millimetres