R09DS0019EJ0300 Rev.3.00 Page 1 of 8
May 19, 2011
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Data Sheet
μ
PG2163T5N
GaAs Integrated Circuit
Broadband SPDT Switch for Dual-Band Wireless LAN
DESCRIPTION
The
μ
PG2163T5N is GaAs MMIC SPDT (Single Pole Double Throw) switch which was developed for 2.4 GHz and 6
GHz dual-band wireless LAN. This device can operate at frequencies from 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz,
with low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to
high-density surface mounting.
FEATURES
Operating frequency : f = 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz
Switch control voltage : Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.)
: Vcont (L) = 0.3 to 0.3 V (0 V TYP.)
Low insertion loss : Lins1 = 0.40 dB TYP. @ f = 2.4 to 2.5 GHz
: Lins2 = 0.50 dB TYP. @ f = 4.9 to 6.0 GHz
: Lins3 = 0.90 dB TYP. @ f = 8.0 GHz
: Lins4 = 0.50 dB TYP. @ f = 0.5 to 2.5 GHz
High isolation : ISL1 = 38 dB TYP. @ f = 2.4 to 2.5 GHz
: ISL2 = 30 dB TYP. @ f = 4.9 to 6.0 GHz
: ISL3 = 23 dB TYP. @ f = 8.0 GHz
: ISL4 = 43 dB TYP. @ f = 0.5 to 1.0 GHz
: ISL5 = 38 dB TYP. @ f = 1.0 to 2.5 GHz
Handling power : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)
APPLICATIONS
Dual-band wireless LAN (IEEE802.11a/b/g/n), etc.
ORDERING INFORMATION
Part Number Order Number Package Marking Supplying Form
μ
PG2163T5N-E2
μ
PG2163T5N-E2-A 6-pin plastic TSON
(Pb-Free)
G4X Embossed tape 8 mm wide
Pin 1, 6 face the perforation side of the tape
Qty 3 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order:
μ
PG2163T5N-A
CAUTION
Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this
device. This device must be protected at all times from ESD. Static charges may easily produce potentials of
several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard
ESD precautions must be employed at all times.
R09DS0019EJ0300
Rev.3.00
May 19, 2011
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PG2163T5N
R09DS0019EJ0300 Rev.3.00 Page 2 of 8
May 19, 2011
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name
1 GND
2 Vcont2
3 OUT2 (RX)
4 OUT1 (TX)
5 Vcont1
(Top View)(Top View)
6
5
4
1
2
3
G4X
1
2
3
6
5
4
(Bottom View)
1
2
3
6
5
4
6 IN (ANT)
Remark Exposed pad : GND
TRUTH TABLE
Vcont1 Vcont2 IN (ANT)OUT1 (TX) IN (ANT)OUT2 (RX)
High Low OFF ON
Low High ON OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter Symbol Ratings Unit
Switch Control Voltage Vcont 6.0 to +6.0 V
Input Power Pin +32 dBm
Operating Ambient Temperature TA 45 to +85 °C
Storage Temperature Tstg 55 to +135 °C
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter Symbol MIN. TYP. MAX. Unit
Switch Control Voltage (H) Vcont (H) 2.8 3.0 5.0 V
Switch Control Voltage (L) Vcont (L) 0.3 0 0.3 V
Operating Frequency 1 Note 1 f1 2.4
2.5 GHz
Operating Frequency 2 Note 1 f2 4.9
6.0 GHz
Operating Frequency 3 Note 2 f3
8.0 GHz
Operating Frequency 4 Note 3 f4 0.5
1.0 GHz
Operating Frequency 5 Note 3 f5 1.0
2.4 GHz
Notes 1. DC blocking capacitors = 4 pF
2. DC blocking capacitors = 2 pF
3. DC blocking capacitors = 100 pF
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R09DS0019EJ0300 Rev.3.00 Page 3 of 8
May 19, 2011
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF,
unless otherwise specified)
Parameter Symbol Test Conditions MIN. TYP. MAX. Unit
Insertion Loss 1 Lins1 f = 2.4 to 2.5 GHz 0.40 0.60 dB
Insertion Loss 2 Lins2 f = 4.9 to 6.0 GHz 0.50 0.80 dB
Insertion Loss 3 Lins3 f = 8.0 GHz Note 1 0.90 dB
Insertion Loss 4 Lins4 f = 0.5 to 2.5 GHz Note 2 0.50 dB
Isolation 1 ISL1 f = 2.4 to 2.5 GHz 35 38 dB
Isolation 2 ISL2 f = 4.9 to 6.0 GHz 27 30 dB
Isolation 3 ISL3 f = 8.0 GHz Note 1 23 dB
Isolation 4 ISL4 f = 0.5 to 1.0 GHz Note 2 40 43
dB
Isolation 5 ISL5 f = 1.0 to 2.5 GHz Note 2 35 38
dB
Input Return Loss 1 RLin1 f = 2.4 to 2.5 GHz 15 dB
Input Return Loss 2 RLin2 f = 4.9 to 6.0 GHz 15 dB
Input Return Loss 3 RLin3 f = 8.0 GHz Note 1 15 dB
Input Return Loss 4 RLin4 f = 0.5 to 2.5 GHz Note 2 20 dB
Output Return Loss 1 RLout1 f = 2.4 to 2.5 GHz 15 dB
Output Return Loss 2 RLout2 f = 4.9 to 6.0 GHz 15 dB
Output Return Loss 3 RLout3 f = 8.0 GHz Note 1 15 dB
Output Return Loss 4 RLout4 f = 0.5 to 2.5 GHz Note 2 20 dB
1 dB Loss Compression
Input Power 1 Note 3
Pin (1 dB) 1 f = 2.4 to 2.5 GHz +31.0 dBm
1 dB Loss Compression
Input Power 2 Note 3
Pin (1 dB) 2 f = 4.9 to 6.0 GHz +29.0 dBm
Input 3rd Order Intercept Point IIP3 +55 dBm
Switch Control Current Icont 0.1 1.0
μ
A
Switch Control Speed tSW 50% CTL to 90/10% 50 ns
Notes 1. DC blocking capacitors = 2 pF
2. DC blocking capacitors = 100 pF
3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
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R09DS0019EJ0300 Rev.3.00 Page 4 of 8
May 19, 2011
EVALUATION CIRCUIT
V
cont
2
OUT1 (TX)
6
5
4
1
2
3
OUT2 (RX)
V
cont
1
1 000 pF
IN (ANT)
1 000 pF
4 pF
C1
C1
Remark C1: 2.4 to 2.5 GHz and 4.9 to 6.0 GHz 4 pF
8.0 GHz 2 pF
0.5 to 2.5 GHz 100 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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R09DS0019EJ0300 Rev.3.00 Page 5 of 8
May 19, 2011
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
0.3 0.5 0.3
0.2
0.3
0.5
0.5
MOUNTING PAD
0.3
1.0
SOLDER MASK
0.475 0.25 0.475
0.15
0.25
0.5
0.5
0.35
0.55
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
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PG2163T5N
R09DS0019EJ0300 Rev.3.00 Page 6 of 8
May 19, 2011
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
0.5±0.06
0.2±0.1 0.7±0.1
(Bottom View)
(Top View)
1.5±0.1
1.5±0.1
0.37+0.03
–0.05
0.2+0.07
–0.05
0.3±0.07
(Side View)
1.2±0.1
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R09DS0019EJ0300 Rev.3.00 Page 7 of 8
May 19, 2011
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your nearby sales office.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reflow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Partial Heating Peak temperature (terminal temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
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PG2163T5N
R09DS0019EJ0300 Rev.3.00 Page 8 of 8
May 19, 2011
Caution GaAs Products This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
Do not burn, destroy, cut, crush, or chemically dissolve the product.
Do not lick the product or in any way allow it to enter the mouth.
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All trademarks and registered trademarks are the property of their respective owners.
C - 1
Revision History
μ
PG2163T5N Data Sheet
Description
Rev. Date Page Summary
Feb 2008 Previous No. :PG10626EJ02V0DS
3.00 May 19, 2011 Throughout Modification of operating frequencies
f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz -> f = 0.5 to 2.5 GHz, 4.9 to 6.0 GHz and 8.0 GHz
p.1 Modification of APPLICATIONS
p.7 Modification of RECOMMENDED SOLDERING CONDITIONS
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NOTICE
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and
application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. California
Eastern Laboratories and Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits,
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incurred by you resulting from errors in or omissions from the information included herein.
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