DATA SH EET
Preliminary specification
Supersedes data of 2002 Sep 13 2003 Nov 06
INTEGRATED CIRCUITS
TEA5768HL
Low-power FM stereo radio for
handheld applications
2003 Nov 06 2
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
CONTENTS
1 FEATURES
2 GENERAL DESCRIPTION
3 ORDERING INFORMATION
4 QUICK REFERENCE DATA
5 BLOCK DIAGRAM
6 PINNING
7 FUNCTIONAL DESCRIPTION
7.1 Low-noise RF amplifier
7.2 FM mixer
7.3 VCO
7.4 Crystal oscillator
7.5 PLL tuning system
7.6 RF AGC
7.7 IF filter
7.8 FM demodulator
7.9 Level voltage generator and analog-to-digital
converter
7.10 IF counter
7.11 Soft mute
7.12 MPX decoder
7.13 Signal dependent mono to stereo blend
7.14 Signal dependent AF response
7.15 Software programmable ports
8I
2
C-BUS AND BUS-CONTROLLED
FUNCTIONS
8.1 I2C-bus specification
8.1.1 Data transfer
8.1.2 Power-on reset
8.2 I2C-bus protocol
8.3 Writing data
8.4 Reading data
8.5 Bus timing
9 LIMITING VALUES
10 THERMAL CHARACTERISTICS
11 DC CHARACTERISTICS
12 AC CHARACTERISTICS
13 INTERNAL PIN CONFIGURATION
14 APPLICATION INFORMATION
15 PACKAGE OUTLINE
16 SOLDERING
16.1 Introduction to soldering surface mount
packages
16.2 Reflow soldering
16.3 Wave soldering
16.4 Manual soldering
16.5 Suitability of surface mount IC packages for
wave and reflow soldering methods
17 DATA SHEET STATUS
18 DEFINITIONS
19 DISCLAIMERS
20 PURCHASE OF PHILIPS I2C COMPONENTS
2003 Nov 06 3
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
1 FEATURES
•High sensitivity due to integrated low-noise RF input
amplifier
•FM mixer for conversion to IF of the US/Europe
(87.5 to 108 MHz) and Japanese (76 to 91MHz)
FM band
•Preset tuning to receive Japanese TV audio up to
108 MHz
•RF Automatic Gain Control (AGC) circuit
•LC tuner oscillator operating with low cost fixed chip
inductors
•FM IF selectivity performed internally
•No external discriminator needed due to fully integrated
FM demodulator
•Crystal reference frequency oscillator; the oscillator
operates with a 32.768 kHz clock crystal or with a
13 MHz crystal and with an externally applied 6.5 MHz
reference frequency
•PLL synthesizer tuning system
•I2C-bus
•7-bit IF counter output via the I2C-bus
•4-bit level information output via the I2C-bus
•Soft mute
•Signal dependent mono to stereo blend [Stereo Noise
Cancelling (SNC)]
•Signal dependent High Cut Control (HCC)
•Soft mute, SNC and HCC can be switched off via the
I2C-bus
•Adjustment-free stereo decoder
•Autonomous search tuning function
•Standby mode
•Two software programmable ports
•Bus enable line to switch the bus input and output lines
into 3-state mode.
2 GENERAL DESCRIPTION
The TEA5768HL is a single-chip electronically tuned FM
stereoradioforlow-voltageapplicationwithfullyintegrated
IF selectivity and demodulation. The radio is completely
adjustment-free and only requires a minimum of small and
low cost external components. The radio can be tuned to
the European, US and Japanese FM bands.
3 ORDERING INFORMATION
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TEA5768HL LQFP32 plastic low profile quad flat package; 32 leads; body 7 ×7×1.4 mm SOT358-1
2003 Nov 06 4
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
4 QUICK REFERENCE DATA
VCCA =V
CC(VCO) =V
CCD.
Note
1. LOWside andHIGH sideselectivity canbe switchedby changingthe mixerfrom HIGHside toLOW side LO injection.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VCCA analog supply voltage 2.5 3.0 5.0 V
VCC(VCO) voltage controlled oscillator
supply voltage 2.5 3.0 5.0 V
VCCD digital supply voltage 2.5 3.0 5.0 V
ICCA analog supply current operating; VCCA = 3 V 6.0 8.4 10.5 mA
standby mode; VCCA =3V −36 µA
I
CC(VCO) voltage controlled oscillator
supply current operating; VVCOTANK1 =V
VCOTANK2 = 3 V 560 750 940 µA
standby mode; VVCOTANK1 =V
VCOTANK2 =3V −12 µA
I
CCD digital supply current operating; VCCD = 3 V 2.1 3.0 3.9 mA
standby mode; VCCD =3V
bus enable line HIGH 30 56 80 µA
bus enable line LOW 11 19 26 µA
fFM(ant) FM input frequency 76 −108 MHz
Tamb ambient temperature VCCA =V
CC(VCO) =V
CCD = 2.5 to 5 V −10 −+75 °C
FM overall system parameters; see Fig.5
VRF RF sensitivity input voltage fRF = 76 to 108 MHz; ∆f = 22.5 kHz;
fmod = 1 kHz; (S+N)/N = 26 dB;
de-emphasis = 75 µs; L = R;
BAF = 300 Hz to 15 kHz
−2 3.5 µV
S−200 LOW side 200 kHz selectivity ∆f=−200 kHz; fRF = 76 to 108 MHz; note 1 32 36 −dB
S+200 HIGH side 200 kHz
selectivity ∆f = +200 kHz; fRF = 76 to 108 MHz; note 1 39 43 −dB
VAFL; VAFR left and right audio frequency
output voltage VRF = 1 mV; L = R; ∆f = 22.5 kHz;
fmod = 1 kHz; de-emphasis = 75 µs60 75 90 mV
(S+N)/N maximum signal plus
noise-to-noise ratio VRF = 1 mV; L = R; ∆f = 22.5 kHz;
fmod = 1 kHz; de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
54 60 −dB
αcs(stereo) stereo channel separation VRF = 1 mV; R = L = 0 or R = 0 and L = 1
including 9% pilot; ∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0; data byte 4 bit1=1
24 30 −dB
THD total harmonic distortion VRF = 1 mV; L = R; ∆f = 75 kHz; fmod = 1 kHz;
de-emphasis = 75 µs−0.4 1 %
2003 Nov 06 5
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
2003 Nov 06 5
Philips Semiconductors Preliminary specification
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5 BLOCK DIAGRAM
handbook, full pagewidth
MHC275
I/Q-MIXER
1st FM
IF CENTRE
FREQUENCY
ADJUST
100 pF
22 nF
VCCA
28
25
26
27
24 23 22 21 20
27 pF
L1 47 pF
22 µF
29
30
31
32
RFI1
Igain
AGND
FM antenna
VCCA
RFGND
RFI2
TAGC
LOOPSW
12
VCOTANK1 34
CPOUT VCOTANK2 VCC(VCO)
5678
DATAVCCD
DGND CLOCK
AGC
programmable divider output
reference frequency divider output
TUNING SYSTEM
4.7 nF
47 nF 47 nF 33 nF
19 18 17
LIMDEC2 LIMDEC1 TIFC Vref MPXO TMUTE VAFL VAFR
16
15
14
13
12
11
10 BUSENABLE
BUSMODE
SWPORT1
SWPORT2
XTAL1
XTAL2
PHASEFIL
PILFIL
9
SDS
33 nF
1 nF
22 nF
22 nF
Ccomp(1)
Cpull(1) 32.768 kHz
or
13 MHz
33 kΩ
10 kΩ
10 kΩ
47 nF
VCO
39 nF
10 nF
R1
4.7 Ω
100 kΩ
10 kΩ
47 Ω
VCC(VCO)
12 Ω
22 nF
D1
L3
D2
L2
22 nF
LEVEL
ADC IF
COUNTER
LIMITER DEMODULATOR
Iref
RESONANCE
AMPLIFIER
SOFTWARE
PROGRAMMABLE
PORT
MUX
I2C-BUS
VCCD
GAIN
STABILIZATION POWER
SUPPLY
SOFT
MUTE
MPX
DECODER
CRYSTAL
OSCILLATOR
TEA5768HL
VCCA
2
N1
pilot
mono
Fig.1 Block diagram.
The component list is given Chapter 14.
(1) Ccomp and Cpull data depends on crystal specification.
2003 Nov 06 6
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
6 PINNING
SYMBOL PIN DESCRIPTION
CPOUT 1 charge pump output of synthesizer PLL
VCOTANK1 2 voltage controlled oscillator tuned circuit output 1
VCOTANK2 3 voltage controlled oscillator tuned circuit output 2
VCC(VCO) 4 voltage controlled oscillator supply voltage
DGND 5 digital ground
VCCD 6 digital supply voltage
DATA 7 bus data line input/output
CLOCK 8 bus clock line input
BUSMODE 9 bus mode select input
BUSENABLE 10 bus enable input
SWPORT1 11 software programmable port 1
SWPORT2 12 software programmable port 2
XTAL1 13 crystal oscillator input 1
XTAL2 14 crystal oscillator input 2
PHASEFIL 15 phase detector loop filter
PILFIL 16 pilot detector low-pass filter
VAFR 17 right audio frequency output voltage
VAFL 18 left audio frequency output voltage
TMUTE 19 time constant for soft mute
MPXO 20 FM demodulator MPX signal output
Vref 21 reference voltage
TIFC 22 time constant for IF centre adjust
LIMDEC1 23 decoupling IF limiter 1
LIMDEC2 24 decoupling IF limiter 2
Igain 25 gain control current for IF filter
AGND 26 analog ground
VCCA 27 analog supply voltage
RFI1 28 RF input 1
RFGND 29 RF ground
RFI2 30 RF input 2
TAGC 31 time constant RF AGC
LOOPSW 32 switch output of synthesizer PLL loop filter
2003 Nov 06 7
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
handbook, full pagewidth
TEA5768HL
MHC274
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
LOOPSW
TAGC
RFI2
RFGND
RFI1
VCCA
AGND
Igain
BUSMODE
BUSENABLE
SWPORT1
SWPORT2
XTAL1
XTAL2
PHASEFIL
PILFIL
CPOUT
VCOTANK1
VCOTANK2
VCC(VCO)
DGND
VCCD
DATA
CLOCK
LIMDEC2
LIMDEC1
TIFC
Vref
MPXO
TMUTE
VAFL
VAFR
Fig.2 Pin configuration.
7 FUNCTIONAL DESCRIPTION
7.1 Low-noise RF amplifier
The LNA input impedance together with the LC RF input
circuit defines an FM band filter. The gain of the LNA is
controlled by the RF AGC circuit.
7.2 FM mixer
The FM quadrature mixer converts the FM RF
(76 to 108 MHz) to an IF of 225 kHz.
7.3 VCO
The varactor tuned LC VCO provides the Local Oscillator
(LO) signal for the FM quadrature mixer. The VCO
frequency range is 150 to 217 MHz.
7.4 Crystal oscillator
The crystal oscillator can operate with a 32.768 kHz clock
crystal or a 13 MHz crystal. The temperature drift of
standard 32.768 kHz clock crystals limits the operational
temperature range from −10 to +60 °C.
The PLL synthesizer can be clocked externally with a
32.768 kHz, a 6.5 MHz or a 13 MHz signal via pin XTAL2.
The crystal oscillator generates the reference frequency
for:
•The reference frequency divider for the synthesizer PLL
•The timing for the IF counter
•The free-running frequency adjustment of the stereo
decoder VCO
•The centre frequency adjustment of the IF filters.
7.5 PLL tuning system
The PLL synthesizer tuning system is suitable to operate
with a 32.768 kHz or a 13 MHz reference frequency
generated by the crystal oscillator or applied to the IC from
an external source. The synthesizer can also be clocked
via pin XTAL2 at 6.5 MHz. The PLL tuning system can
perform an autonomous search tuning function.
7.6 RF AGC
The RF AGC prevents overloading and limits the amount
of intermodulation products created by strong adjacent
channels.
2003 Nov 06 8
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
7.7 IF filter
Fully integrated IF filter.
7.8 FM demodulator
The FM quadrature demodulator has an integrated
resonator to perform the phase shift of the IF signal.
7.9 Level voltage generator and analog-to-digital
converter
TheFM IFanaloglevel voltageisconverted to4 bitsdigital
data and output via the I2C-bus.
7.10 IF counter
The IF counter outputs a 7-bit count result via the I2C-bus.
7.11 Soft mute
The low-pass filtered level voltage drives the soft mute
attenuator at low RF input levels. The soft mute function
can be switched off via the I2C-bus.
7.12 MPX decoder
The PLL stereo decoder is adjustment-free. The stereo
decoder can be switched to mono via the I2C-bus.
7.13 Signal dependent mono to stereo blend
With a decreasing RF input level the MPX decoder blends
from stereo to mono to limit the output noise. The
continuousmono tostereo blendcan alsobe programmed
viathe I2C-bustoan RFlevel dependingswitchedmono to
stereo transition. Stereo Noise Cancelling (SNC) can be
switched off via the I2C-bus.
7.14 Signal dependent AF response
Theaudio bandwidth willbe reducedwith adecreasing RF
input level. The function can be switched off via the
I2C-bus.
7.15 Software programmable ports
Two software programmable ports (open-collector) can be
addressed via the I2C-bus.
The port 1 (pin SWPORT1) function can be changed with
write data byte 4 bit 0 (see Table 13). Pin SWPORT1 is
then output for the ready flag of read byte 1.
8I
2
C-BUS AND BUS-CONTROLLED FUNCTIONS
8.1 I2C-bus specification
InformationabouttheI2C-buscanbe foundinthebrochure
“The I
2
C-bus and how to use it”
(order number
9398 393 40011).
The standard I2C-bus specification is expanded by the
following definitions.
IC address C0: 1100000.
Structure of the I2C-bus logic: slave transceiver.
Subaddresses are not used.
The maximum LOW-level input and the minimum
HIGH-level input are specified to 0.2VCCD and 0.45VCCD
respectively.
The pin BUSMODE must be connected to ground.
Note: The bus operates at a maximum clock frequency of
400 kHz. It is not allowed to connect the IC to a bus
operating at a higher clock rate.
8.1.1 DATA TRANSFER
Datasequence:address,byte 1, byte 2,byte 3,byte 4and
byte 5 (the data transfer has to be in this order). The
LSB = 0of theaddressindicates aWRITEoperation tothe
TEA5768HL.
Bit 7 of each byte is considered as the MSB and has to be
transferred as the first bit of the byte.
The data becomes valid bitwise at the appropriate falling
edge of the clock. A STOP condition after any byte can
shorten transmission times.
When writing to the transceiver by using the STOP
condition before completion of the whole transfer:
•The remaining bytes will contain the old information
•Ifthe transferof abyte isnot completed,the newbits will
be used, but a new tuning cycle will not be started.
The IC can be switched into a low current standby mode
with the standby bit; the bus is then still active. The
standby current can be reduced by deactivating the bus
interface (pin BUSENABLE LOW). If the bus interface is
deactivated (pin BUSENABLE LOW) without the standby
mode being programmed, the IC maintains normal
operation, but is isolated from the bus lines.
2003 Nov 06 9
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
The software programmable output (SWPORT1) can be
programmed to operate as a tuning indicator output.
As long as the IC has not completed a tuning action,
pin SWPORT1 remains LOW. The pin becomes HIGH,
when a preset or search tuning is completed or when a
band limit is reached.
The reference frequency divider of the synthesizer PLL is
changed when the MSB in byte 5 is set to logic 1. The
tuning system can then be clocked via pin XTAL2 at
6.5 MHz.
8.1.2 POWER-ON RESET
At Power-on reset the mute is set, all other bits are set to
LOW. To initialize the IC all bytes have to be transferred.
8.2 I2C-bus protocol
Table 1 Write mode
Notes
1. S = START condition.
2. A = acknowledge.
3. P = STOP condition.
Table 2 Read mode
Notes
1. S = START condition.
2. A = acknowledge.
Table 3 IC address byte
Note
1. Read or write mode:
a) 0 = write operation to the TEA5768HL
b) 1 = read operation from the TEA5768HL.
S(1) address (write) A(2) data byte(s) A(2) P(3)
S(1) address (read) A(2) data byte 1
IC ADDRESS MODE
1100000R/
W
(1)
2003 Nov 06 10
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
8.3 Writing data
Table 4 Write mode
Table 5 Format of 1st data byte
Table 6 Description of 1st data byte bits
Table 7 Format of 2nd data byte
Table 8 Description of 2nd data byte bits
Table 9 Format of 3rd data byte
Table 10 Description of 3rd data byte bits
DATA BYTE 1 DATA BYTE 2 DATA BYTE 3 DATA BYTE 4 DATA BYTE 5
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
MUTE SM PLL13 PLL12 PLL11 PLL10 PLL9 PLL8
BIT SYMBOL DESCRIPTION
7 MUTE if MUTE = 1 then L and R audio are muted; if MUTE = 0 then L and R audio are not
muted
6SMSearch Mode: if SM = 1 then in search mode; if SM = 0 then not in search mode
5 to 0 PLL[13:8] setting of synthesizer programmable counter for search or preset
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
PLL7 PLL6 PLL5 PLL4 PLL3 PLL2 PLL1 PLL0
BIT SYMBOL DESCRIPTION
7 to 0 PLL[7:0] setting of synthesizer programmable counter for search or preset
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
SUD SSL1 SSL0 HLSI MS MR ML SWP1
BIT SYMBOL DESCRIPTION
7 SUD Search Up/Down: if SUD = 1 then search up; if SUD = 0 then search down
6 and 5 SSL[1:0] Search Stop Level: see Table 11
4 HLSI HIGH/LOW Side Injection: if HLSI = 1 then HIGH side LO injection; if HLSI = 0 then
LOW side LO injection
3MSMono to Stereo: if MS = 1 then forced mono; if MS = 0 then stereo ON
2MRMute Right: if MR = 1 then the right audio channel is muted and forced mono; if MR = 0
then the right audio channel is not muted
1MLMute Left: if ML = 1 then the left audio channel is muted and forced mono; if ML = 0
then the left audio channel is not muted
0 SWP1 Software programmable port 1: if SWP1 = 1 then port 1 is HIGH; if SWP1 = 0 then
port 1 is LOW
2003 Nov 06 11
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
Table 11 Search stop level setting
Table 12 Format of 4th data byte
Table 13 Description of 4th data byte bits
Table 14 Format of 5th data byte
Table 15 Description of 5th data byte bits
SSL1 SSL0 SEARCH STOP LEVEL
0 0 not allowed in search mode
0 1 low; level ADC output = 5
1 0 mid; level ADC output = 7
1 1 high; level ADC output = 10
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
SWP2 STBY BL XTAL SMUTE HCC SNC SI
BIT SYMBOL DESCRIPTION
7 SWP2 Software programmable port 2: if SWP2 = 1 then port 2 is HIGH; if SWP2 = 0 then
port 2 is LOW
6 STBY Standby: if STBY = 1 then in standby mode; if STBY = 0 then not in standby mode
5BLBand Limits: if BL = 1 then Japanese FM band; if BL = 0 then US/Europe FM band
4 XTAL if XTAL = 1 then fxtal = 32.768 kHz; if XTAL = 0 then fxtal = 13 MHz
3 SMUTE Soft MUTE: if SMUTE = 1 then soft mute is ON; if SMUTE = 0 then soft mute is OFF
2 HCC High Cut Control: if HCC = 1 then high cut control is ON; if HCC = 0 then high cut
control is OFF
1 SNC Stereo Noise Cancelling: if SNC = 1 then stereo noise cancelling is ON; if SNC = 0
then stereo noise cancelling is OFF
0SISearch Indicator: if SI = 1 then pin SWPORT1 is output for the ready flag; if SI = 0 then
pin SWPORT1 is software programmable port 1
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
PLLREF DTC −−−−−−
BIT SYMBOL DESCRIPTION
7 PLLREF if PLLREF = 1 then the 6.5 MHz reference frequency for the PLL is enabled;
if PLLREF = 0 then the 6.5 MHz reference frequency for the PLL is disabled
6 DTC if DTC = 1 then the de-emphasis time constant is 75 µs; if DTC = 0 then the
de-emphasis time constant is 50 µs
5to0 −not used; position is don’t care
2003 Nov 06 12
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
8.4 Reading data
Table 16 Read mode
Table 17 Format of 1st data byte
Table 18 Description of 1st data byte bits
Table 19 Format of 2nd data byte
Table 20 Description of 2nd data byte bits
Table 21 Format of 3rd data byte
Table 22 Description of 3rd data byte bits
DATA BYTE 1 DATA BYTE 2 DATA BYTE 3 DATA BYTE 4 DATA BYTE 5
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
RF BLF PLL13 PLL12 PLL11 PLL10 PLL9 PLL8
BIT SYMBOL DESCRIPTION
7RFReady Flag: if RF = 1 then a station has been found or the band limit has been
reached; if RF = 0 then no station has been found
6 BLF Band Limit Flag: if BLF = 1 then the band limit has been reached; if BLF = 0 then the
band limit has not been reached
5 to 0 PLL[13:8] setting of synthesizer programmable counter after search or preset
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
PLL7 PLL6 PLL5 PLL4 PLL3 PLL2 PLL1 PLL0
BIT SYMBOL DESCRIPTION
7 to 0 PLL[7:0] setting of synthesizer programmable counter after search or preset
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
STEREO IF6 IF5 IF4 IF3 IF2 IF1 IF0
BIT SYMBOL DESCRIPTION
7 STEREO Stereo indication: if STEREO = 1 then stereo reception; if STEREO = 0 then mono
reception
6 to 0 PLL[13:8] IF counter result
2003 Nov 06 13
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
Table 23 Format of 4th data byte
Table 24 Description of 4th data byte bits
Table 25 Format of 5th data byte
Table 26 Description of 5th data byte bits
8.5 Bus timing
Table 27 Digital levels and timing
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
LEV3 LEV2 LEV1 LEV0 CI3 CI2 CI1 0
BIT SYMBOL DESCRIPTION
7 to 4 LEV[3:0] level ADC output
3 to 1 CI[3:1] Chip Identification: these bits have to be set to logic 0
0−this bit is internally set to logic 0
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
00000000
BIT SYMBOL DESCRIPTION
7to0 −reserved for future extensions; these bits are internally set to logic 0
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Digital inputs
VIH HIGH-level input voltage 0.45VCCD −V
VIL LOW-level input voltage −0.2VCCD V
Digital outputs
Isink(L) LOW-level sink current 500 −µA
V
OL LOW-level output voltage IOL = 500 µA−450 mV
Timing (I2C-bus enabled)
fclk clock input frequency −400 kHz
tHIGH clock HIGH time 1 −µs
t
LOW clock LOW time 1 −µs
2003 Nov 06 14
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Machine model (R = 0 Ω, C = 200 pF).
2. Human body model (R = 1.5 kΩ, C = 100 pF).
10 THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VVCOTANK1 VCO tuned circuit output voltage 1 −0.3 +8 V
VVCOTANK2 VCO tuned circuit output voltage 2 −0.3 +8 V
VCCD digital supply voltage −0.3 +5 V
VCCA analog supply voltage −0.3 +8 V
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −10 +75 °C
Ves electrostatic handling voltage
for all pins except pin DATA note 1 −200 +200 V
note 2 −2000 +2000 V
for pin DATA note 1 −150 +200 V
note 2 −2000 +2000 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air 80 K/W
2003 Nov 06 15
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
11 DC CHARACTERISTICS
VCCA =V
VCOTANK1 =V
VCOTANK2 =V
CCD = 2.7 V; Tamb =25°C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply voltages; note 1
VCCA analog supply voltage 2.5 3.0 5.0 V
VCC(VCO) voltage controlled
oscillator supply voltage 2.5 3.0 5.0 V
VCCD digital supply voltage 2.5 3.0 5.0 V
Supply currents
ICCA analog supply current operating
VCCA = 3 V 6.0 8.4 10.5 mA
VCCA = 5 V 6.2 8.6 10.7 mA
standby mode
VCCA =3V −36 µA
V
CCA =5V −3.2 6.2 µA
ICC(VCO) voltage controlled
oscillator supply current operating
VVCOTANK1 =V
VCOTANK2 = 3 V 560 750 940 µA
VVCOTANK1 =V
VCOTANK2 = 5 V 570 760 950 µA
standby mode
VVCOTANK1 =V
VCOTANK2 =3V −12 µA
V
VCOTANK1 =V
VCOTANK2 =5V −1.2 2.2 µA
ICCD digital supply current operating
VCCD = 3 V 2.1 3.0 3.9 mA
VCCD = 5 V 2.25 3.15 4.05 mA
standby mode; VCCD =3V
bus enable line HIGH 30 56 80 µA
bus enable line LOW 11 19 26 µA
standby mode; VCCD =5V
bus enable line HIGH 50 78 105 µA
bus enable line LOW 20 33 45 µA
2003 Nov 06 16
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
Note
1. VCCA, VCC(VCO) and VCCD must not differ more than 200 mV.
DC operating points
VCPOUT unloaded DC voltage 0.1 −VCC(VCO) −0.1 V
VXTAL1 data byte 4 bit 4 = 1 1.64 1.72 1.8 V
data byte 4 bit 4 = 0 1.68 1.75 1.82 V
VXTAL2 data byte 4 bit 4 = 1 1.64 1.72 1.8 V
data byte 4 bit 4 = 0 1.68 1.75 1.82 V
VPHASEFIL 0.4 1.2 VCCA −0.4 V
VPILFIL 0.65 0.9 1.3 V
VVAFL fRF = 98 MHz; VRF = 1 mV 720 850 940 mV
VVAFR fRF = 98 MHz; VRF = 1 mV 720 850 940 mV
VTMUTE VRF = 0 V 1.5 1.65 1.8 V
VMPXO fRF = 98 MHz; VRF = 1 mV 680 815 950 mV
VVref 1.45 1.55 1.65 V
VTIFC 1.34 1.44 1.54 V
VLIMDEC1 1.86 1.98 2.1 V
VLIMDEC2 1.86 1.98 2.1 V
VIgain 480 530 580 mV
VRFI1 0.93 1.03 1.13 V
VRFI2 0.93 1.03 1.13 V
VTAGC VRF = 0 V 1 1.57 2 V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2003 Nov 06 17
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
12 AC CHARACTERISTICS
VCCA =V
VCOTANK1 =V
VCOTANK2 =V
CCD = 2.7 V; Tamb =25°C; measured in the circuit of Fig.5; all AC values are given
in RMS; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Voltage controlled oscillator
fosc oscillator frequency 150 −217 MHz
Crystal oscillator
CIRCUIT INPUT:PIN XTAL2
Vi(osc) oscillator input voltage oscillator externally clocked 140 −350 mV
Riinput resistance oscillator externally clocked
data byte 4 bit 4 = 0 2 3 4 kΩ
data byte 4 bit 4 = 1 230 330 430 kΩ
Ciinput capacitance oscillator externally clocked
data byte 4 bit 4 = 0 3.9 5.6 7.3 pF
data byte 4 bit 4 = 1 5 6 7 pF
CRYSTAL: 32.768 kHz
frseries resonance frequency data byte 4 bit 4 = 1 −32.768 −kHz
∆f/frfrequency deviation −20 ×10−6−+20 ×10−6
C0shunt capacitance −−3.5 pF
RSseries resistance −−80 kΩ
∆fr/fr(25 °C) temperature drift −10 °C<T
amb < +60 °C−50 ×10−6−+50 ×10−6
CRYSTAL:13MHz
f
rseries resonance frequency data byte 4 bit 4 = 0 −13 −MHz
∆f/frfrequency deviation −30 ×10−6−+30 ×10−6
C0shunt capacitance −−4.5 pF
Cmot motional capacitance 1.5 −3.0 fF
RSseries resistance −−100 Ω
∆fr/fr(25 °C) temperature drift −40 °C<T
amb < +85 °C−30 ×10−6−+30 ×10−6
Synthesizer
PROGRAMMABLE DIVIDER; note 1
Nprog programmable divider ratio data byte 1 = XX111111;
data byte 2 = 11111110 −−8191
data byte 1 = XX010000;
data byte 2 = 00000000 2048 −−
∆N
step programmable divider step
size −1−
REFERENCE FREQUENCY DIVIDER
Nref crystal oscillator divider
ratio data byte 4 bit 4 = 0 −260 −
data byte 5 bit 7 = 1;
data byte 4 bit 4 = 0 −130 −
data byte 4 bit 4 = 1 −1−
2003 Nov 06 18
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
CHARGE PUMP:PIN CPOUT
Isink charge pump peak sink
current 0.2V<V
CPOUT
<V
VCOTANK2 −0.2 V;
fVCO >f
ref ×Nprog
−0.5 −µA
I
source charge pump peak source
current 0.2V<V
CPOUT
<V
VCOTANK2 −0.2 V;
fVCO <f
ref ×Nprog
−−0.5 −µA
IF counter
VRF RF input voltage for correct
IF count −12 18 µV
NIF IF counter length −7−bit
Nprecount IF counter prescaler ratio −64 −
Tcount(IF) IF counter period fxtal = 32.768 kHz −15.625 −ms
fxtal = 13 MHz −15.754 −ms
REScount(IF) IF counter resolution fxtal = 32.768 kHz −4.096 −kHz
fxtal = 13 MHz −4.0625 −kHz
IFcount IF counter result for search
tuning stop fxtal = 32.768 kHz 31 −3E HEX
fxtal = 13 MHz 32 −3D HEX
Pins DATA, CLOCK, BUSMODE and BUSENABLE
Riinput resistance 10 −− MΩ
Software programmable ports
PIN SWPORT1
Isink(max) maximum sink current data byte 4 bit 0 = 0;
data byte 5 bit 0 = 0;
VSWPORT1 < 0.5 V
500 −− µA
I
leak(max) maximum leakage current data byte 4 bit 0 = 1;
VSWPORT1 <5V −1−+1 µA
PIN SWPORT2
Isink(max) maximum sink current data byte 5 bit 7 = 0;
VSWPORT1 < 0.5 V 500 −− µA
I
leak(max) maximum leakage current data byte 5 bit 1 = 1;
VSWPORT1 <5V −1−+1 µA
FM signal channel
FM RF INPUT
Riinput resistance at pins
RFI1 and RFI2 to RFGND 75 100 125 Ω
Ciinput capacitance at pins
RFI1 and RFI2 to RFGND) 2.5 4 6 pF
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2003 Nov 06 19
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
VRF RF sensitivity input voltage fRF = 76 to 108 MHz;
∆f = 22.5 kHz; fmod = 1 kHz;
(S+N)/N = 26 dB;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
−2 3.5 µV
IP3in in-band 3rd-order intercept
point related to VRFI1-RFI2
(peak value)
∆f1= 200 kHz; ∆f2= 400 kHz;
ftune = 76 to 108 MHz 81 84 −dBµV
IP3out out-band 3rd-order
intercept point related to
VRFI1-RFI2 (peak value)
∆f1= 4 MHz; ∆f2= 8 Hz;
ftune = 76 to 108 MHz 82 85 −dBµV
RF AGC
VRF1 RF input voltage for start of
AGC fRF1 = 93 MHz; fRF2 = 98 MHz;
VRF2 =50dBµV;
; note 2
66 72 78 dBµV
IF filter
fIF IF filter centre frequency 215 225 235 kHz
BIF IF filter bandwidth 85 94 102 kHz
S+200 HIGH side 200 kHz
selectivity ∆f = +200 kHz;
ftune = 76 to 108 MHz; note 3 39 43 −dB
S−200 LOW side 200 kHz
selectivity ∆f=−200 kHz;
ftune = 76 to 108 MHz; note 3 32 36 −dB
S+100 HIGH side 100 kHz
selectivity ∆f = +100 kHz;
ftune = 76 to 108 MHz; note 3 812−dB
S−100 LOW side 100 kHz
selectivity ∆f=−100 kHz;
ftune = 76 to 108 MHz; note 3 812−dB
IR image rejection ftune = 76 to 108 MHz;
VRF =50dBµV24 30 −dB
FM IF level detector and mute voltage
VRF RF input voltage for start of
level ADC read mode data byte 4 bit4=1 2 3 5 µV
∆V
step level ADC step size 2 3 5 dB
PIN TMUTE
Vlevel level output DC voltage VRF =0µV 1.55 1.65 1.80 V
VRF =3µV 1.60 1.70 1.85 V
Vlevel(slope) slope of level voltage VRF =10to500µV 150 165 180
Rooutput resistance 280 400 520 kΩ
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VTMUTE
∆VRF1
----------------------- 14 mV
3 dBµV
--------------------
<
mV
20 dB
---------------
2003 Nov 06 20
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
FM demodulator: pin MPXO
VMPXO demodulator output voltage VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
60 75 90 mV
(S+N)/N maximum signal plus
noise-to-noise ratio VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
54 60 −dB
THD total harmonic distortion VRF = 1 mV;L = R;∆f = 75 kHz;
fmod = 1 kHz;
de-emphasis = 75 µs
−0.5 1.5 %
αAM AM suppression VRF = 300 µV; L=R;
∆f = 22.5 kHz; fmod = 1 kHz;
m = 0.3; de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
40 −− dB
Rodemodulator output
resistance −−500 Ω
Isink demodulator output sink
current −−30 µA
Soft mute
VRF RF input voltage for soft
mute start αmute = 3 dB; data byte 4
bit3=1 3510µV
α
mute mute attenuation VRF =1µV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz;
data byte 4 bit 3 = 1
10 20 30 dB
MPX decoder
VAFL; VAFR left and right audio
frequency output voltage VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs
60 75 90 mV
RAFL; RAFR left and right audio
frequency output resistance −−50 Ω
Isink(AFL);
Isink(AFR)
left and right audio
frequency output sink
current
170 −− µA
V
MPXIN(max) input overdrive margin THD < 3% 4 −− dB
VAFL/VAFR left and right audio
frequency output voltage
difference
VRF = 1 mV;L = R;∆f = 75 kHz;
fmod = 1 kHz;
de-emphasis = 75 µs
−1−+1 dB
αcs(stereo) stereo channel separation VRF = 1 mV; R = L = 0 or R = 0
and L = 1 including 9% pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 1
24 30 −dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
2003 Nov 06 21
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
(S+N)/N maximum signal plus
noise-to-noise ratio VRF = 1 mV; L = R;
∆f = 22.5 kHz; fmod = 1 kHz;
de-emphasis = 75 µs;
BAF = 300 Hz to 15 kHz
54 60 −dB
THD total harmonic distortion VRF = 1 mV;L = R;∆f = 75 kHz;
fmod = 1 kHz;
de-emphasis = 75 µs
−0.4 1 %
αpilot pilot suppression measured
at pins VAFL and VAFR
related to ∆f = 75 kHz;
fmod = 1 kHz;
de-emphasis = 75 µs
40 50 −dB
∆fpilot stereo pilot frequency
deviation VRF = 1 mV; read mode;
data byte 3
bit7=1 −3.6 5.8 kHz
bit7=0 1 3 −kHz
pilot switch hysteresis VRF = 1 mV 2 −− dB
HIGH CUT CONTROL
TCde-em de-emphasis time constant VRF =1mV
data byte 5 bit 2 = 0 38 50 62 µs
data byte 5 bit 2 = 1 57 75 93 µs
VRF =1µV
data byte 5 bit 2 = 0 114 150 186 µs
data byte 5 bit 2 = 1 171 225 279 µs
MONO TO STEREO BLEND CONTROL
αcs(stereo) stereo channel separation VRF =45µV;R=L=0orR=0
and L = 1 including 9% pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 1
41016dB
MONO TO STEREO SWITCHED
αcs(stereo) stereo channel separation
switching from mono to
stereo with increasing RF
input level
VRF =1µV; R = L = 0 or R = 0
and L = 1 including 9% pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 0
24 −− dB
αcs(stereo) stereo channel separation
switching from stereo to
mono with decreasing RF
input level
VRF =20µV;R=L=0orR=0
and L = 1 including 9% pilot;
∆f = 75 kHz; fmod = 1 kHz;
data byte 3 bit 3 = 0;
data byte 4 bit 1 = 0
−−1dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
fpilot1
∆fpilot2
∆
----------------
2003 Nov 06 22
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
Notes
1. Calculation of this 14-bit word can be done as follows:
formula for HIGH side injection: ; formula for LOW side injection:
where:
N = decimal value of PLL word
fRF = the wanted tuning frequency [Hz]
fIF = the intermediate frequency [Hz] = 225 kHz
fref = the reference frequency [Hz] = 32.768 kHz for the 32.768 kHz crystal; fref = 50 kHz for the 13 MHz crystal or
when externally clocked with 6.5 MHz.
Example for receiving a channel at 100 MHz with HIGH side injection: .
The PLL word becomes 2FCAH.
2. VRF in Fig.5 is replaced by VRF1 +V
RF2. The radio is tuned to 98 MHz (HIGH side injection).
3. LOWside andHIGH sideselectivity canbe switchedby changingthe mixerfrom HIGHside toLOW side LO injection.
BUS-DRIVEN MUTE FUNCTIONS
Tuning mute
αmute VAFL and VAFR muting depth data byte 1 bit 7 = 1 −−−60 dB
αmute(L) VAFL muting depth data byte 3 bit 1 = 1;
fAF = 1 kHz; Rload(L) <30kΩ−−−80 dB
αmute(R) VAFR muting depth data byte 3 bit 2 = 1;
fAF = 1 kHz; Rload(R) <30kΩ−−−80 dB
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
N4f
RF fIF
+()×
f
ref
----------------------------------
=N4f
RF fIF
–()×
f
ref
----------------------------------
=
N4 100 6
×10 225 3
×10+()×
32768
------------------------------------------------------------------ 12234==
2003 Nov 06 23
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
handbook, full pagewidth
10
0
VAFL, VAFR
(dB)
VRF (mV)
−80
−30
−40
−50
−60
−70
−10
−20
MHC247
10−310−210−11
(1)
(2)
(3)
(4)
(5)
(6)
10 102
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
THD
(%)
103
Fig.3 FM characteristics 1.
(1) Mono signal; soft mute on.
(2) Left channel with modulation left; SNC on.
(3) Right channel with modulation left; SNC on.
(4) Noise in mono mode; soft mute on.
(5) Noise in stereo mode; SNC on.
(6) Total harmonic distortion; ∆f = 75 kHz; L = R; fmod = 1 kHz.
2003 Nov 06 24
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
handbook, full pagewidth
10
0
VAFL, VAFR
(dB)
VRF (mV)
−80
−30
−40
−50
−60
−70
−10
−20
MHC309
10−310−210−11
(1)
(2)
(3)
10 102
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
103
VTMUTE
(V)
Fig.4 FM characteristics 2.
(1) Mono signal; no soft mute.
(2) Noise in mono mode; no soft mute.
(3) Level voltage; VCCA = 2.7 V.
2003 Nov 06 25
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
13 INTERNAL PIN CONFIGURATION
PIN SYMBOL EQUIVALENT CIRCUIT
1 CPOUT
2 VCOTANK1
3 VCOTANK2
4V
CC(VCO)
5 DGND
6V
CCD
7 DATA
8 CLOCK
MHC251
1
270 Ω
MHC25
2
3
120 Ω
2
120 Ω
MHC25
3
7
5
270 Ω
MHC25
4
58
2003 Nov 06 26
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
9 BUSMODE
10 BUSENABLE
11 SWPORT1
12 SWPORT2
13 XTAL1
14 XTAL2
15 PHASEFIL
PIN SYMBOL EQUIVALENT CIRCUIT
270 Ω
MHC25
5
59
150 Ω
MHC25
6
510
MHC25
7
11
5
150 Ω
MHC25
8
12
5
150 Ω
13 14
MHC259
15
26
MHC26
0
2003 Nov 06 27
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
16 PILFIL
17 VAFR
18 VAFL
19 TMUTE
20 MPXO
PIN SYMBOL EQUIVALENT CIRCUIT
270 Ω16
26
MHC261
10 Ω
MHC262
26
17
10 Ω
MHC263
26
18
19
1 kΩ
MHC26
4
26
150 Ω
MHC265
26
20
2003 Nov 06 28
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
21 Vref
22 TIFC
23 LIMDEC1
24 LIMDEC2
25 Igain
26 AGND
27 VCCA
PIN SYMBOL EQUIVALENT CIRCUIT
MHC266
21
26
MHC26
7
22
40 kΩ
MHC26
8
270 Ω23
MHC26
9
24
270 Ω
MHC27
0
25
2003 Nov 06 29
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
14 APPLICATION INFORMATION
Table 28 Component list for Figs 1 and 5
28 RFI1
29 RFGND
30 RFI2
31 TAGC
32 LOOPSW
COMPONENT PARAMETER VALUE TOLERANCE TYPE MANUFACTURER
R1 resistor with low temperature coefficient 18 kΩ±1% RC12G Philips
D1 and D2 varicap for VCO tuning −− BB202 Philips
L1 RF band filter coil 120 nH ±2% Qmin =40
L2 and L3 VCO coil 33 nH ±2% Qmin =40
XTAL13 13 MHz crystal −− NX4025GA
Cpull pulling capacitor for NX4025GA 10 pF −
XTAL32.768 32.768 kHz crystal −−
PIN SYMBOL EQUIVALENT CIRCUIT
MHC271
29
28 30
MHC27
2
29
31
MHC27
3
32
4
2003 Nov 06 30
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
2003 Nov 06 30
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handbook, full pagewidth
MHC276
I/Q-MIXER
1st FM
IF CENTRE
FREQUENCY
ADJUST
100 pF
22 nF
VRF
VCCA
28
25
26
27
24 23 22 21 20
27 pF
L1 47 pF
22 µF
29
30
31
32
RFI1
Igain
AGND
VCCA
RFGND
RFI2
TAGC
LOOPSW
12
VCOTANK1 34
CPOUT VCOTANK2 VCC(VCO)
5678
DATAVCCD
DGND CLOCK
AGC
programmable divider output
reference frequency divider output
TUNING SYSTEM
4.7 nF
47 nF 47 nF 33 nF
19 18 17
LIMDEC2 LIMDEC1 TIFC Vref MPXO TMUTE VAFL VAFR
16
15
14
13
12
11
10 BUSENABLE
BUSMODE
SWPORT1
SWPORT2
XTAL1
XTAL2
PHASEFIL
PILFIL
9
SDS
33 nF
1 nF
22 nF
22 nF
Ccomp(1)
Cpull(1) 32.768 kHz
or
13 MHz
33 kΩ
10 kΩ
10 kΩ
47 nF
VCO
39 nF
10 nF
R1
4.7 Ω
100 kΩ
10 kΩ
40 Ω
47 Ω
VCC(VCO)
12 Ω
22 nF
D1
L3
D2
L2
22 nF
LEVEL
ADC IF
COUNTER
LIMITER DEMODULATOR
Iref
RESONANCE
AMPLIFIER
SOFTWARE
PROGRAMMABLE
PORT
MUX
I2C-BUS
VCCD
GAIN
STABILIZATION POWER
SUPPLY
SOFT
MUTE
MPX
DECODER
CRYSTAL
OSCILLATOR
TEA5768HL
VCCA
2
N1
pilot
mono
Fig.5 Test circuit.
(1) Ccomp and Cpull data depends on crystal specification.
2003 Nov 06 31
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
15 PACKAGE OUTLINE
UNIT A
max. A1A2A3bpcE
(1) eH
E
LL
pZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 1.6 0.20
0.05 1.45
1.35 0.25 0.4
0.3 0.18
0.12 7.1
6.9 0.8 9.15
8.85 0.9
0.5 7
0
o
o
0.25 0.11 0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT358 -1 136E03 MS-026 00-01-19
03-02-25
D(1) (1)(1)
7.1
6.9
HD
9.15
8.85
E
Z
0.9
0.5
D
bp
e
θ
EA1
A
Lp
detail X
L
(A )
3
B
8
c
D
H
bp
E
HA2
vMB
D
ZD
A
ZE
e
vMA
X
1
32
25
24 17
16
9
y
pin 1 index
wM
wM
0 2.5 5 mm
scale
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1
2003 Nov 06 32
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
16 SOLDERING
16.1 Introduction to soldering surface mount
packages
Thistextgives averybriefinsightto acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs, butitisnotsuitablefor finepitch
SMDs. In these situations reflow soldering is
recommended.
16.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuitboardby screenprinting, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
•below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA and SSOP-T packages
– for packages with a thickness ≥2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥350 mm3 so called thick/large packages.
•below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
16.3 Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices (SMDs)orprinted-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
•Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
•For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
•Forpackageswithleads onfoursides,thefootprintmust
be placed at a 45°angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
16.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2003 Nov 06 33
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
16.5 Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. Formore detailedinformationon theBGApackages refertothe
“(LF)BGAApplication Note
”(AN01026); orderacopy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C±10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
PACKAGE(1) SOLDERING METHOD
WAVE REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS not suitable(4) suitable
PLCC(5), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable
PMFP(8) not suitable not suitable
2003 Nov 06 34
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
17 DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL DATA SHEET
STATUS(1) PRODUCT
STATUS(2)(3) DEFINITION
I Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
18 DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor atanyother conditions abovethosegiven inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuch applicationswillbe
suitable for the specified use without further testing or
modification.
19 DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
2003 Nov 06 35
Philips Semiconductors Preliminary specification
Low-power FM stereo radio for
handheld applications TEA5768HL
20 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
© Koninklijke Philips Electronics N.V. 2003 SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands R30/02/pp36 Date of release: 2003 Nov 06 Document order number: 9397 750 12072
