ADC16DV160CILQE/NOPB - NATIONAL SEMICONDUCTOR

ADC16DV160

ADC16DV160 Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with

DDR LVDS Outputs

Literature Number: SNAS488G

ADC16DV160

August 16, 2011

Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital

Converter with DDR LVDS Outputs

General Description

The ADC16DV160 is a monolithic dual channel high perfor-

mance CMOS analog-to-digital converter capable of convert-

ing analog input signals into 16-bit digital words at rates up to

160 Mega Samples Per Second (MSPS). This converter uses

a differential, pipelined architecture with digital error correc-

tion and an on-chip sample-and-hold circuit to minimize pow-

er consumption and external component count while provid-

ing excellent dynamic performance. Automatic power-up

calibration enables excellent dynamic performance and re-

duces part-to-part variation, and the ADC16DV160 can be re-

calibrated at any time through the 3-wire Serial Peripheral

Interface (SPI). An integrated low noise and stable voltage

reference and differential reference buffer amplifier eases

board level design. The on-chip duty cycle stabilizer with low

additive jitter allows a wide range of input clock duty cycles

without compromising dynamic performance. A unique sam-

ple-and-hold stage yields a full-power bandwidth of 1.4 GHz.

The interface between the ADC16DV160 and a receiver block

can be easily verified and optimized via fixed pattern gener-

ation and output clock position features. The digital data is

provided via dual data rate LVDS outputs – making possible

the 68-pin, 10 mm x 10 mm LLP package. The ADC16DV160

operates on dual power supplies of +1.8V and +3.0V with a

power-down feature to reduce power consumption to very low

levels while allowing fast recovery to full operation.

Features

■Low power consumption

■On-chip precision reference and sample-and-hold circuit

■On-chip automatic calibration during power-up

■Dual data rate LVDS output port

■Dual Supplies: 1.8V and 3.0V operation

■Selectable input range: 2.4 and 2.0 VPP

■Sampling edge flipping with clock divider by 2 option

■Internal clock divide by 1 or 2

■On-chip low jitter duty-cycle stabilizer

■Power-down and sleep modes

■Output fixed pattern generation

■Output clock position adjustment

■3-wire SPI

■Offset binary or 2's complement data format

■68-pin LLP package (10x10x0.8, 0.5mm pin-pitch)

Key Specifications

■Resolution 16 Bits

■Conversion Rate 160 MSPS

■SNR

(@FIN = 30 MHz)

(@FIN = 197 MHz)

78 dBFS (typ)

76 dBFS (typ)

■SFDR

(@FIN = 30 MHz)

(@FIN = 197 MHz)

95 dBFS (typ)

89 dBFS (typ)

■Full Power Bandwidth 1.4 GHz (typ)

■Power Consumption

-Core per channel

-LVDS Driver

-Total

612 mW (typ)

117 mW (typ)

1.3W (typ)

■ Operating Temperature Range -40°C ~ 85°C

Applications

■Multi-carrier, Multi-standard Base Station Receivers

-MC-GSM/EDGE, CDMA2000, UMTS, LTE and WiMAX

■High IF Sampling Receivers

■Diversity Channel Receivers

■Test and Measurement Equipment

■Communications Instrumentation

■Portable Instrumentation

ADC16DV160 Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with LVDS Outputs

Block Diagram

30101402

Functional Block Diagram

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ADC16DV160

Connection Diagram

30101401

Pin-Out of ADC16DV160

Ordering Information

Industrial (−40°C ≤ +85°C) Package

ADC16DV160CILQ 68–pin LLP

ADC16DV160HFEB Evaluation Board

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ADC16DV160

Pin Descriptions

Pin(s) Name Type Function and Connection

ANALOG I/O

VIN+I

VIN+Q

Input Differential analog input pins. The differential full-scale input signal level

is 2.4 VPP by default, but can be set to 2.4/2.0 VPP via SPI. Each input

pin signal is centered on a common mode voltage, VCM.

VIN−I

VIN−Q

Input

7, 8

10, 11

VRPI

VRPQ

Output

Upper reference voltage.

This pin should not be used to source or sink current. The decoupling

capacitor to AGND (low ESL 0.1 µF) should be placed very close to the

pin to minimize stray inductance. VRP needs to be connected to VRN

through a low ESL 0.1 µF and a low ESR 10 µF capacitors in parallel.

5, 6

12, 13

VRNI

VRNQ

Output

Lower reference voltage.

This pin should not be used to source or sink current. The decoupling

capacitor to AGND (low ESL 0.1 µF) should be placed very close to the

pin to minimize stray inductance. VRN needs to be connected to VRP

through a low ESL 0.1 µF and a low ESR 10 µF capacitors in parallel.

VRMI

VRMQ

Output

Common mode voltage

These pins should be bypassed to AGND with a low ESL (equivalent

series inductance) 0.1 µF capacitor placed as close to the pin as

possible to minimize stray inductance, and a 10 µF capacitor should be

placed in parallel. It is recommended to use VRM to provide the common

mode voltage for the differential analog inputs.

9VREF Output/Input

Internal reference voltage output / External reference voltage input. By

default, this pin is the output for the internal 1.2V voltage reference. This

pin should not be used to sink or source current and should be

decoupled to AGND with a 0.1 µF, low ESL capacitor. The decoupling

capacitors should be placed as close to the pins as possible to minimize

inductance and optimize ADC performance. The decoupling capacitor

should not be larger than 0.1 µF, otherwise dynamic performance after

power-up calibration can decrease due to the extended VREF settling

time.

This pin can also be used as the input for a low noise external reference

voltage. The output impedance for the internal reference at this pin is

10kΩ and this can be overdriven provided the impedance of the external

source is < 10kΩ. Careful decoupling is just as essential when an

external reference is used. The 0.1 µF low ESL decoupling capacitor

should be placed as close to this pin as possible.

The default Input differential voltage swing is equal to 2 * VREF, although

this can be changed through the SPI.

26 CLK+ Input Differential clock input pins. DC biasing is provided internally. For single-

ended clock mode, drive CLK+ through AC coupling while decoupling

CLK- pin to AGND.

25 CLK− Input

DIGITAL I/O

23 SCLK Input Serial Clock. Serial data is shifted into and out of the device synchronous

with this clock signal.

24 SDIO Input/Output

Serial Data In/Out. Serial data is shifted into the device on this pin while

the CSB signal is asserted and data input mode is selected. Serial data

is shifted out of the device on this pin while CSB is asserted and data

output mode is selected.

27 CSB Input

Serial Chip Select. When this signal is asserted SCLK is used to clock

input or output serial data on the SDIO pin. When this signal is de-

asserted, the SDIO pin is a high impedence and the input data is

ignored.

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ADC16DV160

Pin(s) Name Type Function and Connection

28 - 43

61 - 46

D1/0+/-Q to

D15/14+/-Q

D1/0+/-I to

D15/14+/-I

Output

LVDS Data Output. The 16-bit digital output of the data converter is

provided on these ports in a dual data rate manner. A 100Ω termination

resistor must be placed between each pair of differential signals at the

far end of the transmission line. The odd bit data is output first and should

be captured first when de-interleaving the data.

44, 45 OUTCLK+/- Output

Output Clock. This pin is used to clock the output data. It has the same

frequency as the sampling clock. One word of data is output in each

cycle of this signal. A 100Ω termination resistor must be placed between

the differential clock signals at the far end of the transmission line. The

falling edge of this signal should be used to capture the odd bit data

(D15, D13, D11…D1). The rising edge of this signal should be used to

capture the even bit data (D14, D12, D10…D0).

POWER SUPPLIES

4, 14, 22, 64 VA3.0 Analog Power

3.0V Analog Power Supply. These pins should be connected to a quiet

source and should be decoupled to AGND with 0.1 µF capacitors

located close to the power pins.

1, 17 VA1.8 Analog Power

1.8V Analog Power Supply. These pins should be connected to a quiet

source and should be decoupled to AGND with 0.1 µF capacitors

located close to the power pins.

0, 3, 15, 18, 21,

65, 68 AGND Analog Ground

Analog Ground Return.

Pin 0 is the exposed pad on the bottom of the package. The exposed

pad must be connected to the ground plane to ensure rated

performance.

62 VDR Analog Power

Output Driver Power Supply. This pin should be connected to a quiet

voltage source and be decoupled to DRGND with a 0.1 µF capacitor

close to the power pins.

63 DRGND Ground Output Driver Ground Return.

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ADC16DV160

Absolute Maximum Ratings (Note 1, Note

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (VA3.0) −0.3V to 4.2V

Supply Voltage (VA1.8, VDR) −0.3V to 2.35V

Voltage at any Pin except

OUTCLK, CLK, VIN, CSB,

SCLK, SDIO, D15/14-D1/0

−0.3V to (VA3.0 +0.3V)

(Not to exceed 4.2V)

Voltage at CLK, VIN Pins -0.3V to (VA1.8 +0.3V)

(Not to exceed 2.35V)

Voltage at D15/14-D1/0,

OUTCLK, CSB, SCLK, SDIO

Pins

0.3V to (VDR + 0.3V)

(Not to exceed 2.35V)

Input Current at any Pin 5 mA

Storage Temperature Range -65°C to +150°C

Maximum Junction Temp (TJ) +150°C

Thermal Resistance (θJA)19.1°C/W

Thermal Resistance (θJC)1.0°C/W

ESD Rating

Machine Model 200V

Human Body Model 2000V

Charged Device Model 1250V

Soldering process must comply with National

Semiconductor's Reflow Temperature Profile

specifications. Refer to www.national.com/packaging.

(Note 5)

For soldering specifications:

see product folder at www.national.com and

www.national.com/ms/MS/MS-SOLDERING.pdf

Operating Ratings

Specified Temperature

Range:

-40°C to +85°C

3.0V Analog Supply Voltage

Range: (VA3.0)

+2.7V to +3.6V

1.8V Supply Voltage Range:

VA1.8, VDR

+1.7V to +1.9V

Clock Duty Cycle 30/70 %

Electrical Characteristics

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS Rterm = 100Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TA = TMIN to TMAX. All other limits apply for TA = +25°C, unless otherwise noted.

Symbol Parameter Conditions Typical Limits Units

STATIC CONVERTER CHARACTERISTICS

Resolution with No Missing Codes 16 Bits

INL Integral Non Linearity ±2.5 LSB

DNL Differential Non Linearity +0.7,-0.

2 LSB

PGE Positive Gain Error −1.0 %FS

NGE Negative Gain Error -1.0 %FS

VOFF Offset Error (VIN+ = VIN−) 0.1 %FS

Under Range Output Code 0.5dB below negative full scale 0 0

Over Range Output Code 0.5dB above positive full scale 65535 65535

REFERENCE AND ANALOG INPUT CHARACTERISTICS

VCM Common Mode Input Voltage VRM is the common mode reference

voltage

VRM

±0.05 V

VRM

Reference Ladder Midpoint Output

Voltage 1.15 V

VREF Internal Reference Voltage 1.20 V

Differential Analog Input Range Internal Reference, default input

range is selected 2.4 VPP

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ADC16DV160

Dynamic Converter Electrical Characteristics

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS RTERM = 100Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TA = TMIN to TMAX. All other limits apply for TA = +25°C, unless otherwise noted.

Symbol Parameter Conditions Typ Limits Units

SNR Signal-to-Noise Ratio

Fin = 30 MHz at −1dBFS 78 dBFS

Fin = 197 MHz at −1dBFS 76 74.3 dBFS

Fin = 197 MHz at −7dBFS 77.3 dBFS

SFDR Single-tone Spurious Free Dynamic Range

(Note 9)

Fin = 30 MHz at −1dBFS 95 dBFS

Fin = 197 MHz at −1dBFS 89 81 dBFS

Fin = 197 MHz at −7dBFS 99 dBFS

THD Total Harmonic Distortion Fin = 197 MHz at −1dBFS −85 -80 dBFS

Fin = 197 MHz at −7dBFS −96 dBFS

H2 Second-order Harmonic (Note 9)Fin = 197 MHz at −1dBFS −90 dBFS

Fin = 197 MHz at −7dBFS −99 dBFS

H3 Third-order Harmonic (Note 9)Fin = 197 MHz at −1dBFS −93 dBFS

Fin = 197 MHz at −7dBFS −105 dBFS

SPUR Worst Harmonic or Spurious Tone excluding H2

and H3

Fin = 197 MHz at −1dBFS 98 90 dBFS

Fin = 197 MHz at −7dBFS 102 dBFS

Full Power Bandwidth -3dB Point 1.4 GHz

Crosstalk

0 MHz tested channel, fIN=32.5 MHz at

-1dBFS other channel 110 dBFS

0 MHz tested channel, fIN=192 MHz at

-1dBFS other channel 103 dBFS

Logic and Power Supply Electrical Characteristics

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS RTERM = 100Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TA = TMIN to TMAX. All other limits apply for TA = +25°C, unless otherwise noted.

Symbol Parameter Conditions Typical Limits Units

(Limits)

POWER SUPPLY CHARACTERISTICS

IA3.0 Analog 3.0V Supply Current Full Operation (Note 11) 345 374 mA

IA1.8 Analog 1.8V Supply Current Full Operation (Note 11) 105 116 mA

IDR Output Driver Supply Current Full Operation (Note 11) 65 76 mA

Core Power Consumption VA3.0 + VA1.8 power per channel 612 mW

Driver Power Consumption VDR power; Fin = 5MHz Rterm = 100Ω117 mW

Total Power Consumption Full Operation (Note 11) 1.34 1.47 W

Power Consumption in Power Down State Power down state, no external clock 4.4 mW

Sleep state, no external clock 60 mW

DIGITAL INPUT CHARACTERISTICS (SCLK, SDIO, CSB)

VIH Logical “1” Input Voltage VDR = 1.9V 1.2 V (min)

VIL Logical “0” Input Voltage VDR = 1.7V 0.4 V (max)

IIN1 Logical “1” Input Current 10 µA

IIN0 Logical “0” Input Current −10 µA

CIN Digital Input Capacitance 5 pF

DIGITAL OUTPUT CHARACTERISTICS (SDIO)

VOH Logical “1” Output Voltage IOUT = 0.5 mA, VDR = 1.8V 1.2 V (min)

VOL Logical “0” Output Voltage IOUT = 1.6 mA, VDR = 1.8V 0.4 V (max)

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ADC16DV160

Symbol Parameter Conditions Typical Limits Units

(Limits)

+ISC Output Short Circuit Source Current VOUT = 0V −10 mA

−ISC Output Short Circuit Source Current VOUT = VDR 10

LVDS Electrical Characteristics

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS RTERM = 100Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TA = TMIN to TMAX. All other limits apply for TA = +25°C, unless otherwise noted.

Symbol Parameter Conditions Min Typ Max Units

LVDS DC SPECIFICATIONS (Apply to pins D0 to D15, OUTCLK)

VOD Output Differential Voltage 100Ω Differential Load 175 260 325 mV

VOS Output Offset Voltage 100Ω Differential Load 1.1 1.2 1.3 V

Timing Specifications

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS RTERM = 100 Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C, unless otherwise noted.

Parameter Conditions Typ Limits Units

Input Clock Frequency (FCLK) 160 MHz

Input Clock Frequency (FCLK) 20 MHz (min)

Input Clock Amplitude Measured at each pin (CLK+, CLK-).

Differential clock is 2.8 Vpp (typ) 1.4 0.85

1.7

VPP (min)

VPP (max)

Data Output Setup Time (TSU) (Note 10) Measured @ VOD/2; FCLK = 160 MHz. 1.57 1ns (min)

Data Output Hold Time (TH) (Note 10) Measured @ VOD/2; FCLK = 160 MHz. 1.55 1ns (min)

LVDS Rise/Fall Time (tR, tF)CL= 5pF to GND, RL= 100Ω270 ps

Pipeline Latency 11.5 Clock Cycles

Aperture Jitter 80 fs rms

Power-Up Time From assertion of Power to specified level

of performance. 0.5+ 103*(222+217)/FCLK ms

Power-Down Recovery Time From de-assertion of power down mode to

output data available. 0.1+ 103*(219+217)/FCLK ms

Sleep Recovery Time From de-assertion of sleep mode to output

data available. 100 μS

Unless otherwise specified, the following specifications apply: VA3.0 = 3.0V, VA1.8 = 1.8V, VDR = 1.8V, Differential sinusoidal clock,

fCLK = 160 MSPS at 2.8 VPP, AIN = -1dBFS, LVDS RTERM = 100Ω, CL = 5 pF. Typical values are for TA = 25°C. Boldface limits

apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C, unless otherwise noted.

Symbol Parameter Conditions Typ Max Units

fSCLK Serial Clock Frequency fSCLK = 1 / tP 20 MHz

(max)

tPH SCLK Pulse Width - High % of SCLK Period 40

% (min)

% (max)

tPL SCLK Pulse Width - Low % of SCLK Period 40

% (min)

% (max)

tSSU SDIO Input Data Setup Time 5 ns (min)

tSH SDIO Input Data Hold Time 5 ns (min)

tODZ SDIO Output Data Driven-to-Tri-State Time 5 ns (max)

tOZD SDIO Output Data Tri-State-to-Driven Time 5 ns (max)

tOD SDIO Output Data Delay Time 15 ns (max)

tCSS CSB Setup Time 5 ns (min)

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ADC16DV160

Symbol Parameter Conditions Typ Max Units

tCSH CSB Hold Time 5 ns (min)

tIAG Inter-access Gap Minimum time CSB must be

deasserted between accesses 30 ns (min)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under

the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended.

Note 2: All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified.

Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The

±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5mA to 10.

Note 4: Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω.

Note 5: Reflow temperature profiles are different for lead-free and non-lead-free packages.

Note 6: Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical specifications are not

guaranteed.

Note 7: The inputs are protected as shown below. Input voltage magnitudes above VA3.0 or below GND will not damage this device, provided current is limited

per (Note 3). However, errors in the A/D conversion can occur if the input goes above 2.6V or below GND as described in the Operating Ratings section.

30101457

Note 8: The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance.

Note 9: This parameter is specified in units of dBFS – dB relative to the ADC's input full-scale voltage.

Note 10: This parameter is a function of the CLK frequency - increasing directly as the frequency is lowered.

Note 11: This parameter is guaranteed only at 25°C. For power dissipation over temperature range, refer to Power vs. Temperature plot in Typical Performance

Characteristics, Dynamic Performance.

Timing Diagrams

30101403

FIGURE 1. Digital Output Timing

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ADC16DV160

30101412

FIGURE 2. SPI Write Timing

30101413

FIGURE 3. SPI Read Timing

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ADC16DV160

Specification Definitions

APERTURE DELAY is the time after the falling edge of the

clock to when the input signal is acquired or held for conver-

sion.

APERTURE JITTER (APERTURE UNCERTAINTY) is the

variation in aperture delay from sample to sample. Aperture

jitter manifests itself as noise in the output.

CLOCK DUTY CYCLE is the ratio of the time during one cycle

that a repetitive digital waveform is high to the total time of

one period. The specification here refers to the ADC clock

input signal.

COMMON MODE VOLTAGE (VCM) is the common DC volt-

age applied to both input terminals of the ADC.

CONVERSION LATENCY is the number of clock cycles be-

tween initiation of conversion and the time when data is

presented to the output driver stage. Data for any given sam-

ple is available at the output pins the Pipeline Delay plus the

Output Delay after the sample is taken. New data is available

at every clock cycle, but the data lags the conversion by the

pipeline delay.

CROSSTALK is the coupling of energy from one channel into

the other channel.

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of

the maximum deviation from the ideal step size of 1 LSB.

FULL POWER BANDWIDTH is a measure of the frequency

at which the reconstructed output fundamental drops 3 dB

below its low frequency value for a full scale input.

GAIN ERROR is the deviation from the ideal slope of the

transfer function. It can be calculated as:

Gain Error = Positive Full Scale Error − Negative Full Scale

Error

It can also be expressed as Positive Gain Error and Negative

Gain Error, which are calculated as:

PGE = Positive Full Scale Error - Offset Error

NGE = Offset Error - Negative Full Scale Error

INTEGRAL NON LINEARITY (INL) is a measure of the de-

viation of each individual code from a best fit straight line. The

deviation of any given code from this straight line is measured

from the center of that code value.

INTERMODULATION DISTORTION (IMD) is the creation of

additional spectral components as a result of two sinusoidal

frequencies being applied to the ADC input at the same time.

It is defined as the ratio of the power in the intermodulation

products to the total power in the original frequencies. IMD is

usually expressed in dBFS.

LSB (LEAST SIGNIFICANT BIT) is the bit that has the small-

est value or weight of all bits. This value is VFS/2n, where

“VFS” is the full scale input voltage and “n” is the ADC reso-

lution in bits.

MISSING CODES are those output codes that will never ap-

pear at the ADC outputs. The ADC16DV160 is guaranteed

not to have any missing codes.

MSB (MOST SIGNIFICANT BIT) is the bit that has the largest

value or weight. Its value is one half of full scale.

NEGATIVE FULL SCALE ERROR is the difference between

the actual first code transition and its ideal value of ½ LSB

above negative full scale.

OFFSET ERROR is the difference between the two input

voltages (VIN+ – VIN-) required to cause a transition from code

32767LSB and 32768LSB with offset binary data format.

PIPELINE DELAY (LATENCY) See CONVERSION LATEN-

CY.

POSITIVE FULL SCALE ERROR is the difference between

the actual last code transition and its ideal value of 1½ LSB

below positive full scale.

POWER SUPPLY REJECTION RATIO is a measure of how

well the ADC rejects a change in the power supply voltage.

PSRR is the ratio of the Full-Scale output of the ADC with the

supply at the minimum DC supply limit to the Full-Scale output

of the ADC with the supply at the maximum DC supply limit,

expressed in dB.

SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in

dB, of the power of input signal to the total power of all other

spectral components below one-half the sampling frequency,

not including harmonics and DC.

SIGNAL TO NOISE AND DISTORTION (SINAD) Is the ratio,

expressed in dB, of the power of the input signal to the total

power of all of the other spectral components below half the

clock frequency, including harmonics but excluding DC.

SPUR (SPUR) is the difference, expressed in dB, between

the power of input signal and the peak spurious signal power,

where a spurious signal is any signal present in the output

spectrum that is not present at the input excluding the second

and third harmonic distortion.

SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-

ence, expressed in dB, between the power of input signal and

the peak spurious signal power, where a spurious signal is

any signal present in the output spectrum that is not present

at the input.

TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-

pressed in dB, of the total power of the first eight harmonics

to the input signal power. THD is calculated as:

where f12 is the power of the fundamental frequency and f22

through f92 are the powers of the first eight harmonics in the

output spectrum.

SECOND HARMONIC DISTORTION (2ND HARM or H2) is

the difference expressed in dB, from the power of its 2nd har-

monic level to the power of the input signal.

THIRD HARMONIC DISTORTION (3RD HARM or H3) is the

difference expressed in dB, from the power of the 3rd har-

monic level to the power of the input signal.

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ADC16DV160

Typical Performance Characteristics, DNL, INL

Unless otherwise noted, these specifications apply: VA3.0= +3.0V, VA1.8, VDR = 1.8V, fCLK = 160 MSPS. Differential Clock Mode,

Offset Binary Format. LVDS Rterm = 100 Ω. CL = 5 pF. Typical values are at TA = +25°C. Fin = 32.4MHz with –1dBFS.

DNL

30101441

INL

30101442

DNL vs.VA3.0

30101443

INL vs .VA3.0

30101444

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ADC16DV160

Typical Performance Characteristics, Dynamic Performance

Unless otherwise noted, these specifications apply: VA3.0= +3.0V, VA1.8, VDR = 1.8V, fCLK = 160 MSPS. Differential Clock Mode,

Offset Binary Format. LVDS Rterm = 100 Ω. CL = 5 pF. Typical values are at TA = +25°C. Fin = 197MHz with –1dBFS.

SNR, SINAD, SFDR vs. fIN

30101415

DISTORTION vs. fIN

30101416

SNR, SINAD, SFDR vs. VA3.0

30101417

DISTORTION vs. VA3.0

30101418

SNR, SINAD, SFDR vs. VA1.8

30101425

DISTORTION vs. VA1.8

30101426

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ADC16DV160

SNR, SFDR vs. Input Amplitude (dBFS)

30101471

SNR, SFDR vs. Input Amplitude (dBc)

30101472

Spectral Response @ 10.1 MHz

30101461

Spectral Response @ 32.5 MHz

30101462

Spectral Response at 70 MHz

30101463

Spectral Response @ 150 MHz

30101464

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ADC16DV160

Spectral Response @ 197 MHz

30101465

Spectral Response @ 220 MHz

30101466

Spectral Response @ 197 MHz, -7dBFS

30101467

Two Tone Spectral Response @ 197 MHz, 203 MHz

30101468

Power vs. Temperature

30101427

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ADC16DV160

Functional Description

Operating on dual +1.8V and +3.0V supplies, the AD-

C16DV160 digitizes a differential analog input signal to 16

bits, using a differential pipelined architecture with error cor-

rection circuitry and an on-chip sample-and-hold circuit to

ensure maximum performance. The user has the choice of

using an internal 1.2V stable reference, or using an external

1.2V reference. The internal 1.2V reference has a high output

impedance of > 9 kΩ and can be easily over-driven by an

external reference. A 3-wire SPI-compatible serial interface

facilitates programming and control of the ADC16DV160.

ADC Architecture

The ADC16DV160 architecture consists of a dual channel

highly linear and wide bandwidth sample-and-hold circuit, fol-

lowed by a switched capacitor pipeline ADC. Each stage of

the pipeline ADC consists of low resolution flash sub-ADC

and an inter-stage multiplying digital-to-analog converter

(MDAC), which is a switched capacitor amplifier with a fixed

stage signal gain and DC level shifting circuits. The amount

of DC level shifting is dependent on sub-ADC digital output

code. A 16-bit final digital output is the result of the digital error

correction logic, which receives the digital output of each

stage including redundant bits to correct offset error of each

sub-ADC.

Applications Information

1.0 OPERATING CONDITIONS

We recommend that the following conditions be observed for

operation of the ADC16DV160:

2.7V ≤ VA3.0 ≤ 3.6V

1.7V ≤ VA1.8 ≤ 1.9V

1.7V ≤ VDR ≤ 1.9V

20 MSPS ≤ FCLK ≤ 160 MSPS

VREF ≤ 1.2V

VCM = 1.15V (from VRM)

2.0 ANALOG INPUTS

The analog input circuit of the ADC16DV160 is a differential

switched capacitor sample-and-hold circuit (see Figure 4) that

provides optimum dynamic performance wide input frequency

range with minimum power consumption. The clock signal al-

ternates sample mode (QS) and hold mode (QH). An integrat-

ed low jitter duty cycle stabilizer ensures constant optimal

sample and hold time over a wide range of input clock duty

cycle. The duty cycle stabilizer is always turned on during

normal operation.

During sample mode, analog signals (VIN+, VIN-) are sampled

across two sampling capacitors (CS) while the amplifier in the

sample-and-hold circuit is idle. The dynamic performance of

the ADC16DV160 is likely determined during sampling mode.

The sampled analog inputs (VIN+, VIN-) are held during hold

mode by connecting input side of the sampling capacitors to

output of the amplifier in the sample-and-hold circuit while

driving pipeline ADC core.

The signal source, which drives the ADC16DV160, is recom-

mended to have a source impedance less than 100Ω over a

wide frequency range for optimal dynamic performance.

A shunt capacitor can be placed across the inputs to provide

high frequency dynamic charging current during sample

mode and also absorb any switching charge coming from the

ADC16DV160. A shunt capacitor can be placed across each

input to GND for similar purpose. Smaller physical size and

low ESR and ESL shunt capacitors are recommended.

The value of shunt capacitance should be carefully chosen to

optimize the dynamic performance at specific input frequency

range. Larger value shunt capacitors can be used for lower

input frequencies, but the value has to be reduced at high

input frequencies.

Balancing impedance at positive and negative input pin over

entire signal path must be ensured for optimal dynamic per-

formance.

30101406

FIGURE 4. Simplified Switched-Capacitor Sample-and-hold Circuit

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ADC16DV160

Input Common Mode

The analog inputs of the ADC16DV160 are not internally dc

biased and the range of input common mode is very narrow.

Hence it is highly recommended to use the common mode

voltage (VRM, typically 1.15V) as input common mode for op-

timal dynamic performance regardless of DC and AC coupling

applications. Input common mode signal must be decoupled

with low ESL 0.1 μF input bias resistors to minimize noise

performance degradation due to any coupling or switching

noise between the ADC16DV160 and input driving circuit.

Driving Analog Inputs

For low frequency applications, either a flux or balun trans-

former can convert single-ended input signals into differential

and drive the ADC16DV160 without additive noise. An exam-

ple is shown in Figure 5. The VRM pin is used to bias the input

common mode by connecting the center tap of the

transformer’s secondary ports. A flux transformer is used for

this example, but AC coupling capacitors enable the use of a

balun type transformer.

30101407

FIGURE 5. Transformer Drive Circuit for Low Input Frequency

Transformers act as band pass filters. The lower frequency

limit is set by saturation at frequencies below a few MHz and

parasitic resistance and capacitance set the upper frequency

limit. The transformer core will be saturated with excessive

signal power and it causes distortion as the equivalent load

termination becomes heavier at high input frequencies. This

is a reason to reduce shunt capacitors for high IF sampling

applications to balance the amount of distortion caused by the

transformer and charge kick-back noise from the device.

As input frequency goes higher with the input network in Fig-

ure 5, amplitude and phase unbalance increase between

positive and negative inputs (VIN+ and VIN-) due to the inherent

impedance mismatch between the two primary ports of the

transformer since one is connected to the signal source and

the other is connected to GND. Distortion increases as a re-

sult.

The cascaded transmission line (balun) transformers in Fig-

ure 6 can be used for high frequency applications like high IF

sampling base station receive channels. The transmission

line transformer has less stray capacitance between primary

and secondary ports and so the impedance mismatch at the

secondary ports is effectively less even with the given inher-

ent impedance mismatch on the primary ports. Cascading two

transmission line transformers further reduces the effective

stray capacitance from the secondary ports of the secondary

transformer to primary ports of first transformer, where the

impedance is mismatched. A transmission line transformer,

for instance MABACT0040 from M/A-COM, with a center tap

on the secondary port can further reduce amplitude and

phase mismatch.

30101408

FIGURE 6. Transformer Drive Circuit for High Input Frequency

Equivalent Input Circuit and Its S11

The input circuit of the ADC16DV160 during sample mode is

a differential switched capacitor as shown in Figure 7. The

bottom plate sampling switch is bootstrapped in order to re-

duce its turn on impedance and its variation across input

signal amplitude. Bottom plate sampling switches, and top

plate sampling switch are all turned off during hold mode. The

sampled analog input signal is processed through the follow-

ing pipeline ADC core. The equivalent impedance changes

drastically between sample and hold mode and a significant

amount of charge injection occurs during the transition be-

tween the two operating modes.

Distortion and SNR heavily rely on the signal integrity,

impedance matching during sample mode and charge injec-

tion due to the sampling switches.

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ADC16DV160

30101409

FIGURE 7. Input Equivalent Circuit

The S11 of the input circuit of the ADC16DV160 is shown in

Figure 8. Up to 500 MHz, it is predominantly capacitive load-

ing with small stray resistance and inductance as shown in

Figure 8. An appropriate resistive termination at a given input

frequency band has to be added to improve signal integrity.

Any shunt capacitor on the analog input pin deteriorates sig-

nal integrity but it provides high frequency charge to absorb

the charge injected by the sampling switches. An optimal

shunt capacitor is dependent on input signal frequency as well

as the impedance characteristic of the analog input signal

path including components like transformers, termination re-

sistors, and AC coupling capacitors.

30101429

FIGURE 8. ADC16DV160 Input S11

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ADC16DV160

3.0 CLOCK INPUT CONSIDERATIONS

Clock Input Modes

The ADC16DV160 provides a low additive jitter differential

clock receiver for optimal dynamic performance over a wide

input frequency range. The input common mode of the clock

receiver is internally biased at VA1.8/2 through a 10 kΩ resistor

as shown in Figure 9. Normally the external clock input should

be AC-coupled. It is possible to DC-couple the clock input, but

the common mode (average voltage of CLK+ and CLK-) must

not be higher than VA1.8/2 to prevent substantial tail current

reduction leading to lowered jitter performance. CLK+ and

CLK- should never be lower than AGND. A high speed back-

to-back diode connected between CLK+ and CLK- can limit

the maximum swing, but this could cause signal integrity con-

cerns when the diode turns on and reduces the load

impedance instantaneously.

The preferred differential transformer coupled clocking ap-

proach is shown in Figure 10. A 0.1 μF decoupling capacitor

on the center tap of the secondary of a flux type transformer

stabilizes clock input common mode. Differential clocking in-

creases the maximum amplitude of the clock input at the pins

6dB vs. the singled-ended circuit shown in Figure 11. The

clock amplitude is recommended to be as large as possible

while CLK+ and CLK- both never exceed the supply rails of

VA1.8 and AGND. With the equivalent input noise of the dif-

ferential clock receiver shown in Figure 9, a larger clock

amplitude at CLK+ and CLK- pins increases its slope around

the zero-crossing point so that higher signal-to-noise results.

30101431

FIGURE 9. Equivalent Clock Receiver

The differential receiver of the ADC16DV160 has an extreme-

ly low-noise floor but its bandwidth is also extremely wide. The

wide band clock noise folds back into the first Nyquist zone at

the ADC output. Increased slope of the input clock lowers the

equivalent noise contributed by the differential receiver.

A band-pass filter (BPF) with narrow pass band and low in-

sertion loss can be added to the clock input signal path when

the wide band noise of the clock source is noticeably large

compared to the input equivalent noise of the differential clock

receiver.

Load termination can be a combination of R and C instead of

a pure R. This RC termination can improve the noise perfor-

mance of the clock signal path by filtering out high frequency

noise through a low pass filter. The size of R and C is depen-

dent on the clock rate and slope of the clock input.

An LVPECL and/or LVDS driver can also drive the AD-

C16DV160. However the full dynamic performance of the

ADC16DV160 might not be achieved due to the high noise

floor of the driving circuit itself especially in high IF sampling

applications.

30101432

FIGURE 10. Differential Clocking, Transformer Coupled

A singled-ended clock can drive the CLK+ pin through a 0.1

µF AC coupling capacitor while CLK- is decoupled to AGND

through a 0.1 μF capacitor as shown in Figure 11.

30101433

FIGURE 11. Singled-Ended 1.8V Clocking, Capacitive AC

Coupled

Duty Cycle Stabilizer

The highest operating speed with optimal performance can

only be achieved with a 50% clock duty cycle because the

switched-capacitor circuit of the ADC16DV160 is designed to

have equal amount of settling time between each stage. The

maximum operating frequency could be reduced accordingly

when the clock duty cycle departs from 50%.

The ADC16DV160 contains a duty cycle stabilizer that ad-

justs the non-sampling (rising) clock edge to make the duty

cycle of the internal clock 50% for a 30-to-70% input clock

duty cycle. The duty cycle stabilizer is always on because the

noise and distortion performance are not affected at all. It is

not recommended to use the ADC16DV160 at clock frequen-

cies less than 20 MSPS where the feedback loop in the duty

cycle stabilizer becomes unstable.

Clock Jitter vs. Dynamic Performance

High speed and high resolution ADCs require a low-noise

clock input to ensure full dynamic performance over wide in-

put frequency range. SNR (SNRFin) at a given input frequency

(Fin) can be calculated by:

30101434

with a given total noise power (VN2) of an ADC, total rms jitter

(Tj), and input amplitude (A) in dBFS.

The clock signal path must be treated as an analog signal

whenever aperture jitter affects the dynamic performance of

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ADC16DV160

the ADC16DV160. Power supplies for the clock drivers have

to be separated from the ADC output driver supplies to pre-

vent modulating the clock signal with the ADC digital output

signals. Higher noise floor and/or increased distortion/spur

may result from any coupling of noise from the ADC digital

output signals to the analog input and clock signals.

In IF sampling applications, the signal-to-noise ratio is partic-

ularly affected by clock jitter as shown in Figure 12. Tj is the

integrated noise power of the clock signal divided by the slope

of clock signal around the tripping point. The upper limit of the

noise integration is independent of applications and set by the

bandwidth of the clock signal path. However, the lower limit

of the noise integration highly relies on the application. In base

station receive channel applications, the lower limit is deter-

mined by the channel bandwidth and space from an adjacent

channel.

30101435

FIGURE 12. SNR with given Jitter vs. Input Frequency

4.0 CALIBRATION

The automatic calibration engine contained within the AD-

C16DV160 improves dynamic performance and reduces its

part-to-part variation. Digital output signals including output

clock (OUTCLK+/-) are all logic low while calibrating. The AD-

C16DV160 is automatically calibrated when the device is

powered up. Optimal dynamic performance might not be ob-

tained if the power-up time is longer than the internal delay

time (~32 mS @ 160 MSPS clock rate). In this case, the AD-

C16DV160 can be re-calibrated by asserting and then de-

asserting power down mode. Re-calibration is recommended

whenever the operating clock rate changes.

5.0 VOLTAGE REFERENCE

A stable and low-noise voltage reference and its buffer am-

plifier are built into the ADC16DV160. The input full scale is

two times VREF, which is the same as VBG (the on-chip

bandgap output with a 10 kΩ output impedance) as well as

VRP - VRN as shown in Figure 13. The input range can be

adjusted by changing VREF either internally or externally. An

external reference with low output impedance can easily over-

drive the VREF pin. The default VREF is 1.2V. The input com-

mon mode voltage (VRM) is a fixed voltage level of 1.15V.

Maximum SNR can be achieved at the maximum input range

where VREF = 1.2V. Although the ADC16DV160's dynamic

and static performance is optimized at a VREF of 1.2V, reduc-

ing VREF can improve SFDR performance by sacrificing some

of the ADC16DV160's SNR performance.

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ADC16DV160

30101436

FIGURE 13. Internal References and their Decoupling

Reference Decoupling

It is highly recommended to place the external decoupling

capacitors connected to VRP, VRN, VRM and VREF pins as close

to the pins as possible. The external decoupling capacitors

should have minimal ESL and ESR. During normal operation,

inappropriate external decoupling with large ESL and/or ESR

capacitors increase the settling time of the ADC core and re-

sult in lower SFDR and SNR performance. The VRM pin may

be loaded up to 1mA for setting input common mode. The

remaining pins should not be loaded. Smaller capacitor val-

ues might result in degraded noise performance. The decou-

pling capacitor on the VREF pin must not exceed 0.1 μF.

Additional decoupling on this pin will cause improper calibra-

tion during power-up. All the reference pins except VREF have

a very low output impedance. Driving these pins via a low-

output impedance external circuit for a long time period may

damage the device.

When the VRM pin is used to set the input common mode level

via transformer, a smaller series resistor should be placed on

the signal path to isolate any switching noise between the

ADC core and input signal. The series resistor introduces a

voltage error between VRM and VCM due to charge injection

while the sampling switches are toggling. The series resis-

tance should not be larger than 50Ω.

All grounds associated with each reference and analog input

pin should be connected to a solid and quiet ground on the

PC board. Coupling noise from digital outputs and their sup-

plies to the reference pins and their ground can cause de-

graded SNR and SFDR performance.

6.0 LAYOUT AND GROUNDING

Proper grounding and proper routing of all signals are essen-

tial to ensure accurate conversion. Maintaining separate ana-

log and digital areas of the board, with the ADC16DV160

between these areas, is required to achieve the specified

performance.

Even though LVDS outputs reduce ground bounce, the pos-

itive and negative signal path have to be well matched, and

their traces should be kept as short as possible. It is recom-

mend to place an LVDS repeater between the ADC16DV160

and digital data receiver block to prevent coupling noise from

the receiving block when the length of the traces are long or

the noise level of the receiving block is high.

Capacitive coupling between the typically noisy digital circuit-

ry and the sensitive analog circuitry can lead to poor perfor-

mance. The solution is to keep the analog circuitry separated

from the digital circuitry, and to keep the clock line as short as

possible.

Since digital switching transients are composed largely of

high frequency components, total ground plane copper

weight will have little effect upon the logic-generated noise.

Because of the skin effect, the total surface area is more im-

portant than its thickness.

Generally, analog and digital lines should not cross. However

whenever it is inevitable, make sure that these lines are

crossing each other at 90° to minimize cross talk. Digital out-

put and output clock signals must be separated from analog

input, references and clock signals unconditionally to ensure

the maximum performance from the ADC16DV160. Any cou-

pling may result in degraded SNR and SFDR performance

especially for high IF applications.

Be especially careful with the layout of inductors and trans-

formers. Mutual inductance can change the characteristics of

the circuit in which they are used. Inductors and transformers

should not be placed side by side, even with just a small part

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ADC16DV160

of their bodies beside each other. For instance, place trans-

formers for the analog input and the clock input at 90° to one

another to avoid magnetic coupling. It is recommended to

place the transformers of the input signal path on the top side,

and the transformer for the clock signal path on the bottom

side. Every critical analog signal path like analog inputs and

clock inputs must be treated as a transmission line and should

have a solid ground return path with a small loop area.

The analog input should be isolated from noisy signal traces

to avoid coupling of spurious signals into the input. Any ex-

ternal component (e.g., a filter capacitor) connected between

the converter’s input pins and ground or to the reference pins

and ground should be connected to a very clean point in the

ground plane.

All analog circuitry (input amplifiers, filters, reference compo-

nents, etc.) should be placed in the analog area of the board.

All digital circuitry and dynamic I/O lines should be placed in

the digital area of the board. The ADC16DV160 should be

between these two areas. Furthermore, all components in the

reference circuitry and the input signal chain that are con-

nected to ground should be connected together with short

traces and enter the ground plane at a single, quiet point. All

ground connections should have a low inductance path to

ground.

The ground return current path can be well managed when

the supply current path is precisely controlled and the ground

layer is continuous and placed next to the supply layer. This

is because of the proximity effect. A ground return current

path with a large loop area will cause electro-magnetic cou-

pling and results in poor noise performance. Note that even if

there is a large plane for a current path, the high-frequency

return current path is not spread evenly over the large plane,

but only takes the path with lowest impedance. Instead of a

large plane, using a thick trace for supplies makes it easy to

control the return current path. It is recommended to place the

supply next to the GND layer with a thin dielectric for a smaller

ground return loop. Proper location and size of decoupling

capacitors provides a short and clean return current path.

7.0 SUPPLIES AND THEIR SEQUENCE

There are three supplies for the ADC16DV160: one 3.0V sup-

ply VA3.0 and two 1.8V supplies VA1.8 and VDR. It is recom-

mended to separate VDR from VA1.8 supplies, any coupling

from VDR to the rest of the supplies and analog signals could

cause lower SFDR and noise performance. When VA1.8 and

VDR are both from the same supply source, coupling noise

can be mitigated by adding a ferrite-bead on the VDR supply

path.

Different decoupling capacitors can be used to provide cur-

rent over wide frequency range. The decoupling capacitors

should be located close to the point of entry and close to the

supply pins with minimal trace length. A single ground plane

is recommended because separating ground under the

ADC16DV160 could cause an unexpected long return current

path.

The VA3.0 supply must turn on before VA1.8 and/or VDR reaches

a diode turn-on voltage level. If this supply sequence is re-

versed, an excessive amount of current will flow through the

VA3.0 supply. The ramp rate of the VA3.0 supply must be kept

less than 60 V/mS (i.e., 60 μS for 3.0V supply) in order to

prevent excessive surge current through ESD protection de-

vices.

8.0 SERIAL CONTROL INTERFACE

The ADC16DV160 has a serial control interface that allows

access to the control registers. The serial interface is a gener-

ic 3-wire synchronous interface that is compatible with SPI-

type interfaces that are used on many microcontrollers and

DSP controllers. Each serial interface access cycle is exactly

16 bits long. A register-read or register-write can be accom-

plished in one cycle. Register space supported by this inter-

face is 64. Figure 14 and Figure 15 show the access protocol

used by this interface. Each signal’s function is described be-

low. The SPI must be in a static condition during the normal

operation of the ADC16DV160, otherwise the performance of

the ADC16DV160 may degrade due to the coupling noise

generated by the SPI control signals. When a SPI bus is used

for multiple devices on the board, it is recommended to reduce

the potential for noise coupling by placing logic buffers be-

tween the SPI bus and the ADC16DV160.

30101451

FIGURE 14. Serial Interface Protocol (Write Operation)

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ADC16DV160

30101452

FIGURE 15. Serial Interface Protocol (Read Operation)

Signal Descriptions

SCLK: Used to register the input date (SDI) on the rising

edge; and to source the output data (SDO) on the

falling edge. User may disable clock and hold it in the

low-state, as long as clock pulse width min. spec is

not violated when clock is enabled or disabled.

CSB: Chip Select Bar. Each assertion starts a new register

access – i.e., the SDATA field protocol is required.

CSB should be de-asserted after the 16th clock. If the

CSB is de-asserted before the 16th clock, no address

or data write will occur. The rising edge captures the

address just shifted-in and, in the case of a write op-

eration, writes the addressed register.

SDIO: Serial Data. Must observe setup/hold requirements

with respect to the SCLK. Each cycle is 16-bit long.

•R/W: A value of ‘1’ indicates a read operation, while a

value of ‘0’ indicates a write operation

•Reserved: Reserved for future use. Must be set to 0.

•ADDR: Up to 64 registers can be addressed.

•DATA: In a write operation the value in this field will be

written to the register addressed in this cycle when CSB

is de-asserted. In a read operation this field is ignored.

9.0 FIXED PATTERN MODE

The ADC16DV160 provides user defined fixed patterns at

digital output pins to check timing and connectivity with the

receiving device on the board. The fixed pattern map is shown

in Figure 16; there are 6 hard-wired fixed patterns (PATTERN

(000) to PATTERN (101)) and 2 user-defined patterns (PAT-

TERN (110) and PATTERN (111)). PATTERN (110) and

PATTERN (111) can be written via SPI and all ‘0’s are the

default values for both. See Register Map address 0CH

through 0FH for the details.

30101453

FIGURE 16. Fixed Pattern Map

For flexibility, the user can determine a fixed pattern with a

depth of 8 patterns as shown in Figure 17. The user can fill

these 8 sequences (SEQ0 – SEQ7) with an arbitrary pattern

(PATTERN (000) – PATTERN (111)). See Register Map ad-

dress 08h through 0Bh below for the details. The default

which generates alternating 0xFF and 0x00 at the ADC output

as shown in Figure 18. Note that since the ADC outputs odd

bits on the falling edge of the OUTCLK and even bits on the

rising edge, the resulting 16-bit output codes are 0xAAAA.

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ADC16DV160

30101454

FIGURE 17. State Machine Generating Fixed Pattern Sequence

30101455

FIGURE 18. Fixed Pattern at ADC Output with Default SPI Register Values

10.0 SAMPLING EDGE

The internal clock divider features allows more flexible design

from the perspective of the system clocking scheme. The

ADC16DV160 supports divide by 1 or 2 clocking. This feature

may cause a potential issue when synchronizing the sample

edge of multiple ADCs when the internal clock is divided by 2

from the input clock (CLKIN). The ADC16DV160 samples the

analog input signal at the falling edge of the input clock, which

will be the falling edge of the internally divided by 2 clock when

divide by 2 is configured as shown as dashed lines in Figure

19 below. If there is some timing skew of the SPI control sig-

nals and/or input clock between multiple ADCs with this clock-

ing configuration, the sampling edge of some ADC, which is

ADC SLAVE I for this example, could be out of phase com-

pared to the ADC MASTER as shown in Figure 19. The

sampling edge of the non-synchronized ADC can be syn-

chronized if the internal clock can be inverted through some

control bit. This sampling edge flipping function is provided by

the ADC16DV160 via SPI. See the SPI Register Map below

for the details.

30101456

FIGURE 19. Sampling Edge of Multiple ADCs with

Internal Division On

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ADC16DV160

Note: Accessing unspecified addresses may cause functional failure or damage. All reserved bits must be written with the listed

default values.

Operation Mode Addr: 00h R/W

7 6 5 4 3 2 1 0

DF Operation Mode Reserved Full Scale Default

Bit 7 Data Format

1 Two's Complement

0 Offset Binary (Default)

Bits (6:5) Operation Mode

0 0 Normal Operation (Default)

0 1 Sleep Mode. Device is powered down, but it can wake up quickly.

1 0 Power down mode. Device is powered down at lowest power dissipation.

1 1 Fixed pattern mode. Device outputs fixed patterns to check connectivity with interfacing

components.

Bit 4 Reserved. Must be set to 0.

Bit 3 Reserved. Must be set to 0.

Bit 2 Reserved. Must be set to 1.

Bit 1 Full scale. Full scale can be adjusted from 2.0 to 2.4VPP.

0 2.0VPP

1 2.4VPP (default)

Bit 0 Restore Default Register Values. Default values of SPI registers can be restored at the rising edge of this bit.

1 Restore default register values

0 As is (default)

Synchronization Mode Addr: 01h R/W

7 6 5 4 3 2 1 0

Sample

Phase

Clock Divider Reserved Output Clock Phase Reserved Reserved

Bit 7 Sampling Clock Phase. This is for synchronizing sampling edge for multiple devices while the ADC16DV160 is

configured at clock divide by 2.

0 Keep sampling edge as is (default).

1 Invert internal clock to adjust sampling edge.

Bit 6 Clock divider. Internal operating clock frequency can be programmed either to be divided by 1 or 2.

0 Divide by 1 (default).

1 Divide by 2

Bit 5 Reserved. Must be set to 0.

Bits (4:2) Output Clock Phase Adjustment. User can adjust output clock phase from 31° to 143°. Each 1 LSB increment

results in about 16° of output clock phase increase.

0 0 0 31°

0 0 1 47°

0 1 0 63°

0 1 1 79°

1 0 0 95° (default)

1 0 1 111°

1 1 0 127°

1 1 1 143°

Bit 1 Reserved. Must be set to 0.

Bit 0 Reserved. Must be set to 0.

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ADC16DV160

Fixed Pattern Mode:

SEQ0 and SEQ1 Addr: 08h R/W

7 6 5 4 3 2 1 0

SEQ1<2> SEQ1<1> SEQ1<0> SEQ0<2> SEQ0<1> SEQ0<0> Reserved Reserved

Bits (7:5) 3 bit pattern code for SEQ1. 010 is the default.

Bits (4:2) 3 bit pattern code for SEQ0. 010 is the default.

Bit 1 Reserved, Must be set to 0.

Bit 0 Reserved, Must be set to 0.

Fixed Pattern Mode:

SEQ2 and SEQ3 Addr: 09h R/W

7 6 5 4 3 2 1 0

SEQ3<2> SEQ3<1> SEQ3<0> SEQ2<2> SEQ2<1> SEQ2<0> Reserved Reserved

Bits (7:5) 3 bit pattern code for SEQ3. 010 is the default.

Bits (4:2) 3 bit pattern code for SEQ2. 010 is the default.

Bit 1 Reserved, Must be set to 0.

Bit 0 Reserved, Must be set to 0.

Fixed Pattern Mode:

SEQ4 and SEQ5 Addr: 0Ah R/W

7 6 5 4 3 2 1 0

SEQ5<2> SEQ5<1> SEQ5<0> SEQ4<2> SEQ4<1> SEQ4<0> Reserved Reserved

Bits (7:5) 3 bit pattern code for SEQ5. 010 is the default.

Bits (4:2) 3 bit pattern code for SEQ4. 010 is the default.

Bit 1 Reserved, Must be set to 0.

Bit 0 Reserved, Must be set to 0.

Fixed Pattern Mode:

SEQ6 and SEQ7 Addr: 0Bh R/W

7 6 5 4 3 2 1 0

SEQ7<2> SEQ7<1> SEQ7<0> SEQ6<2> SEQ6<1> SEQ6<0> Reserved Reserved

Bits (7:5) 3 bit pattern code for SEQ7. 010 is the default.

Bits (4:2) 3 bit pattern code for SEQ6. 010 is the default.

Bit 1 Reserved, Must be set to 0.

Bit 0 Reserved, Must be set to 0.

Fixed Pattern Mode:

LSB PATTERN <110> Addr: 0Ch R/W

7 6 5 4 3 2 1 0

D<7> D<6> D<5> D<4> D<3> D<2> D<1> D<0>

Bits (7:0) 8 LSBs of a fixed pattern for Sequence >110>

All '0' for default.

Fixed Pattern Mode:

MSB PATTERN <110> Addr: 0Dh R/W

7 6 5 4 3 2 1 0

D<7> D<6> D<5> D<4> D<3> D<2> D<1> D<0>

Bits (7:0) 8 MSBs of a fixed pattern for Sequence >110>

All '0' for default.

www.national.com 26

ADC16DV160

Fixed Pattern Mode:

LSB PATTERN <111> Addr: 0Eh R/W

7 6 5 4 3 2 1 0

D<7> D<6> D<5> D<4> D<3> D<2> D<1> D<0>

Bits (7:0) 8 LSBs of a fixed pattern for Sequence >111>

All '0' for default.

Fixed Pattern Mode:

MSB PATTERN <1110> Addr: 0Fh R/W

7 6 5 4 3 2 1 0

D<7> D<6> D<5> D<4> D<3> D<2> D<1> D<0>

Bits (7:0) 8 MSBs of a fixed pattern for Sequence >111>

All '0' for default.

27 www.national.com

ADC16DV160

Physical Dimensions inches (millimeters) unless otherwise noted

68-Lead LLP Package

Ordering Number ADC16DV160CILQ

NS Package Number LQA68A

www.national.com 28

ADC16DV160

Notes

29 www.national.com

ADC16DV160

Notes

ADC16DV160 Dual Channel, 16-Bit, 160 MSPS Analog-to-Digital Converter with LVDS Outputs

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