ALPHA & OMEGA SEMICONDUCTOR TSOP6 PACKAGE OUTLINE : Document No. PO00002 Version rev H mo & z 6 =0.25mm C Try 010mm RECOMMENDED LAND PATTERN aH GE rh [= 9.80 = 2.40 19.63 UNIT: mm NOTE DIMENSIONS IN MILLIMETERS 0.80 0.70 0.08 2.50 1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH AT THE NON-LEAD SIDES SHOULD BE LESS THAN 5 MILS EACH. 2. DIMENSION "L" IS MEASURED IN GAUGE PLANE. 3. TOLERANCE +0.100 mm(4 mil) UNLESS OTHERWISE SPECIFIED. 4. FOLLOWED FROM JEDEC MO-178C & MO-193C. 5. CONTROLLING DIMENSIONS IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 0.95 BSC. MAX 1.25 0.031 1.20 0.028 0.20 0.003 3.10 0.098 DIMENSIONS IN INCHES MAX = 0.049 0.043 0.047 0.005 0.008 0.110 0.122 0.037BSC.