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Rev E
PRELIMINARY
Electrical Specifications **
Features:
1700-2300 MHz
AMPS, GSM, WCDMA & LTE
High Power
Very Low Loss
Tight Amplitude Balance
High Isolation
Production Friendly
Tape and Reel
Lead-Free
Frequency
Isolation
Insertion
Loss
VSWR
Amplitude
Balance
MHz
dB Min
dB Max
Max : 1
dB Max
1700-2300
20
0.25
1.22
± 0.4
1805-1880
23
0.20
1.22
± 0.3
1930-1990
26
0.20
1.12
± 0.3
2110-2200
20
0.20
1.22
± 0.3
Phase
Group Delay
Power
JC
Operating
Temp.
Degrees
ns
Avg. CW Watts
at 95º C
ºC/Watt
ºC
90 ± 4.0
0.14 ± 0.04
25
54.43
-55 to +140
90 ± 3.0
0.14 ± 0.04
25
54.43
-55 to +140
90 ± 3.0
0.14 ± 0.04
25
54.43
-55 to +140
90 ± 3.0
0.14 ± 0.04
25
54.43
-55 to +140
**Specification based on performance of unit properly installed on Anaren Test Board with small signal applied.
Specifications subject to change without notice. Refer to parameter definitions for details.
Mechanical Outline
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Rev E
Hybrid Coupler Pin Configuration
The X3C19F1-03S has an orientation marker to denote Pin 1. Once port one has been identified the other ports are
known automatically. Please see the chart below for clarification:
Configuration
Pin 1
Pin 2
Pin 3
Pin 4
Splitter
Input
Isolated
-3dB
90
-3dB
Splitter
Isolated
Input
-3dB
-3dB
90
Splitter
-3dB
90
-3dB
Input
Isolated
Splitter
-3dB
-3dB
90
Isolated
Input
*Combiner
A
90
A
Isolated
Output
*Combiner
A
A
90
Output
Isolated
*Combiner
Isolated
Output
A
90
A
*Combiner
Output
Isolated
A
A
90
*Notes: “A” is the amplitude of the applied signals. When two quadrature signals with equal amplitudes are
applied to the coupler as described in the table, they will combine at the output port. If the amplitudes are
not equal, some of the applied energy will be directed to the isolated port.
The actual phase,
, or amplitude at a given frequency for all ports, can be seen in our de-embedded s-
parameters, that can be downloaded at www.anaren.com.
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PRELIMINARY
Insertion Loss and Power Derating Curves
Insertion Loss Derating:
The insertion loss, at a given frequency, of a group of
couplers is measured at 25C and then averaged. The
measurements are performed under small signal
conditions (i.e. using a Vector Network Analyzer). The
process is repeated at 85C and 150C. A best-fit line for
the measured data is computed and then plotted from -
55C to 150C.
Power Derating:
The power handling and corresponding power derating
plots are a function of the thermal resistance, mounting
surface temperature (base plate temperature), maximum
continuous operating temperature of the coupler, and the
thermal insertion loss. The thermal insertion loss is
defined in the Power Handling section of the data sheet.
As the mounting interface temperature approaches the
maximum continuous operating temperature, the power
handling decreases to zero.
If mounting temperature is greater than 95C, Xinger
coupler will perform reliably as long as the input power
is derated to the curve above.
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Rev E
Typical Performance (-55°C , 25°C, 95°C, 140°C)
1600 1700 1800 1900 2000 2100 2200 2300
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for X3C19F1-03S (Feeding Port 1)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for X3C19F1-03S (Feeding Port 2)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for X3C19F1-03S (Feeding Port 3)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-50
-40
-30
-20
-10
0
Frequency (MHz)
Return Loss (dB)
Return Loss for X3C19F1-03S (Feeding Port 4)
-55ºC
25ºC
95ºC
140ºC
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Typical Performance (-55°C , 25°C, 95°C, 140°C)
1600 1700 1800 1900 2000 2100 2200 2300
-3.8
-3.7
-3.6
-3.5
-3.4
-3.3
-3.2
-3.1
-3
-2.9
-2.8
-2.7
Frequency (MHz)
Coupling (dB)
Coupling for X3C19F1-03S (Feeding Port 1)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-50
-40
-30
-20
-10
0
Frequency (MHz)
Isolation (dB)
Isolation for X3C19F1-03S (Feeding Port 1)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-0.5
-0.4
-0.3
-0.2
-0.1
0
Frequency (MHz)
Insertion Loss (dB)
Insertion Loss for X3C19F1-03S (Feeding Port 1)
-55ºC
25ºC
95ºC
140ºC
1600 1700 1800 1900 2000 2100 2200 2300
-4
-2
0
2
4
Frequency (MHz)
Phase Balance (deg)
Phase Balance for X3C19F1-03S (Feeding Port 1)
-55ºC
25ºC
95ºC
140ºC
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Rev E
Definition of Measured Specifications
Parameter
Definition
Mathematical Representation
VSWR
(Voltage Standing Wave
Ratio)
The impedance match of
the coupler to a 50
system. A VSWR of 1:1 is
optimal.
VSWR =
min
max
V
V
Vmax = voltage maxima of a standing wave
Vmin = voltage minima of a standing wave
Return Loss
The impedance match of
the coupler to a 50
system. Return Loss is
an alternate means to
express VSWR.
Return Loss (dB)= 20log
1-VSWR 1VSWR
Insertion Loss
The input power divided
by the sum of the power
at the two output ports.
Insertion Loss(dB)= 10log
direct cpl
in
PP P
Isolation
The input power divided
by the power at the
isolated port.
Isolation(dB)= 10log
iso
in
P
P
Phase Balance
The difference in phase
angle between the two
output ports.
Phase at coupled port – Phase at direct port
Amplitude Balance
The power at each output
divided by the average
power of the two outputs.
10log
2PP P
directcpl
cpl
and 10log
2PP P
directcpl
direct
Group Delay
Group delay is average
of group delay’s from
input port to the coupled
port
Average ( GD-C)
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Notes on RF Testing and Circuit Layout
The X3C19F1-03S Surface Mount Couplers require the use of a test fixture for verification of RF performance. This
test fixture is designed to evaluate the coupler in the same environment that is recommended for installation.
Enclosed inside the test fixture, is a circuit board that is fabricated using the recommended footprint. The part being
tested is placed into the test fixture and pressure is applied to the top of the device using a pneumatic piston. A four
port Vector Network Analyzer is connected to the fixture and is used to measure the S-parameters of the part. Worst
case values for each parameter are found and compared to the specification. These worst case values are reported to
the test equipment operator along with a Pass or Fail flag. See the illustrations below.
2dB, 3 dB and 5dB
Test Board
Test Board
In Fixture
Test Station
Test Board
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The effects of the test fixture on the measured data must be minimized in order to accurately determine the
performance of the device under test. If the line impedance is anything other than 50 and/or there is a discontinuity
at the microstrip to SMA interface, there will be errors in the data for the device under test. The test environment can
never be “perfect”, but the procedure used to build and evaluate the test boards (outlined below) demonstrates an
attempt to minimize the errors associated with testing these devices. The lower the signal level that is being
measured, the more impact the fixture errors will have on the data. Parameters such as Return Loss and
Isolation/Directivity, which are specified as low as 27dB and typically measure at much lower levels, will present the
greatest measurement challenge.
The test fixture errors introduce an uncertainty to the measured data. Fixture errors can make the performance of the
device under test look better or worse than it actually is. For example, if a device has a known return loss of 30dB and
a discontinuity with a magnitude of –35dB is introduced into the measurement path, the new measured Return Loss
data could read anywhere between –26dB and –37dB. This same discontinuity could introduce an insertion phase
error of up to 1.
There are different techniques used throughout the industry to minimize the affects of the test fixture on the
measurement data. Anaren uses the following design and de-embedding criteria:
Test boards have been designed and parameters specified to provide trace impedances of 50
1. Furthermore, discontinuities at the SMA to microstrip interface are required to be less than
–35dB and insertion phase errors (due to differences in the connector interface discontinuities
and the electrical line length) should be less than 0.50 from the median value of the four
paths.
A “Thru” circuit board is built. This is a two port, microstrip board that uses the same SMA to
microstrip interface and has the same total length (insertion phase) as the actual test board. The
“Thru” board must meet the same stringent requirements as the test board. The insertion loss
and insertion phase of the “Thru” board are measured and stored. This data is used to
completely de-embed the device under test from the test fixture. The de-embedded data is
available in S-parameter form on the Anaren website (www.anaren.com).
Note: The S-parameter files that are available on the anaren.com website include data for frequencies that are
outside of the specified band. It is important to note that the test fixture is designed for optimum performance through
frequency band of operation. Some degradation in the test fixture performance will occur above this frequency and
connector interface discontinuities of –25dB or more can be expected. This larger discontinuity will affect the data at
frequencies above band of operation.
Circuit Board Layout
The dimensions for the Anaren test board are shown below. The test board is printed on Rogers RO4350 material
that is 0.020” thick. Consider the case when a different material is used. First, the pad size must remain the same to
accommodate the part. But, if the material thickness or dielectric constant (or both) changes, the reactance at the
interface to the coupler will also change. Second, the linewidth required for 50 will be different and this will introduce
a step in the line at the pad where the coupler interfaces with the printed microstrip trace. Both of these conditions will
affect the performance of the part. To achieve the specified performance, serious attention must be given to the
design and layout of the circuit environment in which this component will be used.
If a different circuit board material is used, an attempt should be made to achieve the same interface pad reactance
that is present on the Anaren RO4350 test board. When thinner circuit board material is used, the ground plane will
be closer to the pad yielding more capacitance for the same size interface pad. The same is true if the dielectric
constant of the circuit board material is higher than is used on the Anaren test board. In both of these cases,
narrowing the line before the interface pad will introduce a series inductance, which, when properly tuned, will
compensate for the extra capacitive reactance. If a thicker circuit board or one with a lower dielectric constant is used,
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the interface pad will have less capacitive reactance than the Anaren test board. In this case, a wider section of line
before the interface pad (or a larger interface pad) will introduce a shunt capacitance and when properly tuned will
match the performance of the Anaren test board.
Notice that the board layout for the 2dB, 3dB , 4dB and 5dB couplers is different from that of the 10dB and 20dB
couplers. The test board for the 2 to 5dB couplers has all four traces interfacing with the coupler at the same angle.
The test board for the 10dB and 20dB couplers has two traces approaching at one angle and the other two traces at a
different angle. The entry angle of the traces has a significant impact on the RF performance and these parts
have been optimized for the layout used on the test boards shown below.
69772- PFHX_A
Ø.015
THRU HOLE
2x .065
.025 TYP 4x .040
(1.930)
.140
(2.290)
2dB- 5dB Coupler Test Board
Testing Sample Parts Supplied on Anaren Test Boards
If you have received a coupler installed on an Anaren produced microstrip test board, please remember to remove the
loss of the test board from the measured data. The loss is small enough that it is not of concern for Return Loss and
Isolation/Directivity, but it should certainly be considered when measuring coupling and calculating the insertion loss
of the coupler. An S-parameter file for a “Thru” board (see description of “Thru” board above) will be supplied upon
request. As a first order approximation, one should consider the following loss estimates:
Frequency Band
Avg. Ins. Loss of Test Board @ 25C
869-894 MHz
~0.092dB
925-960 MHz
~0.095dB
1805-1880 MHz
~0.166dB
1930-1990 MHz
~0.170dB
2110-2170 MHz
~0.186dB
2000-2500 MHz
~0.208dB
2500-3000 MHz
~0.240dB
3000-3500 MHz
~0.270dB
3500-4000 MHz
~0.312dB
It is important to note that the loss of the test board will change with temperature and must be considered if the
coupler is to be evaluated at other temperatures.
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Peak Power Handling
High-Pot testing of these couplers during the qualification procedure resulted in a minimum breakdown voltage of
1.44Kv (minimum recorded value). This voltage level corresponds to a breakdown resistance capable of handling at
least 12dB peaks over average power levels, for very short durations. The breakdown location consistently occurred
across the air interface at the coupler contact pads (see illustration below). The breakdown levels at these points will
be affected by any contamination in the gap area around these pads. These areas must be kept clean for optimum
performance. It is recommended that the user test for voltage breakdown under the maximum operating conditions
and over worst case modulation induced power peaking. This evaluation should also include extreme environmental
conditions (such as high humidity).
Orientation Marker
A printed circular feature appears on the top surface of the coupler to designate Pin 1. This orientation marker is not
intended to limit the use of the symmetry that these couplers exhibit but rather to facilitate consistent placement of
these parts into the tape and reel package. This ensures that the components are always delivered with the same
orientation. Refer to the table on page 2 of the data sheet for allowable pin configurations.
Test Plan
Xinger couplers are manufactured in large panels and then separated. All parts are RF small signal tested and DC
tested for shorts/opens at room temperature in the fixture described above . (See “Qualification Flow Chart” section
for details on the accelerated life test procedures.)
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Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
The unit has reached a steady state operating condition.
Maximum mounting interface temperature is 95oC.
Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta (T) divided by thermal resistance (R). The
dissipated power (Pdis) can also be calculated as a function of the total input power (Pin) and the thermal insertion loss
(ILtherm):
)(10110 WP
R
T
Ptherm
IL
indis
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
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Pin 1
Pin 4
Input Port
Coupled Port Direct Port
Isolated Port
PIn POut(RL) POut(ISO)
POut(CPL) POut(DC)
Figure 1
The coupler is excited at the input port with Pin (watts) of power. Assuming the coupler is not ideal, and that there are
no radiation losses, power will exit the coupler at all four ports. Symbolically written, Pout(RL) is the power that is
returned to the source because of impedance mismatch, Pout(ISO) is the power at the isolated port, Pout(CPL) is the
power at the coupled port, and Pout(DC) is the power at the direct port.
At Anaren, insertion loss is defined as the log of the input power divided by the sum of the power at the coupled and
direct ports:
Note: in this document, insertion loss is taken to be a positive number. In many places, insertion loss is written as a
negative number. Obviously, a mere sign change equates the two quantities.
)dB(
PP P
log10IL
)DC(out)CPL(out
in
10
(2)
In terms of S-parameters, IL can be computed as follows:
)dB(SSlog10IL 2
41
2
3110
(3)
We notice that this insertion loss value includes the power lost because of return loss as well as power lost to the
isolated port.
For thermal calculations, we are only interested in the power lost “inside” the coupler. Since Pout(RL) is lost in the
source termination and Pout(ISO) is lost in an external termination, they are not be included in the insertion loss for
thermal calculations. Therefore, we define a new insertion loss value solely to be used for thermal calculations:
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)(log10
)()()()(
10 dB
PPPP P
IL
RLoutISOoutDCoutCPLout
in
therm
(4)
In terms of S-parameters, ILtherm can be computed as follows:
)(log10 2
41
2
31
2
21
2
1110 dBSSSSILtherm
(5)
The thermal resistance and power dissipated within the unit are then used to calculate the average total input power
of the unit. The average total steady state input power (Pin) therefore is:
)(
1011011010
W
R
T
P
Pthermtherm ILIL
dis
in
(6)
Where the temperature delta is the circuit temperature (Tcirc) minus the mounting interface temperature (Tmnt):
)( CTTT o
mntcirc
(7)
The maximum allowable circuit temperature is defined by the properties of the materials used to construct the unit.
Multiple material combinations and bonding techniques are used within the Xinger product family to optimize RF
performance. Consequently the maximum allowable circuit temperature varies. Please note that the circuit
temperature is not a function of the Xinger case (top surface) temperature. Therefore, the case temperature cannot
be used as a boundary condition for power handling calculations.
Due to the numerous board materials and mounting configurations used in specific customer configurations, it is the
end users responsibility to ensure that the Xinger coupler mounting interface temperature is maintained within the
limits defined on the power derating plots for the required average power handling. Additionally appropriate solder
composition is required to prevent reflow or fatigue failure at the RF ports. Finally, reliability is improved when the
mounting interface and RF port temperatures are kept to a minimum.
The power-derating curve illustrates how changes in the mounting interface temperature result in converse changes
of the power handling of the coupler.
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Rev E
XXFX-XXS
X3C
.140
[3.56]
4x .015
[0.38]
4x 50
Transmission
Line
Multiple Plated
Thru Holes
To Ground
4x .039
[0.98]
RR CC
X3C
To ensure proper electrical and thermal
performance there must be a ground plane with
100% solder connection underneath the part
orientated as shown with text facing up.
4x .065
[1.65]
Dimensions are in Inches [Millimeters]
X3CXXFX-XXS Mounting Footprint
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50Ω transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal
coefficient of expansion (CTE) of 17-25 ppm/oC.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger products are
available in an immersion tin finish. IPC storage
conditions used to control oxidation should be followed
for these surface mount components.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
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Figure 2: Solder Paste Application
Coupler Positioning: The surface mount coupler can
be placed manually or with automatic pick and place
mechanisms. Couplers should be placed (see Figure 3
and 4) onto wet paste with common surface mount
techniques and parameters. Pick and place systems
must supply adequate vacuum to hold a 0.042 gram
coupler.
Figure 3: Component Placement
Figure 4: Mounting Features Example
Reflow: The surface mount coupler is conducive to most of
today’s conventional reflow methods. A low and high
temperature thermal reflow profile are shown in Figures 5
and 6, respectively. Manual soldering of these components
can be done with conventional surface mount non-contact
hot air soldering tools. Board pre-heating is highly
recommended for these selective hot air soldering
methods. Manual soldering with conventional irons should
be avoided.
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Figure 5 – Low Temperature Solder Reflow Thermal Profile
Figure 6 – High Temperature Solder Reflow Thermal Profile
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Qualification Flow Chart
Visual Inspection
n=45
Mechanical Inspection
n=40
Solderability Test
n=5
Initial RF Test
n=40
Solder Units to Test Board
n=20
Post Solder Visual Inspection
n=20
Initial RF Test Board Mounted
Over Temp
n=20
Visual Inspection
n=40
Automated TT&R Operation
n=45
Thermal Shock
n=40
Post Shock RF Test
n=40
Moisture Resistance
n=40
Reflow /Resistance to
Solder Heat
n=20 (loose)
Bake Units
n=40
Micro section
n = 2
Visual Inspection
n=40
Life Test
n=3
Final RF Test
n=3
RF Test
n = 20 (loose), n = 20
(mounted over temp)
Voltage Breakdown
n=10
Visual Inspection
n=10
RF Test
n=10
Micro section
n = 1 loose control, n = 1
mounted control, n = 3
board mounted, n = 3
loose
Visual Inspection
n=45
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
Model X3C19F1-03S
Rev E
Packaging and Ordering Information
Parts are available in reels. Packaging follows EIA 481-D for reels. Parts are oriented in tape and reel as shown
below. Tape and reel is available in 4000 pcs per reel.
SECTION A-A
.472
[12.00]
.069
[1.75]
A
A
.217
[5.50]
.315
[8.00]
.079
[2.00]
.157
[4.00]
.012
[0.30]
.071
[1.80] Direction of
Part Feed
(Loading)
.213
[5.40]
.138
[3.50]
RR CC
XXFX-XXS
X3C
Ø.059
[Ø1.50]
Dimensions are in Inches [Millimeters]
B
ØA ØC
REEL DIMENSIONS (inches [mm])
TABLE 1
ØA 13.0 [330.0]
B .945 [24.0]
ØC 4.017 [102.03]
ØD 0.512 [13.0]