Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200716F • Skyworks Proprietary and Confidential information • Products and Product Information are Subject to Change Without Notice • January 21, 2008 1
DATA SHEET
SKY73070: 700 – 1000 MHz High Gain and Linearity Single
Downconversion Mixer
Applications
• 2G/3G base station transceivers:
− GSM/EDGE, CDMA, UMTS/WCDMA, iDEN
• Land mobile radio
• ISM band transceivers
• High performance radio links
• RF identification
Features
• Operating frequency range: 700 to 1000 MHz
• IF frequency range: 40 to 300 MHz
• Conversion gain: 9.5 dB
• Input IP3: +27.0 dBm
• Output IP3: +36.5 dBm
• Noise figure: 8.3 dB
• Integrated LO driver
• Integrated low loss RF balun
• High linearity IF amplifier
• Small, MCM (20-pin, 5 x 5 mm) Pb-free package (MSL3, 260 °C
per JEDEC J-STD-020)
Skyworks offers lead (Pb)-free RoHS (Restriction of
Hazardous Substances) compliant packaging.
Description
The SKY73070 is a fully integrated single mixer that includes a
Local Oscillator (LO) driver, high linearity mixer, and large
dynamic range Intermediate Frequency (IF) amplifier. A low loss
RF balun has also been included to reduce design complications
and lower system cost.
The SKY73070 features an input IP3 of +27.0 dBm and a Noise
Figure (NF) of 8.3 dB, making the device an ideal solution for high
dynamic range systems such as 2G/3G base station transceivers.
The SKY73070 is manufactured using a robust silicon BiCMOS
process and has been designed for optimum long-term reliability.
The SKY73070 single downconversion mixer is provided in a
compact, 20-pin 5 x 5 mm Multi-Chip Module (MCM). A functional
block diagram is shown in Figure 1. The pin configuration and
package are shown in Figure 2. Signal pin assignments and
functional pin descriptions are provided in Table 1.
S1080
RF
LO
VCC1_LO
IFA+
RXIF
IFA–
VCC_IFRF
Figure 1. SKY73070 Block Diagram
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S1081
V
CC_IFRF
RF
N/C
GND
GND
VCC1_LO
N/C
VCC2_LO
N/C
GND
15
14
13
12
11
N/C
GND
GND
N/C
LO
1
2
3
4
5
67 8910
RXIF
IF+
IF–
GND
N/C
20 19 18 17 16
Figure 2. SKY73070 Pinout – 20-Pin MCM
Table 1. SKY73070 Signal Descriptions
Pin # Name Description Pin # Name Description
1 VCC_IFRF IF and RF DC supply, +5V 11 LO LO input
2 RF RF input 12 N/C No connection
3 N/C No connection 13 GND Ground
4 GND Ground 14 GND Ground
5 GND Ground 15 N/C No connection
6 VCC1_LO DC supply for LO driver, +5V 16 N/C No connection
7 N/C No connection 17 GND Ground
8 VCC2_LO DC supply for LO buffer, +5V 18 IF– Negative IF output
9 N/C No connection 19 IF+ Positive IF output
10 GND Ground 20 RXIF IF bias adjust
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Functional Description
The SKY73070 is a high gain single mixer, optimized for base
station receiver applications. The device consists of a low loss RF
balun, high linearity passive mixer, and a low noise IF amplifier.
An LO amplifier is also included that allow the SKY73070 to
connect directly to the output of a Voltage Controlled Oscillator
(VCO). This eliminates the extra gain stages needed by most
discrete passive mixers.
RF Balun and Passive Mixer
The RF balun provides a single ended input, which can easily be
matched to 50 Ω using a simple external matching circuit. The RF
balun offers very low loss, and excellent amplitude and phase
balance.
The high linearity SKY73070 is a passive, double balanced mixer
that provides a very low conversion loss, and excellent 3rd Order
Input Insertion Point (IIP3).
Additionally, the balanced nature of the mixer provides for high
port-to-port isolation.
LO Buffer
An LO buffer allows the input power of the SKY73070 to be in the
range of ±6 dBm. The LO section is optimized for high-side LO
injection. However, the LO can be driven over a wide frequency
range with only slight degradation in performance.
IF Amplifier
The SKY73070 includes a high dynamic range IF amplifier that
follows the passive mixer in the signal path. The outputs require a
supply voltage connection using inductive chokes. These choke
inductors should be high-Q and have the ability to handle 200 mA
or greater.
A simple matching network allows the output ports to be matched
to a balanced 200 Ω impedance. The IF amplifier is optimized for
IF frequencies between 40 and 300 MHz. The IF amplifier can be
operated outside of this range, but with a slight degradation in
performance.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY73070 are provided in
Table 2 and the recommended operating conditions in Table 3.
Electrical characteristics for the SKY73070 are provided in
Table 4.
Typical performance characteristics for the SKY73070 are
illustrated in Figures 3 through 18.
Table 2. SKY73070 Absolute Maximum Ratings (Note 1)
Parameter Symbol Minimum Maximum Units
Supply voltage, +5 V VCC 4.5 5.5 V
Supply current ICC 240 mA
RF input power PRF +20.0 dBm
LO input power PLO +20.0 dBm
Operating case temperature TC –40 +85 °C
Junction temperature (Note 2) TJ +150 °C
Storage case temperature TSTG –40 +125 °C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
Note 2: Nominal thermal resistance (junction to center ground pad) is 5.1 °C/W.
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Table 3. SKY73070 Recommended Operating Conditions
Parameter Symbol Minimum Typical Maximum Units
Supply voltage, +5 V VCC 4.75 5.00 5.25 V
Supply current ICC 210 mA
LO input power PLO –6.0 0 +6.0 dBm
Operating case temperature TC –40 +85 °C
RF frequency range fRF 700 1000 MHz
LO frequency range (Note 1) FLO 900 1250 MHz
IF frequency range FIF 40 300 MHz
Note 1: The SKY73070 has been optimized for high-side LO injection. However, the LO can be used outside of the specified frequency range with degraded performance.
Table 4. SKY73070 Electrical Specifications
(VCC = +5 V, TA = +25 °C, LO = 0 dBm, RF Frequency = 900 MHz, IF Frequency = 200 MHz, LO Frequency = 1100 MHz, Unless Otherwise
Noted)
Parameter Symbol Test Condition Min Typical Max Units
Conversion gain G fRF = 824 to 915 MHz,
TA = 25 °C, PLO = –3 to
+3 dBm
8.2 9.5 dB
Gain variation over temperature TA = –40 to +85 °C ±0.6 dB
Noise Figure NF TA = 25 °C, PLO = –3 to
+3 dBm, VCC = 4.75 to
5.25 V, IF = 200 MHz
8.3 dB
Noise Figure variation over temperature TA = –40 to +85 °C ±0.8 dB
Noise Figure with a blocker signal NFBLK Blocking signal input
power = +8 dBm
18 dB
Third order input intercept point IIP3 fRF = 900 MHz and
900.8 MHz,
PRF = –10 dBm/tone,
VCC = 4.75 to 5.25 V
+24.7 +27.0 dBm
Input IP3 variation over temperature TA = –40 to +85 °C ±0.3 dB
Third order output intercept point OIP3 fRF = 900 MHz and
900.8 MHz,
PRF = –10 dBm/tone,
VCC = 4.75 to 5.25 V
+36.5 dBm
2RF – 2LO 2x2 PRF = –10 dBm –68.5 –63 dBc
3RF – 3LO 3x3 PRF = –10 dBm –80 –70 dBc
Input 1 dB compression point IP1dB +11.0 +13.3 dBm
Output 1 dB compression point OP1dB +22.8 dBm
RF to IF isolation 30 48 dB
LO leakage:
@ RF port
@ IF port
–59
–34
–20
–23
dBm
dBm
RF port input return loss ZIN_RF With external matching
components
14 dB
LO port input return loss ZIN_LO With external matching
components
14 dB
IF port output return loss ZOUT_IF With external matching
components
14 dB
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8.0
8.5
9.0
10.0
7.5
7.0
6.5
6.0
9.5
10.5
11.0
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Gain (dB)
4.75 V
5.00 V
5.25 V
Figure 3. Gain vs Frequency and Supply Voltage
8.0
8.5
9.0
10.0
7.5
7.0
6.5
6.0
9.5
10.5
11.0
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Gain (dB)
–3 dBm
0 dBm
+3 dBm
Figure 5. Gain vs Frequency and LO Power
8
9
10
12
7
6
5
4
11
13
14
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Noise Figure (dB)
4.75 V
5.00 V
5.25 V
Figure 7. Noise Figure vs Frequency and Supply Voltage
8.0
8.5
9.0
10.0
7.5
7.0
6.5
6.0
9.5
10.5
11.0
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Gain (dB)
–40
o
C
+25
o
C
+85
o
C
Figure 4. Gain vs Frequency and Temperature
8
9
10
12
7
6
5
4
11
13
14
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Noise Figure (dB)
–40
o
C
+25
o
C
+85
o
C
Figure 6. Noise Figure vs Frequency and Temperature
8
9
10
12
7
6
5
4
11
13
14
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
Noise Figure (dB)
–3 dBm
0 dBm
+3 dBm
Figure 8. Noise Figure vs Frequency and LO Power
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24
25
26
28
23
22
21
20
27
29
30
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IIP3 (dBm)
–40
o
C
+25
o
C
+85
o
C
Figure 9. IIP3 vs Frequency and Temperature
24
25
26
28
23
22
21
20
27
29
30
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IIP3 (dBm)
–3 dBm
0 dBm
+3 dBm
Figure 11. IIP3 vs Frequency and LO Power
12
13
14
16
11
10
9
8
15
17
18
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IP1dB (dBm)
4.75 V
5.00 V
5.25 V
Figure 13. IP1dB vs Frequency and Supply Voltage
24
25
26
28
23
22
21
20
27
29
30
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IIP3 (dBm)
4.75 V
5.00 V
5.25 V
Figure 10. IIP3 vs Frequency and Supply Voltage
12
13
14
16
11
10
9
8
15
17
18
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IP1dB (dBm)
–40
o
C
+25
o
C
+85
o
C
Figure 12. IP1dB vs Frequency and Temperature
12
13
14
16
11
10
9
8
15
17
18
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
IP1dB (dBm)
–3 dBm
0 dBm
+3 dBm
Figure 14. IP1dB vs Frequency and LO Power
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–79
–75
–71
–63
–83
–87
–91
–95
–67
–59
–55
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
2RF - 2LO (dB)
–40
o
C
+25
o
C
+85
o
C
Figure 15. 2RF – 2LO vs Frequency and Temperature
–37
–35
–33
–29
–39
–41
–43
–45
–31
–27
–25
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
LO to IF Leakage (dBm)
–40
o
C
+25
o
C
+85
o
C
Figure 17. LO to IF Leakage vs Frequency and Temperature
43
45
47
51
41
39
37
35
49
53
55
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
RF to IF Isolation (dB)
–40
o
C
+25
o
C
+85
o
C
Figure 16. RF to IF Isolation vs Frequency and Temperature
–60
–55
–50
–40
–65
–70
–75
–80
–45
–35
–30
824 839 854 869 884 899 91
4
RF Frequency
(
MHz
)
LO to RF Leakage (dBm)
–40
o
C
+25
o
C
+85
o
C
Figure 18. LO to RF Leakage vs Frequency and Temperature
Evaluation Board Description
The SKY73070 Evaluation Board is used to test the performance
of the SKY73070 downconversion mixer. An assembly drawing for
the Evaluation Board is shown in Figure 19 and the layer detail is
provided in Figure 20.
Circuit Design Configurations
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short and as low
impedance as possible.
2. The ground pad of the SKY73070 provides critical electrical
and thermal functionality. This pad is the main thermal
conduit for heat dissipation. Since the circuit board acts as
the heat sink, it must shunt as much heat as possible from
the device. Therefore, design the connection to the ground
pad to dissipate the maximum heat produced by the circuit
board. For more information on soldering the SKY73070, refer
to the Package and Handling Information section of this Data
Sheet.
3. Skyworks recommends including external bypass capacitors
on the VCC voltage inputs of the device.
4. Components L5 and L4 (see Figure 21) are high-Q, low loss
inductors. These inductors must be able to pass currents in
excess of 200 mA DC.
5. Components R7 and R8 (see Figure 21) allow for external
adjustment of the IF amplifier bias points. To reduce the IF
amplifier bias current, connect pin 20 to ground through
external resistor R8. To increase the IF amplifier bias current,
connect pin 20 to VCC through external resistor R7. For
operation as specified in Tables 3 and 4, these resistors are
not required.
A schematic diagram for the SKY73070 Evaluation Board is
shown in Figure 21.
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S1083
J3
J8
J4
J1
J5
J9
Note: This Evaluation Board is used for several different Skyworks devices.
Components C4, C6, C8 through C13, C15 through C19, R3, R5, and L3 are not used for the
device described by this Data Sheet.
C17
C19
C20
C3
C2 C1
C5
C6
C8 C9
C4
C18
L3 L2
R5 R4
R3
L5
C16 C15 C13 C14
C11
C10
C7
R7
R8
R2
R1
U1
C12
R6
T2
L4
L1
J2
Figure 19. SKY73070 Evaluation Board Assembly Diagram
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S94
0
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane
Figure 20. SKY73070 Evaluation Board Layer Detail
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SKY73070
VCC
VCC
C1
0 Ω
C3
2.7 pF
L1
3.3 pF
C20
1 μF
VCC
C7
33 pF
R2
0 ΩJ3
C5
33 pF
T2
1
2
34
6
J4 C2
15 nH
L4
470 nH
L5
470 nH
R1
0 Ω
R8
DNI
R7
DNI
R6
0 Ω
C14
22 pF
J5
L2
8.2 nH
R4
0 Ω
S1082
VCC_IFRF
RF
N/C
GND
GND
VCC1_LO
N/C
VCC2_LO
N/C
GND
15
14
13
12
11
GND
N/C
GND
N/C
LO
1
2
3
4
5
67 8910
RXIF
IF+
IF–
GND
N/C
20 19 18 17 16
×
×
×
× ×
×
Notes: Values for all components are subject to change
for matching purposes.
Some component labels may be different than the
corresponding component symbol shown here.
Component values, however, are accurate as of the
date of this Data Sheet.
Figure 21. SKY73070 Evaluation Board Schematic
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Package Dimensions
Figure 22 shows the package dimensions for the 20-pin MCM,
and Figure 23 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it is
baked and vacuum packed before shipping. Instructions on the
shipping container label regarding exposure to moisture after the
container seal is broken must be followed. Otherwise, problems
related to moisture absorption may occur when the part is
subjected to high temperature during solder assembly.
THE SKY73070 is rated to Moisture Sensitivity Level 3 (MSL3) at
260 °C. It can be used for lead or lead-free soldering. For
additional information, refer to the Skyworks Application Note,
PCB Design & SMT Assembly/Rework Guidelines for MCM-L
Packages, document number 101752.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the Skyworks
Application Note, Tape and Reel, document number 101568.
Electrostatic Discharge (ESD) Sensitivity
The SKY73070 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper ESD
precautions.
Pin 1
Indicator
5
5
B
C
0.15 A B C
Side View Bottom View
Top View
A
0.1
1.1 ± 0.1
0A
5X 4.8
0.2 x 0.2
3X R0.2
3
3
5X 4.8
Pin 20
Pin 1
Pin 1 indicator
(See Detail B)
4X 1.3
4X 0.65
0
4X 1.3
4X 0.65
Solder Mask Opening
20X SMT Pad
0.2 A B C
A B C
0.15
Metal Pad Edge
0.45 ± 0.05
0.3 ± 0.03
0.45 ± 0.1 (0.1)
Detail A Detail B
All measurements are in millimeters.
Dimensioning and tolerancing according to ASME Y14.5M-1994.
Solder Mask Edges
S944
Figure 22. SKY73070 20-Pin MCM Package Dimensions
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S461
Notes:
1. Carrier tape: black conductive polystyrene
2. Cover tape material: transparent conductive PSA
3. Cover tape size: 9.3 mm width
4. ESD surface resistivity is </=1 x 1010 Ohms/Square
according to EIA, JEDIC TNR specification.
5. P
0
/P
1
10 pitches cumulative tolerance on tape: ±0.20 mm
6. A and B measurement points are 0.30 mm from bottom pocket.
7. All dimensions are in millimeters
A
B
2.00 ± 0.05
∅1.55 ± 0.05
0.30 ± 0.05
5o Max.
5o Max.
5.35
1.75 ± 0.10
∅1.50 Min.
5.50 ± 0.05
8.00 (P1) 4.00 (P0)
A
B
B
A
1.70
12.00 ± 0.30
5.35
Pin #1
Indicator
Figure 23. SKY73070 Tape and Reel Dimensions
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Ordering Information
Model Name Manufacturing Part Number Evaluation Kit Part Number
SKY73070 700-1000 MHz Downconversion Mixer SKY73070-11 (Pb-free package) TW16-D660
Copyright © 2007, 2008 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or
information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions
of Sale.
THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A
PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY
DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS
SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION,
LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any
damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands
and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com,
are incorporated by reference.
