TCD1103GFG Rev. 2.0 TOSHIBA CCD Image Sensor CCD (charge coupled device) TCD1103GFG The TCD1103GFG is a high sensitive and low dark current 1500-elements linear image sensor. This device consists of sensitivity CCD chip. The TCD1103GFG has electronic shutter function (ICG). Electronic shutter function can keep always output voltage constant that vary with intensity of lights. Features * Number of Image Sensing Elements: 1500 elements * Image Sensing Element Size: 5.5 m x 64 m * Photo Sensing Region: High sensitive and low dark current pn photodiode * Internal Circuit: CCD Drive Circuit * Power Supply: Only 3.0V Drive (MIN.) * Function: Electronics Shutter, Sample and Hold Circuit * Package: 16 pin GLCC Package Weight: 0.37 g (typ.) Pin Maximum Ratings (Note1) Characteristic Symbol Rating Connections OS 1 16 NC SS 2 15 NC VAD 3 14 NC VDD 4 13 NC 5 12 NC ICG 6 11 NC Unit Master clock pulse voltage V Shift pulse voltage VSH ICG pulse voltage VICG Digital power supply VDD Analog Power Supply VAD Operating temperature Topr -25~60 C SH 7 10 NC Storage temperature Tstg -40~85 C NC 8 9 NC -0.3~7.0 V Note 1: All voltage are with respect to SS terminals (ground). 1 2009-01-15 TCD1103GFG Rev. 2.0 Block Diagram CCD ANALOG SHIFT REGISTER 2 SHIFT GATE 2 D45 ... D44 D33 D32 S1500 PHOTO ... DIODE ... S1499 S2 S1 D31 ...... D30 D19 D18 D16 SIGNAL OUTPUT BUFFER 1 D17 INTEGRATION CLEAR GATE 2 OS INTEGRATION CLEAR GATE 1 SHIFT GATE 1 VAD 3 CCD ANALOG SHIFT REGISTER 1 LOGIC CIRCUIT VDD 4 6 7 5 2 ICG SH M SS Pin Names Pin No. Symbol 1 OS 2 SS Name Pin No. Symbol Name Output signal 16 NC Non Connection Ground 15 NC Non Connection 3 VAD Power (Analog) 14 NC Non Connection 4 VDD Power (Digital) 13 NC Non Connection 5 M Master clock 12 NC Non Connection 6 ICG Integration clear gate 11 NC Non Connection 7 SH Shift gate 10 NC Non Connection 8 NC Non Connection 9 NC Non Connection 2 2009-01-15 TCD1103GFG Rev. 2.0 Optical/Electrical Characteristics (Ta = 25C, V = 3.3V (pulse), f = 2.0 MHz (Data rate=1MHz), Tint(Integration time) =10ms, Load resistance = 100 k, VAD = VDD = 3.3V, Light source = Daylight fluorescent lamp) Characteristics Symbol Min Typ. Max Unit Note R 55 79 V/lxs (Note2) PRNU 10 % (Note3) RI 3 % (Note4) VSAT 450 900 mV (Note5) Sensitivity Photo response non uniformity Register imbalance Saturation output voltage Saturation exposure SE 0.008 lxs (Note6) Dark signal voltage VMDK 3 15 mV (Note7) DC power dissipation PD 16 48 mW Total transfer efficiency TTE 92 95 % Output impedance ZO 0.5 1.0 DC output voltage VOS 1.0 1.5 2.0 V (Note8) Dynamic range DR 200 (Note9) Note 2: Sensitivity is defined for signal outputs when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU is defined for a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. X PRNU = x 100(%) X Where X is average of total signal output and X is the maximum deviation from X . The amount of incident light is 1/2SE. Note 4: Register imbalance is defined as follows. RI = Y x100(%) X Where X is average of total signal output. Y : | average of odd signal output - average of even signal output | Z : | average of odd dummy signal - average of even dummy signal | Note 5: VSAT is defined as minimum saturation output of all effective pixels. Note 6: Definition of SE SE = VSAT R (lxs) Note 7: VMDK is defined as maximum dark signal voltage of all effective pixels. OS VMDK 3 2009-01-15 TCD1103GFG Rev. 2.0 Note 8: DC signal output voltage is defined as follows. OS VOS Note 9: Definition of DR VSAT VMDK VMDK is proportional to Tint (Integration time), so, the shorter Tint condition makes wider DR. DR = 4 2009-01-15 TCD1103GFG Rev. 2.0 Operating Condition Characteristics Master clock pulse voltage Symbol "H" Level V "L" Level "H" Level Shift pulse voltage VSH "L" Level "H" Level ICG pulse voltage "L" Level VICG Min Typ. Max 3.0 3.3 4.0 0 0 0.44 3.0 3.3 4.0 0 0 0.44 3.0 3.3 4.0 0 0 0.44 Unit V (Note 10) V (Note 10) V (Note 10) Power supply voltage (Digital) VDD 3.0 3.3 4.0 V (Note 11) Power supply voltage (Analog) VAD 3.0 3.3 4.0 V (Note 11) Note 10: "H" level of maximum pulse voltage = VDD VDD-0.5V = "H" level of minimum pulse voltage. Note 11: VAD = VDD Clock Characteristics (Ta = 25C) (3.0V VAD = VDD 4.0V) Characteristics Symbol Min Typ. Max Unit f 0.4 2 4 MHz fDATA 0.2 1 2 MHz Master clock capacitance C 10 pF ICG Pulse capacitance CICG 35 pF Shift pulse capacitance CSH 150 pF Master clock frequency Data Rate Optical/Electrical characteristics of page 3 are defined under the condition of 1MHz data rate. 5 2009-01-15 TCD1103GFG Rev. 2.0 Timing Chart 1 TINT (Integration Time) SH ICG M D45 D44 D43 D42 D41 D40 D37 D36 D35 D34 D33 D32 S1500 S1499 S1498 S1497 S1496 S4 S3 S2 S1 D31 D30 D29 D28 D27 D26 D25 D19 D18 D17 D16 D15 D14 D13 D3 D2 D1 D0 OS (Output at S/H ON) DUMMY OUTPUTS LIGHT SHIELD OUTPUTS (16 elements) (13 elements) (3 elements) DUMMY OUTPUTS (32 elements) SIGNAL OUTPUTS (1500 elements) DUMMY OUTPUTS 14 elements) 1 LINE READOUT PERIOD 1546 elements) 6 2009-01-15 TCD1103GFG Rev. 2.0 Timing Chart 2 (Use electric shutter function) TINT (Integration Time) Read Out Time SH ICG M D45 D44 D43 D42 D41 D40 D37 D36 D35 D34 D33 D32 S1500 S1499 S1498 S1497 S1496 S4 S3 S2 S1 D31 D30 D29 D28 D27 D26 D25 D19 D18 D17 D16 D15 D14 D13 D3 D2 D1 D0 OS (Output at S/H ON) DUMMY OUTPUTS LIGHT SHIELD OUTPUTS (16 elements) (13 elements) (3 elements) DUMMY OUTPUTS (32 elements) SIGNAL OUTPUTS (1500 elements) DUMMY OUTPUTS 14 elements) 1 LINE READOUT PERIOD 1546 elements) 7 2009-01-15 TCD1103GFG Rev. 2.0 Timing Requirements t2 t3 t1 t4 SH ICG M OS (S/H ON) Characteristics Symbol Min Typ. Max Unit ICG pulse delay t1 1000 5000 ns Pulse timing of ICG and SH t2 100 500 1000 ns Shift pulse width t3 1000 ns Pulse timing of ICG and M t4 0 20 ns * : To keep M " High " level when ICG switch from "Low" to "High" level. Use electronic shutter Pulse timing of SH and ICG Integration time (TINT) t3 ** *** *** *** **** SH ICG Read out time ** : Each SH high pulse have to keep always the same value with " t3 ". (t3 1000ns (Min.)) *** : SH pulse cycle have to keep the same cycle (SH cycle period 10s) except TINT period. **** : TINT 10s (Min.) Note : The illumination of light source must be used with less that 1000 times based on 10ms TINT. 8 2009-01-15 TCD1103GFG Rev. 2.0 Typical performance curves SENSITIVITY RESPONSE S E N S IT IV IT Y (V / lx .s ) 150 100 50 0 3 3.3 3.6 POWER SUPPLY VAD,VDD(V) 9 3.9 2009-01-15 TCD1103GFG Rev. 2.0 Typical performance curves D C O U T PU T V O LT A GE V O S(V ) DC OUTPUT VOLTAGE POWER SUPPLY VOLTAGE 3 2 1 0 3 3.3 3.6 POWER SUPPLY VAD,VDD (V) 10 3.9 2009-01-15 TCD1103GFG Rev. 2.0 Typical Drive Circuit 16 NC 15 NC 14 NC 13 NC 12 11 10 NC NC M ICG SH NC 9 NC TCD1103GFG 3.3V OS SS 1 2 VAD VDD 3 4 5 6 NC 7 8 3.3V 0.1 F/25 V 10F/25V SH R1 ICG M R1 R2 TR IC1 : TC74AC04P R1 R2 OS 11 : 150 : 2200 IC 2009-01-15 TCD1103GFG Rev. 2.0 Caution 1. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but inferior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, cutting pliers, tweezers or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. d. When the product is handed, please use tweezers to avoid the damage of CCD image sensor. Recommended tweezers is P-815 (HOZAN) or equivalent. e. Ionized air is recommended for discharge when handling CCD image sensors. 2. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 3. Ultrasonic Cleaning Ultrasonic cleaning should not be used with such hermetically-sealed ceramic package as CCD because the bonding wires can become disconnected due to resonance during the cleaning process. 4. Window Glass Protective Tape The window glass protective tape is manufactured from materials in which static charges tend to build up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape from being charged with static electricity. When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as black or white flaws on the image, please wipe the window glass surface with the cloth into which the organic solvent was infiltrated. Then please attach CCD to a product. Do not reuse the tape. 12 2009-01-15 TCD1103GFG Rev. 2.0 5. Cleaning Method of the Window Glass Surface Wiping Cloth Use soft cloth with a fine mesh. The wiping cloth must not cause dust from itself. Use a clean wiping cloth necessarily. Recommended wiping cloth is as follow; - MK cloth (Toray Industries) Cleaner Recommended cleaning liquid of window glass are as follow; - EE-3310 (Olympus) When using solvents, such as alcohol, unavoidably, it is cautious of the next. a. A clean thing with quick-drying. b. After liquid dries, there needs to be no residual substance. c. A thing safe for a human body. And, please observe the use term of a solvent and use the storage container of a solvent to be clean. Be cautious of fire enough. Way of Cleaning First, the surface of window glass is wiped with the wiping cloth into which the cleaner was infiltrated. Please wipe down the surface of window glass at least 2 times or more. Next, the surface of window glass wipes with the dry wiping cloth. Please wipe down the surface of window glass at least 3 times or more. Finally, blow cleaning is performed by dry N2 filtered. If operator wipes the surface of the window glass with the above-mentioned process and dirt still remains, Toshiba recommends repeating the clean operation from the beginning. Be cautious of the next thing. a. Don't infiltrate the cleaner too much. b. A wiping portion is performed into the optical range and don't touch the edge of window glass. c. Be sure to wipe in a long direction and the same direction. d. A wiping cloth always uses an unused portion. a. b. c. Wiper 13 2009-01-15 TCD1103GFG Rev. 2.0 The standard reflow condition for GLCC (Surface Mount device, Pb-Free) 1. Storage precautions 1) Do not drop or toss device packaging. The laminated aluminum material in it can be rendered ineffective by rough handling. 2) Ensure packaging materials are stored in a 3090%RH environment and do not store at the low temperature to prevent dew condensation. Use devices within 12 months; do not store them longer than that. 3) If the 30% humidity indicator is pink when the packaging is opened, bake the devices at 125 for 24 hours to remove any moisture present. Devices should also be baked, whether still packed or not, if the effective usage period of the indicator has expires. 4) Perform destructive prevention of the devices by static electricity in case of implementation of baking processing. 5) After opening the moiture-proof packing, store the products in the environment under 30, and below 60%RH, and use them within 5 days. If the effective usage period passed after opening the moisture-proof packing, baking should be done before use at 125 for 24 hours. 6) CCD surface mount products may have a haze on the inside of glass, so be careful about folling. Even if the haze arises inside of glass, when it is not on the pixel eria, there is no problem in quality. 2. Mounting conditions using reflow 1) Mounting method : (a) Hot air reflows. (b) Infrared ray reflow 2) Preheating condition : 150180, 60120 seconds 3) Reflow condition : (a) maximum 240 (b) over 230, within 3050 seconds 4) Heating times : only 1 time 5) Caution : This product does not support a Re-flow with Pb-Sn solder. Pb-free solder should be used to Re-flow with Fig1's profile. * The temperature profile is specified in terms of the temperature of top surface of the device. This temperature profile shows maximum guaranteed device temperature. Please set up the optimum temperature profile conditions within the Fig.1 profile. Fig.1 Example of recommended temperature profile for reflows In addition, in case of the repair work accompanied by IC removal, since the degree of parallel may be spoiled with the left solder, please do not carry out. 14 2009-01-15 TCD1103GFG Rev. 2.0 3. Mounting 1) In the case of solder mounting, the devices should be mounted with the window glass protective tape in order to avoid dust or dirt included in reflow machine. 2) The window glass protective tape is manufactured from materials in which static charges tend to build up. When removing the tape from CCD sensor after solder mounting, install an ionizer to prevent the tape from being charged with static electricity. 3) When the tape is removed, adhesives will remain in the glass surface. Since these adhesives appear as black or white flaws on the image, please wipe the window glass surface with the cloth into which the organic solvent was infiltrated. Then please attach CCD to a product. 4) Do not reuse the window glass protective tape. 5) The parts of glass seal area have possibility to be became clouded by reflow process, however, there is no problem in quality.. 4. Foot Pattern on the PCB We recommend Fig 2's foot pattern for your PCB (Printed circuit Board). Fig.2 5. Mask for Solder Paste Application We recommend metal mask that have the following thickness. a thickness of 0.1mm. And, we recommend that the size of the pattern of the metal mask is 100% of recommended foot pattern at fig. 2. 15 2009-01-15 TCD1103GFG Rev. 2.0 Package Dimensions 16 2009-01-15 TCD1103GFG Rev. 2.0 Revision Date Description Note 1.0 2008-6-23 New - 2.0 2009-01-15 Added: Caution of storage Deleted: Caution of soft tray - * The information contained herein is subject to change without notice. 021023_D * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. 021023_A * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. 021023_B * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. 021023_C * Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF * The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 17 2009-01-15