XC6802 Series ETR2501-006 800mA Single Cell Li-ion Battery Linear Charger IC GENERAL DESCRIPTION The XC6802 series is a constant-current/constant-voltage linear charger IC for single cell lithium-ion batteries. The XC6802 includes a reference voltage source, battery voltage monitor, driver transistor, constant-current/constant-voltage charge circuit, over heat protection circuit, phase compensation circuit. The battery charge termination voltage is internally set to 4.2V 0.7% and the trickle charge voltage and accuracy is 2.9V 3%. In trickle charge mode, a safe charge to a battery is possible because approximately 1/10 out of setting charge current is supplied to the battery. With an external RSEN resistor, the charge current can be set freely up to 800mA (MAX.), therefore, the series is ideal for various battery charge applications. The series' charge status output pin, /CHG pin, is capable of checking the IC's charging state while connecting with an external LED. Charging docks, charging cradles MP3 players, portable audio players Cellular phones, PDAs Bluetooth headsets FEATURES Operating Voltage Range Charge Current : 4.25V ~ 6.0V : Externally set up to 800mA (MAX.) Charge Termination Voltage Trickle Charge Voltage Supply Current (Stand-by) Function : 4.2V 0.7% : 2.9V 3% : 15A (TYP.) : Constant-current/constant-voltage Operation Thermal Shutdown Automatic Recharge Charge Status Output Pin Soft-start Function (Inrush Limit Current) : -40+85 : SOT-89-5, SOT-25, USP-6C, USP-6EL : EU RoHS Compliant, Pb Free Operating Ambient Temperature Packages Environmentally Friendly TYPICAL PERFORMANCE CHARACTERISTICS Battery Charge Cycle Li-ion Liio n Battery Bat t e r yCharge C h ar geCycle C yc le VIN=5.0V, CIN=1F VIN=5.0V, CIN=1uF RSEN=2k, 830mAh 830mAh Battery Battery RSEN=2kohm, 700 4.40 Charge Current IBAT (mA) Battery Voltage Battery Voltage Charge Current : IBAT (mA) TYPICAL APPLICATION CIRCUIT 600 4.20 500 4.00 400 3.80 300 3.60 ChargeCurrent Current Charge 200 3.40 100 0 0.00 Battery Voltage VBAT(V) Battery Voltage : VBAT (V) APPLICATIONS 3.20 0.25 0.50 0.75 1.00 1.25 1.50 1.75 3.00 2.00 Time (hours) Time (hour) 1/21 XC6802 Series PIN CONFIGURATION * The dissipation pad for the USP-6C / USP-6EL package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin. PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS 3 /CHG Charge Status Output Pin 2 2 VSS Ground SOT-25 SOT-89-5 USP-6C USP-6EL 1 5 3 2 2 3 4 1 1 BAT Charge Current Output Pin 4 3 6 6 VIN Input Voltage Pin 5 1 4 4 ISEN Charge Current Setup Pin - - 5 5 NC No Connection FUNCTIONS XC6802A42X PIN NAME ISEN CONDITIONS IC OPERATION H Level (1.4VVSENVIN) or Open OFF (Shutdown Mode) Pull-down by external components ON, Charge Current IBAT=1000 / RSEN * * For SOT-25, SOT-89-5, and USP-6C, charge current should be set to become IBAT800mA. For USP-6EL, charge current should be set to become IBAT500mA. PRODUCT CLASSIFICATION Ordering Information XC6802A42X- DESIGNATOR - (*1) (*1) ITEM Packages (Order Unit) SYMBOL DESCRIPTION PR SOT-89-5 (1,000/Reel) PR-G SOT-89-5 (1,000/Reel) MR SOT-25 (3,000/Reel) MR-G SOT-25 (3,000/Reel) ER USP-6C (3,000/Reel) ER-G USP-6C (3,000/Reel) 4R-G USP-6EL (3,000/Reel) The "-G" suffix denotes Halogen and Antimony free as well as being fully RoHS compliant. 2/21 XC6802 Series BLOCK DIAGRAM * Diodes inside the circuits are ESD protection diodes and parasitic diodes. ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL Ta=25 RATINGS UNIT VIN Pin Voltage VIN -0.3 ~ + 6.5 V ISEN Pin Voltage VSEN -0.3 ~ VIN + 0.3 or +6.5 (*2) V BAT Pin Voltage VBAT -0.3 ~ + 6.5 V /CHG Pin Voltage SOT-89-5 SOT-25 BAT Pin Current (*1) USP-6C V/CHG -0.3 ~ + 6.5 V 900 IBAT USP-6EL 550 500 SOT-89-5 1300 (PCB mounted) (*3) 250 SOT-25 Power Dissipation mA Pd USP-6C 600 (PCB mounted) (*3) mW 120 1000 (PCB mounted) (*3) 120 USP-6EL 1000 (PCB mounted) (*3) Operating Temperature Range Topr - 40 ~ + 85 Storage Temperature Range Tstg - 55 ~ + 125 All voltages are described based on the VSS pin. (*1) Please use within the range of IBATPd/(VIN-VBAT). (*2) The maximum rating corresponds to the lowest value between VIN+0.3 or +6.5. (*3) This is a reference data taken by using the test board. Please refer to page 17 to 20 for details. 3/21 XC6802 Series ELECTRICAL CHARACTERISTICS XC6802A42x Ta=25 PARAMETER SYMBOL Input Voltage VIN Supply Current ISS Stand-by Current ISTBY Shut-down Current ISHUT Float Voltage 1 Float Voltage 2 (*1) Maximum Battery Current (*2) CONDITIONS TYP MAX UNIT CIRCUIT 4.25 - 6.0 V - Charge mode, RSEN=10k - 15 35 A Stand-by mode - 15 35 A - 10 23 A x0.993 4.2 x1.007 V x0.99 4.2 x1.01 V - mA - mA Shut-down mode (RSEN=NC, VIN If the BAT pin voltage is less than trickle voltage (TYP. 2.9V), the charger enters trickle charge mode. In this mode, a safe battery charge is possible because approximately only 1/10 of the charge current which was set by the ISEN pin, is supplied to the battery. When the BAT pin voltage rises above the trickle voltage, the charger enters constant-current mode (CC mode) and the battery is charged by the programmed charge current. When the BAT pin voltage reaches 4.2V, the charger enters constant-voltage mode (CV mode) automatically. After this, the charge current starts to drop and when it reaches a level which is 1/10 of the programmed charge current, the charge terminates. The charge current can be set by connecting a resistor between the ISEN pin and the VSS pin. The battery charge current, IBAT, is 1000 times the current out of the ISEN pin. Therefore, the charge current, IBAT, is calculated by the following equations: IBAT = (VISEN / RSEN) x 1000 (VISEN = 1.0V (TYP.): Current sense pin voltage) However IBAT800mA (SOT-25, SOT-89-5, and USP-6C), IBAT500mA (USP-6EL) The battery charge is terminated when the charge current decreases to 1/10 of the full charging level after the battery pin voltage reaches a float voltage. An internal comparator monitors the ISEN pin voltage to detect the charge termination. When the comparator monitors the ISEN pin voltage is less than 100mV (charge termination detect) (*1) for 1ms TYP. (charge termination detect time), the IC enters stand-by mode. A driver transistor turns off during the stand-by mode. In this state, a failure detection circuit and a monitoring circuit of the battery pin voltage operates. (*1) The detect after charging completed: ISEN pin voltage should be less than 100mV. In stand-by mode battery voltage falls. When the voltage level at the battery pin drops to recharge battery threshold voltage (TYP. 4.05V) or less, the charge cycle automatically re-starts after a delay of (TYP. 2ms). As such, no external activation control is needed. 5/21 XC6802 Series OPERATIONAL EXPLANATION (Continued) IBAT Charge Current IBAT/10 4.20V 4.05V Battery Voltage 2.9V Trickle CC CV Standby Battery Termination Detect Time (1ms, Typ) /CHG Pin Status Strong Pull Down (10mA, Typ) Recharge Recharge Battery Time (2ms, Typ) Weak Pull Down (20uA, Typ) Strong Pull Down (10mA, Typ) The /CHG pin constantly monitors the charge states classified as below: Strong pull-down: I/CHG=10mA (TYP.) in a charge cycle, Weak pull-down: I/CHG=20A (TYP.) in a stand-by mode, High impedance: in shutdown mode. Even if the BAT pin is shorted to the VSS, a trickle charge mode starts to operate for protecting the IC from destruction caused by over current. The UVLO circuit keeps the charger in shut-down mode until the input voltage, VIN, rises more than the UVLO voltage. Moreover, in order to protect the battery charger, the UVLO circuit keeps the charger in shut-down mode when a voltage between the input pin voltage and BAT pin voltage falls to less than 30mV (TYP.). The charge will not restart until the voltage between the input pin voltage and BAT pin voltage rises more than 100mV (TYP.). During the shut-down mode, the driver transistor turns off but a failure detection circuit operates, and supply current is reduced to 10A (TYP.). To protect against inrush current from the input to the battery, soft-start time is set in the circuit optimally (150s, TYP.). During the charge cycle, the IC can be shifted to the shut-down mode by floating the ISEN pin. For this, a drain current to the battery is reduced to less than 2A and a shut-down current of the IC is reduced to less than 10A (TYP.). A new charge cycle starts when reconnecting the current sense resistor. When the BAT pin is left open, the IC needs to be shut-down once after monitoring the CHG pin by a microprocessor etc and keeping the ISEN pin in H level. A backflow prevention circuit protects against current flowing from the BAT pin to the VIN pin even the BAT pin voltage is higher than the VIN pin voltage. 6/21 XC6802 Series NOTES ON USE 1. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be exceeded. 2. Where wiring impedance is high, operations may become unstable due to noise and/or phase lag depending on output current. Please wire the CIN as close to the IC as possible. 3. Torex places an importance on improving our products and their reliability. We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems. 7/21 XC6802 Series TEST CIRCUITS 1. ON Resistance, Shut-down Voltage, ISEN Pull-up current 2. Battery Termination Detect Time, Recharge Battery Time C/10 Charge Termination Current Threshold12, Battery Termination Voltage1 3. Trickle Charge Current12, Battery Current13, Battery Current5 4. /CHG Pin, Output Low Voltage ISEN Pin Voltage, Trickle Charge Voltage, UVLO, Recharge Battery Threshold Voltage VIN-VBAT Shut-down Release Voltage, /CHG Pin Weak Pull-down Current /CHG Pin Strong Pull-down Current, Stand-by Current, Shut-down Current 5. Battery Current 4 8/21 6. Soft-start XC6802 Series TYPICAL PERFORMANCE CHARACTERISTICS (1) Charge Cycle 1 4.20 600 3.90 400 3.60 Battery Current 200 3.30 (V) Battery Voltage: V VBAT BAT (V) 800 0 0.3 0.6 0.9 1.2 4.50 Battery Voltage 800 4.20 600 3.90 400 3.60 3.30 200 3.00 0 VIN=5V, CIN=1.0F RSEN=1.25k, 850mAh Battery 1000 4.50 Battery Voltage Battery Current: IBAT BAT (mA) (mA) 1000 Battery Current: IIBAT (mA) BAT (mA) XC6802A42X VIN=5V, CIN=1.0F RSEN=1.25k, 420mAh Battery Battery Current 3.00 0 1.5 (V) Battery Voltage: V VBAT BAT (V) XC6802A42X 0 0.3 Time(hour) (hour) Charge Time 0.6 0.9 1.2 1.5 Time(hour) (hour) Charge Time (2) Battery Current vs. Battery Voltage 2 XC6802A42X VIN=5V, RSEN=10k 120 100 80 60 40 -40 25 85 20 VIN=5V, RSEN=2k 600 Battery Current: IIBAT (mA) BAT(mA) Battery Current: IIBAT (mA) BAT(mA) XC6802A42X 500 400 300 200 -40 25 85 100 0 0 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 3.5 4.3 3.6 3.7 (V) Battery Voltage: VVBAT BAT (V) XC6802A42X 3.9 4.0 4.1 Battery Current: IBAT (mA) IBAT (mA) 100 80 60 VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V 20 4.3 RSEN=2k 600 40 4.2 XC6802A42X RSEN=10k 120 Battery Current:IBAT IBAT(mA) (mA) 3.8 VBAT (V)(V) Battery Voltage: VBAT 500 400 300 VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V 200 100 0 0 3.5 3.6 3.7 3.8 3.9 4.0 4.1 (V) Battery Voltage: VVBAT BAT (V) 4.2 4.3 3.5 3.6 3.7 3.8 3.9 4.0 4.1 4.2 4.3 Battery Voltage: VBAT VBAT (V) (V) 9/21 XC6802 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3) Battery Voltage vs. Battery Current 3 XC6802A42X XC6802A42X 4.20 4.15 4.10 -40 25 85 4.05 4.25 Battery Voltage: V VBAT (V) BAT(V) Battery Voltage: V VBAT (V) BAT(V) VIN=5V, RSEN=2k VIN=5V, RSEN=10k 4.25 4.20 4.15 4.10 -40 25 85 4.05 4.00 4.00 50 60 70 80 90 100 250 110 300 Battery Current: IBAT (mA) BAT(mA) 350 RSEN=10k 550 4.20 4.15 VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V RSEN=2k 4.25 Battery Voltage:VV (V) BAT (V) BAT Battery Voltage:VVBAT (V) BAT(V) 500 XC6802A42X 4.25 4.05 450 Battery Current:IBAT IBAT(mA) (mA) XC6802A42X 4.10 400 4.00 4.20 4.15 VIN=4.5V VIN=5.0V VIN=5.5V VIN=6.0V 4.10 4.05 4.00 50 60 70 80 90 100 110 250 300 350 (mA) Battery Current:IBAT IBAT (mA) 400 450 500 550 Battery Current:IBAT IBAT(mA) (mA) (4) Charge Termination Voltage vs. Ambient Temperature 4 - XC6802A42X VIN=5V, IBAT=40mA, RSEN=10k 4.24 4.23 4.22 4.21 4.20 4.19 4.18 4.17 4.16 -50 -25 0 25 50 Ta Ambient Temperature: Ta () 10/21 75 100 Charge Termination VVoltage: VFLOAT1 (V) 1 FLOAT1V Charge Termination V Voltage: V (V) 1 FLOAT1V FLOAT1 XC6802A42X VIN=5V, IBAT=200mA, RSEN=2k 4.24 4.23 4.22 4.21 4.20 4.19 4.18 4.17 4.16 -50 -25 0 25 50 75 TaTa () Ambient Temperature: 100 XC6802 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (5) Battery Current vs.-Ambient Temperature 5 XC6802A42X XC6802A42X VIN=5V, VBAT=3.8V, RSEN=2k VIN=5V, VBAT=3.8V, RSEN=10k 460 Battery Current2:IBAT2 IBAT2 (mA) 2 mA Battery Current1:IBAT1 IBAT1 (mA) 1 mA 80 90 100 110 120 480 500 520 540 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 TaTa () Ambient Temperature: Ambient Temperature: Ta () Ta (6) Trickle Charge Current vs. Ambient Temperature 6 - XC6802A42X VIN=5V, VBAT=2.5V, RSEN=10k 6 7 8 9 10 11 12 13 14 Trickle Charge Current2: ITRIKL2 (mA) 2 ITRIKL2mA Trickle Charge Current1: ITRIKL1 (mA) 1 ITRIKL1mA XC6802A42X VIN=5V, VBAT=2.5V, RSEN=2k 30 35 40 45 50 55 60 65 70 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 100 TaTa () Ambient Temperature: Ta Ambient Temperature: Ta () (8) Manual Shutdown Voltage vs. Ambient Temperature 8 - (7) Trickle Voltage vs. Ambient Temperature 7 - XC6802A42X XC6802A42X VIN=5V Manual Shutdown Voltage: VV SD(V) SD V Trickle Voltage:VTRIKL VTRIKL (V) V 3.00 2.95 2.90 2.85 2.80 2.75 Trickle Voltage (Release) Trickle Voltage (Detect) 2.70 2.65 -50 -25 0 25 50 Ta Ambient Temperature: Ta () 75 100 1.45 Manual Shutdown Voltage (Detect) 1.40 Manual Shutdown Voltage (Release) 1.35 1.30 1.25 1.20 1.15 1.10 -50 -25 0 25 50 75 100 Ambient Temperature: Ta () Ta 11/21 XC6802 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) XC6802A42X 3.85 3.75 XC6802A42X 200 VIN-VBAT VIN-VBAT Shutdown Voltage (Detect) 160 VIN-VBAT Shutdown Voltage (Release) VIN-VBAT 120 V UVLO Voltage: VUVLO UVLO VUVLO V(V) 3.95 VASD VASD (V) IN-V VIN -VV Shutdown Release Voltage: BATBAT (10) VIN - VBAT Shutdown Voltage vs. -Ambient Temperature 10VIN-VBAT (9) UVLO Voltage-vs. Ambient Temperature 9UVLO 3.65 3.55 UVLO UVLO Voltage (Detect) 3.45 UVLO Voltage (Release) UVLO 3.35 -50 -25 0 25 50 75 Ta Ambient Temperature: Ta () 100 80 40 0 -50 -25 0 25 50 75 Ta Ambient Temperature: Ta () 100 Recharge Time-vs. Ambient Temperature (11) Charge Termination Detect Time vs. Ambient Temperature (12) 11 - 12 XC6802A42X VIN=5V VIN=5V 3.0 2.5 Recharge Time: tRECHRG (ms) TRECHRG ms Charge Termination Detect Time: TTERM mstTERM (ms) XC6802A42X 2.0 1.5 1.0 0.5 0.0 2.5 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 -50 Ta Ambient Temperature: Ta () 0 25 50 100 (14) Soft Start Time vs. Ambient Temperature 14 - XC6802A42X XC6802A42X VIN=5V VIN=5V 220 Soft Start Time: Tss (s) SSs 220 200 180 160 140 120 100 200 180 160 140 120 100 80 80 -50 -25 0 25 50 Ta Ambient Temperature: Ta () 12/21 75 Ta Ambient Temperature: Ta () (13) Recharge Threshold Voltage vs. Ambient Temperature 13 - Recharge Threshold Voltage: V RECHRG (mV) VRECHRG mV -25 75 100 -50 -25 0 25 50 Ta Ambient Temperature: Ta () 75 100 XC6802 Series TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (15) ON Resistance vs. Ambient Temperature 15ON - (16) Shutdown Current vs. Ambient Temperature 16 - XC6802A42X VIN=4.15V, IBAT=100mA, VISEN=0.5V 0.8 0.6 0.4 0.2 0.0 -50 -25 0 25 50 75 VIN=5V, RSEN=NC 25 Shutdown Current: ISHUT (A) IShutA 1.0 ON Resistance: ON () ON RONR XC6802A42X 20 15 10 5 0 -50 100 -25 0 A Stand-by Current: IStby ISTBY (A) 30 25 20 15 10 5 0 25 50 75 100 /CHG Pull Down Current: ICHG1 (A) /CHGWeak Weak_Pull_Down Ichg1A) VIN=5V, VBAT=4.3V 35 0 75 100 XC6802A42X XC6802A42X -25 50 (18) /CHG Weak PullPull Down Current vs. /CHG Pin Voltage 18/CHG Weak Down 17 - (17) Stand-by Current vs. Ambient Temperature -50 25 Ta Ambient Temperature: Ta () Ta Ambient Temperature: Ta () VIN=5V, VBAT=4.3V 45 -40 25 85 40 35 30 25 20 15 10 5 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 (V)(V) /CHG VCHG /CHG Pin Voltage: VCHG Ta Ambient Temperature: Ta () (19) /CHG Strong PullPull Down Current vs. /CHG Pin Voltage 19/CHG Strong Down (20) /CHG Pin Output Low Voltage-vs. Ambient Temperature 20/CHGLOW XC6802A42X VIN=5V, VBAT=4.0V 25 -40 25 85 20 15 10 5 0 0 1 2 3 4 /CHG Pin Voltage: VVCHG (V) CHG(V) /CHG 5 6 /CHG Pin Output Low Voltage: V/CHG /CHG LOW V/CHG V(V) /CHG/CHG Strong Pull Down Current:Ichg2 ICHG2 (mA) Strong_Pull_Down (mA) XC6802A42X I/CHG=5mA, VIN=5V, VBAT=2.5V 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -50 -25 0 25 50 75 100 Ambient Temperature: Ta () Ta 13/21 XC6802 Series PACKAGING INFORMATION SOT-25 SOT-89-5 4.50.1 +0.15 1.6 -0.2 0.420.06 2 4 (0.4) 5 0.4 +0.03 -0.02 0.4 +0.03 -0.02 5 0.420.06 0.8 MIN 0.420.06 1 2 0.420.06 0.8 MIN 5 2.50.1 4.35 MAX 1.0 3 0.470.06 0.420.06 8 1.50.1 (0.1) 8 1.50.1 (unit : mm) 1.50.1 USP-6C Reference Pattern Layout USP-6C 1.8 0.25 0.5 0.25 0.5 0.25 0.225 1.80.05 1pin INDENT USP-6C Reference Metal Mask Design 0.300.05 0.50 0.100.05 14/21 1.40.1 0.200.05 (unit : mm) 1.4 1.2 0.25 0.25 0.5 0.6 0.5 0.25 0.225 (0.10) XC6802 Series PACKAGING INFORMATION (Continued) USP-6EL Reference Pattern Layout USP-6EL 1.80.05 1PIN INDENT USP-6EL Reference Metal Mask Design 0.30.05 2 3 5 4 (unit: mm) 2.2 (0.55 1.50.05 0.3 6 0.9 0.3 1 15/21 XC6802 Series MARKING RULE USPxx(5) USP-6C / USP-6EL 1 1pin pin SOT-25 SOT-25 5 4 1 2 4 2 16/21 2 Standard product, Represent the 7th digits MARK A PRODUCT SERIES XC6802A*****-G Standard product, Represents the 8th digits MARK 4 PRODUCT SERIES XC6802*4****-G Represents production lot number 01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to AZ, B1 to ZZ in order. (G, I, J, O, Q, W excepted) *No character inversion used. 3 1 PRODUCT SERIES XC6802******-G SOT89-5 SOT-89-5 5 Represents product series MARK N 3 XC6802 Series PACKAGING INFORMATION (Continued) SOT-89-5 Power Dissipation Power dissipation data for the SOT-89-5 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 5 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 1300 85 520 Thermal Resistance (/W) 76.92 PdmW Power Dissipation Pd (mW) Pd-Ta Pd vs. Ta 1400 1200 1000 800 600 400 200 0 25 45 65 85 Ambient Temperature Ta () Ta 105 125 17/21 XC6802 Series PACKAGING INFORMATION (Continued) SOT-25 Power Dissipation Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.) Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 600 85 240 Thermal Resistance (/W) 166.67 PdmW Power Dissipation Pd (mW) Pd-Ta Pd vs. Ta 700 600 500 400 300 200 100 0 25 18/21 45 65 85 Ambient Temperature Ta () Ta 105 125 XC6802 Series PACKAGING INFORMATION (Continued) USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 1000 85 400 Thermal Resistance (/W) 100 Power Dissipation PdmW Pd vs. Ta 1200 1000 800 600 400 200 0 25 45 65 85 105 Ambient Temperature Ta 125 19/21 XC6802 Series PACKAGING INFORMATION (Continued) USP-6EL Power Dissipation Power dissipation data for the USP-6EL is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm in one side) 2 Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter Evaluation Board (Unit: mm) 2. Power Dissipation vs. Ambient Temperature Board Mount (Tj max = 125) Ambient Temperature Power Dissipation PdmW 25 1000 85 400 Thermal Resistance (/W) 100.00 PdmW Power Dissipation Pd (mW) Pd-Ta Pd vs. Ta 1200 1000 800 600 400 200 0 25 20/21 45 65 85 Ta Ambient Temperature Ta () 105 125 XC6802 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this datasheet. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this datasheet. 4. The products in this datasheet are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this datasheet within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this datasheet may be copied or reproduced without the prior permission of TOREX SEMICONDUCTOR LTD. 21/21