CYBT-343151-02 EZ-BTTM WICED(R) XT/XR Module CYBT-343151-02, EZ-BTTM WICED XT/XR Module General Description The CYBT-343151-02 is a fully integrated Bluetooth Smart Ready wireless module. The CYBT-343151-02 includes an onboard crystal oscillator, passive components, flash memory, and the Cypress CYW20706 silicon device. Refer to the CYW20706 datasheet for additional details on the capabilities of the silicon device used in this module. The CYBT-343151-02 provides extended industrial temperature operation (XT). The CYBT-343151-02 supports peripheral functions (ADC and PWM), UART, I2C, and SPI communication, and a PCM/I2S audio interface. The CYBT-343151-02 includes a royalty-free Bluetooth stack compatible with Bluetooth 5.0 in a 12.0 x 15.5 x 1.95 mm package. The CYBT-343151-02 includes 512 KB of onboard serial flash memory and is designed for standalone operation. The CYBT-343151-02 uses an integrated power amplifier to achieve Class I or Class II output power capability. The CYBT-343151-02 is fully qualified by Bluetooth SIG and is targeted at applications requiring cost optimized Bluetooth wireless connectivity. Module Description Module size: 12.00 mm x 15.50 mm x 1.95 mm Drop-in compatible with CYBT-343026-01 Bluetooth 5.0 Qualified Smart Ready module QDID: 99198 Declaration ID: D035378 Low power mode support Deep Sleep: 2.69 A Functional Capabilities - ADC for audio (12 bits) and DC measurement (10 bits) Serial Communications Interface compatible with I2C slaves Certified to FCC, ISED, MIC, and CE regulations SPI support for both master and slave modes Castelated solder pad connections for ease-of-use HCI interface through UART 512-KB on-module serial flash memory PCM/I2S Audio interface Up to 11 GPIOs Two-wire Global Coexistence Interface (GCI) Temperature range: -30 C to +105 C Integrated peripherals such as PWM, ADC Arm(R) Cortex(R)-M3 32-bit processor Programmable output power control Maximum TX output power +12 dbm for Bluetooth Classic +9 dBm for Bluetooth Low Energy (BLE) * BLE connection range of up to 250 meters at 9 dBm[1] Supports extended synchronous connections (eSCO), for enhanced voice quality by allowing for retransmission of dropped packets RX Receive Sensitivity: Bluetooth Classic: * -93.5 dBm at 1 Mbps, GFSK * -95.5 dBm at 2 Mbps, /4-DQPSK * -89.5 dBm at 3 Mbps, 8-DPSK -96.5 dBm for Bluetooth Low Energy CYBT-343151-02 provides all necessary components required to operate BLE and/or BR/EDR communication standards. Power Consumption Benefits Enhanced Data Rate (EDR) at 8 dBm Peak TX current: 52.5 mA Peak RX current consumption: 26.4 mA BLE at 0 dBm 1-second interval BLE ADV average current consumption: 315 A Proven hardware design ready to use Dual-mode operation eliminates the need for multiple modules Cost optimized for applications without space constraints Nonvolatile memory for self-sufficient operation and Over-the-Air (OTA) updates Bluetooth SIG Listed with QDID and Declaration ID Fully certified module eliminates the time needed for design, development and certification processes WICEDTM Studio provides an easy-to-use integrated design environment (IDE) to configure, develop, and program a Bluetooth application Note 1. Connection range tested module-to-module in full line-of-sight environment, free of obstacles or interference sources with output power of +9.0 dBm. Actual range will vary based on end product design, environment, receive sensitity and transmit output power of the central deivce. Cypress Semiconductor Corporation Document Number: 002-24961 Rev. *A * 198 Champion Court * San Jose, CA 95134-1709 * 408-943-2600 Revised May 2, 2019 CYBT-343151-02 More Information Cypress provides a wealth of data at www.cypress.com to help you to select the right module for your design, and to help you to quickly and effectively integrate the module into your design. References Overview: EZ-BLE/BT Module Portfolio, Module Roadmap CYW20706 BT Silicon Datasheet Development Kits: CYBT-343026-EVAL, CYBT-343026-01 Evaluation Board Test and Debug Tools: (R) CYSmart, Bluetooth LE Test and Debug Tool (Windows) (R) CYSmart Mobile, Bluetooth LE Test and Debug Tool (Android/iOS Mobile App) Knowledge Base Article KBA97095 - EZ-BLETM Module Placement KBA213260 - RF Regulatory Certifications for CYBT-343026-01 EZ-BTTM WICED Modules KBA213976 - FAQ for BLE and Regulatory Certifications with EZ-BLE modules KBA210802 - Queries on BLE Qualification and Declaration Processes KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules KBA221025 - Platform Files for CYBT-343026-EVAL KBA223428 - Programming an EZ-BT WICED Module Development Environments Wireless Connectivity for Embedded Devices (WICED) Studio Software Development Kit (SDK) Cypress' WICED(R) (Wireless Connectivity for Embedded Devices) is a full-featured platform with proven Software Development Kits (SDKs) and turnkey hardware solutions from partners to readily enable Wi-Fi and Bluetooth(R) connectivity in system design. WICED Studio is the only SDK for the Internet of Things (IoT) that combines Wi-Fi and Bluetooth into a single integrated development environment. In addition to providing WICED APIs and an application framework designed to abstract complexity, WICED Studio also leverages many common industry standards. Technical Support Cypress Community: Whether you're a customer, partner or a developer interested in the latest Cypress innovations, the Cypress Developer Community offers you a place to learn, share and engage with both Cypress experts and other embedded engineers around the world. Frequently Asked Questions (FAQs): Learn more about our Bluetooth ECO System. Visit our support page and create a technical support case or contact a local sales representatives. If you are in the United States, you can talk to our technical support team by calling our toll-free number: +1-800-541-4736. Select option 2 at the prompt. Document Number: 002-24961 Rev. *A Page 2 of 52 CYBT-343151-02 Contents Overview ............................................................................ 4 Functional Block Diagram ........................................... 4 Module Description ...................................................... 4 Pad Connection Interface ................................................ 6 Recommended Host PCB Layout ................................... 7 Module Connections ........................................................ 9 Connections and Optional External Components ....... 10 Power Connections (VDDIN) ..................................... 10 External Reset (XRES) .............................................. 10 Multiple-Bonded GPIO Connections ......................... 11 Critical Components List ........................................... 13 Antenna Design ......................................................... 13 Functional Description ................................................... 14 Bluetooth Baseband Core ......................................... 14 Microcontroller Unit ................................................... 15 External Reset (XRES) .............................................. 16 Integrated Radio Transceiver ........................................ 17 Transmitter Path ........................................................ 17 Receiver Path ............................................................ 17 Local Oscillator Generation ....................................... 17 Calibration ................................................................. 17 Internal LDO .............................................................. 18 Collaborative Coexistence ............................................. 18 Global Coexistence Interface ........................................ 18 SECI I/O .................................................................... 18 Peripheral and Communication Interfaces .................. 19 I2C Communication Interface .................................... 19 HCI UART Interface .................................................. 19 Peripheral UART Interface ........................................ 20 Serial Peripheral Interface ......................................... 20 PCM Interface ........................................................... 20 Clock Frequencies .......................................................... 21 GPIO Port ........................................................................ 21 PWM ................................................................................. 22 Document Number: 002-24961 Rev. *A Power Management Unit ................................................ 23 RF Power Management ............................................ 23 Host Controller Power Management ......................... 23 BBC Power Management .......................................... 23 Electrical Characteristics ............................................... 24 Chipset RF Specifications ............................................. 27 Timing and AC Characteristics ..................................... 30 UART Timing ............................................................. 30 SPI Timing ................................................................. 31 I2C Interface Timing .................................................. 33 PCM Interface Timing ................................................ 34 I2S Interface Timing .................................................. 38 Environmental Specifications ....................................... 41 Environmental Compliance ....................................... 41 RF Certification .......................................................... 41 Safety Certification .................................................... 41 Environmental Conditions ......................................... 41 ESD and EMI Protection ........................................... 41 Regulatory Information .................................................. 42 FCC ........................................................................... 42 ISED .......................................................................... 43 European Declaration of Conformity ......................... 44 MIC Japan ................................................................. 44 Packaging ........................................................................ 45 Ordering Information ...................................................... 47 Acronyms ........................................................................ 48 Document Conventions ................................................. 50 Units of Measure ....................................................... 50 Document History Page ................................................. 51 Sales, Solutions, and Legal Information ...................... 52 Worldwide Sales and Design Support ....................... 52 Products .................................................................... 52 PSoC(R) Solutions ...................................................... 52 Cypress Developer Community ................................. 52 Technical Support ..................................................... 52 Page 3 of 52 CYBT-343151-02 Overview Functional Block Diagram Figure 1 illustrates the CYBT-343151-02 functional block diagram. Figure 1. Functional Block Diagram (GPIOs) Module Description The CYBT-343151-02 module is a complete module designed to be soldered to the application's main board. Module Dimensions and Drawing Cypress reserves the right to select components from various vendors to achieve the Bluetooth module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained. Designs should be held within the physical dimensions shown in the mechanical drawings in Figure 2 on page 5. All dimensions are in millimeters (mm). Table 1. Module Design Dimensions Dimension Item Specification Length (X) 12.00 0.15 mm Width (Y) 15.50 0.15 mm Length (X) 12.0 mm Width (Y) 4.62 mm PCB thickness Height (H) 0.50 0.05 mm Shield height Height (H) 1.45 mm typical Maximum component height Height (H) 1.45 mm typical Total module thickness (bottom of module to highest component) Height (H) 1.95 mm typical Module dimensions Antenna connection location dimensions Document Number: 002-24961 Rev. *A Page 4 of 52 CYBT-343151-02 See Figure 2 for the mechanical reference drawing for CYBT-343151-02. Figure 2. Module Mechanical Drawing Side View Top View (Seen from Top) Bottom View Notes 2. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area. For more information on recommended host PCB layout, see "Recommended Host PCB Layout" on page 7. 3. The CYBT-343151-02 includes castellated pad connections, denoted as the circular openings at the pad location above. Document Number: 002-24961 Rev. *A Page 5 of 52 CYBT-343151-02 Pad Connection Interface As shown in the bottom view of Figure 2 on page 5, the CYBT-343151-02 connects to the host board via solder pads on the backside of the module. Table 2 and Figure 3 detail the solder pad length, width, and pitch dimensions of the CYBT-343151-02 module. Table 2. Connection Description Name Connections Connection Type Pad Length Dimension Pad Width Dimension Pad Pitch SP 24 Solder Pads 1.02 mm 0.71 mm 1.22 mm Figure 3. Solder Pad Dimensions (Seen from Bottom To maximize RF performance, the host layout should follow these recommendations: 1. Antenna Area Keepout: The host board directly below the antenna area of the Cypress module (see Figure 2) must contain no ground or signal traces. This keep out area requirement applies to all layers of the host board. 2. Module Placement: The ideal placement of the Cypress Bluetooth module is in a corner of the host board with the PCB trace antenna located at the far corner. This placement minimizes the additional recommended keep out area stated in item 2. Refer to AN96841 for module placement best practices. Figure 4. Recommended Host PCB Keep Out Area Around the CYBT-343151-02 Antenna Document Number: 002-24961 Rev. *A Page 6 of 52 CYBT-343151-02 Recommended Host PCB Layout Figure 5, Figure 6, Figure 7, and Table 3 on page 8 provide details that can be used for the recommended host PCB layout pattern for the CYBT-343151-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.27 mm (0.635 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length. The host PCB layout pattern can be completed using either Figure 5, Figure 6, or Figure 7. It is not necessary to use all figures to complete the host PCB layout pattern. Figure 5. CYBT-343151-02 Host Layout (Dimensioned) Figure 6. CYBT-343151-02 Host Layout (Relative to Origin) Top View (Seen on Host PCB) Top View (Seen on Host PCB) Document Number: 002-24961 Rev. *A Page 7 of 52 CYBT-343151-02 Table 3 provides the center location for each solder pad on the CYBT-343151-02. All dimensions are referenced to the center of the solder pad. Figure 7 shows the location of each module solder pad. Table 3. Module Solder Pad Location Solder Pad (Center of Pad) Figure 7. Solder Pad Reference Location Location (X,Y) from Dimension from Orign (mm) Orign (mils) 1 (0.38, 5.04) (14.96, 198.42) 2 (0.38, 6.26) (14.96, 246.46) 3 (0.38, 7.48) (14.96, 294.49) 4 (0.38, 8.70) (14.96, 342.52) 5 (0.38, 9.92) (14.96, 390.55) 6 (0.38, 11.14) (14.96, 438.58) 7 (0.38, 12.35) (14.96, 486.22) 8 (0.38, 13.57) (14.96, 534.25) 9 (1.73, 15.11) (68.11, 594.88) 10 (2.95, 15.11) (116.14, 594.88) 11 (4.17, 15.11) (164.17, 594.88) 12 (5.39, 15.11) (212.20, 594.88) 13 (6.61, 15.11) (260.24, 594.88) 14 (7.83, 15.11) (308.27, 594.88) 15 (9.05, 15.11) (356.30, 594.88) 16 (10.27, 15.11) (404.33, 594.88) 17 (11.62, 13.57) (457.48, 534.25) 18 (11.62, 12.35) (457.48, 486.22) 19 (11.62, 11.14) (457.48, 438.58) 20 (11.62, 9.92) (457.48, 390.55) 21 (11.62, 8.70) (457.48, 342.52) 22 (11.62, 7.48) (457.48, 294.49) 23 (11.62, 6.26) (457.48, 246.46) 24 (11.62, 5.04) (457.48, 198.42) Document Number: 002-24961 Rev. *A Top View (Seen on Host PCB) Page 8 of 52 CYBT-343151-02 Module Connections Table 4 details the solder pad connection definitions and available functions for the pad connections for the CYBT-343151-02 module. Table 4 lists the solder pads on the CYBT-343151-02 module, the silicon device pin, and denotes what functions are available for each solder pad. Table 4. CYBT-343151-02 Solder Pad Connection Definitions Pad Pad Name Silicon Pin Name Silicon Port-Pin Name UART SPI[4, 5] 1 P0/P34 C8 PCM_Sync/ I2S_WS/P0/P34 PUART_TX/P0 PUART_RX/P34 SPI1_MOSI/P0 (master/slave) 2 I2C_SCL A8 I2S_DO/ PCM_Out/P3/ P29/P35 PUART_CTS/ P3 or P35 SPI1_CLK/P3 (master/slave) 3 XRES RESET_N RESET_N C7 PCM_IN/ I2S_DI/P12 4 I2C_SDA I2C ADC CLK/ XTAL COEX IN29/P0 IN5/P34 SCL SDA/ P35 IN4/P35 IN10/29 GPIO Other PCM_Sync I2S_WS (P3/P29/P3 5) I2S_DO PCM_Out PWM3 (P29) (P12) PCM_IN I2S_DI PWM2 (P28) I2S_CLK PCM_CLK External Reset (Active Low) SDA IN23/P12 SCL/ P37 IN11/P28 IN2/P37 5 P2/P37/P28 B7 PCM_CLK/ I2S_CLK/P2/ P28/P37 6 SPI2_CS_N D7 N/A 7 GND GND GND Ground 8 SPI2_MISO D8 N/A No Connect (Used for on-module memory SPI interface for CYBT-343151-02) PUART_RX/P2 SPI1_CS(slave)/P2 SPI1_MOSI(master) /P2 SPI1_MISO(slave) /P37 ACLK1/P 37 No Connect (Used for on-module memory SPI interface for CYBT-343151-02) 9 SPI2_MOSI E8 N/A No Connect (Used for on-module memory SPI interface for CYBT-343151-02) 10 SPI2_CLK E7 N/A No Connect (Used for on-module memory SPI interface for CYBT-343151-02) 11 GPIO_0 F8 BT_GPIO_0/P36/ P38 SPI1_CLK/P36 SPI1_MOSI/P38 (master/slave) IN3/P36 IN1/P38 ACLK0/P 36 (DevWake) 12 GPIO_1 F7 BT_GPIO_1/P25/ PUART_RX/P25 P32 PUART_TX/P32 SPI1_MISO/P25 (master/slave) SPI1_CS/P32 (slave) IN7/P32 ACLK0/P 32 (HostWake) 13 GND GND GND Ground 14 GPIO_4 D6 BT_GPIO_4/P6/P PUART_RTS/P6 31/LPO_IN PUART_TX/P31 15 P4/P24 G8 BT_CLK_REQ/P4 PUART_RX/P4 /P24 PUART_TX/P24 SPI1_CS/P6 (slave) SPI1_MOSI/P4 (master/slave) SPI1_CLK/P24 (master/slave) IN8/P31 (CLK_REQ) 16 UART_TXD F4 BT_UART_TXD HCI UART Transmit Data 17 UART_CTS G4 BT_UART_CTS HCI UART Clear To Send Input 18 UART_RTS F3 BT_UART_RTS HCI UART Request To Send Output 19 GPIO_7 C6 BT_GPIO_7/ P30 20 UART_RXD F5 BT_UART_RXD 21 VDDIN G1 VDDIN PUART_RTS/ P30 22 GPIO_3 C5 BT_GPIO_3/P27/ PUART_RX/P33 P33 23 GPIO_6 B6 BT_GPIO_6/P11/ P26 24 GND GND GND Ext LPO In IN9/P30 (GCI_SECI _OUT) HCI UART Receive Data VDDIN (2.3V ~ 3.6V) SPI1_MOSI/P27 (master/slave) SPI1_MOSI/P33 (slave) SPI1_CS/P26 (slave) PWM1 (P27) IN6/P33 IN24/P11 (GCI_SECI _IN) ACLK1/P 33 PWM0 (P26) Ground Notes 4. The CYBT-343026-01 contains a single SPI (SPI1) peripheral supporting both master or slave configurations. SPI2 is used for on-module serial memory interface. 5. In Master mode, any available GPIO can be configured as SPI1_CS. This function is not explicitly shown in the table above. Document Number: 002-24961 Rev. *A Page 9 of 52 CYBT-343151-02 Connections and Optional External Components Power Connections (VDDIN) The CYBT-343151-02 contains one power supply connection, VDDIN. VDDIN accepts a supply input range of 2.3 V to 3.6 V for CYBT-343151-02. Table 11 on page 24 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 11. It is not required to place any power supply decoupling or noise reduction circuitry on the host PCB. If desired, an external ferrite bead between the supply and the module connection can be included, but is not necessary. If used, the ferrite bead should be positioned as close as possible to the module pin connection and the recommended ferrite bead value is 330, 100 MHz. Considerations and Optional Components for Brownout (BO) Conditions Power supply design must be completed to ensure that the CYBT-343151-02 module does not encounter a Brownout condition, which can lead to unexpected functionality, or module lock up. A Brownout condition may be met if power supply provided to the module during power up or reset is in the following range: VILVDDIN VIH. Refer to Table 12 on page 24 for the VIL and VIH specifications. System design should ensure that the above condition is not encountered when power is removed from the system. In the event that this cannot be guaranteed (that is, battery installation, high-value power capacitors with slow discharge), it is recommended that an external voltage detection device be used to prevent the Brownout voltage range from occurring during power removal. Figure 8 shows the recommended circuit design when using an external voltage detection IC. Figure 8. Reference Circuit Block Diagram for External Voltage Detection IC In the event that the module does encounter a Brownout condition, and is operating erratically or not responsive, power cycling the module will correct this issue and once reset, the module should operate correctly. Brownout conditions can potentially cause issues that cannot be corrected, but in general, a power-on reset (POR) operation will correct a Brownout condition. External Reset (XRES) The CYBT-343151-02 has an integrated POR circuit, which completely resets all circuits to a known power-on state. This action can also be evoked by an external reset signal, forcing it into a power-on reset state. The XRES signal is an active-low signal, which is an input to the CYBT-343151-02 module (solder pad 3). The CYBT-343151-02 module does not require an external pull-up resistor on the XRES input. During power-on operation, the XRES connection to the CYBT-343151-02 is required to be held low 50 ms after the VDD power supply input to the module is stable. This can be accomplished in the following ways: The host device should connect a GPIO to the XRES of the Cypress CYBT-343151-02 module and pull XRES low until VDD is stable. XRES is recommended to be released 50 ms after VDDIN is stable. If the XRES connection of the CYBT-343151-02 module is not used in the application, a 10-F capacitor may be connected to the XRES solder pad of the CYBT-343151-02 in order to delay the XRES release. The capacitor value for this recommended implementation is approximate, and the exact value may differ depending on the VDDIN power supply ramp time of the system. The capacitor value should result in an XRES release timing of 50 ms after VDDIN stability. The XRES release timing may be controlled by a external voltage detection IC. XRES should be released 50 ms after VDD is stable. Refer to Figure 11 on page 16 for XRES operating and timing requirements during power-on events. Document Number: 002-24961 Rev. *A Page 10 of 52 CYBT-343151-02 Multiple-Bonded GPIO Connections The CYBT-343151-02 contains GPIOs, which are multiple-bonded at the silicon level. If any of these dual-bonded GPIOs are used, only the functionality and features for one of these port pins may be used. The desired port pin should be configured in the WICED Studio SDK. For details on the features and functions that each of these multiple-bonded GPIOs provide, refer to Table 4. The list below details the multiple-bonded GPIOs available on the CYBT-343151-02 module: PAD 1 P0/34: I2S_WS_PCM_SYNC/P0/P34 (triple bonded; only one of four is available) PAD 2 I2C_SCL: I2S_PCM_OUT/P3/P29/P35 (quadruple bonded; only one of four is available) PAD 4 I2C_SDA: I2S_PCM_IN/P12 (dual bonded; only one of two is available) PAD 5 P2/P37/P28: I2S_PCM_CLK/P2/P28/P37 (quadruple bonded; only one of four is available) PAD 11 GPIO_0: GPIO_0/P36/P38 (triple bonded; only one of three is available) PAD 12 GPIO_1: GPIO_1/P25/P32 (triple bonded; only one of three is available) PAD 14 GPIO_4: GPIO_4/LPO_IN/P6/P31 (quadruple bonded; only of four is available) PAD 15 P4/P24: BT_CLK_REQ/P4/P24 (triple bonded; only one of three is available) PAD 19 GPIO_7: GPIO_7/P30 (Dual bonded; only one of two is available) PAD 22 GPIO_3: GPIO_3/P27/P33 (triple bonded; only one of three is available) PAD 23 GPIO_6: GPIO_6/P11/P26 (triple bonded; only one of three is available) Document Number: 002-24961 Rev. *A Page 11 of 52 CYBT-343151-02 Figure 9 illustrates the CYBT-343151-02 schematic. Figure 9. CYBT-343151-02 Schematic Diagram Document Number: 002-24961 Rev. *A Page 12 of 52 CYBT-343151-02 Critical Components List Table 5 details the critical components used in the CYBT-343151-02 module. Table 5. Critical Component List Component Reference Designator Description Silicon U1 49-pin FBGA BT/BLE Silicon Device - CYW20706 Silicon U2 8-pin TDF8N, 512K Serial Flash Crystal Y1 24 MHz, 12 pF Antenna Design Table 6 details trace antenna used in the CYBT-343151-02 module. Table 6. Trace Antenna Specifications Item Description Frequency Range 2400-2500 MHz Peak Gain -0.5 dBi typical Return Loss 10 dB minimum Document Number: 002-24961 Rev. *A Page 13 of 52 CYBT-343151-02 Functional Description Bluetooth Baseband Core The Bluetooth Baseband Core (BBC) implements all of the time-critical functions required for high-performance Bluetooth operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It also buffers data that passes through it, handles data flow control, schedules SCO/ACL and TX/RX transactions, monitors Bluetooth slot usage, optimally segments, and packages data into baseband packets, manages connection status indicators, and composes and decodes HCI packets. In addition to these functions, it independently handles HCI event types, and HCI command types. The following transmit and receive functions are also implemented in the BBC hardware to increase reliability and security of the TX/RX data before sending over-the-air: Symbol timing recovery, data deframing, forward error correction (FEC), header error control (HEC), cyclic redundancy check (CRC), data decryption, and data dewhitening in the receiver. Data framing, FEC generation, HEC generation, CRC generation, key generation, data encryption, and data whitening in the transmitter. Table 7. Bluetooth Features Bluetooth 1.0 Bluetooth 1.2 Bluetooth 2.0 Basic Rate Interlaced Scans EDR 2 Mbps and 3 Mbps SCO Adaptive Frequency Hopping - Paging and Inquiry eSCO - Page and Inquiry Scan - - Sniff - Bluetooth 2.1 - Bluetooth 3.0 Bluetooth 4.0 Secure Simple Pairing Unicast Connectionless Data Bluetooth Low Energy Enhanced Inquiry Response Enhanced Power Control - Sniff Subrating eSCO - Bluetooth 4.1 Bluetooth 4.2 Low Duty Cycle Advertising Data Packet Length Extension - Dual Mode LE Secure Connection - LE Link Layer Topology Link Layer Privacy - Link Control Layer The link control layer is part of the Bluetooth link control functions that are implemented in dedicated logic in the link control unit (LCU). This layer consists of the command controller that takes commands from the software, and other controllers that are activated or configured by the command controller, to perform the link control tasks. Each task is performed in a different state in the Bluetooth Link Controller. States: Standby Connection Page Page Scan Inquiry Inquiry Scan Sniff Advertising Scanning Document Number: 002-24961 Rev. *A Page 14 of 52 CYBT-343151-02 Test Mode Support The CYBT-343151-02 fully supports Bluetooth Test Mode as described in Part I:1 of the Specification of the Bluetooth System Version 3.0. This includes the transmitter tests, normal and delayed loopback tests, and reduced hopping sequence. In addition to the standard Bluetooth Test Mode, the CYBT-343151-02 also supports enhanced testing features to simplify RF debugging and qualification and type-approval testing. These features include: Fixed frequency carrier wave (unmodulated) transmission Simplifies some type-approval measurements (Japan) Aids in transmitter performance analysis Fixed frequency constant receiver mode Receiver output directed to I/O pin Allows for direct BER measurements using standard RF test equipment Facilitates spurious emissions testing for receive mode Fixed frequency constant transmission 8-bit fixed pattern or PRBS-9 Enables modulated signal measurements with standard RF test equipment. Frequency Hopping Generator The frequency hopping sequence generator selects the correct hopping channel number based on the link controller state, Bluetooth clock, and device address. Microcontroller Unit The microprocessor unit in CYBT-343151-02 runs software from the link control (LC) layer up to the host controller interface (HCI). The microprocessor is based on the Arm Cortex-M3 32-bit RISC processor with embedded ICE-RT debug and JTAG interface units. The microprocessor also includes 848 KB of ROM memory for program storage and boot ROM, 352 KB of RAM for data scratch-pad, and patch RAM code. The internal boot ROM provides flexibility during power-on reset to enable the same device to be used in various configurations. At power-up, the lower layer protocol stack is executed from the internal ROM. External patches can be applied to the ROM-based firmware to provide flexibility for bug fixes and features additions. These patches can be downloaded using external NVRAM. The device can also support the integration of user applications and profiles using an external serial flash memory. NVRAM Configuration Data and Storage NVRAM contains configuration information about the customer application, including the following: Fractional-N information BD_ADDR UART baud rate SDP service record File system information used for code, code patches, or data. The CYBT-343151-02 uses SPI Serial Flash for NVRAM storage. One-Time Programmable Memory The microprocessor unit in CYBT-343151-02 includes 2 KB of one-time programmable (OTP) memory allow manufacturing customization and to avoid the need for an onboard NVRAM. If customization is not required, then the OTP does not need to be programmed. Whether the OTP is programmed or not, to save power it is disabled when the boot process is complete. The OTP is designed to store a minimal amount of information. Aside from OTP data, most user configuration information will be downloaded to RAM after the CYBT-343151-02 boots and is ready for host transport communication. The OTP contents are limited to: Parameters required prior to downloading the user configuration to RAM. Parameters unique to each part and each customer (for example, the Bluetooth device address and/or the software license key). VDDIN for the module must be kept to 3.0 V to 3.6 V power supply range if OTP is used in the application. Document Number: 002-24961 Rev. *A Page 15 of 52 CYBT-343151-02 External Reset (XRES) The CYBT-343151-02 has an integrated POR circuit that completely resets all circuits to a known power-on state. An external active low reset signal, XRES, can be used to put the CYBT-343151-02 in the reset state. The XRES pin has an internal pull-up resistor and, in most applications, it does not require anything to be connected to it. Figure 10. External Reset Internal Timing External Reset (XRES) Recommended External Components and Proper Operation During a power-on event, the XRES line of the CYBT-343151-02 is required to be held low 50 ms after the VDD power supply input to the module is stable. Refer to Figure 11 for the Power-On XRES timing operation. This power-on operation can be accomplished in the following ways: A host device should connect a GPIO to the XRES of the Cypress CYBT-343151-02 module and pull XRES low until VDD is stable. XRES can be released after VDD is stable. If the XRES connection of the CYBT-343151-02 module is not used in the application, a 10-F capacitor may be connected to the XRES solder pad of the CYBT-343151-02. The XRES release timing can also be controlled via an external voltage detection circuit. Figure 11. Power-On External Reset (XRES) Operation Document Number: 002-24961 Rev. *A Page 16 of 52 CYBT-343151-02 Integrated Radio Transceiver The CYBT-343151-02 has an integrated radio transceiver that has been optimized for use in 2.4-GHz Bluetooth wireless systems. It has been designed to provide low-power, low-cost, robust communications for applications operating in the globally available 2.4-GHz unlicensed ISM band. The CYBT-343151-02 is fully compliant with the Bluetooth Radio Specification and EDR specification and meets or exceeds the requirements to provide the highest communication link quality of service. Transmitter Path The CYBT-343151-02 a fully integrated zero-IF transmitter. The baseband transmit data is GFSK-modulated in the modem block and upconverted to the 2.4-GHz ISM band in the transmitter path. The transmitter path consists of signal filtering, I/Q upconversion, output power amplifier, and RF filtering. The transmitter path also incorporates /4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support EDR. The transmitter section is compatible with the BLE specification. The transmitter PA bias can also be adjusted to provide Bluetooth class 1 or class 2 operation. Digital Modulator The digital modulator performs the data modulation and filtering required for the GFSK, 4-DQPSK, and 8-DPSK signal. The fully digital modulator minimizes any frequency drift or anomalies in the modulation characteristics of the transmitted signal and is much more stable than direct VCO modulation schemes. Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit synchronization algorithm. Power Amplifier The fully integrated PA supports Class 1 or Class 2 output using a highly linearized, temperature-compensated design. The transmitter features a sophisticated on-chip transmit signal strength indicator (TSSI) block to keep the absolute output power variation within a tight range across process, voltage, and temperature. Receiver Path The receiver path uses a low-IF scheme to downconvert the received signal for demodulation in the digital demodulator and bit synchronizer. The receiver path provides a high degree of linearity, an extended dynamic range, and high-order on-chip channel filtering to ensure reliable operation in the noisy 2.4 GHz ISM band. The front-end topology, with built-in out-of-band attenuation, enables the CYBT-343151-02 to be used in most applications with minimal off-chip filtering. For integrated handset operation, in which the Bluetooth function is integrated close to the cellular transmitter, external filtering is required to eliminate the desensitization of the receiver by the cellular transmit signal. Digital Demodulator and Bit Synchronizer The digital demodulator and bit synchronizer take the low-IF received signal and perform an optimal frequency tracking and bit synchronization algorithm. Receiver Signal Strength Indicator The radio portion of the CYBT-343151-02 provides a receiver signal strength indicator (RSSI) to the baseband. This enables the controller to take part in a Bluetooth power-controlled link by providing a metric of its own receiver signal strength to determine whether the transmitter should increase or decrease its output power. Local Oscillator Generation The local oscillator (LO) provides fast frequency hopping (1600 hops/second) across the 79 maximum available channels. The LO generation sub-block employs an architecture for high immunity to LO pulling during PA operation. The CYBT-343151-02 uses an internal loop filter. Calibration The CYBT-343151-02 radio transceiver features an automated calibration scheme that is fully self-contained in the radio. No user interaction is required during normal operation or during manufacturing to provide optimal performance. Calibration tunes the performance of all the major blocks within the radio to within 2% of optimal conditions, including gain and phase characteristics of filters, matching between key components, and key gain blocks. This takes into account process variation and temperature variation. Calibration occurs transparently during normal operation during the settling time of the hops, and calibrates for temperature variations as the device cools and heats during normal operation in its environment. Document Number: 002-24961 Rev. *A Page 17 of 52 CYBT-343151-02 Internal LDO The microprocessor in CYBT-343151-02 uses two LDOs: one for 1.2 V and the other for 2.5 V. The 1.2-V LDO provides power to the baseband and radio and the 2.5-V LDO powers the PA. Collaborative Coexistence The CYBT-343151-02 provides extensions and collaborative coexistence to the standard Bluetooth AFH for direct communication with WLAN devices. Collaborative coexistence enables WLAN and Bluetooth to operate simultaneously in a single device. The device supports industry-standard coexistence signaling, including 802.15.2, and supports Cypress and third-party WLAN solutions. Global Coexistence Interface The CYBT-343151-02 supports the proprietary Cypress Global Coexistence Interface (GCI) which is a two-wire interface. The following key features are associated with the interface: Enhanced coexistence data can be exchanged over GCI_SECI_IN and GCI_SECI_OUT a two-wire interface, one serial input (GCI_SECI_IN), and one serial output (GCI_SECI_OUT). The pad configuration registers must be programmed to choose the digital I/O pins that serve the GCI_SECI_IN and GCI_SECI_OUT function. It supports generic UART communication between WLAN and Bluetooth devices. To conserve power, it is disabled when inactive. It supports automatic resynchronization upon waking from sleep mode. It supports a baud rate of up to 4 Mbps. SECI I/O The microprocessor in CYBT-343151-02 has dedicated GCI_SECI_IN (PAD 23/GPIO_6) and GCI_SECI_OUT (PAD19/GPIO_7) pins. Table 4 on page 9 details the module solder pad number used for SECI I/O. Document Number: 002-24961 Rev. *A Page 18 of 52 CYBT-343151-02 Peripheral and Communication Interfaces I2C Communication Interface The CYBT-343151-02 provides a two-pin master I2C interface, which can be used to retrieve configuration information from an external EEPROM or to communicate with peripherals such as track-ball or touch-pad modules, and motion tracking ICs used in mouse devices. This interface is compatible with I2C slave devices. I2C does not support multimaster capability or flexible wait-state insertion by either master or slave devices. The following transfer clock rates are supported by the I2C: 100 kHz 400 kHz 800 kHz (Not a standard I2C-compatible speed.) 1 MHz (Compatibility with high-speed I2C-compatible devices is not guaranteed.) The following transfer types are supported by the I2C: Read (Up to 127 bytes can be read.) Write (Up to 127 bytes can be written.) Read-then-Write (Up to 127 bytes can be read and up to 127 bytes can be written.) Write-then-Read (Up to127 bytes can be written and up to 127 bytes can be read.) Hardware controls the transfers, requiring minimal firmware setup and supervision. The clock pad (I2C_SCL) and data pad 2 (I2C_SDA) are both open-drain I/O pins. Pull-up resistors, external to the CYBT-343151-02, are required on both the SCL and SDA pad for proper operation. HCI UART Interface The UART physical interface is a standard, four-wire interface (RX, TX, RTS, and CTS) with adjustable baud rates from 38400 bps to 4 Mbps. During initial boot, UART speed may be limited to 750 kbps. The baud rate may be selected via a vendor-specific UART HCI command. The CYBT-343151-02 has a 1040-byte receive FIFO and a 1040-byte transmit FIFO to support enhanced data rates. The interface supports the Bluetooth UART HCI (H4) specification. The default baud rate for H4 is 115.2 kbaud. The UART clock default setting is 24 MHz, and can be configured to run as high as 48 MHz to support up to 4 Mbps. The baud rate of the CYBT-343151-02 UART is controlled by two values. The first is a UART clock divisor (set in the DLBR register) that divides the UART clock by an integer multiple of 16. The second is a baud rate adjustment (set in the DHBR register) that is used to specify a number of UART clock cycles to stuff in the first or second half of each bit time. Up to eight UART cycles can be inserted into the first half of each bit time, and up to eight UART clock cycles can be inserted into the end of each bit time. Table 8 contains example values to generate common baud rates with a 24 MHz UART clock. Table 8. Common Baud Rate Examples, 24 MHz Clock Baud Rate (bps) Baud Rate Adjustment Mode Error (%) 0xF4 High rate 0.00 0xF8 High rate 0.00 0XFF 0XF4 High rate 0.00 1M 0X44 0XFF Normal 0.00 921600 0x05 0x05 Normal 0.16 460800 0x02 0x02 Normal 0.16 230400 0x04 0x04 Normal 0.16 115200 0x00 0x00 Normal 0.16 High Nibble Low Nibble 4M 0xFF 3M 0xFF 2M 57600 0x00 0x00 Normal 0.16 38400 0x01 0x00 Normal 0.00 Document Number: 002-24961 Rev. *A Page 19 of 52 CYBT-343151-02 Normally, the UART baud rate is set by a configuration record downloaded after reset. Support for changing the baud rate during normal HCI UART operation is included through a vendor-specific command that allows the host to adjust the contents of the baud rate registers. The CYBT-343151-02 UART operates correctly with the host UART as long as the combined baud rate error of the two devices is within 2%. Peripheral UART Interface The CYBT-343151-02 has a second UART that may be used to interface to other peripherals. This peripheral UART is accessed through the optional I/O ports, which can be configured individually and separately for each signal as shown in Table 9. Table 9. CYBT-343151-02 Peripheral UART Signal Name PUART_TX PUART_RX PUART_CTS_N PUART_RTS_N PUART Port Configuration #1 P0 P2 P3 P6 PUART Port Configuration #2 P31 P33 P35 P30 Serial Peripheral Interface The CYBT-343151-02 has two independent SPI interfaces. One is a master-only interface (SPI2) and the other (SPI1) can be either a master or a slave. Each interface has a 64-byte transmit buffer and a 64-byte receive buffer. To support more flexibility for user applications, the CYBT-343151-02 has optional I/O ports that can be configured individually and separately for each functional pin. The CYBT-343151-02 acts as an SPI master device that supports 3.3 V SPI slaves. For master mode, refer to Table 4 on page 9 to identify the solder pads available for SPI1_MISO, SPI1_MOSI, and SPI1_CLK connections. Note In master mode, any available GPIO can be assigned as SPI1_CS. The CYBT-343151-02 can also act as an SPI slave device that supports a 3.3 V SPI master. For SPI1 slave mode, refer to Table 4 to identify the solder pads available for SPI1 slave mode connections. SPI voltage depends on VDDIN; therefore, VDDIN should be set to 3.3 V for SPI communication. PCM Interface The CYBT-343151-02 includes a PCM interface that shares pins with the I2S interface. The PCM Interface on the CYBT-343151-02 can connect to linear PCM codec devices in master or slave mode. In master mode, the CYBT-343151-02 generates the PCM_CLK and PCM_SYNC signals. In slave mode, these signals are provided by another master on the PCM interface and are inputs to the CYBT-343151-02. Slot Mapping The CYBT-343151-02 supports up to three simultaneous full-duplex SCO or eSCO channels through the PCM interface. These three channels are time-multiplexed onto the single PCM interface by using a time-slotting scheme where the 8 kHz or 16 kHz audio sample interval is divided into as many as 16 slots. The number of slots is dependent on the selected interface rate (128 kHz, 512 kHz, or 1024 kHz). The corresponding number of slots for these interface rates is 1, 2, 4, 8, and 16, respectively. Transmit and receive PCM data from an SCO channel is always mapped to the same slot. The PCM data output driver tristates its output on unused slots to allow other devices to share the same PCM interface signals. The data output driver tristates its output after the falling edge of the PCM clock during the last bit of the slot. Frame Synchronization The CYBT-343151-02 supports both short- and long-frame synchronization in both master and slave modes. In short-frame synchronization mode, the frame synchronization signal is an active-high pulse at the audio frame rate that is a single-bit period in width and is synchronized to the rising edge of the bit clock. The PCM slave looks for a high on the falling edge of the bit clock and expects the first bit of the first slot to start at the next rising edge of the clock. In long-frame synchronization mode, the frame synchronization signal is again an active-high pulse at the audio frame rate; however, the duration is three bit periods and the pulse starts coincident with the first bit of the first slot. Data Formatting The CYBT-343151-02 may be configured to generate and accept several different data formats. For conventional narrowband speech mode, the CYBT-343151-02 uses 13 of the 16 bits in each PCM frame. The location and order of these 13 bits can be configured to support various data formats on the PCM interface. The remaining three bits are ignored on the input and may be filled with 0s, 1s, a sign bit, or a programmed value on the output. The default format is 13-bit 2's complement data, left justified, and clocked MSB first. Document Number: 002-24961 Rev. *A Page 20 of 52 CYBT-343151-02 Clock Frequencies The CYBT-343151-02 has an integrated 24 MHz crystal on the module. There is no need to add an additional crystal oscillator. GPIO Port The CYBT-343151-02 has nine GPIOs besides two I2C pads. All GPIOs support programmable pull-ups and are capable of driving up to 8 mA at 3.3 V or 4 mA at 1.8 V, except chips P26, P27, P28, and P29, which are capable of driving up to 16 mA at 3.3 V. The following GPIOs are available on the module pads: PAD 1 P0/34: I2S_WS_PCM_SYNC/P0/P34 (triple bonded; only one of four is available) PAD 2 I2C_SCL: I2S_PCM_OUT/P3/P29/P35 (quadruple bonded; only one of four is available) PAD 4 I2C_SDA: I2S_PCM_IN/P12 (dual bonded; only one of two is available) PAD 5 P2/P37/P28: I2S_PCM_CLK/P2/P28/P37 (quadruple bonded; only one of four is available) PAD 11 GPIO_0: GPIO_0/P36/P38 (triple bonded; only one of three is available) PAD 12 GPIO_1: GPIO_1/P25/P32 (triple bonded; only one of three is available) PAD 14 GPIO_4: GPIO_4/LPO_IN/P6/P31 (quadruple bonded; only of four is available) PAD 15 P4/P24: BT_CLK_REQ/P4/P24 (triple bonded; only one of three is available) PAD 19 GPIO_7: GPIO_7/P30 (Dual bonded; only one of two is available) PAD 22 GPIO_3: GPIO_3/P27/P33 (triple bonded; only one of three is available) PAD 23 GPIO_6: GPIO_6/P11/P26 (triple bonded; only one of three is available) Refer to Table 4 on page 9 to determine what GPIOs can be configured as ADC Inputs. Note Any available GPIO can be used for SPI1_CS when in master mode. Port 26-Port 29 in PAD 23/PAD 22/PAD 5/PAD 2 P[26:29] in PAD 23/PAD 22/PAD 5/PAD 2 consists of four pins. All pins are capable of sinking up to 16 mA for LEDs. These pins also have PWM functionality, which can be used for LED dimming. For a description of the capabilities of all GPIOs, see Table 4. Document Number: 002-24961 Rev. *A Page 21 of 52 CYBT-343151-02 PWM The CYBT-343151-02 has four PWMs. The PWM module consists of the following: PWM0-3 The following GPIOs can be mapped as PWMs, module pad shown are: PWM0: P26 on P11/P26 [Pad 23] PWM1: P27 on P33/P27 [Pad 22] PWM2: P28 on P2/P37/P28 [Pad 5] PWM3: P29 on P3/P35/P29/I2C_SCL [Pad 2] PWM1-4: Each of the four PWM channels contains the following registers: 10-bit initial value register (read/write) 10-bit toggle register (read/write) 10-bit PWM counter value register (read) PWM configuration register shared among PWM1-4 (read/write). This 12-bit register is used to perform the following: Configure each PWM channel. Select the clock of each PWM channel. Change the phase of each PWM channel. Figure 12 shows the structure of one PWM. Figure 12. PWM Block Diagram Document Number: 002-24961 Rev. *A Page 22 of 52 CYBT-343151-02 Power Management Unit The Power Management Unit (PMU) provides power management features that can be invoked by software through power management registers or packet-handling in the baseband core. RF Power Management The BBC generates power-down control signals for the transmit path, receive path, PLL, and power amplifier to the 2.4-GHz transceiver, which then processes the power-down functions accordingly. Host Controller Power Management Power is automatically managed by the firmware based on input device activity. As a power-saving task, the firmware controls the disabling of the on-chip regulator when in deep sleep (HIDOFF) mode. BBC Power Management There are several low-power operations for the BBC: Physical layer packet handling turns RF on and off dynamically within packet TX and RX. Bluetooth-specified low-power connection mode. While in these low-power connection modes, the CYBT-343151-02 runs on the Low Power Oscillator and wakes up after a predefined time period. The CYBT-343151-02 automatically adjusts its power dissipation based on user activity. The following power modes are supported: Active mode Idle mode Sleep mode HIDOFF (Deep Sleep) mode The CYBT-343151-02 transitions to the next lower state after a programmable period of user inactivity. Busy mode is immediately entered when user activity resumes. In HIDOFF (Deep Sleep) mode, the CYBT-343151-02 baseband and core are powered off by disabling power to LDOOUT. The VDDO domain remains powered up and will turn the remainder of the chip on when it detects user events. This mode minimizes chip power consumption and is intended for long periods of inactivity. Document Number: 002-24961 Rev. *A Page 23 of 52 CYBT-343151-02 Electrical Characteristics Table 10 shows the maximum electrical rating for voltages referenced to VDDIN pad. Table 10. Maximum Electrical Rating Symbol Value Unit VDDIN Rating - 3.795 V Voltage on input or output pin - VSS - 0.3 to VDD + 0.3 V Operating ambient temperature range Topr -30 to +105 C Storage temperature range Tstg -40 to +105 C Table 11 shows the power supply characteristics for the range TJ = 0 to 125 C. Table 11. Power Supply Parameter Description VDDIN Power Supply Input (CYBT-343151-02) VDDIN_RIPPLE Maximum Power Supply Ripple for VDDIN input voltage Min[6] Typ Max[6] Unit 2.3 - 3.6 V - - 100 mV Table 12 shows the specifications for the digital voltage levels. Table 12. Digital Voltage Levels Characteristics Symbol Min Typ Max Unit VIL - - 0.8 V Input high voltage VIH 2.0 - - V Output low voltage VOL - - 0.4 V Output high voltage VOH VDDIN - 0.4 - - V Input capacitance (VDDMEM domain) CIN - - 0.4 pF Input low voltage Note 6. Overall performance degrades beyond minimum and maximum supply voltages.The voltage range specified is determined by the minimum and maximum operating voltage of the SPI Serial Flash included on the module. Document Number: 002-24961 Rev. *A Page 24 of 52 CYBT-343151-02 Table 13 shows the current consumption measurements Table 13. Bluetooth, BLE, BR, and EDR Current Consumption Parameter Description Silicon/ Output Module Power Parameter Level/Class Typical Unit Bluetooth Classic (BR, EDR) 3DM5/3DH5 HCI control mode Silicon Class 1 37.1 mA DM1/DH1 HCI control mode Silicon Class 1 32.2 mA DM3/DH3 HCI control mode Silicon Class 1 38.2 mA DM5/DH5 HCI control mode Silicon Class 1 38.5 mA RX1M_BR Peak receive (1 Mbps) current level when receiving a basic rate packet (radio only) Silicon Class 1 26.4 mA TX1M_BR Peak transmit (1 Mbps) current level when transmitting a basic rate packet (radio only) Silicon 10 dBm 60.3 mA RX23M_EDR Peak receive (EDR) current level when receiving a 2 or 3 Mbps rate packet (radio only) Silicon Class 1 26.4 mA TX23M_EDR Peak transmit (EDR) current level when transmitting a 2 or 3 Mbps rate packet (radio only) Silicon 8 dBm 52.5 mA Deep Sleep Deep Sleep (HIDOFF) current Module All 2.69 uA IDLE Module is idle, non-discoverable and non-connectable Module Class 1 0.11 mA IScan Inquiry Scan (1.28 seconds) Module Class 1 0.65 mA PScan Page scan (1.28 seconds) Module Class 1 0.65 mA IScan+PScan Inquiry scan + Page Scan (1.28 seconds) Module Class 1 1.2 mA Connected Connected with no data transfer Module Class 1 2.6 mA Connected + PScan Connected with no data transfer + Page Scan (1.28 seconds) Module Class 1 3.3 mA Connected + IScan + PScan Connected with no data transfer + Inquiry Scan (1.28 seconds) + Page Scan (1.28 seconds) Module Class 1 3.6 mA Connected + SNIFF Connected with no data transfer + SNIFF (500 ms) Module Class 1 0.95 mA Connected + SNIFF+ IScan Connected with no data transfer + SNIFF (500 ms) + PScan + Inquiry Scan and Page Scan 1.28 seconds Module Class 1 1.9 mA TX_BR Data transfer @ 115200 baud rate Module Class 1 22 mA TX+SNIFF_BR Data transfer @ 115200 baud rate + Sniff (500 ms) Module Class 1 5.5 mA Bluetooth Low Energy (BLE) RXPeak Peak RX current Module -2.5dBm +6.5 dBm +9.0 dBm 42 54 56 mA TXPeak Peak TX Current Module -2.5dBm +6.5 dBm +9.0 dBm 28 28 28 mA Deep Sleep Deep Sleep (HIDOFF) current Module All 2.69 A Connection_1s Connection - 1-second interval Module -2.5dBm +6.5 dBm +9.0 dBm 970 980 1000 A Document Number: 002-24961 Rev. *A Page 25 of 52 CYBT-343151-02 Table 13. Bluetooth, BLE, BR, and EDR Current Consumption (continued) Parameter Description Silicon/ Output Module Power Parameter Level/Class Typical Unit Bluetooth Classic (BR, EDR) Connection_4s Connection - 4-second interval Module -2.5dBm +6.5 dBm +9.0 dBm 900 945 950 A Adv_640 Advertisement (low duty cycle) - 640 ms Module -2.5dBm +6.5 dBm +9.0 dBm 0.4 0.5 0.5 mA Adv_30 Advertisement (high duty cycle) - 30 ms Module -2.5dBm +6.5 dBm +9.0 dBm 3.8 4.2 4.3 mA Adv_1s 1-second non-connectable advertisement (Beacon) Module -2.5dBm +6.5 dBm +9.0 dBm 315 350 350 A Document Number: 002-24961 Rev. *A Page 26 of 52 CYBT-343151-02 Chipset RF Specifications All specifications in Table 14 are for industrial temperatures and are single-ended. Unused inputs are left open. Table 14. Chipset Receiver RF Specifications Parameter Conditions Min Typ[7] Max Unit 2402 - 2480 MHz - -93.5 - dBm General Frequency Range - GFSK, 0.1% BER, 1 Mbps LE GFSK, 0.1% BER, 1 Mbps - -96.5 - dBm /4-DQPSK, 0.01% BER, 2 Mbps - -95.5 - dBm 8-DPSK, 0.01% BER, 3 Mbps - -89.5 - dBm Maximum Input GFSK, 1 Mbps - - -20 dBm Maximum Input /4-DQPSK, 8-DPSK, 2/3 Mbps - - -20 dBm C/I Cochannel GFSK, 0.1% BER - 9.5 11 dB C/I 1 MHz Adjacent Channel GFSK, 0.1% BER - -5 0 dB C/I 2 MHz Adjacent Channel GFSK, 0.1% BER - -40 -30.0 dB C/I > 3 MHz Adjacent Channel GFSK, 0.1% BER - -49 -40.0 dB C/I Image Channel GFSK, 0.1% BER - -27 -9.0 dB C/I 1 MHz adjacent to Image Channel GFSK, 0.1% BER - -37 -20.0 dB - 11 13 dB - -8 0 dB C/I 2 MHz Adjacent Channel /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER /4-DQPSK, 0.1% BER - -40 -30.0 dB C/I > 3 MHz Adjacent Channel 8-DPSK, 0.1% BER - -50 -40.0 dB C/I Image Channel /4-DQPSK, 0.1% BER - -27 -7.0 dB C/I 1 MHz adjacent to Image Channel /4-DQPSK, 0.1% BER - -40 -20.0 dB C/I Cochannel 8-DPSK, 0.1% BER - 17 21 dB C/I 1 MHz Adjacent Channel 8-DPSK, 0.1% BER - -5 5 dB C/I 2 MHz Adjacent Channel 8-DPSK, 0.1% BER - -40 -25.0 dB C/I > 3 MHz Adjacent Channel 8-DPSK, 0.1% BER - -47 -33.0 dB C/I Image Channel 8-DPSK, 0.1% BER - -20 0 dB C/I 1 MHz adjacent to Image Channel 8-DPSK, 0.1% BER - -35 -13.0 dB RX Sensitivity[8] Interference Performance C/I Cochannel C/I 1 MHz Adjacent Channel Out-of-Band Blocking Performance (CW)[9] 30 MHz-2000 MHz 0.1% BER - -10.0 - dBm 2000-2399 MHz 0.1% BER - -27 - dBm 2498-3000 MHz 0.1% BER - -27 - dBm Notes 7. Typical operating conditions are 1.22-V operating voltage and 25C ambient temperature. 8. The receiver sensitivity is measured at BER of 0.1% on the device interface. 9. Meets this specification using front-end band pass filter. 10. Numbers are referred to the pin output with an external BPF filter. 11. f0 = -64 dBm Bluetooth-modulated signal, f1 = -39 dBm sine wave, f2 = -39 dBm Bluetooth-modulated signal, f0 = 2f1 - f2, and |f2 - f1| = n * 1 MHz, where n = 3, 4, or 5. For the typical case, n = 4. 12. Includes baseband radiated emissions. Document Number: 002-24961 Rev. *A Page 27 of 52 CYBT-343151-02 Table 14. Chipset Receiver RF Specifications (continued) Parameter 3000 MHz-12.75 GHz Conditions 0.1% BER Min Typ[7] Max Unit - -10.0 - dBm - -10[10] - dBm [10] Out-of-Band Blocking Performance, Modulated Interferer 776-764 MHz CDMA 824-849 MHz CDMA - -10 - dBm 1850-1910 MHz CDMA - -23[10] - dBm - -10 [10] - dBm -10 [10] - dBm [10] 824-849 MHz EDGE/GSM 880-915 MHz EDGE/GSM - 1710-1785 MHz EDGE/GSM - -23 - dBm 1850-1910 MHz EDGE/GSM - -23[10] - dBm - -23 [10] - dBm -23 [10] - dBm 1850-1910 MHz WCDMA 1920-1980 MHz Intermodulation WCDMA - Performance[11] BT, Df = 5 MHz - -39.0 - - dBm 30 MHz to 1 GHz - - - -62 dBm 1 GHz to 12.75 GHz - - - -47 dBm 65 MHz to 108 MHz FM RX - -147 - dBm/Hz 746 MHz to 764 MHz CDMA - -147 - dBm/Hz 851-894 MHz CDMA - -147 - dBm/Hz Spurious Emissions[12] 925-960 MHz EDGE/GSM - -147 - dBm/Hz 1805-1880 MHz EDGE/GSM - -147 - dBm/Hz 1930-1990 MHz PCS - -147 - dBm/Hz 2110-2170 MHz WCDMA - -147 - dBm/Hz Notes 7. Typical operating conditions are 1.22-V operating voltage and 25C ambient temperature. 8. The receiver sensitivity is measured at BER of 0.1% on the device interface. 9. Meets this specification using front-end band pass filter. 10. Numbers are referred to the pin output with an external BPF filter. 11. f0 = -64 dBm Bluetooth-modulated signal, f1 = -39 dBm sine wave, f2 = -39 dBm Bluetooth-modulated signal, f0 = 2f1 - f2, and |f2 - f1| = n * 1 MHz, where n = 3, 4, or 5. For the typical case, n = 4. 12. Includes baseband radiated emissions. Document Number: 002-24961 Rev. *A Page 28 of 52 CYBT-343151-02 Table 15. Chipset Transmitter RF Specifications Parameter Conditions Min Typ Max Unit - 2402 - 2480 MHz - - 12 - dBm General Frequency range [13] Class1: GFSK TX Power [14] - - 9 - dBm Class 2: GFSK TX Power - - 2 - dBm Power Control Step - 2 4 8 dB /4-DQPSK Frequency Stability /4-DQPSK RMS DEVM /4-QPSK Peak DEVM /4-DQPSK 99% DEVM - -10 - 10 kHz - - - 20 % - - - 35 % - - - 30 % 8-DPSK Frequency Stability - -10 - 10 kHz 8-DPSK RMS DEVM - - - 13 % 8-DPSK Peak DEVM - - - 25 % 8-DPSK 99% DEVM - - - 20 % 1.0 MHz < |M - N| < 1.5 MHz - - - -26 dBm 1.5 MHz < |M - N| < 2.5 MHz - - - -20 dBm |M - N| > 2.5 MHz - - - -40 dBm - - - -36.0[15] dBm Class1: EDR TX Power Modulation Accuracy In-Band Spurious Emissions Out-of-Band Spurious Emissions 30 MHz to 1 GHz -30.0 [15, 16] dBm 1 GHz to 12.75 GHz - - - 1.8 GHz to 1.9 GHz - - - -47.0 dBm 5.15 GHz to 5.3 GHz - - - -47.0 dBm Table 16. Chipset BLE RF Specifications Parameter Conditions Frequency range N/A [17] GFSK, 0.1% BER, 1 Mbps RX sense TX power [18] Mod Char: Delta F1 average Mod Char: Delta F2 max [19] Mod Char: Ratio Min Typ Max Unit 2402 - 2480 MHz - -96.5 - dBm N/A - - 9 dBm N/A 225 255 275 kHz N/A 99.9 - - % N/A 0.8 0.95 - % Notes 13. TBD dBm output for GFSK measured with PAVDD = 2.5 V. 14. TBD dBm output for EDR measured with PAVDD = 2.5 V. 15. Maximum value is the value required for Bluetooth qualification. 16. Meets this spec using a front-end band-pass filter. 17. Dirty TX is Off. 18. The BLE TX power can be increased to compensate for front-end losses such as BPF, diplexer, switch, etc. The output is capped at 12 dBm out. The BLE TX power at the antenna port cannot exceed the 10 dBm EIRP specification limit. 19. At least 99.9% of all delta F2 max frequency values recorded over 10 packets must be greater than 185 kHz. Document Number: 002-24961 Rev. *A Page 29 of 52 CYBT-343151-02 Timing and AC Characteristics In this section, use the numbers listed in the Reference column of each table to interpret the following timing diagrams. UART Timing Table 17. UART Timing Specifications Reference Characteristics Min Max Unit 1 Delay time, UART_CTS_N low to UART_TXD valid - 24 Baud Out Cycles 2 Setup time, UART_CTS_N high before midpoint of stop bit - 10 ns 3 Delay time, midpoint of stop bit to UART_RTS_N high - 2 Baud Out Cycles Figure 13. UART Timing Document Number: 002-24961 Rev. *A Page 30 of 52 CYBT-343151-02 SPI Timing The SPI interface supports clock speeds up to 12 MHz Table 18 and Figure 14 show the timing requirements when operating in SPI Mode 0 and 2, and SPI Mode 1 and 3, respectively. Table 18. SPI Mode 0 and 2 Reference Min Max Unit 1 Time from slave assert SPI_INT to master assert SPI_CSN (DirectRead) Characteristics 0 ns 2 Time from master assert SPI_CSN to slave assert SPI_INT (DirectWrite) 0 ns 3 Time from master assert SPI_CSN to first clock edge 20 ns 4 Setup time for MOSI data lines 8 1/2 SCK ns 5 Hold time for MOSI data lines 8 1/2 SCK ns 6 Time from last sample on MOSI/MISO to slave deassert SPI_INT 0 100 ns 7 Time from slave deassert SPI_INT to master deassert SPI_CSN 0 ns 8 Idle time between subsequent SPI transactions 1 SCK ns Figure 14. SPI Timing - Mode 0 and 2 Document Number: 002-24961 Rev. *A Page 31 of 52 CYBT-343151-02 Table 19 and Figure 15 show the timing requirements when operating in SPI Mode 1 and 3. Table 19. SPI Mode 1 and 3 Reference Characteristics Min Max Unit 1 Time from slave assert SPI_INT to master assert SPI_CSN (DirectRead) 0 ns 2 Time from master assert SPI_CSN to slave assert SPI_INT (DirectWrite) 0 ns 3 Time from master assert SPI_CSN to first clock edge 20 ns 4 Setup time for MOSI data lines 8 1/2 SCK ns 5 Hold time for MOSI data lines 8 1/2 SCK ns 6 Time from last sample on MOSI/MISO to slave deassert SPI_INT 0 100 ns 7 Time from slave deassert SPI_INT to master deassert SPI_CSN 8 Idle time between subsequent SPI transactions 0 ns 1 SCK ns Figure 15. SPI Timing - Mode 1 and 3 Document Number: 002-24961 Rev. *A Page 32 of 52 CYBT-343151-02 I2C Interface Timing Table 20. I2C Interface Timing Specifications Reference Characteristics Min Unit 100 kHz 400 kHz 800 kHz 1 Clock frequency 1000 kHz 2 START condition setup time 650 - ns 3 START condition hold time 280 - ns 4 Clock low time 650 - ns 5 Clock high time 280 - ns 6 Data input hold time[20] 0 - ns 7 Data input setup time 100 - ns 8 STOP condition setup time 280 - ns - 400 ns 650 - ns 9 Output valid from clock 10 Bus free time[21] - Max Figure 16. I2C Interface Timing Diagram Notes 20. As a transmitter, 125 ns of delay is provided to bridge the undefined region of the falling edge of SCL to avoid unintended generation of START or STOP conditions. 21. Time that the cbus must be free before a new transaction can start. Document Number: 002-24961 Rev. *A Page 33 of 52 CYBT-343151-02 PCM Interface Timing Short Frame Sync, Master Mode Figure 17. PCM Timing Diagram (Short Frame Sync, Master Mode) Table 21. PCM Interface Timing Specifications (Short Frame Sync, Master Mode) Reference Characteristics Min Typ Max Unit - - 12 MHz PCM bit clock LOW 41.0 - - ns 3 PCM bit clock HIGH 41.0 - - ns 4 PCM_SYNC delay 0 - 25.0 ns 5 PCM_OUT delay 0 - 25.0 ns 6 PCM_IN setup 8.0 - - ns 7 PCM_IN hold 8.0 - - ns 8 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 - 25.0 ns 1 PCM bit clock frequency 2 Document Number: 002-24961 Rev. *A Page 34 of 52 CYBT-343151-02 Short Frame Sync, Slave Mode Figure 18. PCM Timing Diagram (Short Frame Sync, Slave Mode) Table 22. PCM Interface Timing Specifications (Short Frame Sync, Slave Mode) Reference Characteristics Min Typ Max Unit 1 PCM bit clock frequency - - 12.0 MHz 2 PCM bit clock LOW 41.0 - - ns 3 PCM bit clock HIGH 41.0 - - ns 4 PCM_SYNC setup 8.0 - - ns 5 PCM_SYNC hold 8.0 - - ns 6 PCM_OUT delay 0 - 25.0 ns 7 PCM_IN setup 8.0 - - ns 8 PCM_IN hold 8.0 - - ns 9 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 - 25.0 ns Document Number: 002-24961 Rev. *A Page 35 of 52 CYBT-343151-02 Long Frame Sync, Master Mode Figure 19. PCM Timing Diagram (Long Frame Sync, Master Mode) Table 23. PCM Interface Timing Specifications (Long Frame Sync, Master Mode) Reference Characteristics Min Typ Max Unit 1 PCM bit clock frequency - - 12 MHz 2 PCM bit clock LOW 41.0 - - ns 3 PCM bit clock HIGH 41.0 - - ns 4 PCM_SYNC delay 0 - 25.0 ns 5 PCM_OUT delay 0 - 25.0 ns 6 PCM_IN setup 8.0 - - ns 7 PCM_IN hold 8.0 - - ns 8 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance - 25.0 ns Document Number: 002-24961 Rev. *A 0 Page 36 of 52 CYBT-343151-02 Long Frame Sync, Slave Mode Figure 20. PCM Timing Diagram (Long Frame Sync, Slave Mode) Table 24. PCM Interface Timing Specifications (Long Frame Sync, Slave Mode) Reference Characteristics Min Typ Max Unit - - 12 MHz PCM bit clock LOW 41.0 - - ns 3 PCM bit clock HIGH 41.0 - - ns 4 PCM_SYNC setup 8.0 - - ns 5 PCM_SYNC hold 8.0 - - ns 6 PCM_OUT delay 0 - 25.0 ns 7 PCM_IN setup 8.0 - - ns 8 PCM_IN hold 8.0 - - ns 9 Delay from rising edge of PCM_BCLK during last bit period to PCM_OUT becoming high impedance 0 - 25.0 ns 1 PCM bit clock frequency 2 Document Number: 002-24961 Rev. *A Page 37 of 52 CYBT-343151-02 I2S Interface Timing The I2S interface supports both master and slave modes. The I2S signals are: I2S clock: I2S SCK I2S Word Select: I2S WS I2S Data Out: I2S SDO 2 I S 2 Data In: I2S SDI I S SCK and I2S WS become outputs in master mode and inputs in slave mode, while I2S SDO always stays as an output. The channel word length is 16 bits and the data is justified so that the MSB of the left-channel data is aligned with the MSB of the I2S bus, per the I2S specification. The MSB of each data word is transmitted one bit clock cycle after the I2S WS transition, synchronous with the falling edge of bit clock. Left-channel data is transmitted when I2S WS is low, and right-channel data is transmitted when I2S WS is high. Data bits sent by the CYBT-343151-02 are synchronized with the falling edge of I2S_SCK and should be sampled by the receiver on the rising edge of I2S_SSCK. The clock rate in master mode is either of the following: 48 kHz 32 bits per frame = 1.536 MHz 48 kHz 50 bits per frame = 2.400 MHz Document Number: 002-24961 Rev. *A Page 38 of 52 CYBT-343151-02 The master clock is generated from the input reference clock using a N/M clock divider. In the slave mode, any clock rate is supported to a maximum of 3.072 MHz. Timing values specified in Table 25 are relative to high and low threshold levels. Table 25. Timing for I2S Transmitters and Receivers Transmitter Parameter Clock Period T Lower Limit Receiver Upper Limit Lower Limit Upper Limit Notes Min Max Min Max Min Max Min Max Ttr - - - Tr - - - Note 22 Master Mode: Clock generated by transmitter or receiver HIGH tHC 0.35Ttr - - - 0.35Ttr - - - Note 23 LOWtLC 0.35Ttr - - - 0.35Ttr - - - Note 23 Slave Mode: Clock accepted by transmitter or receiver HIGH tHC - 0.35Ttr - - - 0.35Ttr - - Note 24 LOW tLC - 0.35Ttr - - - 0.35Ttr - - Note 24 Rise time tRC - - 0.15Ttr - - - - Note 25 Delay tdtr - - - 0.8T - - - - Note 26 Hold time thtr 0 - - - - - - - Note 26 Setup time tsr - - - - - 0.2Tr - - Note 27 Hold time thr - - - - - 0 - - Note 27 Transmitter Receiver Note The time periods specified in Figure 21 and Figure 22 are defined by the transmitter speed. The receiver specifications must match transmitter performance. Notes 22. The system clock period T must be greater than Ttr and Tr because both the transmitter and receiver have to be able to handle the data transfer rate. 23. At all data rates in master mode, the transmitter or receiver generates a clock signal with a fixed mark/space ratio. For this reason, tHC and tLC are specified with respect to T. 24. In slave mode, the transmitter and receiver need a clock signal with minimum HIGH and LOW periods so that they can detect the signal. So long as the minimum periods are greater than 0.35Tr, any clock that meets the requirements can be used. 25. Because the delay (tdtr) and the maximum transmitter speed (defined by Ttr) are related, a fast transmitter driven by a slow clock edge can result in tdtr not exceeding tRC which means thtr becomes zero or negative. Therefore, the transmitter has to guarantee that thtr is greater than or equal to zero, so long as the clock rise-time tRC is not more than tRCmax, where tRCmax is not less than 0.15Ttr. 26. To allow data to be clocked out on a falling edge, the delay is specified with respect to the rising edge of the clock signal and T, always giving the receiver sufficient setup time. 27. The data setup and hold time must not be less than the specified receiver setup and hold time. Document Number: 002-24961 Rev. *A Page 39 of 52 CYBT-343151-02 Figure 21. I2S Transmitter Timing Figure 22. I2S Receiver Timing Document Number: 002-24961 Rev. *A Page 40 of 52 CYBT-343151-02 Environmental Specifications Environmental Compliance This CYBT-343151-02 BLE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and Halogen-Free (HF) directives. The Cypress module and components used to produce this module are RoHS and HF compliant. RF Certification The CYBT-343151-02 module will be certified under the following RF certification standards at production release. FCC: WAP3026 CE IC: 7922A-3026 MIC: 203-JN0721 Safety Certification The CYBT-343151-02 module complies with the following safety regulations: Underwriters Laboratories, Inc. (UL): Filing E331901 CSA TUV Environmental Conditions Table 26 describes the operating and storage conditions for the Cypress BLE module. Table 26. Environmental Conditions for CYBT-343151-02 Description Operating temperature Operating humidity (relative, non-condensation) Thermal ramp rate Minimum Specification Maximum Specification 30 C 105 C 5% 85% - 3 C/minute -40 C 105 C Storage temperature and humidity - 105 C at 85% ESD: Module integrated into end system Components[28] - 15 kV Air 2.0 kV Contact Storage temperature ESD and EMI Protection Exposed components require special attention to ESD and electromagnetic interference (EMI). A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD protection and a low-impedance path to ground. Device Handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability. Note 28. This does not apply to the RF pins (ANT). Document Number: 002-24961 Rev. *A Page 41 of 52 CYBT-343151-02 Regulatory Information FCC FCC NOTICE: The device CYBT-343151-02 complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. CAUTION: The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Cypress Semiconductor may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP3026. In any case the end product must be labeled exterior with "Contains FCC ID: WAP3026". ANTENNA WARNING: This device is tested with a standard SMA connector and with the antenna listed in Table 6 on page 13. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. RF EXPOSURE: To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to install the approved antenna in the previous. The preceding statement must be included as a CAUTION statement in manuals, for products operating with the approved antenna in Table 6, to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of CYBT-343151-02 with the trace antenna is far below the FCC radio frequency exposure limits. Nevertheless, use CYBT-343151-02 in such a manner that minimizes the potential for human contact during normal operation. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance. Document Number: 002-24961 Rev. *A Page 42 of 52 CYBT-343151-02 ISED Innovation, Science and Economic Development Canada (ISED) Certification CYBT-343151-02 is licensed to meet the regulatory requirements of Innovation, Science and Economic Development Canada (ISED), License: IC: 7922A-3026 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in Table 6 on page 13, having a maximum gain of -0.5 dBi. Antennas not included in this list or having a gain greater than -0.5 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 . The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. ISED NOTICE: The device CYBT-343151-02 including the built-in trace antenna complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. L'appareil CYBT-343151-02, y compris l'antenne integree, est conforme aux Regles RSS-GEN de Canada. L'appareil repond aux exigences d'approbation de l'emetteur modulaire tel que decrit dans RSS-GEN. L'operation est soumise aux deux conditions suivantes: (1) Cet appareil ne doit pas causer d'interferences nuisibles, et (2) Cet appareil doit accepter toute interference recue, y compris les interferences pouvant entrainer un fonctionnement indesirable. ISED INTERFERENCE STATEMENT FOR CANADA This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Cet appareil est conforme a la norme sur l'innovation, la science et le developpement economique (ISED) norme RSS exempte de licence. L'exploitation est autorisee aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. ISED RADIATION EXPOSURE STATEMENT FOR CANADA This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 10 mm between the radiator and your body. Cet equipement est conforme aux limites d'exposition aux radiations ISED prevues pour un environnement incontrole. Cet equipement doit etre installe et utilise avec un minimum de 10 mm de distance entre la source de rayonnement et votre corps. LABELING REQUIREMENTS: The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor IC identifier for this product as well as the ISED Notices above. The IC identifier is 7922A-3026. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-3026" Document Number: 002-24961 Rev. *A Page 43 of 52 CYBT-343151-02 European Declaration of Conformity Hereby, Cypress Semiconductor declares that the Bluetooth module CYBT-343151-02 complies with the essential requirements and other relevant provisions of Directive 2014. As a result of the conformity assessment procedure described in Annex III of the Directive 2014, the end-customer equipment should be labeled as follows: All versions of the CYBT-343151-02 in the specified reference design can be used in the following countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The Netherlands, the United Kingdom, Switzerland, and Norway. MIC Japan CYBT-343151-02 is certified as a module with certification number 203-JN0721. End products that integrate CYBT-343151-02 do not need additional MIC Japan certification for the end product. End product can display the certification label of the embedded module. Document Number: 002-24961 Rev. *A Page 44 of 52 CYBT-343151-02 Packaging Table 27. Solder Reflow Peak Temperature Module Part Number Package CYBT-343151-02 24-pad SMT Maximum Peak Temperature Maximum Time at Peak Temperature No. of Cycles 260 C 30 seconds 2 Table 28. Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2 Module Part Number Package MSL CYBT-343151-02 24-pad SMT MSL 3 The CYBT-343151-02 is offered in tape and reel packaging. Figure 23 details the tape dimensions used for the CYBT-343151-02. Figure 23. CYBT-343151-02 Tape Dimensions Figure 24 details the orientation of the CYBT-343151-02 in the tape as well as the direction for unreeling. Figure 24. Component Orientation in Tape and Unreeling Direction Document Number: 002-24961 Rev. *A Page 45 of 52 CYBT-343151-02 Figure 25 details reel dimensions used for the CYBT-343151-02. Figure 25. Reel Dimensions The CYBT-343151-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for the CYBT-343151-02 is detailed in Figure 26. Figure 26. CYBT-343151-02 Center of Mass Document Number: 002-24961 Rev. *A Page 46 of 52 CYBT-343151-02 Ordering Information Table 29 lists the CYBT-343151-02 part number and features. Table 30 lists the reel shipment quantities for the CYBT-343151-02. Table 29. Ordering Information Part Number CPU Speed (MHz) Flash Size (KB) RAM Size (KB) UART I2C (BSC) PWM Package Packaging CYBT-343151-02 24 512 352 Yes Yes 4 24-SMT Tape and Reel Table 30. Tape and Reel Package Quantity and Minimum Order Amount Minimum Reel Quantity Maximum Reel Quantity Reel Quantity Description 500 500 Comments Minimum Order Quantity (MOQ) 500 - - Order Increment (OI) 500 - - Ships in 500 unit reel quantities. The CYBT-343151-02 is offered in tape and reel packaging. The CYBT-343151-02 ships in a reel size of 500. For additional information and a complete list of Cypress Semiconductor Wireless products, contact your local Cypress sales representative. To locate the nearest Cypress office, visit our website. U.S. Cypress Headquarters Address U.S. Cypress Headquarter Contact Info Cypress website address Document Number: 002-24961 Rev. *A 198 Champion Court, San Jose, CA 95134 (408) 943-2600 http://www.cypress.com Page 47 of 52 CYBT-343151-02 Acronyms Table 31. Acronyms Used in this Document Acronym Description Acronym Description ADC analog-to-digital converter IC Industry Canada ALU arithmetic logic unit IIR infinite impulse response, see also FIR AMUXBUS analog multiplexer bus ILO internal low-speed oscillator, see also IMO API application programming interface IMO internal main oscillator, see also ILO Arm(R) advanced RISC machine, a CPU architecture INL integral nonlinearity, see also DNL BLE Bluetooth Low Energy I/O input/output, see also GPIO, DIO, SIO, USBIO Bluetooth SIG Bluetooth Special Interest Group IPOR initial power-on reset BW bandwidth IPSR interrupt program status register CAN Controller Area Network, a communications protocol IRQ interrupt request CE European Conformity ITM instrumentation trace macrocell CSA Canadian Standards Association KC Korea Certification CMRR common-mode rejection ratio LCD liquid crystal display CPU central processing unit LIN Local Interconnect Network, a communications protocol. CRC cyclic redundancy check, an error-checking protocol LNA low noise amplifier ECC error correcting code LR link register ECO external crystal oscillator LUT lookup table EEPROM electrically erasable programmable read-only memory LVD low-voltage detect, see also LVI EMI electromagnetic interference LVI low-voltage interrupt, see also HVI EMIF external memory interface LVTTL low-voltage transistor-transistor logic EOC end of conversion MAC multiply-accumulate EOF end of frame MCU microcontroller unit ESD electrostatic discharge MIC Ministry of Internal Affairs and Communications (Japan) FCC Federal Communications Commission MISO master-in slave-out FET field-effect transistor NC no connect FIR finite impulse response, see also IIR NMI nonmaskable interrupt FPB flash patch and breakpoint NRZ non-return-to-zero FS full-speed NVIC nested vectored interrupt controller GPIO general-purpose input/output, applies to a PSoC pin NVL nonvolatile latch, see also WOL HCI host controller interface Opamp operational amplifier HVI high-voltage interrupt, see also LVI, LVD OTA Over-the-Air IC integrated circuit PA power amplifier IDAC current DAC, see also DAC, VDAC PAL programmable array logic, see also PLD IDE integrated development environment PC program counter I2C, or IIC Inter-Integrated Circuit, a communications protocol PCB printed circuit board Document Number: 002-24961 Rev. *A Page 48 of 52 CYBT-343151-02 Table 31. Acronyms Used in this Document (continued) Acronym Description Acronym Description PGA programmable gain amplifier SINAD signal to noise and distortion ratio PHUB peripheral hub SIO special input/output, GPIO with advanced features. See GPIO. PHY physical layer SMT surface-mount technology; a method for producing electronic circuitry in which the components are placed directly onto the surface of PCBs PICU port interrupt control unit SPI Serial Peripheral Interface, a communications protocol PLA programmable logic array SR slew rate PLD programmable logic device, see also PAL SRAM static random access memory PLL phase-locked loop SRES software reset PMDD package material declaration data sheet STN super twisted nematic POR power-on reset SWD serial wire debug, a test protocol PRES precise power-on reset SWV single-wire viewer PRS pseudo random sequence TD transaction descriptor, see also DMA port read data register THD total harmonic distortion Programmable System-on-ChipTM TIA transimpedance amplifier PS (R) PSoC PSRR power supply rejection ratio TN twisted nematic PWM pulse-width modulator TRM technical reference manual QDID qualification design ID TTL transistor-transistor logic RAM random-access memory TUV Germany: Technischer Uberwachungs-Verein (Technical Inspection Association) RISC reduced-instruction-set computing TX transmit RMS root-mean-square UART Universal Asynchronous Transmitter Receiver, a communications protocol RTC real-time clock UDB universal digital block RTL register transfer language USB Universal Serial Bus RTR remote transmission request USBIO USB input/output, PSoC pins used to connect to a USB port RX receive VDAC voltage DAC, see also DAC, IDAC SAR successive approximation register WDT watchdog timer SC/CT switched capacitor/continuous time WOL write once latch, see also NVL 2 WRES watchdog timer reset 2 I C serial data XRES external reset I/O pin SOC start of conversion XTAL crystal SOF start of frame S/H sample and hold SCL SDA I C serial clock Document Number: 002-24961 Rev. *A Page 49 of 52 CYBT-343151-02 Document Conventions Units of Measure Table 32. Units of Measure Symbol Unit of Measure C degrees Celsius dB decibel dBm decibel-milliwatts fF femtofarads Hz hertz KB 1024 bytes kbps kilobits per second Khr kilohour kHz kilohertz k kilo ohm ksps kilosamples per second LSB least significant bit Mbps megabits per second MHz megahertz M mega-ohm Msps megasamples per second A microampere F microfarad H microhenry s microsecond V microvolt W microwatt mA milliampere ms millisecond mV millivolt nA nanoampere ns nanosecond nV nanovolt ohm pF picofarad ppm parts per million ps picosecond s second sps samples per second sqrtHz square root of hertz V volt Document Number: 002-24961 Rev. *A Page 50 of 52 CYBT-343151-02 Document History Page Document Title: CYBT-343151-02, EZ-BTTM WICED(R) XT/XR Module Document Number: 002-24961 Revision ECN Orig. of Change Submission Date ** 6429304 SHNG 01/04/2019 New datasheet. *A 6562313 SHNG 5/02/2019 Description of Change Updated QDID/Declaration ID and Temperature Range to "-30 C to +105 C" on Page 1. Updated Table 10: Changed Operating ambient temperature range to "-30 to +105 C" and Storage temperature range "-40 to +105 C". Document Number: 002-24961 Rev. *A Page 51 of 52 CYBT-343151-02 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer's representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC(R) Solutions Products Arm(R) Cortex(R) Microcontrollers Automotive cypress.com/arm cypress.com/automotive Clocks & Buffers Interface cypress.com/clocks cypress.com/interface Internet of Things Memory cypress.com/iot cypress.com/memory Microcontrollers cypress.com/mcu PSoC cypress.com/psoc Power Management ICs Cypress Developer Community Community | Projects | Video | Blogs | Training | Components Technical Support cypress.com/support cypress.com/pmic Touch Sensing cypress.com/touch USB Controllers Wireless Connectivity PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP | PSoC 6 MCU cypress.com/usb cypress.com/wireless (c) Cypress Semiconductor Corporation, 2019. This document is the property of Cypress Semiconductor Corporation and its subsidiaries, including Spansion LLC ("Cypress"). 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Cypress disclaims any liability relating to any Security Breach, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any Security Breach. In addition, the products described in these materials may contain design defects or errors known as errata which may cause the product to deviate from published specifications. To the extent permitted by applicable law, Cypress reserves the right to make changes to this document without further notice. Cypress does not assume any liability arising out of the application or use of any product or circuit described in this document. Any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. It is the responsibility of the user of this document to properly design, program, and test the functionality and safety of any application made of this information and any resulting product. "High-Risk Device" means any device or system whose failure could cause personal injury, death, or property damage. Examples of High-Risk Devices are weapons, nuclear installations, surgical implants, and other medical devices. "Critical Component" means any component of a High-Risk Device whose failure to perform can be reasonably expected to cause, directly or indirectly, the failure of the High-Risk Device, or to affect its safety or effectiveness. Cypress is not liable, in whole or in part, and you shall and hereby do release Cypress from any claim, damage, or other liability arising from any use of a Cypress product as a Critical Component in a High-Risk Device. You shall indemnify and hold Cypress, its directors, officers, employees, agents, affiliates, distributors, and assigns harmless from and against all claims, costs, damages, and expenses, arising out of any claim, including claims for product liability, personal injury or death, or property damage arising from any use of a Cypress product as a Critical Component in a High-Risk Device. Cypress products are not intended or authorized for use as a Critical Component in any High-Risk Device except to the limited extent that (i) Cypress's published data sheet for the product explicitly states Cypress has qualified the product for use in a specific High-Risk Device, or (ii) Cypress has given you advance written authorization to use the product as a Critical Component in the specific High-Risk Device and you have signed a separate indemnification agreement.. Cypress, the Cypress logo, Spansion, the Spansion logo, and combinations thereof, WICED, PSoC, CapSense, EZ-USB, F-RAM, and Traveo are trademarks or registered trademarks of Cypress in the United States and other countries. For a more complete list of Cypress trademarks, visit cypress.com. Other names and brands may be claimed as property of their respective owners. Document Number: 002-24961 Rev. *A Revised May 2, 2019 Page 52 of 52