January 2009 Rev 11 1/37
1
M24C16, M24C08
M24C04, M24C02, M24C01
16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit serial I²C bus EEPROM
Features
■Two-wire I²C serial interface
Supports 400 kHz protocol
■Single supply voltage:
– 2.5 V to 5.5 V for M24Cxx-W
– 1.8 V to 5.5 V for M24Cxx-R
– 1.7 V to 5.5 V for M24Cxx-F
■Write Control input
■Byte and Page Write (up to 16 bytes)
■Random and Sequential Read modes
■Self-timed programming cycle
■Automatic address incrementing
■Enhanced ESD/latch-up protection
■More than 1 million write cycles
■More than 40-year data retention
■Packages
–ECOPACK
® (RoHS compliant)
1. Only M24C08-R and M24C08-F devices are offered in
the WLCSP package.
Table 1. Device summary
Reference Part number
M24C16
M24C16-W
M24C16-R
M24C16-F
M24C08
M24C08-W
M24C08-R
M24C08-F
M24C04
M24C04-W
M24C04-R
M24C04-F
M24C02 M24C02-W
M24C02-R
M24C01 M24C01-W
M24C01-R
PDIP8 (BN)
SO8 (MN)
150 mils width
TSSOP8 (DW)
169 mils width
TSSOP8 (DS)
3 × 3 mm body size
UFDFPN8 (MB)
2 × 3 mm (MLP)
WLCSP (CS)(1)
www.st.com
Contents M24C16, M24C08, M24C04, M24C02, M24C01
2/37
Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3.1 Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.1 Operating supply voltage VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.2 Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.3 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4.4 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2 Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.3 Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6 Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.6.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.6.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.6.3 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 16
3.7 Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.1 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.7.2 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.7.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.7.4 Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
M24C16, M24C08, M24C04, M24C02, M24C01 Contents
3/37
7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
List of tables M24C16, M24C08, M24C04, M24C02, M24C01
4/37
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 6. Operating conditions (M24Cxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 7. Operating conditions (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 8. Operating conditions (M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 9. DC characteristics (M24Cxx-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 10. DC characteristics (M24Cxx-W, device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 11. DC characteristics (M24Cxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 12. DC characteristics (M24Cxx-F). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 13. AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 14. Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 15. AC characteristics (M24Cxx-W, M24Cxx-R, M24Cxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 16. WLCSP-R 1.215 x 1.025 mm 0.4 mm pitch 5 bumps, package data . . . . . . . . . . . . . . . . . 25
Table 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 26
Table 18. SO8 narrow – 8 lead plastic small outline, 150 mils body width,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 19. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 29
Table 21. TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 22. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 23. Available M24C16 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 24. Available M24C08 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 25. Available M24C04 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 26. Available M24C02 products (package, voltage range, temperature grade) . . . . . . . . . . . . 32
Table 27. Available M24C01 products (package, voltage range, temperature grade) . . . . . . . . . . . . 33
Table 28. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
M24C16, M24C08, M24C04, M24C02, M24C01 List of figures
5/37
List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. 8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. M24C08-R and M24C08-F WLCSP connections (top view, marking side,
with balls on the underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. Maximum RP value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . 10
Figure 6. I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 7. Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 9. Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 10. Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 12. AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 13. WLCSP-R 1.215 x 1.025 mm 0.4 mm pitch 5 bumps, package outline . . . . . . . . . . . . . . . 25
Figure 14. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 26
Figure 15. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 27
Figure 16. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Figure 17. TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 18. TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Description M24C16, M24C08, M24C04, M24C02, M24C01
6/37
1 Description
These I²C-compatible electrically erasable programmable memory (EEPROM) devices are
organized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02 and
M24C01).
Figure 1. Logic diagram
I²C uses a two-wire serial interface, comprising a bidirectional data line and a clock line. The
devices carry a built-in 4-bit Device Type Identifier code (1010) in accordance with the I²C
bus definition.
The device behaves as a slave in the I²C protocol, with all memory operations synchronized
by the serial clock. Read and Write operations are initiated by a Start condition, generated
by the bus master. The Start condition is followed by a device select code and Read/Write
bit (RW) (as described in Ta b l e 3 ), terminated by an acknowledge bit.
When writing data to the memory, the device inserts an acknowledge bit during the 9th bit
time, following the bus master’s 8-bit transmission. When data is read by the bus master, the
bus master acknowledges the receipt of the data byte in the same way. Data transfers are
terminated by a Stop condition after an Ack for Write, and after a NoAck for Read.
Table 2. Signal names
Signal name Function Direction
E0, E1, E2 Chip Enable Input
SDA Serial Data Input/output
SCL Serial Clock Input
WC Write Control Input
VCC Supply voltage
VSS Ground
AI02033
3
E0-E2 SDA
VCC
M24Cxx
WC
SCL
VSS
M24C16, M24C08, M24C04, M24C02, M24C01 Description
7/37
Figure 2. 8-pin package connections (top view)
1. NC = Not connected
2. See Section 7: Package mechanical data for package dimensions, and how to identify pin-1.
Figure 3. M24C08-R and M24C08-F WLCSP connections (top view, marking side,
with balls on the underside)
SDAVSS
SCL
WC
VCC
/ E2
AI02034E
M24Cxx
1
2
3
4
8
7
6
5
/ E2/ E2/ E2NC
/ E1
/ E1/ E1/ NCNC
/ E0
/ E0/ NC/ NCNC
/1Kb
/2Kb/4Kb/8Kb16Kb
VCC
WC
SDA
SCL VSS
ai14908
Signal description M24C16, M24C08, M24C04, M24C02, M24C01
8/37
2 Signal description
2.1 Serial Clock (SCL)
This input signal is used to strobe all data in and out of the device. In applications where this
signal is used by slave devices to synchronize the bus to a slower clock, the bus master
must have an open drain output, and a pull-up resistor can be connected from Serial Clock
(SCL) to VCC. (Figure 5 indicates how the value of the pull-up resistor can be calculated). In
most applications, though, this method of synchronization is not employed, and so the pull-
up resistor is not necessary, provided that the bus master has a push-pull (rather than open
drain) output.
2.2 Serial Data (SDA)
This bidirectional signal is used to transfer data in or out of the device. It is an open drain
output that may be wire-OR’ed with other open drain or open collector signals on the bus. A
pull up resistor must be connected from Serial Data (SDA) to VCC. (Figure 5 indicates how
the value of the pull-up resistor can be calculated).
2.3 Chip Enable (E0, E1, E2)
These input signals are used to set the value that is to be looked for on the three least
significant bits (b3, b2, b1) of the 7-bit device select code. These inputs must be tied to VCC
or VSS, to establish the device select code as shown in Figure 4. When not connected (left
floating), E0, E1, E2 are read as low (0,0,0).
Figure 4. Device select code
2.3.1 Write Control (WC)
This input signal is useful for protecting the entire contents of the memory from inadvertent
write operations. Write operations are disabled to the entire memory array when Write
Control (WC) is driven High. When unconnected, the signal is internally read as VIL, and
Write operations are allowed.
When Write Control (WC) is driven High, device select and address bytes are
acknowledged, data bytes are not acknowledged.
Ai11650
VCC
M24Cxx
VSS
Ei
VCC
M24Cxx
VSS
Ei
M24C16, M24C08, M24C04, M24C02, M24C01 Signal description
9/37
2.4 Supply voltage (VCC)
2.4.1 Operating supply voltage VCC
Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage
within the specified [VCC(min), VCC(max)] range must be applied (see Ta bl e 6 , Ta b le 7 and
Ta bl e 8 ). In order to secure a stable DC supply voltage, it is recommended to decouple the
VCC line with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the
VCC/VSS package pins.
This voltage must remain stable and valid until the end of the transmission of the instruction
and, for a Write instruction, until the completion of the internal write cycle (tW).
2.4.2 Power-up conditions
The VCC voltage has to rise continuously from 0 V up to the minimum VCC operating voltage
defined in Ta bl e 6 , Ta b le 7 and Tabl e 8 and the rise time must not vary faster than 1 V/µs.
2.4.3 Device reset
In order to prevent inadvertent write operations during power-up, a power-on-reset (POR)
circuit is included. At power-up (continuous rise of VCC), the device does not respond to any
instruction until VCC reaches the power-on-reset threshold voltage (this threshold is lower
than the minimum VCC operating voltage defined in Ta bl e 6 , Tabl e 7 and Ta bl e 8 ). When
VCC passes over the POR threshold, the device is reset and enters the Standby Power
mode. The device, however, must not be accessed until VCC reaches a valid and stable VCC
voltage within the specified [VCC(min), VCC(max)] range.
In a similar way, during power-down (continuous decrease in VCC), as soon as VCC drops
below the power-on-reset threshold voltage, the device stops responding to any instruction
sent to it.
2.4.4 Power-down conditions
During power-down (continuous decrease in VCC), the device must be in the Standby Power
mode (mode reached after decoding a Stop condition, assuming that there is no internal
write cycle in progress).
Signal description M24C16, M24C08, M24C04, M24C02, M24C01
10/37
Figure 5. Maximum RP value versus bus parasitic capacitance (C) for an I²C bus
Figure 6. I²C bus protocol
1
10
100
10 100 1000
Bus line capacitor (pF)
Bus line pull-up resistor
(k )
fC = 400 kHz, tLOW = 1.3 µs
Rbus x Cbus time
constant must be less than
500 ns
I²C bus
master M24xxx
Rbus
VCC
Cbus
SCL
SDA
ai14796
SCL
SDA
SCL
SDA
SDA
Start
condition
SDA
Input
SDA
Change
AI00792c
Stop
condition
123 789
MSB ACK
Start
condition
SCL 123 789
MSB ACK
Stop
condition
M24C16, M24C08, M24C04, M24C02, M24C01 Signal description
11/37
Table 3. Device select code
Device type identifier(1)
1. The most significant bit, b7, is sent first.
Chip Enable(2),(3)
2. E0, E1 and E2 are compared against the respective external pins on the memory device.
3. A10, A9 and A8 represent most significant bits of the address.
RW
b7 b6 b5 b4 b3 b2 b1 b0
M24C01 select code 1 0 1 0 E2 E1 E0 RW
M24C02 select code 1 0 1 0 E2 E1 E0 RW
M24C04 select code 1 0 1 0 E2 E1 A8 RW
M24C08 select code 1 0 1 0 E2 A9 A8 RW
M24C16 select code 1 0 1 0 A10 A9 A8 RW
Device operation M24C16, M24C08, M24C04, M24C02, M24C01
12/37
3 Device operation
The device supports the I²C protocol. This is summarized in Figure 6. Any device that sends
data on to the bus is defined to be a transmitter, and any device that reads the data to be a
receiver. The device that controls the data transfer is known as the bus master, and the
other as the slave device. A data transfer can only be initiated by the bus master, which will
also provide the serial clock for synchronization. The M24Cxx device is always a slave in all
communication.
3.1 Start condition
Start is identified by a falling edge of Serial Data (SDA) while Serial Clock (SCL) is stable in
the High state. A Start condition must precede any data transfer command. The device
continuously monitors (except during a Write cycle) Serial Data (SDA) and Serial Clock
(SCL) for a Start condition, and will not respond unless one is given.
3.2 Stop condition
Stop is identified by a rising edge of Serial Data (SDA) while Serial Clock (SCL) is stable
and driven High. A Stop condition terminates communication between the device and the
bus master. A Read command that is followed by NoAck can be followed by a Stop condition
to force the device into the Standby mode. A Stop condition at the end of a Write command
triggers the internal Write cycle.
3.3 Acknowledge bit (ACK)
The acknowledge bit is used to indicate a successful byte transfer. The bus transmitter,
whether it be bus master or slave device, releases Serial Data (SDA) after sending eight bits
of data. During the 9th clock pulse period, the receiver pulls Serial Data (SDA) Low to
acknowledge the receipt of the eight data bits.
3.4 Data input
During data input, the device samples Serial Data (SDA) on the rising edge of Serial Clock
(SCL). For correct device operation, Serial Data (SDA) must be stable during the rising edge
of Serial Clock (SCL), and the Serial Data (SDA) signal must change only when Serial Clock
(SCL) is driven Low.
M24C16, M24C08, M24C04, M24C02, M24C01 Device operation
13/37
3.5 Memory addressing
To start communication between the bus master and the slave device, the bus master must
initiate a Start condition. Following this, the bus master sends the device select code, shown
in Ta b l e 3 (on Serial Data (SDA), most significant bit first).
The device select code consists of a 4-bit Device Type Identifier, and a 3-bit Chip Enable
“Address” (E2, E1, E0). To address the memory array, the 4-bit Device Type Identifier is
1010b.
Each device is given a unique 3-bit code on the Chip Enable (E0, E1, E2) inputs. When the
device select code is received, the device only responds if the Chip Enable Address is the
same as the value on the Chip Enable (E0, E1, E2) inputs. However, those devices with
larger memory capacities (the M24C16, M24C08 and M24C04) need more address bits. E0
is not available for use on devices that need to use address line A8; E1 is not available for
devices that need to use address line A9, and E2 is not available for devices that need to
use address line A10 (see Figure 2 and Ta b l e 3 for details). Using the E0, E1 and E2 inputs,
up to eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can
be connected to one I²C bus. In each case, and in the hybrid cases, this gives a total
memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devices are used).
The 8th bit is the Read/Write bit (RW). This bit is set to 1 for Read and 0 for Write operations.
If a match occurs on the device select code, the corresponding device gives an
acknowledgment on Serial Data (SDA) during the 9th bit time. If the device does not match
the device select code, it deselects itself from the bus, and goes into Standby mode.
Table 4. Operating modes
Mode RW bit WC(1)
1. X = VIH or VIL.
Bytes Initial sequence
Current Address Read 1 X 1 Start, Device Select, RW = 1
Random Address Read 0X1Start, Device Select, RW = 0, Address
1 X reStart, Device Select, RW = 1
Sequential Read 1 X ≥ 1 Similar to Current or Random Address
Read
Byte Write 0 VIL 1 Start, Device Select, RW = 0
Page Write 0 VIL ≤ 16 Start, Device Select, RW = 0
Device operation M24C16, M24C08, M24C04, M24C02, M24C01
14/37
Figure 7. Write mode sequences with WC = 1 (data write inhibited)
3.6 Write operations
Following a Start condition the bus master sends a device select code with the Read/Write
bit (RW) reset to 0. The device acknowledges this, as shown in Figure 8, and waits for an
address byte. The device responds to the address byte with an acknowledge bit, and then
waits for the data byte.
When the bus master generates a Stop condition immediately after the Ack bit (in the “10th
bit” time slot), either at the end of a Byte Write or a Page Write, the internal Write cycle is
triggered. A Stop condition at any other time slot does not trigger the internal Write cycle.
During the internal Write cycle, Serial Data (SDA) and Serial Clock (SCL) are ignored, and
the device does not respond to any requests.
3.6.1 Byte Write
After the device select code and the address byte, the bus master sends one data byte. If
the addressed location is Write-protected, by Write Control (WC) being driven High (during
the period from the Start condition until the end of the address byte), the device replies to
the data byte with NoAck, as shown in Figure 7, and the location is not modified. If, instead,
the addressed location is not Write-protected, the device replies with Ack. The bus master
terminates the transfer by generating a Stop condition, as shown in Figure 8.
Stop
Start
Byte Write Dev select Byte address Data in
WC
Start
Page Write Dev select Byte address Data in 1 Data in 2
WC
Data in 3
AI02803d
Page Write
(cont'd)
WC (cont'd)
Stop
Data in N
ACK ACK NO ACK
R/W
ACK ACK NO ACK NO ACK
R/W
NO ACK NO ACK
M24C16, M24C08, M24C04, M24C02, M24C01 Device operation
15/37
3.6.2 Page Write
The Page Write mode allows up to 16 bytes to be written in a single Write cycle, provided
that they are all located in the same page in the memory: that is, the most significant
memory address bits are the same. If more bytes are sent than will fit up to the end of the
page, a condition known as ‘roll-over’ occurs. This should be avoided, as data starts to
become overwritten in an implementation dependent way.
The bus master sends from 1 to 16 bytes of data, each of which is acknowledged by the
device if Write Control (WC) is Low. If the addressed location is Write-protected, by Write
Control (WC) being driven High (during the period from the Start condition until the end of
the address byte), the device replies to the data bytes with NoAck, as shown in Figure 7,
and the locations are not modified. After each byte is transferred, the internal byte address
counter (the 4 least significant address bits only) is incremented. The transfer is terminated
by the bus master generating a Stop condition.
Figure 8. Write mode sequences with WC = 0 (data write enabled)
Stop
Start
Byte Write Dev Select Byte address Data in
WC
Start
Page Write Dev Select Byte address Data in 1 Data in 2
WC
Data in 3
AI02804c
Page Write
(cont'd)
WC (cont'd)
Stop
Data in N
ACK
R/W
ACK ACK
ACK ACK ACK ACK
R/W
ACKACK
Device operation M24C16, M24C08, M24C04, M24C02, M24C01
16/37
Figure 9. Write cycle polling flowchart using ACK
3.6.3 Minimizing system delays by polling on ACK
During the internal Write cycle, the device disconnects itself from the bus, and writes a copy
of the data from its internal latches to the memory cells. The maximum Write time (tw) is
shown in Tab le 1 5 , but the typical time is shorter. To make use of this, a polling sequence
can be used by the bus master.
The sequence, as shown in Figure 9, is:
●Initial condition: a Write cycle is in progress.
●Step 1: the bus master issues a Start condition followed by a device select code (the
first byte of the new instruction).
●Step 2: if the device is busy with the internal Write cycle, no Ack will be returned and
the bus master goes back to Step 1. If the device has terminated the internal Write
cycle, it responds with an Ack, indicating that the device is ready to receive the second
part of the instruction (the first byte of this instruction having been sent during Step 1).
Write cycle
in progress
AI01847d
Next
operation is
addressing the
memory
Start condition
Device select
with RW = 0
ACK
Returned
YES
NO
YESNO
ReStart
Stop
Data for the
Write operation
Device select
with RW = 1
Send Address
and Receive ACK
First byte of instruction
with RW = 0 already
decoded by the device
YESNO Start
condition
Continue the
Write operation
Continue the
Random Read operation
M24C16, M24C08, M24C04, M24C02, M24C01 Device operation
17/37
Figure 10. Read mode sequences
1. The seven most significant bits of the device select code of a Random Read (in the 1st and 3rd bytes) must
be identical.
3.7 Read operations
Read operations are performed independently of the state of the Write Control (WC) signal.
The device has an internal address counter which is incremented each time a byte is read.
3.7.1 Random Address Read
A dummy Write is first performed to load the address into this address counter (as shown in
Figure 10) but without sending a Stop condition. Then, the bus master sends another Start
condition, and repeats the device select code, with the Read/Write bit (RW) set to 1. The
device acknowledges this, and outputs the contents of the addressed byte. The bus master
must not acknowledge the byte, and terminates the transfer with a Stop condition.
Start
Dev select * Byte address
Start
Dev select Data out 1
AI01942b
Data out N
Stop
Start
Current
Address
Read
Dev select Data out
Random
Address
Read
Stop
Start
Dev select * Data out
Sequentila
Current
Read
Stop
Data out N
Start
Dev select * Byte address
Sequential
Random
Read
Start
Dev select * Data out 1
Stop
ACK
R/W
NO ACK
ACK
R/W
ACK ACK
R/W
ACK ACK ACK NO ACK
R/W
NO ACK
ACK ACK
R/W
ACK ACK
R/W
ACK NO ACK
Device operation M24C16, M24C08, M24C04, M24C02, M24C01
18/37
3.7.2 Current Address Read
For the Current Address Read operation, following a Start condition, the bus master only
sends a device select code with the Read/Write bit (RW) set to 1. The device acknowledges
this, and outputs the byte addressed by the internal address counter. The counter is then
incremented. The bus master terminates the transfer with a Stop condition, as shown in
Figure 10, without acknowledging the byte.
3.7.3 Sequential Read
This operation can be used after a Current Address Read or a Random Address Read. The
bus master does acknowledge the data byte output, and sends additional clock pulses so
that the device continues to output the next byte in sequence. To terminate the stream of
bytes, the bus master must not acknowledge the last byte, and must generate a Stop
condition, as shown in Figure 10.
The output data comes from consecutive addresses, with the internal address counter
automatically incremented after each byte output. After the last memory address, the
address counter ‘rolls-over’, and the device continues to output data from memory address
00h.
3.7.4 Acknowledge in Read mode
For all Read commands, the device waits, after each byte read, for an acknowledgment
during the 9th bit time. If the bus master does not drive Serial Data (SDA) Low during this
time, the device terminates the data transfer and switches to its Standby mode.
M24C16, M24C08, M24C04, M24C02, M24C01 Initial delivery state
19/37
4 Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
5 Maximum rating
Stressing the device outside the ratings listed in Ta bl e 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE program and other relevant
quality documents.
Table 5. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
TAAmbient operating temperature –40 130 °C
TSTG Storage temperature –65 150 °C
TLEAD
Lead temperature during soldering see note (1)
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-specific lead temperature during soldering 260(2)
2. TLEAD max must not be applied for more than 10 s.
°C
IOL DC output current (SDA = 0) - 5 mA
VIO Input or output range –0.50 6.5 V
VCC Supply voltage –0.50 6.5 V
VESD Electrostatic discharge voltage (human body model)(3)
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
–4000 4000 V
DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01
20/37
6 DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristic tables that
follow are derived from tests performed under the measurement conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 6. Operating conditions (M24Cxx-W)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 2.5 5.5 V
TA
Ambient operating temperature (device grade 6) –40 85 °C
Ambient operating temperature (device grade 3) –40 125 °C
Table 7. Operating conditions (M24Cxx-R)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 1.8 5.5 V
TAAmbient operating temperature –40 85 °C
Table 8. Operating conditions (M24Cxx-F)
Symbol Parameter Min. Max. Unit
VCC Supply voltage 1.7 5.5 V
TAAmbient operating temperature –20 85 °C
Table 9. DC characteristics (M24Cxx-W, device grade 6)
Symbol Parameter Test conditions (in addition to those in
Table 6 )Min. Max. Unit
ILI
Input leakage current
(SCL, SDA, E0, E1,and E2) VIN = VSS or VCC, device in Standby mode ± 2 µA
ILO Output leakage current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply current
VCC = 5 V, fc = 400 kHz
(rise/fall time < 50 ns) 2mA
VCC = 2.5 V, fc = 400 kHz
(rise/fall time < 50 ns) 1mA
ICC1 Standby supply current Device not selected(1), VIN = VSS or VCC,
for 2.5 V < VCC ≤ 5.5 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a write command).
1µA
VIL
Input low voltage (SDA,
SCL, WC)–0.45 0.3VCC V
VIH
Input high voltage (SDA,
SCL, WC)0.7VCC VCC+1 V
VOL Output low voltage IOL = 2.1 mA when VCC = 2.5 V or IOL = 3
mA when VCC = 5.5 V 0.4 V
M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters
21/37
Table 10. DC characteristics (M24Cxx-W, device grade 3)
Symbol Parameter Test condition
(in addition to those in Tabl e 6)Min. Max. Unit
ILI
Input leakage current (SCL,
SDA, E0, E1,and E2)
VIN = VSS or VCC, device in
Standby mode ± 2 µA
ILO Output leakage current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply current
VCC = 5 V, fC= 400 kHz
(rise/fall time < 50 ns) 3mA
VCC = 2.5 V, fC = 400 kHz
(rise/fall time < 50 ns) 3mA
ICC1 Standby supply current
Device not selected(1), VIN = VSS
or VCC, VCC = 5 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a write command).
5µA
Device not selected(1), VIN = VSS
or VCC, VCC = 2.5 V 2µA
VIL
Input low voltage (SDA,
SCL, WC)–0.45 0.3VCC V
VIH
Input high voltage (SDA,
SCL, WC)0.7VCC VCC+1 V
VOL Output low voltage IOL = 2.1 mA when VCC = 2.5 V or
IOL = 3 mA when VCC = 5.5 V 0.4 V
Table 11. DC characteristics (M24Cxx-R)
Symbol Parameter Test condition
(in addition to those in Table 7)Min. Max. Unit
ILI
Input leakage current
(SCL, SDA, E0, E1,and E2)
VIN = VSS or VCC, device in
Standby mode ± 2 µA
ILO Output leakage current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply current VCC = 1.8 V, fc= 400 kHz
(rise/fall time < 50 ns) 0.8 mA
ICC1 Standby supply current Device not selected(1), VIN = VSS
or VCC, VCC = 1.8 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a write command).
1µA
VIL
Input low voltage (SDA,
SCL, WC)
2.5 V ≤ V
CC –0.45 0.3 VCC V
1.8 V ≤ VCC < 2.5V –0.45 0.25V
CC V
VIH
Input high voltage (SDA,
SCL, WC)0.7VCC VCC+1 V
VOL Output low voltage IOL = 0.7 mA, VCC = 1.8 V 0.2 V
DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01
22/37
Figure 11. AC measurement I/O waveform
Table 12. DC characteristics (M24Cxx-F)
Symbol Parameter Test condition
(in addition to those in Table 7)Min. Max. Unit
ILI
Input leakage current
(SCL, SDA, E0, E1,and E2)
VIN = VSS or VCC, device in
Standby mode ± 2 µA
ILO Output leakage current VOUT = VSS or VCC, SDA in Hi-Z ± 2 µA
ICC Supply current VCC = 1.7 V, fc= 400 kHz
(rise/fall time < 50 ns) 0.8 mA
ICC1 Standby supply current Device not selected(1), VIN = VSS
or VCC, VCC = 1.7 V
1. The device is not selected after a power-up, after a read command (after the Stop condition), or after the
completion of the internal write cycle tW (tW is triggered by the correct decoding of a write command).
1µA
VIL
Input low voltage (SDA,
SCL, WC)
2.5 V ≤ VCC –0.45 0.3 VCC V
1.7 V ≤ VCC < 2.5V –0.45 0.25V
CC V
VIH
Input high voltage (SDA,
SCL, WC)0.7VCC VCC+1 V
VOL Output low voltage IOL = 0.7 mA, VCC = 1.7 V 0.2 V
Table 13. AC measurement conditions
Symbol Parameter Min. Max. Unit
CLLoad capacitance 100 pF
Input rise and fall times 50 ns
Input levels 0.2VCC to 0.8VCC V
Input and output timing reference levels 0.3VCC to 0.7VCC V
Table 14. Input parameters
Symbol Parameter(1)
1. Characterized only.
Test condition Min. Max. Unit
CIN Input capacitance (SDA) 8 pF
CIN Input capacitance (other pins) 6 pF
ZWCL WC input impedance VIN < 0.3 V 15 70 kΩ
ZWCH WC input impedance VIN > 0.7VCC 500 kΩ
tNS
Pulse width ignored
(input filter on SCL and SDA) Single glitch 100 ns
AI00825B
0.8VCC
0.2VCC
0.7VCC
0.3VCC
Input and Output
Timing Reference Levels
Input Levels
M24C16, M24C08, M24C04, M24C02, M24C01 DC and AC parameters
23/37
Table 15. AC characteristics (M24Cxx-W, M24Cxx-R, M24Cxx-F)
Test conditions specified in Tabl e 6 and Tabl e 13
Symbol Alt. Parameter Min. Max. Unit
fCfSCL Clock frequency 400 kHz
tCHCL tHIGH Clock pulse width high 600 ns
tCLCH tLOW Clock pulse width low 1300 ns
tXH1XH2(1)
1. Values recommended by the I2C bus Fast-mode specification.
tRInput signal rise time 20 300 ns
tXL1XL2(1) tFInput signal fall time 20 300 ns
tDL1DL2(2)
2. Characterized only.
tFSDA fall time 20 300 ns
tDXCX tSU:DAT Data in setup time 100 ns
tCLDX tHD:DAT Data in hold time 0 ns
tCLQX tDH Data out hold time 200 ns
tCLQV(3)
3. To avoid spurious Start and Stop conditions, a minimum delay is placed between SCL=1 and the falling or
rising edge of SDA.
tAA Clock low to next data valid (access time) 200 900 ns
tCHDX(4)
4. For a reStart condition, or following a Write cycle.
tSU:STA Start condition setup time 600 ns
tDLCL tHD:STA Start condition hold time 600 ns
tCHDH tSU:STO Stop condition setup time 600 ns
tDHDL tBUF
Time between Stop condition and next Start
condition 1300 ns
tWtWR Write time 5 ms
DC and AC parameters M24C16, M24C08, M24C04, M24C02, M24C01
24/37
Figure 12. AC waveforms
SCL
SDA In
SCL
SDA Out
SCL
SDA In
tCHCL
tDLCL
tCHDX
Start
condition
tCLCH
tDXCXtCLDX
SDA
Input
SDA
Change
tCHDH tDHDL
Stop
condition
Data valid
tCLQV tCLQX
tCHDH
Stop
condition
tCHDX
Start
condition
Write cycle
tW
AI00795e
Start
condition
tCHCL
tXH1XH2
tXH1XH2
tXL1XL2
tXL1XL2
Data valid
tDL1DL2
M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data
25/37
7 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 13. WLCSP-R 1.215 x 1.025 mm 0.4 mm pitch 5 bumps, package outline
1. Drawing is not to scale.
Table 16. WLCSP-R 1.215 x 1.025 mm 0.4 mm pitch 5 bumps, package data(1)
1. Preliminary data.
Symbol
millimeters inches(2)
2. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.495 0.595 0.0215 0.0195 0.0234
A1 0.19 0.165 0.215 0.0075 0.0065 0.0085
A2 0.355 0.33 0.38 0.014 0.013 0.015
b 0.27 0.24 0.3 0.0106 0.0094 0.0118
D 1.215 1.195 1.235 0.0478 0.047 0.0486
E 1.025 1.005 1.045 0.0404 0.0396 0.0411
e 0.4 0.0157
e1 0.693 0.0273
e2 0.346 0.0136
F 0.261 0.0103
G 0.313 0.0123
N(3)
3. N is the total number of terminals.
55
Orientation reference
E
A
B
C
D
e1
e2
e
G
F
AA2
A1
SEATING PLANE
123
E1_ME
b
Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01
26/37
Figure 14. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline
1. Drawing is not to scale.
Table 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data
Symbol
millimeters inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ. Min. Max. Typ. Min. Max.
A 5.33 0.2098
A1 0.38 0.015
A2 3.3 2.92 4.95 0.1299 0.115 0.1949
b 0.46 0.36 0.56 0.0181 0.0142 0.022
b2 1.52 1.14 1.78 0.0598 0.0449 0.0701
c 0.25 0.2 0.36 0.0098 0.0079 0.0142
D 9.27 9.02 10.16 0.365 0.3551 0.4
E 7.87 7.62 8.26 0.3098 0.3 0.3252
E1 6.35 6.1 7.11 0.25 0.2402 0.2799
e 2.54 - - 0.1 - -
eA 7.62 - - 0.3 - -
eB 10.92 0.4299
L 3.3 2.92 3.81 0.1299 0.115 0.15
PDIP-B
A2
A1
A
L
be
D
E1
8
1
c
eA
b2
eB
E
M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data
27/37
Figure 15. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package
outline
1. Drawing is not to scale.
2. The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total
number of pins.
Table 18. SO8 narrow – 8 lead plastic small outline, 150 mils body width,
package mechanical data
Symbol
millimeters inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 1.75 0.0689
A1 0.1 0.25 0.0039 0.0098
A2 1.25 0.0492
b 0.28 0.48 0.011 0.0189
c 0.17 0.23 0.0067 0.0091
ccc 0.1 0.0039
D 4.9 4.8 5 0.1929 0.189 0.1969
E 6 5.8 6.2 0.2362 0.2283 0.2441
E1 3.9 3.8 4 0.1535 0.1496 0.1575
e 1.27 - - 0.05 - -
h 0.25 0.5 0.0098 0.0197
k 0°8° 0°8°
L 0.4 1.27 0.0157 0.05
L1 1.04 0.0409
SO-A
E1
8
ccc
b
e
A
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
L1
A1
GAUGE PLANE
Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01
28/37
Figure 16. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, outline
1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be
allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering
process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 19. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.55 0.45 0.6 0.0217 0.0177 0.0236
A1 0.02 0 0.05 0.0008 0 0.002
b 0.25 0.2 0.3 0.0098 0.0079 0.0118
D 2 1.9 2.1 0.0787 0.0748 0.0827
D2 1.6 1.5 1.7 0.063 0.0591 0.0669
E 3 2.9 3.1 0.1181 0.1142 0.122
E2 0.2 0.1 0.3 0.0079 0.0039 0.0118
e 0.5 - - 0.0197 - -
L 0.45 0.4 0.5 0.0177 0.0157 0.0197
L1 0.15 0.0059
L3 0.3 0.0118
ddd(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.08 0.08
D
E
UFDFPN-01
A
A1
ddd
L1
eb
D2
L
E2
L3
M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data
29/37
Figure 17. TSSOP8 – 8 lead thin shrink small outline, package outline
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data
Symbol
millimeters inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ. Min. Max. Typ. Min. Max.
A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 1.000 0.800 1.050 0.0394 0.0315 0.0413
b 0.190 0.300 0.0075 0.0118
c 0.090 0.200 0.0035 0.0079
CP 0.100 0.0039
D 3.000 2.900 3.100 0.1181 0.1142 0.1220
e 0.650 – – 0.0256 – –
E 6.400 6.200 6.600 0.2520 0.2441 0.2598
E1 4.400 4.300 4.500 0.1732 0.1693 0.1772
L 0.600 0.450 0.750 0.0236 0.0177 0.0295
L1 1.000 0.0394
α0° 8° 0° 8°
TSSOP8AM
1
8
CP
c
L
EE1
D
A2A
α
eb
4
5
A1
L1
Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01
30/37
Figure 18. TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,
package outline
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 21. TSSOP8 3 x 3 mm – 8 lead thin shrink small outline, 3 x 3 mm body size,
mechanical data
Symbol
millimeters inches(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 1.10 0.0433
A1 0 0.15 0 0.0059
A2 0.85 0.75 0.95 0.0335 0.0295 0.0374
b 0.22 0.40 0.0087 0.0157
c 0.08 0.23 0.0031 0.0091
D 3.00 2.8 3.20 0.1181 0.1102 0.126
E 4.90 4.65 5.15 0.1929 0.1831 0.2028
E1 3.00 2.80 3.10 0.1181 0.1102 0.122
e 0.65 0.0256
L 0.60 0.40 0.80 0.0236 0.0157 0.0315
L1 0.95 0.0374
L2 0.25 0.0098
k0°8°0°8°
ccc 0.10 0.0039
E3_ME
1
8
ccc
c
L
EE1
D
A2A
k
eb
4
5
A1
L1
L2
M24C16, M24C08, M24C04, M24C02, M24C01 Part numbering
31/37
8 Part numbering
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
Table 22. Ordering information scheme
Example: M24C16 – W DW 3 T P /S
Device type
M24 = I2C serial access EEPROM
Device Function
16 = 16 Kbit (2048 x 8)
08 = 8 Kbit (1024 x 8)
04 = 4 Kbit (512 x 8)
02 = 2 Kbit (256 x 8)
01 = 1 Kbit (128 x 8)
Operating voltage
W = VCC = 2.5 V to 5.5 V (400 kHz)
R = VCC = 1.8 V to 5.5 V (400 kHz)
F = VCC = 1.7 V to 5.5 V (400 kHz)
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB = UFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
DS = TSSOP8 (3 x 3 mm body size, MSOP8)(1)
1. Products sold in this package are not recommended for new design.
CS = WLCSP(2)
2. Only M24C08-R and M24C08-F devices are offered in the WLCSP package.
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
3 = Automotive: device tested with high reliability certified flow(3) over –40 to 125 °C
3. ST strongly recommends the use of the Automotive Grade devices for use in an automotive environment.
The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask your
nearest ST sales office for a copy.
5 = Consumer: device tested with standard test flow over –20 to 85 °C.
Option
T = Tape and reel packing
Plating technology
P or G = ECOPACK® (RoHS compliant)
Process(4)
4. Used only for device grade 3.
/S = F6SP36%
Part numbering M24C16, M24C08, M24C04, M24C02, M24C01
32/37
Table 23. Available M24C16 products (package, voltage range, temperature grade)
Package M24C16-W
VCC = 2.5 V to 5.5 V
M24C16-R
VCC = 1.8 V to 5.5 V
M24C16-F
VCC = 1.7 V to 5.5 V
DIP8 (BN) Range 6 Range 6 -
SO8N (MN) Range 6, Range 3 Range 6 -
UFDFPN8 (MB) - Range 6 -
TSSOP8 (DW) Range 6, Range 3 Range 6 Range 5
Table 24. Available M24C08 products (package, voltage range, temperature grade)
Package M24C08-W
VCC = 2.5 V to 5.5 V
M24C08-R
VCC = 1.8 V to 5.5 V
M24C08-F
VCC = 1.7 V to 5.5 V
DIP8 (BN) Range 6 - -
SO8N (MN) Range 6, Range 3 Range 6 -
UFDFPN8 (MB) - Range 6 Range 5
TSSOP8 (DW) Range 6 Range 6 Range 5
TSSOP8 3 × 3 mm (DS) - Range 6 -
WLCSP (CS) - Range 6 Range 5
Table 25. Available M24C04 products (package, voltage range, temperature grade)
Package M24C04-W
VCC = 2.5 V to 5.5 V
M24C04-R
VCC = 1.8 V to 5.5 V
M24C04-F
VCC = 1.7 V to 5.5 V
DIP8 (BN) Range 6 - -
SO8N (MN) Range 6, Range 3 Range 6 -
UFDFPN8 (MB) - Range 6 Range 5
TSSOP8 (DW) Range 6, Range 3 Range 6 Range 5
Table 26. Available M24C02 products (package, voltage range, temperature grade)
Package M24C02-W
VCC = 2.5 V to 5.5 V
M24C02-R
VCC = 1.8 V to 5.5 V
DIP8 (BN) Range 6 -
SO8N (MN) Range 6, Range 3 Range 6
UFDFPN8 (MB) - Range 6
TSSOP8 (DW) Range 6, Range 3 Range 6
M24C16, M24C08, M24C04, M24C02, M24C01 Part numbering
33/37
Table 27. Available M24C01 products (package, voltage range, temperature grade)
Package M24C01-W
VCC = 2.5 V to 5.5 V
M24C01-R
VCC = 1.8 V to 5.5 V
DIP8 (BN) Range 6 -
SO8N (MN) Range 6 Range 6
UFDFPN8 (MB) - -
TSSOP8 (DW) Range 6 Range 6
TSSOP8 3 × 3 mm (DS) - Range 6
Revision history M24C16, M24C08, M24C04, M24C02, M24C01
34/37
9 Revision history
Table 28. Document revision history
Date Version Changes
10-Dec-1999 2.4 TSSOP8 Turned-Die package removed (p 2 and order information)
Lead temperature added for TSSOP8 in table 2
18-Apr-2000 2.5 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for
Tab-13
05-May-2000 2.6 Extra labelling to Fig-2D
23-Nov-2000 3.0 SBGA package information removed to an annex document
-R range changed to being the -S range, and the new -R range added
19-Feb-2001 3.1
SBGA package information put back in this document
Lead Soldering Temperature in the Absolute Maximum Ratings table
amended
Write Cycle Polling Flow Chart using ACK illustration updated
References to PSDIP changed to PDIP and Package Mechanical data
updated
Wording brought in to line with standard glossary
20-Apr-2001 3.2 Revision of DC and AC characteristics for the -S series
08-Oct-2001 3.3 Ball numbers added to the SBGA connections and package mechanical
illustrations
09-Nov-2001 3.4 Specification of Test Condition for Leakage Currents in the DC
Characteristics table improved
30-Jul-2002 3.5
Document reformatted using new template. SBGA5 package removed
TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range
added
04-Feb-2003 3.6 Document title spelt out more fully. “W”-marked devices with tw=5ms
added.
05-May-2003 3.7
-R voltage range upgraded to 400kHz working, and no longer preliminary
data.
5V voltage range at temperature range 3 (-xx3) no longer preliminary data.
-S voltage range removed. -Wxx3 voltage+temp ranged added as
preliminary data.
07-Oct-2003 4.0
Table of contents, and Pb-free options added. Minor wording changes in
Summary Description, Power-On Reset, Memory Addressing, Read
Operations. VIL(min) improved to
-0.45V. tW(max) value for -R voltage range corrected.
17-Mar-2004 5.0
MLP package added. Absolute Maximum Ratings for VIO(min) and
VCC(min) changed. Soldering temperature information clarified for RoHS
compliant devices. Device grade information clarified. Process
identification letter “G” information added. 2.2-5.5V range is removed, and
4.5-5.5V range is now Not for New Design
M24C16, M24C08, M24C04, M24C02, M24C01 Revision history
35/37
7-Oct-2005 6.0
Product List summary table added. AEC-Q100-002 compliance. Device
Grade information clarified. Updated Device internal reset section,
Figure 4, Figure 5, Ta b l e 1 6 and Ta b l e 2 2 Added ECOPACK® information.
Updated tW=5ms for the M24Cxx-W.
17-Jan-2006 7.0
Pin numbers removed from silhouettes (see on page 1). Internal Device
Reset paragraph moved to below Section 2.4: Supply voltage (VCC).
Section 2.4: Supply voltage (VCC) added below Section 2: Signal
description. Test conditions for VOL updated in Ta b l e 9 and Ta b l e 1 0 SO8N
package specifications updated (see Ta bl e 1 8 )
New definition of ICC1 over the whole VCC range (see Tables 9, 10 and 11).
19-Sep-2006 8
Document converted to new ST template.
SO8 and UFDFPN8 package specifications updated (see Section 7:
Package mechanical data). Section 2.4: Supply voltage (VCC) clarified.
ILI value given with the device in Standby mode in Tables 9, 10 and 11.
Information given in Table 16: AC characteristics (M24Cxx-R and M24Cxx-
F) are no longer preliminary data.
03-Aug-2007 9
1.7 V to 5.5 V VCC voltage range added (M24C16-F, M24C08-F, M24C04-F
part numbers added; Ta b l e 8 and Ta b l e 1 2 added).
Section 2.4: Supply voltage (VCC) modified.
Note 1 updated to latest standard revision in Table 5: Absolute maximum
ratings.
Rise/fall time conditions for ICC modified in Ta bl e 9 , Ta b l e 1 0 and Ta b le 1 1 .
ICC1 conditions modified in Table 11: DC characteristics (M24Cxx-R).
Note removed below Table 14: Input parameters.
tW modified for M24Cxx-R in Ta b l e 1 6 , note added.
TSSOP8 (DS) package specifications updated (see Ta b l e 2 1 and
Figure 18).
Added: Ta b l e 2 3 , Ta b l e 2 4 , Ta b l e 2 5 , Ta bl e 2 6 and Ta bl e 2 7 summarizing
all available products.
Table 22: Ordering information scheme: Blank option removed under
Plating technology, /W removed under Process.
Table 28. Document revision history (continued)
Date Version Changes
Revision history M24C16, M24C08, M24C04, M24C02, M24C01
36/37
27-Sep-2007 10
Section 2.3: Chip Enable (E0, E1, E2) updated.
Concerned signals specified for VIL and VIH parameters, and note removed
in DC characteristics tables (Ta bl e 9 , Ta bl e 1 0 , Tab l e 1 1 and Table 12 ).
tW modified in Table 16: AC characteristics (M24Cxx-R and M24Cxx-F).
M24C08-F and M24C04-F offered in UFDFPN8 package in the
temperature range 5 (see Ta b l e 2 4 and Ta bl e 2 5 ).
30-Jan-2009 11
Section 2.4: Supply voltage (VCC) clarified.
Figure 5: Maximum RP value versus bus parasitic capacitance (C) for an
I²C bus updated.
IOL added to Table 5: Absolute maximum ratings. ICC1 test conditions
clarified in DC characteristics Ta bl e 9 , Ta b le 1 0 , Ta b l e 1 1 and Ta bl e 1 2 .
Note modified below Table 14: Input parameters.
tXH1XH2 and tXL1XL2 added to Table 15: AC characteristics (M24Cxx-W,
M24Cxx-R, M24Cxx-F), note 4 removed. Figure 12: AC waveforms
updated.
WLCSP package added (refer to Figure 3 and Section 7: Package
mechanical data).
In Section 7: Package mechanical data:
– ECOPACK text added
– inch values calculated from millimeters and rounded to four decimal
digits
– UFDFPN package specifications updated
Small text changes.
Table 28. Document revision history (continued)
Date Version Changes
M24C16, M24C08, M24C04, M24C02, M24C01
37/37
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