26301.102J
Description
The A3935 is designed specifically for automotive applications
that require high-power motors. Each provides six high-current
gate drive outputs capable of driving a wide range of N-channel
power MOSFETs.
A requirement of automotive systems is steady operation over
a varying battery input range. The A3935 integrates a pulse-
frequency modulated boost converter to create a constant
supply voltage for driving the external MOSFETs. Bootstrap
capacitors are utilized to provide the above battery supply
voltage required for N-channel FETs.
Direct control of each gate output is possible via six TTL-
compatible inputs. A differential amplifier is integrated to
allow accurate measurement of the current in the three-phase
bridge.
Diagnostic outputs can be continuously monitored to protect
the driver from short-to-battery, short-to-supply, bridge-open,
and battery under/overvoltage conditions. Additional protection
features include dead-time, VDD undervoltage, and thermal
shutdown.
The A3935 is supplied in a 36-lead 0.8 mm pitch QSOP (package
LQ, similar to SOICW). The lead (Pb) free variants (suffix –T )
have 100% matte tin leadframe plating.
Features and Benefits
Drives wide range of N-channel MOSFETs in 3-phase bridges
PFM boost converter for use with low-voltage battery supplies
Internal LDO regulator for gate-driver supply
Bootstrap circuits for high-side gate drivers
Current monitor output
Adjustable battery overvoltage detection
Diagnostic outputs
Motor lead short-to-battery, short-to-ground, and bridge-
open protection
Undervoltage protection
–40°C to 150°C TJ operation
Thermal shutdown
3-Phase Power MOSFET Controller for Automotive Applications
Package 36-pin QSOP (LQ):
Typical Application
Approximate scale 1:1
A3935
3-Phase Power MOSFET Controller for Automotive Applications
A3935
2
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Selection Guide
Absolute Maximum Ratings
Part Number Pb-free Packing Terminals Package
A3935KLQTR1 1500 pieces/reel 36 QSOP (similar to
SOICW) surface mount
A3935KLQTR-T2Yes
1Variant has been determined to be obsolete and is no longer in production. Status change: October 31, 2011.
2Variant is in production but has been determined to be NOT FOR NEW DESIGN. This classification indicates that
sale of the variant is currently restricted to existing customer applications. The variant should not be purchased for
new design applications because obsolescence in the near future is probable. Samples are no longer available.
Status change: October 31, 2011.
Parameter Symbol Conditions Rating Units
Load Supply Voltage
VBAT VBAT pin
–0.6 to 40 V
VDRAIN VDRAIN pin
VBOOST VBOOST pin
VBOOSTD VBOOSTD pin
Output Voltage Range
VGHxGHA, GHB, and GHC pins –4 to 55 V
VSxSA, SB, and SC pins –4 to 40 V
VGLxGLA, GLB, and GLC pins –4 to 16 V
VCxCA, CB, and CC pins –0.6 to 55 V
Sense Circuit Voltage VCSxCSN and CSP pins –4 to 6.5 V
VLSS LSS pin
Logic Supply Voltage VDD VDD pin
–0.3 to 6.5 V
Logic Input/Output
VOVSET OVSET pin
VBOOSTS BOOSTS pin
VCSOUT CSOUT pin
VDSTH VDSTH pin
remaining logic pins
ESD Rating – Human Body Model AEC-Q100-002; all pins 2.5 kV
ESD Rating – Charged Device Model AEC-Q100-011; all pins 1050 V
Operating Temperature TARange K –40 to 135 °C
Junction Temperature* TJ(max)
Fault conditions that produce excessive junction temperature
will activate device thermal shutdown circuitry. These condi-
tions can be tolerated, but should be avoided.
150 °C
Storage Temperature Range Tstg –55 to 150 °C
3-Phase Power MOSFET Controller for Automotive Applications
A3935
3
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
VREG
High-Side
Driver
Low-Side
Driver
Turn ON
Delay
CA
Phase A
GHA
SA
GLA
LSS
CSN
To P hase B
C
BOOT
To P hase C
Turn ON
Delay
R
S
VBOOST
VBAT
Control
Logic
CSP
BOOSTS
BOOSTD
AHI
ALO
BHI
BLO
CHI
CLO
ENABLE
GND
cs
Drain-Source
Fault Monitor
VBAT Overvoltage
VBAT Undervoltage
VREG Undervoltage
Short to Ground
Short to Battery
Bridge Open
VDD Undervoltage
Thermal Shutdown
VDSTH
SA
SB
SC
CSOUTVDRAIN
Low Drop
Out
Linear
Regulator
VREG
REFi
REFv
LSS
VDRAIN
(KELVIN)
FAULT
Motor
Supply
Voltage
UVFLT
OVFLT
OVSET
VDD
VBAT VIGN
VBAT
VREG
VDD
VDD
External +5V
OS
(blank)
OS
(off)
Dwg. FP-053
Functional Block Diagram
3-Phase Power MOSFET Controller for Automotive Applications
A3935
4
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ELECTRICAL CHARACTERISTICS at TJ = –40°C to 150°C, VBAT = 7 to 16 V, VDD = 4.75 to 5.25 V, ENABLE = 22.5 kHz,
50% duty cycle, two phases active;unless otherwise noted
Characteristics Symbol Conditions Min. Typ1. Max. Units
Power Supply
VDD Supply Current IDD All logic inputs = 0 V 7.0 mA
VBAT Supply Current IBAT All logic inputs = 0 V 3.0 mA
Battery Voltage Operating Range VBAT 7.0 40 V
Bootstrap Diode Forward Voltage VDBOOT
IDBOOT = –ICx = 10 mA, VDBOOT = VREG – VCx0.8 2.0 V
IDBOOT = –ICx = 100 mA 1.5 2.3 V
Bootstrap Diode Resistance rDBOOT
rDBOOT(100 mA) = (VDBOOT(150 mA)
– VDBOOT(50 mA)) / 100 mA 2.5 7.5 Ω
Bootstrap Diode Current Limit2IDM 3 V < VREG – VCx < 12 V –150 –1150 mA
Bootstrap Quiescent Current ICx VCx = 40 V, GHx = ON 10 30 μA
Bootstrap Refresh Time trefresh
VSx = low, to guarantee ΔV = +0.5 V refresh of 0.47 μF
Bootstrap Capacitor, CBOOT, to VCx – VSx = +10 V 2.0 μs
VREG Output Voltage3VREG VBAT = 7 to 40 V, VBOOST from Boost Regulator 12.7 14 V
VREG Dropout Voltage4VREGDO VREGDO = VBOOST – VREG, IREG = 40 mA 0.9 V
Gate Drive Average Supply Current IREG No external dc load at VREG, CREG = 10 μF–40mA
VREG Input Bias Current IREGbias Current into VBOOST, ENABLE = 0 4.0 mA
Boost Supply
VBOOST Output Voltage Limit VBOOSTM VBAT = 7 V 14.9 16.3 V
VBOOST Output Voltage Limit Hysteresis VBOOSTM 35 180 mV
Boost Switch On Resistance rDS(on) IBOOSTD < 300 mA 1.4 3.3 Ω
Boost Switch Maximum Current IBOOSTSW 300 mA
Boost Current Limit Threshold Voltage VBI(th) Increasing VBOOSTS 0.45 0.55 V
Off Time toff 3.0 8.0 μs
Blanking Time tblank 100 220 ns
Control Logic
Logic Input Voltage VI(1) Minimum high level input for logic 1 2.0 V
VI(0) Maximum low level input for logic 0 0.8 V
Logic Input Current II(1) VI = VDD 500 μA
II(0) VI = 0.8 V 50 μA
Logic Input Hysteresis VIhys 100 300 mV
Logic Output High Voltage VO(H) IO(H) = –800 μAVDD
0.8 –– V
Logic Output Low Voltage VO(L) IO(L) = 1.6 mA 0.4 V
Gate Drives, GHx (internal source, or upper, switch stages)5
Output High Voltage VDSL(H)
GHx: IxU = –10 mA, VSx = 0 VREG
2.26 –V
REG V
GLx: IxU = –10 mA, VLSS = 0 VREG
0.26 –V
REG V
Source Current (pulsed) IxU
VSDU = 10 V, TJ = 25°C 800 mA
VSDU = 10 V, TJ = 135°C 400 mA
Source On Resistance rSDU(on)
IxU = –150 mA, TJ = 25°C 4.0 10 Ω
IxU = –150 mA, TJ = 135°C 7.0 15 Ω
Continued on the next page…
3-Phase Power MOSFET Controller for Automotive Applications
A3935
5
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ELECTRICAL CHARACTERISTICS (continued) at TJ = –40°C to 150°C, VBAT = 7 to 16 V, VDD = 4.75 to 5.25 V,
ENABLE = 22.5 kHz, 50% duty cycle, two phases active;unless otherwise noted
Characteristics Symbol Conditions Min. Typ1. Max. Units
Gate Drives, GLx (internal sink or lower switch stages)6
Sink Current (pulsed) IxL
VDSL = 10 V, TJ = 25°C 850 mA
VDSL = 10 V, TJ = 135°C 550 mA
Sink On Resistance rDSL(on)
IxL = 150 mA, TJ = 25°C 1.8 6.0 Ω
IxL = 150 mA, TJ = 135°C 3.0 7.5 Ω
Gate Drives, GHx, GLx (General)5,6
Propagation Delay, Logic only tpd Logic input to unloaded GHx, GLx 150 ns
Output Skew Time tsk(o) Grouped by edge, phase–to–phase 50 ns
Dead Time (shoot–through prevention) tdead Between GHx, GLx transitions of same phase 75 180 ns
Sense Amplifier
Input Bias Current2Ibias CSP = CSN = 0 V –180 –360 μA
Input Offset Current2IIO CSP = CSN = 0 V ±35 μA
Input Resistance ri
CSP with respect to GND 80 kΩ
CSN with respect to GND 4.0 kΩ
Diff. Input Operating Voltage VID VID = CSP – CSN, –1.3V < CSP,N < 4V ±200 mV
Output Offset Voltage VOO CSP = CSN = 0 V 77 250 450 mV
Output Offset Voltage Drift ΔVOO CSP = CSN = 0 V 100 μV/°C
Input Common Mode Operating Range VIC CSP = CSN –1.5 4.0 V
Voltage Gain AVVID = 40 to 200 mV 18.6 19.2 19.8 V/V
Low Output Voltage Error EVVID = 0 to 40 mV, VO = (19.2 × VID) + VO + Ev ±25 mV
DC Common Mode Attenuation A
VCCSP = CSN = 200 mV 28 dB
Output Resistance rOVCSOUT = 2.0 V 8.0 Ω
Output Dynamic Range VCSOUT ICSOUT = –100 μA at top rail, 100 μA at bottom rail 0.075 VDD
0.25 V
Output Current, Sink Isink VCSOUT = 2.5 V 20 mA
Output Current, Source2Isource VCSOUT = 2.5 V –1.0 mA
VDD Supply Ripple Rejection PSRRVDD CSP = CSN = GND, frequency = 0 to 1 MHz 20 dB
VREG Supply Ripple Rejection PSRRVREG CSP = CSN = GND, frequency = 0 to 300 kHz 45 dB
Small Signal 3 dB Bandwidth BWf3db 10 mV input 1.6 MHz
AC Common Mode Attenuation A
VC(ac) Vcm = 250 mV(pp), frequency = 0 to 800 kHz 26 dB
Output Slew Rate (positive or negative) SR 200 mV step input, measured at 10/90% points 10 V/μs
Fault Logic
VDD Undervoltage VDD(uv) Decreasing VDD 3.8 4.3 V
VDD Undervoltage Hysteresis VDD(uv) VDD(recovery) – VDD(uv) 100 300 mV
OVSET Operating Voltage Range VSET(ov) 0–V
DD V
OVSET Calibrated Voltage Range VSET(ov)cal 0 2.5 V
OVSET Input Current Range2ISET(ov) –1.0 1.0 μA
VBAT Overvoltage Range VBAT(ov)
0 V < VSET(ov) < 2.5 V 19.4 40 V
Increasing VBAT, VSET(ov) = 0 V 19.4 22.4 25.4 V
VBAT Overvoltage Hysteresis VBAT(ov) Percent of VBAT(ov) value set by VSET(ov) 9.0 15 %
Continued on the next page…
3-Phase Power MOSFET Controller for Automotive Applications
A3935
6
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ELECTRICAL CHARACTERISTICS (continued) at TJ = –40°C to 150°C, VBAT = 7 to 16 V, VDD = 4.75 to 5.25 V,
ENABLE = 22.5 kHz, 50% duty cycle, two phases active;unless otherwise noted
Characteristics Symbol Conditions Min. Typ1. Max. Units
VBAT Overvoltage Gain Constant KBAT(ov)
VBAT(ov) = (KBAT(ov) x VSET(ov)) + VBAT(ov)(0);
VBAT(ov)(0) at VSET(ov) = 0 12 V/V
VBAT Undervoltage VBAT(uv) Decreasing VBAT 5.0 5.25 5.5 V
VBAT Undervoltage Hysteresis VBAT(uv) Percent of VBAT(uv) 8.0 12 %
VREG Undervoltage VREG(uv) Decreasing VREG 9.9 11.1 V
VDSTH Input Range VDSTH 0.5 3.0 V
VDSTH Input Current IDSTH VDSTH > 0.8 V 40 100 μA
Short–to–Ground Threshold VSTG(th)
With a high–side driver on, as VSX decreases,
VDRAIN – VSx > VSTG causes a fault
VDSTH
0.3 VDSTH +
0.2 V
Short–to–Battery Threshold VSTB(th)
With a low–side driver on, as VSX increases,
VSx – VLSS > VSTB causes a fault
VDSTH
0.3 VDSTH +
0.2 V
VDRAIN-Open Bridge Operating Range VDRAIN 7 V < VBAT < 40 V –0.3 VBAT +
2.0 V
VDRAIN-Open Bridge Current IVDRAIN 7 V < VBAT < 40 V 0 1.0 mA
VDRAIN /Open Bridge Threshold Voltage VBDGO(th) If VDRAIN < VBDGOTH then a bridge fault occurs 1.0 3.0 V
Thermal Shut Down Temperature TJ160 170 180 °C
Thermal Shutdown Hysteresis TJ7.0 10 13 °C
1Typical data are for initial design estimations only, and assume optimum manufacturing and application conditions. Performance may vary for individual
units, within the specified maximum and minimum limits.
2Negative current is defined as coming out of (sourcing) the specified device terminal.
3For VBOOSTM < VBOOST < 40 V power dissipation in the VREG LDO increases. Observe TJ < 150°C limit.
4With VBOOST decreasing, dropout voltage measured at VREG = VREG(ref) – 200 mV where VREG(ref) = VREG at VBOOST = 16 V.
5For GHx: VSDU = VCx – VGHx, VDSL = VGHx – VSx, VDSL(H) = VCx – VSDU – VSx.
6For GLx: VSDU = VREG – VGLx, VDSL = VGLx – VLSS, VDSL(H) = VREG – VSDU – VLSS.
3-Phase Power MOSFET Controller for Automotive Applications
A3935
7
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Characteristic Symbol Test Conditions* Value Units
Package Thermal Resistance RθJA On 4-layer PCB, based on JEDEC standard 44 ºC/W
*Additional thermal information available on Allegro Web site.
Thermal Characteristics
50 75 100 125 15025
ALLOWABLE PACKAGE POWER DISSIPATION IN WATTS
AMBIENT TEMPERATURE IN °C
5.0
0
1.0
2.0
3.0
4.0
R
θJA
= 44°C/W*
Power Dissipation versus Ambient Temperature
3-Phase Power MOSFET Controller for Automotive Applications
A3935
8
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Terminal Descriptions
AHI, BHI, and CHI. Direct control of high-side gate outputs
GHA, GHB, and GHC. Logic 1 drives the gate on. Logic 0 pulls
the gate down, turning off the external power MOSFET. Inter-
nally pulled down when the terminal is open.
ALO, BLO, and CLO. Direct control of low-side gate outputs
GHA, GHB, and GHC. Logic 1 drives the gate on. Logic 0 pulls
the gate down, turning off the external power MOSFET. Inter-
nally pulled down when the terminal is open.
BOOSTD. Boost converter switch drain connection.
BOOSTS. Boost converter switch source connection.
CA, CB, and CC. High-side connection for the bootstrap
capacitors, CBOOTx, positive supply for high-side gate drive.
The bootstrap capacitor is charged to VREG when the output Sx
terminal is low. When the output swings high, the voltage on this
terminal rises with the output to provide the boosted gate voltage
needed for N-channel power MOSFETs.
CSN. Input for current-sense differential amplifier, on the
inverting, negative side. Kelvin connection for the ground side of
the current-sense resistor, RSENSE.
CSOUT. Amplifier output voltage proportional to the current
sensed across an external low-value resistor placed in the ground
side of the power MOSFET bridge.
CSP. Input for current-sense differential amplifier, on the non-
inverting, positive side. Connected to the positive side of the
sense resistor, RSENSE.
ENABLE. Logic 0 disables the gate control signals and switches
off all the gate drivers (low) causing a coast condition. Can be
used in conjunction with the gate inputs to PWM (pulse wave
modulate) the load current. Internally pulled down when the
terminal is open.
¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ . Diagnostic logic output signal. When low, indicates
that one or more fault conditions have occurred.
GHA, GHB, and GHC. High-side gate drive outputs for
N-channel MOSFET drivers. External series gate resistors can
control the slew rate seen at the power driver gate, thereby
controlling the di/dt and dv/dt of Sx outputs.
GLA, GLB, and GLC. Low-side gate drive outputs for external,
N-channel MOSFET drivers. External series gate resistors can
control slew rate.
GND. Ground, or negative, side of VDD and VBAT supplies.
LSS. Low-side gate driver return. Connects to the common
sources on the low sides of the power MOSFET bridge.
OVFLT. Logic 1 indicates that the VBAT level exceeded the
VBAT overvoltage trip point set by the OVSET level. It will
recover after exceeding a hysteresis below that maximum value.
Normally, it has a high-impedance state. If OVFLT and UVFLT
are both in high-impedance state; then, at least, a thermal
shutdown or VDD undervoltage has occurred.
OVSET. A positive dc level that controls the VBAT overvoltage
trip point. Usually, set by a precision resistor divider network
between VDD and GND, but can be held grounded for a preset
value. When this terminal is open, it sets an unspecified but high
overvoltage trip point.
SA, SB, and SC. Directly connected to the motor terminals,
these terminals sense the voltages switched across the load and
are connected to the negative side of the bootstrap capacitors,
CBOOTx. Also, are the negative supply connection for the
floating high-side drivers.
UVFLT. Logic 1 indicates that the VBAT level is below its
minimum value. It will recover after exceeding a hysteresis above
that minimum value. Has a high-impedance state. If UVFLT and
OVFLT are both in high-impedance state; then, at least, a thermal
shutdown or VDD undervoltage has occurred.
VBAT. Battery voltage. Positive input. usually connected to the
motor voltage supply.
VBOOST. Boost converter output, 16 V nominal, is also the
input to the regulator for VREG. Has internal boost-current
and boost-voltage control loops. In high-voltage systems is
approximately one diode drop below VBAT.
VDD. Logic supply, +5 V nominal.
VDRAIN. Kelvin connection for drain-to-source voltage monitor.
Connected to the high-side drains of the MOSFET bridge. High
impedance when this terminal is open, and registers as a short-to-
ground fault on all motor phases.
VDSTH. A positive dc level that sets the drain-to-source monitor
threshold voltage. Internally pulled down when this terminal is
open.
VREG. High-side gate driver supply, 13.5 V nominal. Has low-
voltage dropout (LDO) feature.
3-Phase Power MOSFET Controller for Automotive Applications
A3935
9
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Motor Lead Protection. A fault detection circuit monitors
the voltage across the drain-to-source of the external MOSFETs.
A fault is asserted low on the output terminal, ¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ , if the
drain-to-source voltage of any MOSFET that is instructed to
turn on is greater than the voltage applied to the VDSTH input
terminal. When a high-side switch is turned on, the voltage from
VDRAIN to the appropriate motor phase output, VSX, is examined.
If the motor lead is shorted to ground before the high-side is
turned on, the measured voltage will exceed the threshold and
the ¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ terminal will go low. Similarly, when a low-side
MOSFET is turned on, the differential voltage between the motor
phase (drain) and the LSS terminal (source) is monitored. VDSTH
is set by a resistor divider to VDD.
The VDRAIN is intended to be a Kelvin connection for the
high-side, drain-to-source monitor circuit. Voltage drops across
the power bus are eliminated by connecting an isolated PCB trace
from the VDRAIN terminal to the drain of the MOSFET bridge.
This allows improved accuracy in setting the VDSTH threshold
voltage. The low-side, drain-to-source monitor uses the LSS
terminal, rather than VDRAIN, for comparison with VDSTH.
The A3935 just reports these motor faults.
Fault Outputs. Transient faults on any of the fault outputs
are to be expected during switching, and will not disable the
gate drive outputs. External circuitry or controller logic must
determine if the faults represent a hazardous condition.
¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ . This terminal will go active low when any of the follow-
ing conditions occur:
• VBAT overvoltage
• VBAT undervoltage
• VREG undervoltage
• Motor lead short-to-ground
• Motor lead short-to-supply
or short-to-battery
• Bridge (or VDRAIN) open
• VDD undervoltage
• Thermal shut down
OVFLT. Asserts high when a VBAT overvoltage fault occurs and
resets low after a recovery hysteresis. It has a high-impedance
state when a thermal shutdown or VDD undervoltage occurs. The
voltage at the OVSET terminal, VOVSET, controls the VBAT over-
voltage set point VBAT(ov), as follows:
VBAT(ov) = (ABAT(ov) × VSET(ov)) + VBAT(ov)(0),
where ABAT(ov) is the gain (12) and VBAT(ov)(0) is the value of
VBAT(ov) when VSET(ov) = 0 (VBAT(ov) 22.4). For the above
formula to be valid, all variables must be in range and below the
maximum operating specification.
UVFLT. Asserts high when a VBAT undervoltage fault occurs and
resets low after exceeding a recovery hysteresis. It has a high-
impedance state when a thermal shut down or VDD undervoltage
occurs. OVFLT and UVFLT are mutually exclusive by definition.
Current Sensing. A current-sense amplifier is provided to
allow system monitoring of the load current. The differential
amplifier inputs are intended to be Kelvin-connected across a
low-value sense resistor or current shunt. The output voltage is
represented by:
VCSOUT = ( ILOAD ×AV × RSENSE) + VOS
where VOS is the output voltage calibrated at zero load current
and A V is the differential amplifier gain of about 19.2. If either
the CSP or CSN pin is open, the CSOUT pin will go to its
maximum positive level.
Shut Down. If a fault occurs because of excessive junction
temperature or undervoltage on VDD or VBAT, all gate driver
outputs are driven low until the fault condition is removed. In
addition, the boost supply switch and VREG are turned off until
those undervoltages and junction temperatures recover.
Boost Supply. VBOOST is controlled by an inner current-
control loop, and by an outer voltage-feedback loop. The
current-control loop turns off the boost switch for 5 μs whenever
the voltage across the boost current-sense resistor exceeds
500 mV. A diode reverse-recovery current flows through the
sense resistor whenever the boost switch turns on, which could
result in turning off the switch again if not for the blanking-time
circuit. Adjustment of this external sense resistor determines the
maximum current in the inductor. Whenever VBOOST exceeds the
predefined threshold, 16 V nominal the boost switch is inhibited.
Functional Description
3-Phase Power MOSFET Controller for Automotive Applications
A3935
10
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Input Logic Table
Input Output Mode of Operation
ENABLE xLO xHI GLxGHx
0 Don’t Care Don’t Care 0 0 All gate drive outputs low
10000Both gate drive outputs low
10101High-side on
11010Low-side on
11100XOR circuitry prevents shoot-through
Fault Response Table
Operating Conditions Fault Output Regulator State Driver Output
Fault Mode ENABLE ¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ OVFLT UVFLT Boost VREG GHxGLx
No Fault Don’t Care 1 0 0 ON ON aa
Short-to-Battery 1b000ONON
aa
Short-to-Ground 1c000ONON
aa
Bridge (VDRAIN) Fault 1d000ONON
aa
VREG Undervoltage Don’t Care 0 0 0 ON ON aa
VBAT Overvoltage Don’t Care 0 1 0 OFFeON aa
VBAT UndervoltagefDon’t Care 0 0 1 OFF OFF 0 0
VDD UndervoltagefDon’t Care 0 High Z High Z OFF OFF 0 0
Thermal Shut DownfDon’t Care 0 High Z High Z OFF OFF 0 0
aDetermined by input states: xLO, xHI, and ENABLE. See Input Logic table.
bShort-to-battery can only be detected when the corresponding GLx = 1. This fault is not detected when ENABLE = 0.
cShort-to-ground can only be detected when the corresponding GHx = 1. This fault is not detected when ENABLE = 0.
dBridge fault appears as a short-to-ground fault on all motor phases. This fault is not detected when ENABLE = 0.
eOff only because VBOOST VBAT , which is above the voltage threshold of the Boost regulator voltage control loop.
fThese faults are not only reported, but also action is taken by the internal logic to protect the A3935 and the system.
3-Phase Power MOSFET Controller for Automotive Applications
A3935
11
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Number Name Function
1 CSP Current-sense input, positive-side
2 VDSTH DC input, drain-to-source monitor threshold voltage
3 LSS Gate-drive source return, low-side
4 GLC Gate-drive C output, low-side
5 SC Load phase C input
6 GHC Gate-drive C output, high-side
7 CC Bootstrap capacitor C
8 GLB Gate-drive B output, low-side
9 SB Load phase B input
10 GHB Gate-drive B output, high-side
11 CB Bootstrap capacitor B
12 GLA Gate-drive A output, low-side
13 SA Load phase A input
14 GHA Gate-drive A output, high-side
15 CA Bootstrap capacitor A
16 VREG Gate drive supply, positive
17 VDRAIN Kelvin connection to MOSFET high-side drains
18 VBOOST Boost supply output
Number Name Function
19 BOOSTS Boost switch, source
20 BOOSTD Boost switch, drain
21 GND Ground, dc supply returns, negative
22 VBAT Battery supply, positive
23 UVFLT VBAT undervoltage fault output
24 OVFLT VBAT overvoltage fault output
25 ¯F¯ ¯A¯ ¯U¯ ¯L¯ ¯T¯ Active-low fault output, primary
26 ALO Gate control input A, low-side
27 AHI Gate control input A, high-side
28 BHI Gate control input B, high-side
29 BLO Gate control input B, low-side
30 CLO Gate control input C, low-side
31 CHI Gate control input C, high-side
32 ENABLE Gate output enable
33 OVSET DC input, overvoltage threshold setting for VBAT
34 CSOUT Current-sense amplifier output
35 VDD Logic supply, nominally +5 V
36 CSN Current-sense input, negative-side
Pin-out Diagram
CB
GLA
SA
GHA
CA
VREG
VDRAIN
VBOOST
ALO
FAULT
OVFLT
UVFLT
VBAT
GND
BOOSTD
BOOSTS
5
6
7
8
9
10
11
12
13
14
15
16
17
18
4
3
32
31
30
29
28
33
34
LSS
GLC
SC
GHC
CC
GLB
SB
GHB
CSOUT1
OVSET
ENABLE
CHI
CLO
BLO
BHI
2
1
35
36
23
22
21
20
19
24
25
26
27
CSP
VDSTH
CSN
VDD
AHI
Terminal List
3-Phase Power MOSFET Controller for Automotive Applications
A3935
12
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Package LQ, 36-pin QSOP
C
SEATING
PLANE
15.30 ±0.10
10.31 ±0.307.50 ±0.10
0.20 ±0.10
2.64 MAX
A0.10
36X
(0.36)
0.60 0.80
9.50
2.15
(0.80)
4° ±4
0.28 +0.05
–0.04
0.84 +0.44
–0.43
0.40 +0.12
–0.11
21
36
GAGE PLANE
SEATING PLANE A
B
B
Terminal #1 mark area
A
For Reference Only
(QSOP, nonJEDEC standard)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Reference land pattern layout (reference IPC7351
SOP80P1033X264-36M); adjust as necessary to meet
application process requirements and PCB layout
tolerances. All pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application
process requirements and PCB layout tolerances
3-Phase Power MOSFET Controller for Automotive Applications
A3935
13
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
Copyright ©2005-2011, Allegro MicroSystems, Inc.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per-
mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use;
nor for any in fringe ment of patents or other rights of third parties which may result from its use.
For the latest version of this document, visit our website:
www.allegromicro.com
Revision History
Revision Revision Date Description of Revision
Rev. J October 31, 2011 Update product availability