2001-2012 Microchip Technology Inc. DS21389D-page 1
TC1410/TC1410N
Features
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 0.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 500 pF in 25 nsec
• Short Delay Time: 30 nsec Typ.
• Consistent Delay Times With Changes in Supply
Voltage
• Mat ched Delay Times
• Low Supply Current
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 16
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1411/TC1412/TC1413
Applications
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
• Relay Driver
General Description
The TC1410/TC1410N are 0.5A CMOS buffers/ drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
withou t dama ge or l ogic u ps et, up to 500 mA of c urrent
of eit her p ola rity bei ng forc ed b ack in to th eir o utp ut. Al l
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1410/TC1410N can easily
charge a 500 pF gate capacitance in 25 nsec with
matched rise and fall times, and provide low enough
impeda nce in both the ‘ON’ and ‘OFF ’ states to ensu re
the MOSFET’s intended state will not be affected, even
by large transients. The leading and trailing edge
propagation delay times are also matched to allow
driving short-duration inputs with greater accuracy.
Package Type
8-Pin MS OP /P DIP/ SO IC
1
2
3
4
VDD
5
6
7
8OUT
GND
VDD
IN
NC
GND OUT
TC1410
NC = No Connection
26,7
Inverting
26,7
Non-Inverting
1
2
3
45
6
7
8
TC1410N
VDD
IN
NC
GND
VDD
OUT
GND
OUT
NOTE: Duplicate pins must be connected together
for proper operation.
0.5A High-Speed MOSFET Drivers
TC1410/TC1410N
DS21389D-page 2 2001-2012 Microchip Technology Inc.
Functional Block Diagram
Effective
Input C = 10 pF TC1410N
Output
Input
GND
VDD
300 mV
4.7V
Inverting
Non-Inverting
Output
Output
TC1410
2001-2012 Microchip Technology Inc. DS21389D-page 3
TC1410/TC1410N
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage.....................................................+20V
Input Voltage......................VDD + 0.3V to GND – 5.0V
Power Dissipation (TA 70°C)
MSOP..........................................................340 mW
PDIP............................................................730 mW
SOIC............................................................470 mW
Storage Temperature Range..............-65°C to +150°C
Maximum Junction Temperature......................+150°C
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and funct ional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
PIN FUNCTION TABLE
Symbol Description
VDD Supply input, 4.5V to 16V
INPUT Control input
NC No connection
GND Ground
GND Ground
OUTPUT CMOS push-p ull outpu t ,
common to pin 7
OUTPUT CMOS push-p ull outpu t ,
common to pin 6
VDD Supply input, 4.5V to 16V
DC ELECTRIC AL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD16V.
Typical values are measured at TA = +25°C, VDD= 16V.
Parameters Sym Min Typ Max Units Conditions
Input
Logic ‘1’, High Input Voltage VIH 2.0 — — V
Logic ‘0’, Low Input Voltage VIL ——0.8V
Input Current IIN -1 — 1 µA 0VVINVDD, TA = +25°C
-10 — 10 -40°CTA+85°C
Output
High Output Voltage VOH VDD – 0.025 — — V DC Test
Low Ou tput Voltage VOL — — 0.025 V DC Test
Output Re si stance RO—1622VDD = 16V, IO = 10 mA, TA = +25°C
—2028 0°CTA+70°C
—2028 -40°CTA+85°C
Peak Output Current IPK —0.5—AV
DD = 16V
Latch-Up Prote cti on
Withstand Reverse Current IREV — 0.5 — A Duty cycle2%, t 300 µsec,
VDD = 16V
Switching Tim e (Note 1)
Rise Time tR—2535nsecT
A = +25°C
—2740 0°CTA+70°C
—2940 -40°CTA+85°C, Figure 4-1
Fall Time tF—2535nsecT
A = +25°C
—2740 0°CTA+70°C
—2940 -40°CTA+85°C, Figure 4-1
Delay Time tD1 —3040nsecT
A = +25°C
—3345 0°CTA+70°C
—3545 -40°CTA+85°C, Figure 4-1
Note 1: Switching times ensured by design.
TC1410/TC1410N
DS21389D-page 4 2001-2012 Microchip Technology Inc.
TEMPERATURE CHAR ACTERISTICS
Delay Time tD2 —3040nsecT
A = +25°C
—3345 0°CTA+70°C
—3545 -40°CTA+85°C, Figure 4-1
Power Supply
Power Supply Current IS—0.51.0mAV
IN = 3V, VDD = 16V
—0.10.15 V
IN = 0V
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 16V.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA0—+70ºC
Specified Temperature Range (E) TA-40 — +85 ºC
Maximum Junction Temperat ure TJ— — +150 ºC
Storage Temperature Range TA-65 — +150 ºC
Package Thermal Resistances
Thermal Resistance, 8L-MSOP JA —206—ºC/W
Thermal Resistance, 8L-PDIP JA —125—ºC/W
Thermal Resistance, 8L-SOIC JA —155—ºC/W
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V VDD16V.
Typical values are measured at TA = +25°C, VDD= 16V.
Parameters Sym Min Typ Max Units Conditions
Note 1: Switching times ens ured by design.
2001-2012 Microchip Technology Inc. DS21389D-page 5
TC1410/TC1410N
2.0 TY PICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD16V.
FIGURE 2-1: Quiescent Supply Current
vs. Supply Voltage.
FIGURE 2-2: Input Threshold vs. Supply
Voltage.
FIGURE 2-3: High-State Output
Resistance vs. Supply Voltage.
FIGURE 2-4: Quiescent Supply Current
vs. Temperature.
FIGURE 2-5: Input Threshold vs.
Temperature.
FIGURE 2-6: Low-State Output
Resistance vs. Supply Voltage.
Note: The g r ap hs and t ables provided fol low i ng thi s n ote are a statistic al s umm ary based on a l im ite d number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
100
200
300
400
500
16141210864
VIN = 3V
VIN = 0V
TA = +25°C
ISUPPLY (μA)
VDD (V)
1.1
1.2
1.3
1.4
1.5
1.6
16141210864
TA = +25°C
VDD (V)
VTHRESHOLD (V)
VIH
VIL
0
10
20
30
40
50
16141210864
V
DD
(V)
R
DS-ON
(Ohms)
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
-40 -20 0 20 40 60 80
0
100
200
300
400
500
I
SUPPLY
(μA)
V
IN
= 3V
V
IN
= 0V
V
SUPPLY
= 16V
TEMPERATURE (°C)
-40 -20 0 20 40 60 80
1.1
1.2
1.3
1.4
1.5
1.6
V
SUPPLY
= 16V
TEMPERATURE (°C)
V
THRESHOLD
(V)
V
IH
V
IL
0
10
20
30
40
50
16141210864
V
DD
(V)
R
DS-ON
(Ohms)
TA = -40°C
TA = +25°C
TA = +85°C
TC1410/TC1410N
DS21389D-page 6 2001-2012 Microchip Technology Inc.
Note: Unless otherwise indicated, over operating temperature range with 4.5V VDD16V.
FIGURE 2-7: Rise Time vs. Supply
Voltage.
FIGURE 2-8: Propagation Delay vs.
Supply Voltage.
FIGURE 2-9: Rise and Fall Times vs.
Capacitive Load .
FIGURE 2-10: Fall Time vs. Supply
Voltage.
FIGURE 2-11: Propagation Delay vs.
Supply Voltage.
FIGURE 2-12: Propagation Delays vs.
Capacitive Loa d.
0
20
40
60
80
100
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
VDD (V)
C
LOAD
= 500 pF
tRISE (nsec)
0
20
40
60
80
100
16141210864
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
V
DD
(V)
C
LOAD
= 500 pF
t
D1
(nsec)
0 500 1000 1500 2000 2500 3000 3500
0
20
40
60
80
100
t
FALL
t
RISE
T
A
= +25°C
V
DD
= 16V
t
RISE
, t
FALL
(nsec)
C
LOAD
(pF)
0
20
40
60
80
100
16141210864
VDD (V)
C
LOAD
= 500 pF
tD2 (nsec)
T
A
= -40°C
T
A
= +25°C
T
A
= +85°C
0 500 1000 1500 2000 2500 3000 3500
25
29
33
37
41
45
t
D2
t
D1
T
A
= +25°C
V
DD
= 16V
C
LOAD
(pF)
Propagation Delays (nsec)
2001-2012 Microchip Technology Inc. DS21389D-page 7
TC1410/TC1410N
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
3.1 Supply Input (VDD)
The VDD in put is the bia s supply for the M OSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
shoul d be chos en base d on the capaciti ve load that is
being driven. A value of 1.0 µF is suggested.
3.2 Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input also has
300 mV of hysteresis between the high and low
thresholds that prevents output gli tching even when the
rise and fall time of the input signal is very slow.
3.3 CMOS Push-Pull Output
(OUTPUT)
The MOSFET driver output is a low-impedance,
CMOS, push-pull style output, capable of driving a
capacitive load with 0.5 A peak currents.
3.4 Ground
The ground pin s are the return pa th for the bias current
and for the high peak currents that discharge the load
capa citor. The ground pi ns shoul d be tied i nto a groun d
plane or have very short traces to the bias supply
source retur n.
Pin No. Symbol Description
1V
DD Supply input, 4.5V to 16V
2 INPUT Control input
3NC
No connection
4GND
Ground
5GND
Ground
6OUTPUT
CMOS push-pull output, common
to pin 7
7OUTPUT
CMOS push-pull output, common
to pin 6
8V
DD Supply input, 4.5V to 16V
TC1410/TC1410N
DS21389D-page 8 2001-2012 Microchip Technology Inc.
4.0 APPLICATIONS INFORMATION
FIGURE 4-1: Switching Time Test Circuit.
CL = 500 pF
0.1 µF
1.0 µF
Inverting Driver
Non-Inverting Driver
Input
VDD = 16V
Input
Output
tD1 tF
tR
tD2
Input: 100 kHz,
square wave,
tRISE = tFALL 10 nsec
Output
Input
Output
tD1 tF
tR
tD2
+5V
10%
90%
10%
90%
10%
90%
VDD
0V
90%
10%
10% 10%
90%
+5V
VDD
0V
0V
0V
90%
4, 5
26, 7
1, 8
TC1410
TC1410N
TC1410N
TC1410
2001-2012 Microchip Technology Inc. DS21389D-page 9
TC1410/TC1410N
5.0 PACKAGING INFORMATION
5.1 Package Marking Information
XXXXXXXX
XXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
TC1410
CPA057
0346
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
TC1410
COA0346
057
8-Lead MSOP Example:
XXXXXXX
YWWNNN 1410NE
346057
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric trac eability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Mic rochi p pa rt num ber can not be ma rked on on e line, i t will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
TC1410/TC1410N
DS21389D-page 10 2001-2012 Microchip Technology Inc.
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
Units INCHES*MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n88
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top 51015 51015
Mold Draft Angle Bottom 51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Eq uiva le nt: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.c om/packaging
2001-2012 Microchip Technology Inc. DS21389D-page 11
TC1410/TC1410N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
Foot Angle 048048
1512015120
Mold Draft Angle Bottom 1512015120
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146
E1
Molded Package Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff § 1.551.421.32.061.056.052A2Molded Package Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 88
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC1410/TC1410N
DS21389D-page 12 2001-2012 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° -
15°5° -
JEDEC Equivalent: MO-187
0° - 8°
5°
5° -
-
15°
15°
--
--
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microc hi p.com /p a ck agi ng
2001-2012 Microchip Technology Inc. DS21389D-page 13
TC1410/TC1410N
6.0 REVISION HISTORY
Revision D (November 2010)
Added a note to each package outline drawing.
TC1410/TC1410N
DS21389D-page 14 2001-2012 Microchip Technology Inc.
2001-2012 Microchip Technology Inc. DS21389D-page 15
TC1410/TC1410N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Device: TC1410: 0.5A Single MOSFET Driver, Inverting
TC1410N: 0.5A Single MOSFET Driver, Non-Inverting
Temperature Range: C = 0°C to +70°C
E = -40°C to +85°C
Package: OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Ta pe and Reel )
UA = Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Ta pe and Reel )
PA = Plastic DIP (300 mil Body), 8-lead
* MSOP package is only available in E-Temp.
PART NO. X/XX
PackageTemperature
Range
Device
Examples:
a) TC1410COA: 0.5A Single MOSFET
driver, SOI C package,
0°C to +70°C.
b) TC1410CPA: 0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
c) TC1410EUA71 3: Tape and Reel,
0.5A Single MOSFET
driver, MSOP p ackage,
-40°C to +85°C.
a) TC1410NCPA: 0.5A Single MOSFET
driver, PDIP package,
0°C to +70°C.
b) TC1410NEPA: 0.5A Single MOSFET
driver, PDIP package,
-40°C to +85°C.
c) TC1410NEUA: 0.5 A Single MOSFET
driver, MSOP package,
-40°C to +85°C.
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com /cn) to receive the most current information on our products.
TC1410/TC1410N
DS21389D-page 16 2001-2012 Microchip Technology Inc.
NOTES:
2001-2012 Microchip Technology Inc. DS21389D-page 17
Information contained in this publication regarding device
applications a nd the lik e is provided only f or yo ur convenience
and may be supers ed ed by u pda t es . It is y our responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SS T Logo, SuperFlash
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
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MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE , In-Circuit Seria l
Programm ing, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & C o. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767856
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that i ts family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hoppin g
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS21389D-page 18 2001-2012 Microchip Technology Inc.
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11/27/12