Wideband 4 GHz, 43 dB Isolation at 1 GHz,
CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT
ADG918/ADG919
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2003–2008 Analog Devices, Inc. All rights reserved.
FEATURES
Wideband switch: −3 dB @ 4 GHz
Absorptive/reflective switches
High off isolation (43 dB @ 1 GHz)
Low insertion loss (0.8 dB @1 GHz)
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)
APPLICATIONS
Wireless communications
General-purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching
FUNCTIONAL BLOCK DIAGRAMS
RF2
RF1
CTRL
ADG918
RFC 50Ω
50Ω
ADG919
RF2
RF1
CTRL
RFC
0
3335-001
Figure 1.
GENERAL DESCRIPTION
The ADG918/ADG919 are wideband switches using a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG918 is an absorptive (matched) switch having
50 Ω terminated shunt legs, whereas the ADG919 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
LVTTL compatible. The low power consumption of these
CMOS devices makes them ideally suited to wireless and
general-purpose high frequency switching applications.
PRODUCT HIGHLIGHTS
1. –43 dB off isolation @ 1 GHz.
2. 0.8 dB insertion loss @ 1 GHz.
3. Tiny 8-lead MSOP/LFCSP packages.
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
–100
–90
–70
–60
–50
–40
–30
–80
–20
–10
0
ISO
L
A
TION (dB)
S21
V
DD
= 2.5V
T
A
= 25°C
S12
03335-003
Figure 2. Off Isolation vs. Frequency
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
–3.2
–2.8
–2.6
–2.4
–2.2
–1.8
–1.6
–1.4
–1.2
–1.0
–2.0
–3.0
–0.8
–0.6
–
0.4
INSERTION LOSS (dB)
VDD = 2.5V
TA = 25°C
03335-004
Figure 3. Insertion Loss vs. Frequency
ADG918/ADG919
Rev. C | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagrams ............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
Terminology .................................................................................... 10
Test Circuits ..................................................................................... 11
Applications Information .............................................................. 13
Absorptive vs. Reflective Switch ............................................... 13
Wireless Metering....................................................................... 13
Tuner Modules ............................................................................ 13
Filter Selection ............................................................................ 13
ADG9xx Evaluation Board ........................................................... 14
Outline Dimensions ....................................................................... 15
Ordering Guide .......................................................................... 16
REVISION HISTORY
9/08—Rev. B to Rev. C
Changes to Ordering Guide .......................................................... 16
8/08—Rev. A to Rev. B
Changes to Table 1, AC Electrical Characteristics, Third Order
Intermodulation Intercept ............................................................... 3
Updated Outline Dimensions ....................................................... 15
Changes to Ordering Guide .......................................................... 16
9/04—Changed from Rev. 0 to Rev. A
Updated Format .................................................................. Universal
Change to Data Sheet Title ............................................................... 1
Change to Features ............................................................................ 1
Change to Product Highlights ......................................................... 1
Changes to Specifications ................................................................. 3
Change to ADG9xx Evaluation Board section ........................... 13
Changes to Ordering Guide .......................................................... 14
8/03 Revision 0: Initial Version
ADG918/ADG919
Rev. C | Page 3 of 16
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications TMIN to TMAX, unless otherwise noted. Temperature range for
B Version: −40°C to +85°C.
Table 1.
B Version
Parameter Symbol Conditions Min Typ1
Max Unit
AC ELECTRICAL CHARACTERISTICS
Operating Frequency2 dc 2 GHz
3 dB Frequency3 4 GHz
Input Power3 0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 57 60 dB
(CP Package) 500 MHz 46 49 dB
1000 MHz 36 43 dB
Isolation—RFC to RF1/RF2 S21, S12 100 MHz 55 60 dB
(RM Package) 500 MHz 43 47 dB
1000 MHz 34 37 dB
Isolation—RF1 to RF2 (Crosstalk) S21, S12 100 MHz 55 58
(CP Package) 500 MHz 41 44
1000 MHz 31 37
Isolation—RF1 to RF2 (Crosstalk) S21, S12 100 MHz 54 57
(RM Package) 500 MHz 39 42
1000 MHz 31 33
Return Loss (On Channel)3
S11, S22 DC to 100 MHz 21 27 dB
500 MHz 22 27 dB
1000 MHz 22 26 dB
Return Loss (Off Channel)3
S11, S22 DC to 100 MHz 18 23 dB
ADG918 500 MHz 17 21 dB
1000 MHz 16 20 dB
On Switching Time3
tON 50% CTRL to 90% RF 6.6 10 ns
Off Switching Time3
tOFF 50% CTRL to 10% RF 6.5 9.5 ns
Rise Time3
tRISE 10% to 90% RF 6.1 9 ns
Fall Time3
tFALL 90% to 10% RF 6.1 9 ns
1 dB Compression3
P–1 dB 1000 MHz 17 dBm
Third Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm
Video Feedthrough4
2.5 mV p-p
DC ELECTRICAL CHARACTERISTICS
Input High Voltage VINH VDD = 2.25 V to 2.75 V 1.7 V
V
INH VDD = 1.65 V to 1.95 V 0.65 VCC V
Input Low Voltage VINL VDD = 2.25 V to 2.75 V 0.7 V
V
INL VDD = 1.65 V to 1.95 V 0.35 VCC V
Input Leakage Current II 0 V ≤ VIN ≤ 2.75 V ± 0.1 ± 1 μA
ADG918/ADG919
Rev. C | Page 4 of 16
B Version
Parameter Symbol Conditions Min Typ1
Max Unit
CAPACITANCE3
RF On Capacitance CRF ON f = 1 MHz 1.6 pF
CTRL Input Capacitance CCTRL f = 1 MHz 2 pF
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 μA
1 Typical values are at VDD = 2.5 V and 25°C, unless otherwise stated.
2 Point at which insertion loss degrades by 1 dB.
3 Guaranteed by design, not subject to production test.
4 The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
ADG918/ADG919
Rev. C | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VDD to GND –0.5 V to +4 V
Inputs to GND –0.5 V to VDD + 0.3 V1
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
MSOP Package
θJA Thermal Impedance 206°C/W
LFCSP Package
θJA Thermal Impedance (2-layer board) 84°C/W
θJA Thermal Impedance (4-layer board) 48°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature (<20 sec) 235°C
ESD 1 kV
1RF1 and RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ADG918/ADG919
Rev. C | Page 6 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
V
DD
CTRL
GND
RFC
RF1
GND
GND
RF2
ADG918/
ADG919
03335-002
Figure 4. 8-Lead MSOP (RM-8) and
8-Lead 3 mm x 3 mm LFCSP (CP-8);
Exposed Pad Tied to Substrate, GND
Table 3. Pin Function Descriptions
Pin No. Mnemonic Function
1 VDD Power Supply Input. These parts can be operated from 1.65 V to 2.75 V, and VDD should be decoupled to GND.
2 CTRL Logic Control Input. See Table 4.
3, 6, 7 GND Ground Reference Point for All Circuitry on the Part.
4 RFC COMMON RF Port for Switch.
5 RF2 RF2 Port.
8 RF1 RF1 Port.
Table 4. Truth Table
CTRL Signal Path
0 RF2 to RFC
1 RF1 to RFC
ADG918/ADG919
Rev. C | Page 7 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
–0.8
V
DD
= 2.25V V
DD
= 2.75V
T
A
= 25°C
INSERTION LOSS (dB)
–3.2
–2.8
–2.6
–2.4
–2.2
–1.8
–1.6
–1.4
–1.2
–1.0
–2.0
–3.0
–0.6
–0.4
–
0.2
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-017
V
DD
= 2.5V
Figure 5. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
T
A
= 25°C
–0.75
–0.65
–0.60
–0.55
–0.50
–0.45
–0.70
–0.40
–0.35
–0.30
INSERTION LOSS (dB)
–0.80
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-019
V
DD
= 2.75V
V
DD
= 2.5V
V
DD
= 2.25V
Figure 6. Insertion Loss vs. Frequency over Supplies (RF1/RF2,
S12, and S21) (Zoomed Figure 5 Plot)
–3.2
–2.8
–2.6
–2.4
–2.2
–1.8
–1.6
–1.4
–1.2
–1.0
–2.0
–3.0
–0.8
–0.6
–0.4
–
0.2
V
DD
= 1.65V
T
A
= 25°C
V
DD
= 1.8V
INSERTION LOSS (dB)
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-021
V
DD
= 1.95V
Figure 7. Insertion Loss vs. Frequency over Supplies
(RF1/RF2, S12, and S21)
+85°C
VDD = 2.5V
–40°C
+25°C
–3.2
–2.8
–2.6
–2.4
–2.2
–1.8
–1.6
–1.4
–1.2
–1.0
–2.0
–3.0
–0.8
–0.6
–0.4
–
0.2
INSERTION LOSS (dB)
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-018
Figure 8. Insertion Loss vs. Frequency over Temperature
(RF1/RF2, S12, and S21)
–20
S12
S21
VDD = 1.65V TO 2.75V
TA = 25°C
–90
–70
–60
–50
–40
–30
–80
–10
0
ISO
L
A
TION (dB)
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-020
Figure 9. Isolation vs. Frequency over Supplies (RF1/RF2, ADG918)
S12
S21
V
DD
= 1.65V TO 2.75V
T
A
= 25°C
–90
–70
–60
–50
–40
–30
–80
–20
–10
0
ISO
L
A
TION (dB)
–100
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-022
Figure 10. Isolation vs. Frequency over Supplies (RF1/RF2, ADG919)
ADG918/ADG919
Rev. C | Page 8 of 16
–20
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
V
DD
= 2.5V
S12 (+85°C)
S12 (+25°C)
S12 (–40°C)
–90
–70
–60
–50
–40
–30
–80
–
10
ISO
L
A
TION (dB)
–100
S21
03335-023
(–40°C, +25°C, +85°C)
Figure 11. Isolation vs. Frequency over Temperature (RF1/RF2, ADG919)
T
A
= 25°C
V
DD
= 2.5V
OFF SWITCH (ADG918)
ON SWITCH
–35
–40
–30
–25
–20
–15
–10
–5
0
RETURN LOSS (dB)
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-026
Figure 12. Return Loss vs. Frequency (RF1/RF2, S11)
–15
TA = 25°C
VDD = 2.5V
–35
–30
–25
–20
–55
–50
–45
–40
–
10
CROSSTALK (dB)
–70
–60
–65
–75
–80
FREQUENCY (Hz)
10k 100k 1M 10M 100M 1G 10G
03335-028
Figure 13. Crosstalk vs. Frequency (RF1/RF2, S12, S21)
CH1 = CTRL = 1V/DIV T
RISE
= 6.1ns
CH2 = RF1 = 100mV/DIV T
FALL
= 6.1ns
CH3 = RF2 = 100mV/DIV
CH2/3
CH1
03335-024
Figure 14. Switch Timing
CH1 500mV CH2 1mVΩm 10.0ns
CTRL
RFC
CH2 p-p
2.002mV
03335-027
Figure 15. Video Feedthrough
40
35
250 350 450 550
FREQUENCY (MHz)
650 750 850
30
IP3(dBm)
25
20
15
10
5
0
V
DD
= 2.5V
T
A
= 25°C
03335-029
Figure 16. IP3 vs. Frequency
ADG918/ADG919
Rev. C | Page 9 of 16
20
0 250 500 750 1000 1250
FREQUENCY (MHz)
1500
P–1dB (dBm)
2
4
6
8
10
12
14
16
18
0
VDD = 2.5V
TA = 25°C
03335-025
Figure 17. P-1 dB vs. Frequency
ADG918/ADG919
Rev. C | Page 10 of 16
TERMINOLOGY
VDD
Most positive power supply potential.
IDD
Positive supply current.
GND
Ground (0 V) reference.
CTRL
Logic control input.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
CIN
Digital input capacitance.
tON
Delay between applying the digital control input and the output
switching on.
tOFF
Delay between applying the digital control input and the output
switching off.
tRISE
Rise time; time for the RF signal to rise from 10% to 90% of the
on level.
tFALL
Fall time; time for the RF signal to fall from 90% to 10% of the
on level.
Off Isolation
The attenuation between the input and output ports of the
switch when the switch control voltage is in the off condition.
Insertion Loss
The attenuation between the input and output ports of the
switch when the switch control voltage is in the on condition.
P–1 dB
1 dB compression point. The RF input power level at which the
switch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
IP3
Third order intermodulation intercept. This is a measure of the
power in false tones that occur when closely spaced tones are
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
Return Loss
The amount of reflected power relative to the incident power at
a port. Large return loss indicates good matching. By measuring
return loss, the VSWR (voltage standing wave ratio) can be
calculated from conversion charts. VSWR indicates the degree
of matching present at a switch RF port.
Video Feedthrough
Spurious signals present at the RF ports of the switch when the
control voltage is switched from high to low or low to high
without an RF signal present.
ADG918/ADG919
Rev. C | Page 11 of 16
TEST CIRCUITS
Setups for the ADG918 are similar.
tON
50% 50%
90% 10%
V
CTRL
V
OUT
tOFF
V
DD
V
DD
0.1µF
V
S
CTRL
RFx
RFC
GND
R
L
50Ω
V
OUT
03335-009
Figure 18. Switch Timing: tON, tOFF
V
CTRL
V
OUT
50% 50%
90% 90% 10%
10%
t
FALL
t
RISE
V
DD
V
DD
0.1µF
V
S
CTRL
RFx
RFC
GND
R
L
50Ω
V
OUT
03335-010
Figure 19. Switch
V
S
NETWORK
ANALYZER
V
CTRL
OFF ISOLATION = 20log
V
OUT
V
S
V
DD
0.1µF
V
DD
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-011
Figure 20. Off Isolation
V
S
NETWORK
ANALYZER
V
CTRL
INSERTION LOSS = 20log
V
OUT
V
S
V
DD
V
DD
0.1µF
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-012
Figure 21. Insertion Loss
V
S
NETWORK
ANALYZER
V
CTRL
CROSSTALK = 20log
V
OUT
V
S
V
DD
0.1µF
DD
50Ω
V
OUT
R
L
50Ω
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
03335-013
Figure 22. Crosstalk
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
NC
NC
OSCILLOSCOPE
03335-014
Figure 23. Video Feedthrough
ADG918/ADG919
Rev. C | Page 12 of 16
SPECTRUM
ANALYZER
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
COMBINER
RF
SOURCE
RF
SOURCE
03335-015
Figure 24. IP3
SPECTRUM
ANALYZER
V
CTRL
V
DD
0.1µF
V
DD
ADG919
RF2
RF1
CTRL
RFC
GND
50Ω
RF
SOURCE
V
S
03335-016
Figure 25. P-1 dB
ADG918/ADG919
Rev. C | Page 13 of 16
APPLICATIONS INFORMATION
The ADG918/ADG919 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications. The most obvious application
is in a transmit/receive block, as shown in the wireless metering
block diagram in Figure 26.
Other applications include switching between high frequency
filters, an ASK generator, an FSK generator, and an antenna
diversity switch in many tuner modules.
ABSORPTIVE VS. REFLECTIVE SWITCH
The ADG918 is an absorptive (matched) switch with 50 Ω
terminated shunt legs, and the ADG919 is a reflective switch
with 0 Ω terminated shunts to ground. The ADG918 absorptive
switch has a good VSWR on each port, regardless of the switch
mode. An absorptive switch should be used when there is a need
for a good VSWR that is looking into the port but not passing
the through signal to the common port. The ADG918 is there-
fore ideal for applications that require minimum reflections
back to the RF source. It also ensures that the maximum power
is transferred to the load.
The ADG919 reflective switch is suitable for applications where
high off port VSWR does not matter and the switch has some
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
WIRELESS METERING
The ADG918 can be used in wireless metering applications. It
can be used in conjunction with the ADF7020 transceiver IC for
a utility metering transceiver application, providing the
required isolation between the transmit and receive signals.
The SPDT configuration isolates the high frequency receive
signal from the high frequency transmit.
LNA
ANTENNA
TX/RX SWITCH PA
ADG918
03335-005
Figure 26. Wireless Metering
TUNER MODULES
The ADG918 can be used in a tuner module to switch between
the cable TV input and the off-air antenna. This part is also
ideal for use as an antenna diversity switch, switching different
antenna to the tuner.
VGA
ANTENNA
CABLE
ADG918/
ADG919
TUNER
03335-006
Figure 27. Tuner Modules
FILTER SELECTION
The ADG919 can be used as a 2:1 demultiplex to switch high
frequency signals between different filters and also to multiplex
the signal to the output.
ADG919ADG919
RF1
RF2
RF1
RF2 RFC
RF
OUT
RF
IN
RFC
03335-007
Figure 28. Filter Selection
ADG918/ADG919
Rev. C | Page 14 of 16
ADG9xx EVALUATION BOARD
The ADG9xx evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
In addition to the evaluation board, the user requires only a
power supply and a network analyzer. An application note is
available with the evaluation board and gives complete
information about operating the evaluation board.
The RFC port (see Figure 29) is connected through a 50 Ω
transmission line to the top left SMA connector J1. RF1 and
RF2 are connected through 50 Ω transmission lines to the top
two SMA connectors, J2 and J3 respectively. A through trans-
mission line connects J4 and J5 and is used to estimate the loss
of the PCB over the environmental conditions being evaluated.
The board is constructed of a 4-layer, FR4 material with a
dielectric constant of 4.3 and an overall thickness of 0.062
inches. Two ground layers with grounded planes provide
ground for the RF transmission lines. The transmission lines
were designed using a coplanar waveguide with ground plane
model using a trace width of 0.052 inches, a clearance to ground
plane of 0.030 inches, a dielectric thickness of 0.029 inches, and
a metal thickness of 0.014 inches.
03335-008
Figure 29. ADG9xx Evaluation Board Top View
ADG918/ADG919
Rev. C | Page 15 of 16
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.80
0.60
0.40
8°
0°
4
8
1
5
PIN 1
0.65 BSC
SEATING
PLANE
0.38
0.22
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.08
3.20
3.00
2.80
5.15
4.90
4.65
0.15
0.00
0.95
0.85
0.75
Figure 30. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
EXPOSED PAD IS CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMA L CAPABILITY IT
IS RECOMMENDED TH AT THE PAD BE SOLDERED
TO THE GROUND PLANE.
061507-B
1
EXPOSED
PA D
(BOTTOM VIEW)
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP
VIEW
12° MAX 0.70 MAX
0.65 TYP
0.90 MAX
0.85 NOM 0.05 MAX
0.01 NOM
0.20 REF
1.89
1.74
1.59
4
1.60
1.45
1.30
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
58
PIN 1
INDICATOR
S
EATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
Figure 31. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm x 3 mm Body, Very Thin, Dual Lead
(CP-8-2)
Dimensions shown in millimeters
ADG918/ADG919
Rev. C | Page 16 of 16
ORDERING GUIDE
Model
Temperature
Range Package Description Package Option Branding
ADG918BRM –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B
ADG918BRM-500RL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B
ADG918BRM-REEL –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B
ADG918BRM-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B
ADG918BRMZ1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B#
ADG918BRMZ-500RL71
–40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B#
ADG918BRMZ-REEL1
–40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B#
ADG918BRMZ-REEL71
–40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W4B#
ADG918BCP-500RL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B
ADG918BCP-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B
ADG918BCPZ-500RL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B#
ADG918BCPZ-REEL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W4B#
ADG919BRM –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B
ADG919BRM-500RL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B
ADG919BRM-REEL –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B
ADG919BRM-REEL7 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 W5B
ADG919BRMZ1 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X
ADG919BRMZ-REEL1
–40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X
ADG919BRMZ-REEL71 –40°C to +85°C 8-Lead Mini Small Outline Package (MSOP) RM-8 S1X
ADG919BCP-500RL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W5B
ADG919BCP-REEL7 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 W5B
ADG919BCPZ-REEL71 –40°C to +85°C 8-Lead Lead Frame Chip Scale Package (LFCSP_VD) CP-8-2 S1X
EVAL-ADG918EBZ1
Evaluation Board
EVAL-ADG919EBZ1
Evaluation Board
1 Z = RoHS Compliant Part, # denotes RoHS compliant product, may be top or bottom marked.
©2003–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D03335-0-9/08(C)