Data Sheet
August 7, 2012
EHHD006A0B S e ries (Eighth-Brick) DC-DC Converter Power Modules
18 - 75Vdc Input; 12V/6Adc Output
*
UL
is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher El ektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤
IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS09-012 ver. 1.04
PDF name: EHHD006A0B
.pdf
Hammerhead S eri es™
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Flat and high-efficiency curve
Industr y standard, DOSA compliant footprint
57.9mm x 22.8mm x 7.6mm
(2.28 in x 0.9 in x 0.30 in)
Low-pr ofile heig ht and reduced component skyline
Ultra-wide input voltage range: 18-75 Vdc
Tightly regulated output
Remote sense
Output voltage adjust: 90% to 110% of VO,nom
Constant switching frequency
Positive remote On/Off logic
Input under/ ov ervoltage protection
Output overcurrent and overvoltage protection
Overtemperature protecti on
No reverse current during output shutdown
Wide operating temperature range (-40°C to 85°C)
Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module
UL*Recognized to UL60950-1, CAN/CSA† C22.2
No.60950-1, a nd EN60950-1(
VDE
‡ 0805-1)
Licensed
CE mark me et s 200 6/95/E C di r ectiv e§
M eets the voltage and curre nt r equir eme nts for
ETSI 300-132-2 and c omplies with and licensed for
basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE stan dard s
ISO**9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed Power Architectures
Wireless Networks
Acce ss and Optical Network Equipment
Industrial Equipment
Options
Negative Remote On/Off logic (preferred)
Overcurrent/Overtemperature/Overvoltage
protections (Auto-restart) (preferred)
Heat plate version (-H)
Surface Mount version (-S)
Description
The EHHD006A0B [Hammerhead™] Series, eighth-brick, low-height power modules are isolated DC-DC converters
that provide a single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75Vdc. The
EHHD006A0B provid es 12Vdc nominal output voltage rated for 6Adc output current. The module incorporates Lineage
Power’s vast heritage for reliability and quality, while also using the latest in technology and component and process
standardization to achieve highly competitive cost. The open frame module construction, available in both surface
mount and through-hole packaging, enables designers to develop cost and space efficient solutions. The module
achieves typical full load efficiency greater than 92% at VIN=24Vdc and greater than 90% at VIN=48Vdc. Standard
features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to
achieve higher output current in high temperature applications.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operat i onal (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations sect ion)
Storage Temperature All Tstg -55 125 °C
I/O Isolati on Voltage (100% fact ory Hi-Pot tested) All
2250 Vdc
Electri cal Sp ec i fications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Maximum Input Current All IIN 4.4 5.0 Adc
(VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max)
Input No Load Current All IIN,No load 80 mA
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current All IIN,stand-by 5 8 mA
(VIN = 48V, module disabled)
Inrush Transient All I2t 0.5 A2s
Input Reflected Rippl e Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN , min to VIN, max,
IO= IOmax ; See test configuration section) All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included;
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agenci es
require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum DC input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 3
Electri cal Sp ec i fi cat i ons (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Volt age Set-point All VO, set 11.80 12.00 12.24 Vdc
VIN= 24V to 48V IO=IO, max, TA=25°C)
Output Voltage
All VO 11.64 12.36 Vdc
(Overall operating input voltage, resistive load, and
temperature condit i ons until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
All
±0.2
% VO, se t
Load (IO=IO, min to IO, max)
All
±0.2
% VO, se t
Temperature (Tref=TA, min to TA, max)
All
±1.0
% VO, set
Output Ripple and Noise
(VIN=VIN, m in t o VIN, max, IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth) All
25 50 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidt h) All
75 200 mVpk-pk
External Capacitance
All
C
O, max
0
2,000
μF
Output Current All IO 0 6 Adc
Output Current Limit Inc eption (Hicc up Mode ) All IO, lim 6.6 7.8 9.0 Adc
(VO= 90% of VO , set)
Output Short-Circuit Current
All IO, s/c 5 Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN=24V, TA=25°C, IO=3A, VO = 12V All η 90.0 %
VIN=24V, TA=25°C, IO=6A, VO = 12V All η 92.5 %
VIN=48V, TA=25°C, IO=3A, VO = 12V All η 90.0 %
VIN=48V, TA=25°C, IO=6A, VO = 12V All η 90.5 %
Switching Frequency All fsw 280 kHz
Dynamic Load Response
(dI
o
/dt=0.1A/µs; V
IN
= 24V or 48V; T
A
=25°C;
CO>100μF)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk 3 % VO, se t
Settling Time (Vo<10% peak deviation)
All ts 200 µs
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitanc e All Ciso 1000 pF
Isolation Resist ance All Riso 100 MΩ
I/O Isolati on Voltage (100% fact ory Hi-pot test ed) All All 2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliabi l i t y based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All FIT 381.7 109/Hours
All MTBF 2,619,994 Hours
Weight (Open Frame) All 19 (0.7) g (oz.)
Weight (with Heat Plate) All 30 (1.1) g (oz.)
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On /Off Signal Interfa ce
(V
IN
=V
IN, min
to V
IN, max
; open collector or equivalent,
Signal referenced t o VIN- terminal)
Negative Logic: devic e code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage – (Typ = Open Collector) All Von/off 2.5 6.7 Vdc
Logic High maximum allowable leakage current All Ion/off 25 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25
o
C)
Case 1: Input power is applied for at least 1 second
then the On/O ff input is se t from OFF to ON
(Tdelay = On/O ff pin transition until VO = 10% of VO, set) All Tdelay ― 12 ― msec
Case 2: On/Off input is set to Logic Low (Module
ON) then input power is applied
(Tdelay = VIN reaches VIN, min until Vo=10% of VO,set) All Tdelay ― 25 35 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise ― 15 25 msec
Output Voltage Overshoot – Startup All ― 3 % VO, se t
IO= IO, max; VIN=VIN, m in t o V IN, max, TA = 25 oC
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment Range All 90 110 % VO, set
Output Overvoltage Protection
All VO, limit 13.8
16.5 Vdc
Overtemperature Protection – Hiccup Auto Restart
Open
frame Tref 135 OC
Heat Plate
Heat
Plate
Tref 120 OC
Input Undervolt age Lock out All VUVLO
Turn-on Threshold 17 18 Vdc
Turn-off Threshold 14 15.5 16 Vdc
Hysteresis 1 2.0 Vdc
Input Overvoltage Lockout All VOVLO
Turn-on Threshold 76 77
Vdc
Turn-off Threshold
79 81 Vdc
Hysteresis 1 2 Vdc
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 5
Characteristic Curves
The following figures provide typical characteristics for the EHHD006A0B (12.0V, 6A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.
EFFICIENCY, η (%)
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (1A/div)
OUTPUT CURRENT, I
O
(A)
TIME , t ( 200µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=48V, CO>100μF.
OUTPUT VOLTAGE
VO (V) (100mV/div)
OUTPUT VOLTAGE On/Off
VOLTAGE
VO (V) (5V/div) VOn/Off (V) (5V/div)
TIME , t ( 2µs/div)
TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (I
o
= I
o,max
).
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = 24V or 48V, Io =
Io,max).
OUTPUT VOLTAGE OUTPUT CURRENT
VO (V) (200mV/div) Io(A) (1A/div)
OU TP UT VOLTAGE INPUT
VOLTAGE
VO (V) (5V/div) VIN (V) (20V/div)
TIME , t ( 200µs/div)
TIME , t ( 10ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=24V, CO>100μF.
Figure 6. Typical Start-up Using Input Voltage (V
IN
=
24V, Io = Io,max).
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 6
Test Configurations
TO OSCILLOSCOPE
CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1Ω
@ 20°C 100kHz
33-100μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (L
TEST
) of 12μH. Capacitor C
S
offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
R
LOAD
R
contact
R
distribution
R
contact
R
distribution
R
contact
R
contact
R
distribution
R
distribution
V
IN
V
O
NOTE: All voltage measurem ents to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
η
=
V
O
.
I
O
V
IN
.
I
IN
x
100
%
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low AC
impedance source. Highly inductive sour ce
impedance can affect the stability of the power
module. For the test configuration in Figure 7, a 33-
100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounting close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. , UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the AC mains.
One VIN pin and one VOUT pin are to be
grounded, or both the input and output pins are
to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module) as required by the safety
agencies to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are ra ted 94V-0 or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the app licable requirements of basic
insulation between secondary DC mains distribution
input (classified as TNV-2 in Europe) and une ar the d
SELV outputs.
The input to these units is to be provided with a
maximum 10 A fast-acting fuse in the ungrounded
lead.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 7
Feature Descriptions
Remote On/Off
Two remote On/Off options are available. Positive
logic turns the module on during a logic high voltage
on the On/Off pin and off during a logic low. Negative
logic remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
ON/OFF
Vin+
Vin-
I
on/off
V
on/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the On/Off
terminal and t he VIN(-) term ina l (see Figur e 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA and the sw itc h should ma inta in a
logic low level while sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 5.6V and the maximum
allowable leakage current at Von/off = 5.6V is 25μA.
If not using the remote On/Off feature:
For positive logic, leave the On/Off pin open.
For negative logi c, shor t the On/Off pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output volta ge sen se range giv en in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (maximum rated power = Vo,set x Io,max).
Figure 11. Circuit Configuration for Remote
S
ense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point,
Tref, exceeds 135 OC (Figure 13, typical) or 120 OC
(Figure 14, typical), but t he th e rmal shu tdown is not
intended as a guarantee that the unit will survive
temperatur es bey ond its rating. The module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output overvoltage protection scheme of the
modules has an independent overvoltage loop to
prevent single point of failure. This protection feature
latches in the event of overvoltage across the output.
Cycling the On/Off pin or input voltage resets the
latching prot ect ion feat ur e. If the auto-re star t opti on
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitr y and ca n endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, it will latch off
following the overcurrent condition. The module ca n
be restarted by cycling the DC input power for at least
V
O
(+)
SENSE(+)
SENSE(–)
V
O
(–)
V
I
(+)
V
I
(-)
I
O
LOAD
CONTACTAND
DISTRIBUTION LOSSES
SUPPLYI
I
CONTACT
RESISTANCE
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 8
one second or by toggling the r emot e On/Off signal
for at least one second.
If the unit is configured with the auto-restart option (4),
it will remain in the hiccup mode as long as the
overcurrent condition exists. Once the output current
is brought back into its specified range, the unit will
operate normally. The average output current during
hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased from the default value. This is
accomplished by connecting an external resistor
between the TRIM pin and either the VO(+) pin or the
VO(-) pin.
V
O
(+)
V
O
TRIM
V
O
(-)
R
trim-down
LOAD
V
IN
(+)
ON/OFF
V
IN
(-)
R
trim-up
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
ΚΩ
−
∆
=
−
22.10
%
511
downtrim
R
Where
100
0.12
0.12
%×
−
=∆ V
VV
desired
For example, to trim-down the output voltage of the
module by 6% to 11.28V, Rtrim-down is calculated as
follows:
6% =∆
ΚΩ
−=
−
22.10
6
511
downtrim
R
ΚΩ=
−
9.74
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
ΚΩ
−
∆
−
∆×
∆+××
=
−
22.10
%
511
%225.1 %)100(0.1211.5
uptrim
R
Where
100
0.12 0.12
%×
−
=∆
desired
V
For example, to trim-up the output volt age of the
module by 4 % to 12.48V, Rtrim-up is calcula ted is as
follows:
4% =∆
ΚΩ
−−
×
+××
=
−22.10
4
511
4225.1 )4100(0.1211.5
uptrim
R
Ω=
−MR uptrim 16.1
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensatio n and output voltage
set-point adjust men t trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (maximum rated
power = VO,set x IO,max).
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Tref, used in the
specifications for open frame modules is shown in
Figure 13. For reliable operation, these temperatures
should not exceed 125oC.
Figure 13. Tref Temper atu re Meas ur ement
Locations for Open Frame Module.
The thermal reference point , Tref, u sed in the
specifications for modules with a heat plate is shown
in Figure 14. For relia ble oper at ion , this temperature
should not exceed 115 OC.
Figure 14. Tref Temperatur e Measu rement
Location for Module with Heat plate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 2m/s (400 ft./min)
forced airflow are shown in Figures 15 - 18.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(oC)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(-) to Vout(+); VIN =48.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(oC)
Figure 16. Output Current Derating for the Module
with Heat plate; Airflow in the Transverse
Direction from Vout(-) to Vout(+);VIN =48V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPE RATURE, TA (
o
C
)
Figure 17. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(-) to Vout(+); VIN =24V.
AIRFLOW
AIRFLOW
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 10
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (
o
C
)
Figure 18. Output Current Derating for the Module
with Heat plate; Airflow in the Transverse
Direction from Vout(-) to Vout(+);VIN =24V.
Please refer to the Application Note ‘Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules’ for a detailed discussion of
thermal aspects including maximum device
temperatures.
Heat Transfer via Conduction
The module can also be used in a sealed
environment with cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 19. This capability is
achieved by insuring the top side component skyline
profile achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
COLD PL ATE TEMEPERATURE, T
C
(oC)
Figure 20. Derated Output Current versus Cold
Wall Temperature with Local Ambient
Temperature Around Module at 85C; VIN =24V or
48V.
Through-Hole Solde r i ng Information
Lead-Free Soldering
The EHHD006A0Bxx RoHS-compliant through-hole
products use SAC (Sn/Ag/Cu) Pb-free solder and
RoHS-compliant compon ents . They are designed to
be processed through single or dual wave soldering
machines. The pins have a RoHS-compliant finish
that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of
3°C/s is suggested. The wave preheat process
should be such that the temperature of the power
module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C , w hile the
Pb-free solder pot is 270°C max.
Paste-in-Hole Soldering
The EHHD006A0Bxx module is compatible with
reflow paste-in-hole solder ing proce sses shown in
Figures 23-25. Since the EHHD006A0BxxZ module is
not packaged per J-STD-033 Rev.A, the module must
be baked prior to the paste-in-hole reflow process.
EHHD006A0Bxx-HZ modules are not compatible with
paste-in-hole reflow soldering. Please contact your
Lineage Power Sales Representative for further
information.
Surface Mount Information
MSL Rating
The EHHD006A0B-SZ module has a MSL rating of
2a.
Storage a n d Handling
The recommended storage environment and handling
procedures for moisture-s en sit iv e surf ace mount
packages is detai led in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are provided for the
EHHD006A0Bxx-SZ modules. These sealed
packages should not be broken until time of use.
Once the original package is broken, the floor life of
the product at conditions of ≤ 30°C and 60% relative
humidity varies according to the MSL rating (see J-
STD-033A). The shelf life for dry packed SMT
packages is a minimum of 12 months from the bag
seal date, when stored at the following conditions: <
40° C, < 90% relative humidity.
Pick and Place
The EHHD006A0Bxx-S modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, seri al
number and the location of manufacture.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 11
Surface Mount Information (continued)
Figure 21. Pick and Place Location.
Nozzle Rec o m m endations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip sty le, va cuu m pres sure and pla ce ment
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spa cin g, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Reflow Soldering Information
The surface mountable modules in the
EHHD006A0Bxx-S family use our newest SMT
technology called “Column Pin” (CP) connectors.
Figure 22 shows the new CP connector before and
after reflow soldering onto the end-board assembly.
The CP is constructed from a solid copper pin with an
integral solder ball atta che d, which is composed o f
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu
(SAC) solder for –Z codes.
Figure 22. Column Pin Connector Before and After
Reflow Soldering.
The CP connector design is able to compensate for
large amount s of planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183°C (Sn/Pb sold er ) or 217-218°C (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convec tion , IR (radian t
infrared), or a combination of convection/IR. The
following ins truc tion s mus t be observed w hen SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
Tin Lead Soldering
The EHHD006A0Bxx-S power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following ins truc tion s mus t be observed w hen
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process,
peak reflow temperatures are limited to less than
235°C. Typically, the eutectic solder melts at 183°C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable solder i ng, the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The –Z version of the EHHD006A0B modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering pro ces s. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adver sely affect
long-term reliability.
REFLOW TEMP (°C)
REFLOW TIME (S)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 12
Surface Mount Information (continued)
MAX TEMP SOLDER (°C)
Figure 24. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) proces s
Pb-free Reflow Profile
Power systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickn es s of the package (t abl e 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.
Figure 25. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solde r Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropr i ate sol de r ing, cle ani ng and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Ref low Temp ( °C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 13
EMC Considerati ons
The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022
Cla ss B.
Figure 26. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
VIN = 48V, I o = Io,max, L Line
VIN = 48V, I o = Io,max, N Line
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 14
Mechanical O utl i ne for Through-Hole Modul e
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
*Top side label includes Lineage Power name, product designation and date code.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 15
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 16
Mechanical O utl i ne for Through-Hole Mo dule with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 17
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
SMT Recommended Pa d Layout (Component Side View)
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH-HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH-HOLE DIAMETER
TH Recommende d Pad Layout (Component S i de View)
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
LINEAGE POWER 18
Packaging Details
The surface mount versions of the EHHD006A0B (suffix
–S) are supplied as standard in the plastic trays shown
in Figure 27.
Tray Specifi catio n
Material Antistatic coated PVC
Max surface resistivity 1012Ω/sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays
+ 1 empty top tray)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
EHHD006A0B (suffix –S) surface mount module
contains 4 full trays plus one empty hold-down tray
giving a total number of 48 power modules.
Figure 27. Surface Mount Packaging Tray
Data Sheet
August 7, 2012
EHHD006A0B Series Eighth -B ri ck Powe r M od u les
18 - 75Vdc Input; 12V/6Adc Output
Document No: DS09-012 ver. 1.04
PDF name : EHHD006A0B.pdf
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage
Output
Voltage
Output
Current
On/Off
Logic
Connector
Type
Comcodes
EHHD006A0B41Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109159364
EHHD006A0B41-HZ
24/48V (18-75Vdc)
12.0V
6A
Negative
Through-hole
CC109167755
EHHD006A0B841-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109171443
EHHD006A0B41-SZ 24/48V (18-75Vdc) 12.0V 6A Negative Surface mount CC109167763
Table 2. Device Coding Scheme and Options
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Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-888-LINEAGE(546-3243)
(Outside U.S.A.: +1-972-244-WATT(9288))
www.lineagepower.com
e-mail: techsupport1@lineagepower.com
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Tel: +86.021.54279977*808
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Tel: +49.89.878067-280
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Tel: +91.80.28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product(s) or information.
Lineage Power DC -DC products are protected under various patents. Information on these patents is available at www.lineagepower.com/patents.
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