GS1AG
THRU
GS1MG
Features
• For Surface Mount Applications
• Extremely Low Thermal Resistance
• Easy Pick And Place
• High Temp Soldering: 260°C for 10 Seconds At Terminals
Maximum Ratings
• Operating Temperature: -55°C to +150°C
• Storage Temperature: -55°C to +150°C
• Maximum Thermal Resistance; 15 °C/W Junction To Lead
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
GS1AGGS1A 50V 35V 50V
GS1BGGS1B 100V 70V 100V
GS1DGGS1D 200V 140V 200V
GS1GGGS1G 400V 280V 400V
GS1JGGS1J 600V 420V 600V
GS1KGGS1K 800V 560V 800V
GS1MGGS1M 1000V 700V 1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
current
IF(AV) 1.0A TJ = 75°C
Peak Forward Surge
Current
IFSM 30A 8.3ms, half sine,
Maximum
Instantaneous
Forward Voltage
VF1.1V
IFM = 1.0A;
TJ = 25°C*
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
IR10µA
50µA
TJ = 25°C
TJ = 125°C
Typical Junction
Capacitance
CJ15pF Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 2%
DO-214AC
(HSMA) (High Profile)
H
J
E
F
G
A
B
D
C
Cathode Band
0.070”
0.090”
0.085”
SUGGESTED SOLDER
PAD LAYOUT
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A .078 .116 1.98 2.95
B .067 .089 1.70 2.25
C .002 .008 .05 .20
D --- .02 --- .51
E .035 .055 .89 1.40
F .065 .0961.65 2.45
G .205 .224 5.21 5.69
H .160 .180 4.06 4.57
J .100 .112 2.57 2.84
omponents
20736 Marilla Street Chatsworth
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MCC
1.0 Amp Glass
Passivated Rectifier
50 to 1000 Volts
TM
Micro Commercial Components
www.mccsemi.com
1 of 4
Revision: 3 2008/02/01
• Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
x Case MAterial : Molded Palstic. UL Flammability
Classification Rating 94V-0 and MSL rating 1
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.