Product Folder Sample & Buy Support & Community Tools & Software Technical Documents bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 bq27421-G1 System-Side Impedance TrackTM Fuel Gauge With Integrated Sense Resistor 1 Features 3 Description * The Texas Instruments bq27421-G1 fuel gauge is a minimally configured microcontroller peripheral that provides system-side fuel gauging for single-cell LiIon batteries. The device requires very little user configuration and system microcontroller firmware development. 1 * * Single-Cell Li-Ion Battery Fuel Gauge - Resides on System Board - Supports Embedded or Removable Batteries - Powered Directly from Battery with Integrated LDO - Low-Value Integrated Sense Resistor (7 m, Typical) Easy-to-Configure Fuel Gauging Based on Patented Impedance TrackTM Technology - Reports Remaining Capacity and State-ofCharge (SOC) with Smoothing Filter - Automatically Adjusts for Battery Aging, SelfDischarge, Temperature, and Rate Changes - Battery State-of-Health (Aging) Estimation Microcontroller Peripheral Supports: - 400-kHz I2C Serial Interface - Configurable SOC Interrupt or Battery Low Digital Output Warning - Internal Temperature Sensor or Host-Reported Temperature The bq27421-G1 fuel gauge uses the patented Impedance TrackTM algorithm for fuel gauging, and provides information such as remaining battery capacity (mAh), state-of-charge (%), and battery voltage (mV). Battery fuel gauging with the bq27421-G1 fuel gauge requires connections only to PACK+ (P+) and PACK- (P-) for a removable battery pack or embedded battery circuit. The tiny 9-ball, 1.62 mm x 1.58 mm, 0.5-mm pitch NanoFreeTM chip scale package (DSBGA) is ideal for space-constrained applications. Device Information(1) PART NUMBER PACKAGE bq27421-G1 YZF (9) BODY SIZE (NOM) 1.62 mm x 1.58 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 2 Applications * * * * Smartphones, Feature Phones, and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players Simplified Schematic I2C Bus SRX SCL Coulomb Counter SDA Integrated Sense Resistor CPU GPOUT BIN VSYS BatteryPack BAT ADC VDD 1.8 V LDO VSS PACKP 047 . F Li-Ion Cell T Protection IC PACKN NFET NFET 1 F 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device Comparison Table..................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 Absolute Maximum Ratings ...................................... 4 ESD Ratings ............................................................ 4 Recommended Operating Conditions....................... 4 Thermal Information .................................................. 5 Supply Current .......................................................... 5 Digital Input and Output DC Characteristics ............. 5 LDO Regulator, Wake-Up, and Auto-Shutdown DC Characteristics ........................................................... 5 7.8 ADC (Temperature and Cell Measurement) Characteristics ........................................................... 6 7.9 Integrating ADC (Coulomb Counter) Characteristics ................................................................................... 6 7.10 Integrated Sense Resistor Characteristics, -40C to 85C .......................................................................... 6 7.11 Integrated Sense Resistor Characteristics, -40C to 70C .......................................................................... 6 7.12 I2C-Compatible Interface Communication Timing Characteristics ........................................................... 6 7.13 Typical Characteristics ............................................ 8 8 Detailed Description .............................................. 9 8.1 8.2 8.3 8.4 8.5 9 Overview ................................................................... 9 Functional Block Diagram ......................................... 9 Feature Description................................................... 9 Device Functional Modes........................................ 10 Programming........................................................... 10 Applications and Implementation ...................... 14 9.1 Application Information............................................ 14 9.2 Typical Applications ................................................ 15 10 Power Supply Recommendation ....................... 18 10.1 Power Supply Decoupling ..................................... 18 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 19 12 Device and Documentation Support ................. 20 12.1 12.2 12.3 12.4 12.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 20 20 20 20 20 13 Mechanical, Packaging, and Orderable Information ........................................................... 20 4 Revision History Changes from Revision D (July 2015) to Revision E Page * Changed Pin Configuration and Functions............................................................................................................................. 3 * Changed Mechanical, Packaging, and Orderable Information ............................................................................................ 20 Changes from Revision C (December 2014) to Revision D Page * Changed the Integrated Sense Resistor Characteristics, -40C to 85C specifications ...................................................... 6 * Changed the Integrated LDO Capacitor section ................................................................................................................. 16 * Added Community Resources ............................................................................................................................................. 20 Changes from Revision B (November 2014) to Revision C Page * Changed simplified schematic by adding 1-F capacitor ....................................................................................................... 1 * Added description for connecting a 1-F capacitor ................................................................................................................ 3 * Added information for connecting GPOUT ............................................................................................................................. 3 * Changed connection description for BAT pin ....................................................................................................................... 18 * Changed "recommend" to "required".................................................................................................................................... 19 2 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 5 Device Comparison Table PART NUMBER BATTERY TYPE bq27421YZFR-G1A LiCoO2 (4.2 V maximum charge) 0x128 LiCoO2 (4.3 V to 4.35 V maximum charge) 0x312 LiCoO2 (4.3 V to 4.4 V maximum charge) 0x3142 bq27421YZFT-G1A bq27421YZFR-G1B bq27421YZFT-G1B bq27421YZFR-G1D bq27421YZFT-G1D (1) (2) CHEM_ID (1) PACKAGE (2) CSP-9 COMMUNICATION FORMAT I2C See the CHEM_ID subcommand to confirm the battery chemistry type. For the most current package and ordering information see the Package Option Addendum at the end of this document or see the TI website at www.ti.com. 6 Pin Configuration and Functions (TOP VIEW) (BOTTOM VIEW) C3 C2 C1 C1 C2 C3 B3 B2 B1 B1 B2 B3 A3 A2 A1 A1 A2 A3 Pin A1 Index Area Pin Functions PIN NAME BAT BIN NUMBER C3 B1 TYPE (1) DESCRIPTION PI, AI LDO regulator input, battery voltage input, and coulomb counter input typically connected to the PACK+ terminal. Connect a capacitor (1 F) between BAT and VSS. Place the capacitor close to the gauge. DI Battery insertion detection input. If Operation Configuration bit [BIE] = 1 (default), a logic low on the pin is detected as battery insertion. For a removable pack, the BIN pin can be connected to VSS through a pulldown resistor on the pack, typically the 10-k thermistor; the system board should use a 1.8-M pullup resistor to VDD to ensure the BIN pin is high when a battery is removed. If the battery is embedded in the system, it is recommended to leave [BIE] = 1 and use a 10-k pulldown resistor from BIN to VSS. If [BIE] = 0, then the host must inform the gauge of battery insertion and removal with the BAT_INSERT and BAT_REMOVE subcommands. A 10-k pulldown resistor should be placed between BIN and VSS, even if this pin is unused. NOTE: The BIN pin must not be shorted directly to VCC or VSS and any pullup resistor on the BIN pin must be connected only to VDD and not an external voltage rail. This open-drain output can be configured to indicate BAT_LOW when the Operation Configuration [BATLOWEN] bit is set. By default [BATLOWEN] is cleared and this pin performs an interrupt function (SOC_INT) by pulsing for specific events, such as a change in State of Charge. Signal polarity for these functions is controlled by the [GPIOPOL] configuration bit. This pin should not be left floating, even if unused, so a 10-k pullup resistor is recommended. If the device is in SHUTDOWN mode, then toggling GPOUT will make the gauge exit SHUTDOWN. Therefore, it is recommended to connect GPOUT to a GPIO of the host MCU. GPOUT A1 DO SCL A3 DIO SDA A2 DIO SRX C2 AI (1) Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external 10-k pullup resistors (typical) for each pin. If the external pullup resistors will be disconnected from these pins during normal operation, it is recommended to use external 1-M pulldown resistors to VSS at each pin to avoid floating inputs. Integrated high-side sense resistor and coulomb counter input typically connected to system power rail VSYS. IO = Digital input-output, AI = Analog input, P = Power connection Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 3 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com Pin Functions (continued) PIN NAME VDD NUMBER B3 VSS B2, C1 TYPE (1) DESCRIPTION PO 1.8-V Regulator Output. Decouple with 0.47-F ceramic capacitor to VSS. This pin is not intended to provide power for other devices in the system. PI Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via under the device package. It is recommended to route the center pin B2 to the corner pin C1 using a top-layer metal trace on the board. Then route the corner pin C1 to the board ground plane. 7 Specifications 7.1 Absolute Maximum Ratings Over-operating free-air temperature range (unless otherwise noted) (1) MIN MAX VBAT BAT pin input voltage range -0.3 6 V VSRX SRX pin input voltage range VBAT - 0.3 VBAT + 0.3 V VDD VDD pin supply voltage range (LDO output) -0.3 2 V VIOD Open-drain IO pins (SDA, SCL, GPOUT) -0.3 6 V VIOPP Push-pull IO pins (BIN) -0.3 VDD + 0.3 V TA Operating free-air temperature range -40 85 C Tstg Storage temperature -65 150 C (1) UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 1500 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) UNIT V 250 JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions TA = 30C and VREGIN = VBAT = 3.6V (unless otherwise noted) MIN CBAT (1) External input capacitor for internal LDO between BAT and VSS CLDO18 (1) External output capacitor for internal LDO between VDD and VSS VPU (1) External pull-up voltage for opendrain pins (SDA, SCL, GPOUT) (1) 4 Nominal capacitor values specified. A 5% ceramic X5R-type capacitor located close to the device is recommended. 1.62 NOM MAX UNIT 0.1 F 0.47 F 3.6 V Specified by design. Not production tested. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 7.4 Thermal Information bq27421-G1 THERMAL METRIC (1) YZF (DSBGA) UNIT 9 PINS RJA Junction-to-ambient thermal resistance 107.8 C/W RJCtop RJB Junction-to-case (top) thermal resistance 0.7 C/W Junction-to-board thermal resistance 60.4 C/W JT Junction-to-top characterization parameter 3.5 C/W JB Junction-to-board characterization parameter 60.4 C/W RJCbot Junction-to-case (bottom) thermal resistance NA C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.5 Supply Current TA = 30C and VREGIN = VBAT = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ICC (1) NORMAL mode current ILOAD > Sleep Current (2) 93 A ISLP (1) SLEEP mode current ILOAD < Sleep Current (2) 21 A 9 A 0.6 A IHIB (1) ISD (1) (1) (2) (2) HIBERNATE mode current ILOAD < Hibernate Current SHUTDOWN mode current Fuel gauge in host commanded SHUTDOWN mode (LDO regulator output disabled) Specified by design. Not production tested. Wake Comparator Disabled. 7.6 Digital Input and Output DC Characteristics TA = -40C to 85C, typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS VIH(OD) Input voltage, high (2) VIL Input voltage, low (2) VOL Output voltage, low (2) External pullup resistor to VPU MIN TYP Output source current, high IOL(OD) Output sink current, low (2) CIN (1) Input capacitance (2) Ilkg Input leakage current (SCL, SDA, BIN) (2) (3) (3) 0.6 V 0.6 V 0.5 mA -3 mA 5 pF 0.1 Input leakage current (GPOUT) (1) (2) (3) UNIT V (3) IOH MAX VPU x 0.7 A 1 Specified by design. Not production tested. Open Drain pins: (SCL, SDA, GPOUT) Push-pull pin: (BIN) 7.7 LDO Regulator, Wake-Up, and Auto-Shutdown DC Characteristics TA = -40C to 85C, typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER VBAT BAT pin regulator input VDD Regulator output voltage UVLOIT+ VBAT undervoltage lockout LDO wake-up rising threshold UVLOIT- VBAT undervoltage lockout LDO auto-shutdown falling threshold (1) TEST CONDITIONS MIN TYP 2.45 MAX UNIT 4.5 V 1.8 V 2 V 1.95 V Specified by design. Not production tested. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 5 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 7.8 ADC (Temperature and Cell Measurement) Characteristics TA = -40C to 85C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER BAT pin voltage measurement range. VIN(BAT) tADC_CONV (1) TEST CONDITIONS MIN Voltage divider enabled. TYP 2.45 MAX 4.5 Conversion time Effective resolution UNIT V 125 ms 15 bits Specified by design. Not tested in production. 7.9 Integrating ADC (Coulomb Counter) Characteristics TA = -40C to 85C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VSR Input voltage range from BAT to SRX pins tSR_CONV Conversion time Single conversion 1 s Effective Resolution Single conversion 16 bits (1) BAT 25 mV Assured by design. Not tested in production. 7.10 Integrated Sense Resistor Characteristics, -40C to 85C TA = -40C to 85C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) PARAMETER SRXRES (1) Resistance of Integrated Sense Resistor from SRX to BAT TEST CONDITIONS MIN TYP TA = 30C 7 Long term RMS, average device utilization Recommended Sense Resistor input Peak RMS current, 10% device current utilization (3) ISRX (2) Peak pulsed current, 250 ms maximum, 1% device utilization, (3) (1) (2) (3) MAX UNIT m 2000 mA 2500 mA 3500 mA MAX UNIT Firmware compensation applied for temperature coefficient of resistor. Specified by design. Not tested in production. Device utilization is the long-term usage profile at a specific condition compared to the average condition. 7.11 Integrated Sense Resistor Characteristics, -40C to 70C TA = -40C to 70C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) PARAMETER SRXRES (1) Resistance of Integrated Sense Resistor from SRX to BAT TEST CONDITIONS MIN TYP TA = 30C 7 Long term RMS, average device utilization ISRX (2) Recommended Sense Resistor input Peak RMS current, 10% device current utilization (3) Peak pulsed current, 250 ms maximum, 1% device utilization, (3) (1) (2) (3) m 2000 mA 3500 mA 4500 mA MAX UNIT Firmware compensation applied for temperature coefficient of resistor. Specified by design. Not tested in production. Device utilization is the long-term usage profile at a specific condition compared to the average condition. 7.12 I2C-Compatible Interface Communication Timing Characteristics TA = -40C to 85C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) MIN NOM STANDARD Mode (100 kHz) (1) 6 Specified by design. Not production tested. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 I2C-Compatible Interface Communication Timing Characteristics (continued) TA = -40C to 85C; typical values at TA = 30C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1)(1) MIN NOM MAX UNIT 4 s 4.7 s 4 s 4.7 s 250 ns td(STA) Start to first falling edge of SCL tw(L) SCL pulse duration (low) tw(H) SCL pulse duration (high) tsu(STA) Setup for repeated start tsu(DAT) Data setup time Host drives SDA th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 4 s t(BUF) Bus free time between stop and start Includes Command Waiting Time tf SCL or SDA fall time tr SCL or SDA rise time fSCL Clock frequency s 66 (1) (1) (2) 300 ns 300 ns 100 kHz FAST Mode (400 kHz) td(STA) Start to first falling edge of SCL 600 ns tw(L) tw(H) SCL pulse duration (low) 1300 ns SCL pulse duration (high) 600 ns tsu(STA) Setup for repeated start 600 ns tsu(DAT) Data setup time Host drives SDA 100 ns th(DAT) Data hold time Host drives SDA tsu(STOP) Setup time for stop t(BUF) Bus free time between stop and start Includes Command Waiting Time tf SCL or SDA fall time tr SCL or SDA rise time fSCL Clock frequency (2) (2) 0 ns 600 ns 66 s (1) 300 (1) ns 300 ns 400 kHz If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (See and ) tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 1. I2C-Compatible Interface Timing Diagrams Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 7 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 7.13 Typical Characteristics 0.14 10 0.12 5 Temperature Accuracy Error(%) Voltage Accuracy Error (%) 0.1 0.08 0.06 0 -5 -10 0.04 0.02 -40 -20 0 20 40 Temperature (C) 60 80 100 -15 -40 -20 Figure 2. Voltage Accuracy 0 20 40 Temperature (C) 60 80 100 Figure 3. Temperature Accuracy 0 -0.1 Current Accuracy Error (%) -0.2 -0.3 -0.4 -0.5 -0.6 -40 -20 0 20 40 Temperature (C) 60 80 100 Figure 4. Current Accuracy 8 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 8 Detailed Description 8.1 Overview The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-ofcharge (SOC). NOTE The following formatting conventions are used in this document: Commands: italics with parentheses() and no breaking spaces, for example, Control() Data Flash: italics, bold, and breaking spaces, for example, Design Capacity Register bits and flags: italics with brackets [ ], for example, [TDA] Data Flash bits: italics, bold, and brackets [ ], for example, [LED1] Modes and states: ALL CAPITALS, for example, UNSEALED mode 8.2 Functional Block Diagram I2C Bus SRX SCL Coulomb Counter SDA Integrated Sense Resistor CPU GPOUT BIN VSYS BatteryPack BAT ADC VDD 1.8 V LDO PACKP 047 . F T Protection IC PACKN NFET NFET 1 F VSS Li-Ion Cell 8.3 Feature Description Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command(), are used to read and write information contained within the control and status registers, as well as its data locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, system manufacture, or end-equipment operation. The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance TrackTM algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge predictions that can achieve high-accuracy across a wide variety of operating conditions and over the lifetime of the battery. The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a smallvalue sense resistor. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The fuel gauge uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host processor can provide temperature data for the fuel gauge. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 9 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com Feature Description (continued) The bq27421-G1 Technical Reference Manual (SLUUAC5) provides more details. 8.4 Device Functional Modes To minimize power consumption, the fuel gauge has several power modes: INITIALIZATION, NORMAL, SLEEP, HIBERNATE, and SHUTDOWN. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. See the bq27421-G1 Technical Reference Manual (SLUUAC5) for more details. 8.5 Programming 8.5.1 Standard Data Commands The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 1. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. See the bq27421-G1 Technical Reference Manual (SLUUAC5) for more details. Table 1. Standard Commands COMMAND CODE NAME UNIT SEALED ACCESS Control() CNTL 0x00 and 0x01 NA RW Temperature() TEMP 0x02 and 0x03 0.1K RW Voltage() VOLT 0x04 and 0x05 mV R FLAGS 0x06 and 0x07 NA R NominalAvailableCapacity() 0x08 and 0x09 mAh R FullAvailableCapacity() 0x0A and 0x0B mAh R Flags() RemainingCapacity() RM 0x0C and 0x0D mAh R FullChargeCapacity() FCC 0x0E and 0x0F mAh R AverageCurrent() 0x10 and 0x11 mA R StandbyCurrent() 0x12 and 0x13 mA R MaxLoadCurrent() 0x14 and 0x15 mA R AveragePower() 0x18 and 0x19 mW R 0x1C and 0x1D % R 0x1E and 0x1F 0.1K R StateOfCharge() SOC InternalTemperature() StateOfHealth() 0x20 and 0x21 num/% R RemainingCapacityUnfiltered() 0x28 and 0x29 mAh R RemainingCapacityFiltered() 0x2A and 0x2B mAh R FullChargeCapacityUnfiltered() 0x2C and 0x2D mAh R FullChargeCapacityFiltered() 0x2E and 0x2F mAh R StateOfChargeUnfiltered() 0x30 and 0x31 % R 10 SOH Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 8.5.2 Control(): 0x00 and 0x01 Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control() command allows the system to control specific features of the fuel gauge during normal operation and additional features when the device is in different access modes, as described in Table 2. See the bq27421-G1 Technical Reference Manual (SLUUAC5) for more details. Table 2. Control() Subcommands CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes Reports the status of device DEVICE_TYPE 0x0001 Yes Reports the device type (0x0421) FW_VERSION 0x0002 Yes Reports the firmware version of the device DM_CODE 0x0004 Yes Reports the Data Memory Code number stored in NVM PREV_MACWRITE 0x0007 Yes Returns previous MAC command code CHEM_ID 0x0008 Yes Reports the chemical identifier of the battery profile used by the fuel gauge BAT_INSERT 0x000C Yes Forces the Flags() [BAT_DET] bit set when the OpConfig [BIE] bit is 0 BAT_REMOVE 0x000D Yes Forces the Flags() [BAT_DET] bit clear when the OpConfig [BIE] bit is 0 SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1 CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0 SET_CFGUPDATE 0x0013 No Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters CONFIG UPDATE mode SHUTDOWN_ENABLE 0x001B No Enables device SHUTDOWN mode SHUTDOWN 0x001C No Commands the device to enter SHUTDOWN mode SEALED 0x0020 No Places the device in SEALED ACCESS mode TOGGLE_GPOUT 0x0023 Yes Commands the device to toggle the GPOUT pin for 1 ms RESET 0x0041 No Performs a full device reset SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode EXIT_CFGUPDATE 0x0043 No Exits CONFIG UPDATE mode without an OCV measurement and without resimulating to update StateOfCharge() EXIT_RESIM 0x0044 No Exits CONFIG UPDATE mode without an OCV measurement and resimulates with the updated configuration data to update StateOfCharge() CNTL FUNCTION DESCRIPTION 8.5.3 Extended Data Commands Extended data commands offer additional functionality beyond the standard set of commands. They are used in the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words. The number of command bytes for a given extended command ranges in size from single to multiple bytes, as specified in Table 3. Table 3. Extended Commands Name Command Code Unit SEALED Access (1) (2) UNSEALED Access (1) (2) R OpConfig() 0x3A and 0x3B NA R DesignCapacity() 0x3C and 0x3D mAh R R 0x3E NA NA RW DataClass() (2) DataBlock() (2) 0x3F NA RW RW 0x40 through 0x5F NA R RW BlockDataCheckSum() 0x60 NA RW RW BlockDataControl() 0x61 NA NA RW 0x62 through 0x7F NA R R BlockData() Reserved (1) (2) SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01 In SEALED mode, data cannot be accessed through commands 0x3E and 0x3F. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 11 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 8.5.4 Communications 8.5.4.1 I2C Interface The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). Figure 5. I2C Format The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the I2C master. "Quick writes" function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). The following command sequences are not supported: Figure 6. Attempt To Write a Read-only Address (Nack After Data Sent By Master) Figure 7. Attempt To Read an Address Above 0x6B (Nack Command) 8.5.4.2 I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding the lines, releasing them frees them for the master to drive the lines. 12 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 8.5.4.3 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) 66 s bus-free waiting time must be inserted between all packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] A P DATA [7:0] A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read Figure 8. I2C Command Wait Time 8.5.4.4 I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short 100-s clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (INITIALIZATION, NORMAL) a 4-ms clock stretching period may occur within packets addressed for the fuel gauge as the I2C interface performs normal data flow control. Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 13 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 9 Applications and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The Texas Instruments bq27421-G1 fuel gauge is a microcontroller peripheral that provides system-side fuel gauging for single-cell Li-Ion batteries. The device requires minimal user configuration and system microcontroller firmware. Battery fuel gauging with the bq27421-G1 fuel gauge requires connections only to PACK+ (P+) and PACK- for a removable battery pack or embedded battery circuit. NOTE To allow for optimal performance in the end application, special considerations must be taken to ensure minimization of measurement error through proper printed circuit board (PCB) board layout. These requirements are detailed in Design Requirements. 14 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 9.2 Typical Applications Figure 9. Application Schematic Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 15 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com Typical Applications (continued) 9.2.1 Design Requirements As shipped from the Texas Instruments factory, many bq27421-G1 parameters in OTP NVM are left in the unprogrammed state (zero) while some parameters directly associated with the CHEMID are preprogrammed. This partially programmed configuration facilitates customization for each end application. Upon device reset, the contents of OTP are copied to associated volatile RAM-based Data Memory blocks. For proper operation, all parameters in RAM-based Data Memory require initialization -- either by updating Data Memory parameters in a lab/evaluation situation or by programming the OTP for customer production. The bq27421-G1 Technical Reference Manual (SLUUAC5) shows the default value that is present. 9.2.2 Detailed Design Procedure 9.2.2.1 BAT Voltage Sense Input A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing its influence on battery voltage measurements. It proves most effective in applications with load profiles that exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to reduce noise on this sensitive high-impedance measurement node. 9.2.2.2 Integrated LDO Capacitor The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value at least 0.47 F should be connected between the VDD pin and VSS. The capacitor should be placed close to the gauge IC and have short traces to both the VDD pin and VSS. This regulator should not be used to provide power for other devices in the system. 9.2.2.3 Sense Resistor Selection Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard recommendation based on best compromise between performance and price is a 1% tolerance, 50 ppm drift sense resistor with a 1-W power rating. 16 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 Typical Applications (continued) 9.2.3 Application Curves 0.14 10 0.12 5 Temperature Accuracy Error(%) Voltage Accuracy Error (%) 0.1 0.08 0.06 0 -5 -10 0.04 0.02 -40 -20 0 20 40 Temperature (C) 60 80 100 -15 -40 -20 Figure 10. Voltage Accuracy 0 20 40 Temperature (C) 60 80 100 Figure 11. Temperature Accuracy 0 -0.1 Current Accuracy Error (%) -0.2 -0.3 -0.4 -0.5 -0.6 -40 -20 0 20 40 Temperature (C) 60 80 100 Figure 12. Current Accuracy Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 17 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 10 Power Supply Recommendation 10.1 Power Supply Decoupling The battery connection on the BAT pin is used for two purposes: * To supply power to the fuel gauge * As an input for voltage measurement of the battery A capacitor of value of at least 1 F should be connected between BAT and VSS. The capacitor should be placed close to the gauge IC and have short traces to both the BAT pin and VSS. The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value at least 0.47 F should be connected between the VDD pin and VSS. The capacitor should be placed close to the gauge IC and have short traces to both the VDD pin and VSS. 18 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 11 Layout 11.1 Layout Guidelines * * * * A capacitor, of value at least 0.47 F, is connected between the VDD pin and VSS. The capacitor should be placed close to the gauge IC and have short traces to both the VDD pin and VSS. It is required to have a capacitor, at least 1.0 F, connected between the BAT pin and VSS if the connection between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be placed close to the gauge IC and have short traces to both the VDD pin and VSS. If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power operation, it is recommended to use external 1-M pulldown resistors to VSS to avoid floating inputs to the I2C engine. The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 4. Table 4. Recommended Values for SCL and SDA Pullup Resistors VPU RPU * * * * 1.8 V 3.3 V Range Typical Range Typical 400 RPU 37.6 k 10 k 900 RPU 29.2 k 5.1 k If the GPOUT pin is not used by the host, the pin should still be pulled up to VDD with a 4.7-k or 10-k resistor. If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to VSS with a 10-k resistor. The BIN pin should not be shorted directly to VDD or VSS. The actual device ground is the center pin (B2). The C1 pin is floating internally and can be used as a bridge to connect the board ground plane to the device ground (B2). 11.2 Layout Example Figure 13. bq27421-G1 Board Layout Example Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 19 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation * bq27421-G1 Technical Reference Manual (SLUUAC5) * bq27421 EVM: Single-Cell Technology User's Guide (SLUUA63) * Quickstart Guide for bq27421-G1 (SLUUAH7) * Single Cell Gas Gauge Circuit Design (SLUA456) * Key Design Considerations for the bq27500 and bq27501 (SLUA439) * Single Cell Impedance Track Printed-Circuit Board Layout Guide (SLUA457) * ESD and RF Mitigation in Handheld Battery Electronics (SLUA460) 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks Impedance Track, NanoFree, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 PACKAGE OUTLINE YZF0009-C01 DSBGA - 0.625 mm max height SCALE 9.000 DIE SIZE BALL GRID ARRAY 1.65 1.59 B A BALL A1 CORNER 1.61 1.55 C 0.625 MAX SEATING PLANE 0.35 0.15 0.05 C BALL TYP 1 TYP 0.5 TYP C SYMM B 0.5 TYP 1 TYP A 0.35 0.25 C A B 9X 0.015 1 2 3 SYMM 4222180/A 07/2015 NanoFree Is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. TM 3. NanoFree package configuration. www.ti.com Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 21 bq27421-G1 SLUSB85E - MAY 2013 - REVISED JANUARY 2016 www.ti.com EXAMPLE BOARD LAYOUT YZF0009-C01 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 9X ( 0.245) 2 1 3 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:30X 0.05 MAX ( 0.245) METAL METAL UNDER SOLDER MASK 0.05 MIN ( 0.245) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222180/A 07/2015 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com 22 Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85E - MAY 2013 - REVISED JANUARY 2016 EXAMPLE STENCIL DESIGN YZF0009-C01 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP (R0.05) TYP 9X ( 0.25) 1 3 2 A (0.5) TYP SYMM B METAL TYP C SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4222180/A 07/2015 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com Submit Documentation Feedback Copyright (c) 2013-2016, Texas Instruments Incorporated Product Folder Links: bq27421-G1 23 PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) BQ27421YZFR-G1A ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1A BQ27421YZFR-G1B ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1B BQ27421YZFR-G1D ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1D BQ27421YZFT-G1A ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1A BQ27421YZFT-G1B ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1B BQ27421YZFT-G1D ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1D (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 3-Jan-2016 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 9-Mar-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) BQ27421YZFR-G1A DSBGA YZF 9 3000 180.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.78 1.78 0.69 4.0 8.0 Q1 BQ27421YZFR-G1B DSBGA YZF 9 3000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1 BQ27421YZFR-G1D DSBGA YZF 9 3000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1 BQ27421YZFT-G1A DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1 BQ27421YZFT-G1B DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1 BQ27421YZFT-G1D DSBGA YZF 9 250 180.0 8.4 1.78 1.78 0.69 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Mar-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27421YZFR-G1A DSBGA YZF 9 3000 182.0 182.0 20.0 BQ27421YZFR-G1B DSBGA YZF 9 3000 182.0 182.0 20.0 BQ27421YZFR-G1D DSBGA YZF 9 3000 182.0 182.0 20.0 BQ27421YZFT-G1A DSBGA YZF 9 250 182.0 182.0 20.0 BQ27421YZFT-G1B DSBGA YZF 9 250 182.0 182.0 20.0 BQ27421YZFT-G1D DSBGA YZF 9 250 182.0 182.0 20.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: BQ27421YZFR-G1A BQ27421YZFR-G1B BQ27421YZFT-G1A BQ27421YZFT-G1B BQ27421YZFT-G1D BQ27421YZFR-G1D