3.3 V
TPS3809K33
TMS320LC54x
GND
GND
RESET RESET
VDD
VDD
TPS76333
GND
OUTIN5 V
2
3
1
RESET
VDD
GND
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
www.ti.com
SLVS228B –AUGUST 1999–REVISED JULY 2012
3-PIN SUPPLY VOLTAGE SUPERVISORS
Check for Samples: TPS3809J25,TPS3809L30,TPS3809K33,TPS3809I50
1FEATURES APPLICATIONS
2• 3-Pin SOT-23 Package • Applications Using DSPs, Microcontrollers, or
Microprocessors
• Supply Current of 9 μA (Typical) • Wireless Communication Systems
• Precision Supply Voltage Monitor
2.5 V, 3 V, 3.3 V, 5 V • Portable/Battery-Powered Equipment
• Pin-For-Pin Compatible With MAX 809 • Programmable Controls
• Temperature Range: –40°C to +85°C • Intelligent Instruments
• Industrial Equipment
• Notebook/Desktop Computers
• Automotive Systems
DESCRIPTION
The TPS3809 family of supervisory circuits provides circuit initialization and timing supervision, primarily for
DSPs and processor-based systems.
During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V. Thereafter, the
supervisory circuit monitors VDD and keeps RESET active as long as VDD remains below the threshold voltage
VIT. An internal timer delays the return of the output to the inactive state (high) to ensure proper system reset.
The delay time, td(typ) = 200 ms, starts after VDD has risen above the threshold voltage VIT. When the supply
voltage drops below the threshold voltage VIT, the output becomes active (low) again. No external components
are required. All the devices of this family have a fixed sense-threshold voltage VIT set by an internal voltage
divider.
The product spectrum is designed for supply voltages of 2.5 V, 3 V, 3.3 V, and 5 V. The circuits are available in a
3-pin SOT-23. The TPS3809 devices are characterized for operation over a temperature range of –40°C to 85°C.
spacer
Figure 2. Typical Application
Figure 1. DBV PACKAGE
TOP VIEW)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
R2
_
+
R1
VDD
GND
RESET
TPS3809
Oscillator
Reference
Voltage
of 1.137 V
Reset
Logic
+
Timer
25
Family
J9TPS380 RDBV
Reel
Package
Nominal Supply Voltage
Nominal Threshold Voltage
Functionality
FUNCTION/TRUTH TABLE, TPS3809 ORDERING INFORMATION
L
RESET
H
0
VDD>VIT
1
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
SLVS228B –AUGUST 1999–REVISED JULY 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS(1)
TADEVICE NAME THRESHOLD VOLTAGE MARKING
TPS3809J25DBVR TPS3809J25DBVT 2.25 V PCZI
TPS3809L30DBVR TPS3809L30DBVT 2.64 V PDAI
–40°C to 85°C TPS3809K33DBVR TPS3809K33DBVT 2.93 V PDBI
TPS3809I50DBVR TPS3809I50DBVT 4.55 V PDCI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our
web site at www.ti.com.
FUNCTIONAL BLOCK DIAGRAMS
2Copyright © 1999–2012, Texas Instruments Incorporated
td
t
VDD
aaaaa
aaaaa
aaaaa
aaaaa
aaaaa
aaaa
aaaa
aaaa
aaaa
aaaa
V(NOM)
VIT
1.1 V
1
0 t
For VDD< 1.1 V Undefined
Behavior of RESET Output
RESET
td
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
www.ti.com
SLVS228B –AUGUST 1999–REVISED JULY 2012
TIMING DIAGRAM
ABSOLUTE MAXIMUM RATINGS(1) (2)
Over operating free-air temperature range (unless otherwise noted). UNIT
Supply voltage, VDD 7 V
All other pins –0.3 V to 7 V
Maximum low-output current, IOL 5 mA
Maximum high-output current, IOH –5 mA
Input-clamp current, IIK (VI< 0 or VI> VDD) ±20 mA
Output-clamp current, IOK (VO< 0 or VO> VDD) ±20 mA
Continuous total power dissipation See Dissipation Rating Table
Operating junction temperature range, TA–40°C to 85°C
Storage temperature range, Tstg –65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device should not be operated at 7 V for more than t = 1000h
continuously.
DISSIPATION RATINGS TA< 25°C DERATING FACTOR TA= 70°C TA= 85°C
PACKAGE POWER RATING ABOVE TA< 25°C POWER RATING POWER RATING
DBV 437 mW 3.5 mW/°C 280 mW 227 mW
RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT
Supply voltage, VDD 2 6 V
RESET current sink during startup 50 µA
Operating free-air temperature range, TA–40 +85 °C
Copyright © 1999–2012, Texas Instruments Incorporated 3
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
SLVS228B –AUGUST 1999–REVISED JULY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
Overrecommended operating free-air temperature range (unless otherwise noted).
TPS3800-xx, TPS3801-xx, TPS3802-
xx
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD = 2.5 V to 6 V IOH = –500 μA VDD –0.2
VOH High-level output voltage VDD = 3.3 V IOH = –2 mA VDD –0.4 V
VDD = 6 V IOH = –4 mA VDD –0.4
VDD = 2 V to 6 V, IOL = 500 μA 0.2
VOL Low-level output voltage VDD = 3.3 V, IOL = 2 mA 0.4 V
VDD = 6 V, IOL = 4 mA 0.4
Power-up reset voltage(1) VDD ≥1.1 V, IOL = 50 μA 0.2 V
TPS3809J25 2.2 2.25 2.3
TPS3809L30 2.58 2.64 2.7
Negative-going input
VIT– TA= –40°C to 85°C V
threshold voltage(2) TPS3809K33 2.87 2.93 2.99
TPS3809I50 4.45 4.55 4.65
TPS3809J25 30
TPS3809L30 35
Vhys Threshold hysteresis mV
TPS3809K33 40
TPS3809I50 60
VDD = 2 V, output unconnected 9 12
IDD Supply current μA
VDD = 6 V, output unconnected 20 25
CiInput capacitance VI= 0 V to VDD 5 pF
(1) The lowest supply voltage at which RESET becomes active. tr, VDD ≥15 μs/V.
(2) To ensure the best stability of the threshold voltage, a bypass capacitor (0.1-μF ceramic) should be placed near the supply terminals.
TIMING REQUIREMENTS
at RL= 1 MΩ, CL= 50 pF, TA= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
twPulse width at VDD VDD = VIT– + 0.2 V, VDD = VIT– –0.2 V 3 μs
SWITCHING CHARACTERISTICS
at RL= 1 MΩ, CL= 50 pF, TA= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VDD ≥VIT– + 0.2 V,
tdDelay time 120 200 280 ms
See timing diagram
VIL = VIT– – 0.2 V,
Propagation (delay) time, high-to-low-level 1μs
tPHL VDD to RESET delay VIH = VIT– + 0.2 V
output
4Copyright © 1999–2012, Texas Instruments Incorporated
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
IOH – High-Level Output Current – mA
VDD = 6 V
TA= 85oC
0 –10 –20 –30 –40 –50
VOH – High-Level Output Voltage – V
TA= –40 C
o
TA= 0oC
TA= 25oC
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
3.00
IOH – High-Level Output Current – mA
VDD = 2.5 V
TA= 85oC
0 –2 –4 –6 –8 –10
VOH – High-Level Output Voltage – V
TA= –40 C
o
TA= 25oC
TA= 0oC
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
2.75
0 2.5 7.5 10.05.0 12.5
VDD = 2.5 V
TA= 85oC
TA= –40oC
IOL – Low-Level Output Current – mA
OL
V – Low-Level Output Voltage – V
TA= 25 C
o
TA= 0oC
–50
–40
–30
–20
–10
0
10
20
30
40
50
–2 0 2 4 6
TA= 25 C
o
VDD – Supply Voltage – V
CurrentI – Supply – A
DD m
TPS3809J25
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
www.ti.com
SLVS228B –AUGUST 1999–REVISED JULY 2012
TYPICAL CHARACTERISTICS
spacer
LOW-LEVEL OUTPUT VOLTAGE SUPPLY CURRENT
vs vs
LOW-LEVEL OUTPUT CURRENT SUPPLY VOLTAGE
Figure 3. Figure 4.
HIGH-LEVEL OUTPUT VOLTAGE HIGH-LEVEL OUTPUT VOLTAGE
vs vs
HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT CURRENT
Figure 5. Figure 6.
Copyright © 1999–2012, Texas Instruments Incorporated 5
0.995
0.996
0.997
0.998
0.999
1.000
1.001
TA– Free-Air Temperature – C
o
–40 –20 0 20 40 60 85
VDD = 2.3 V
Normalized Threshold Voltage V (T ), V (25 C)
IT A IT
o
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 0.2 0.4 0.6 1.00.8
VDD – Threshold Overdrive Voltage – V
ms
– Minimum Pulse Duration at VDD –
tw
TPS3809J25, TPS3809L30
TPS3809K33, TPS3809I50
SLVS228B –AUGUST 1999–REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SPACE SPACE
NORMALIZED INPUT THRESHOLD VOLTAGE NORMALIZED INPUT THRESHOLD VOLTAGE
vs vs
FREE-AIR TEMPERATURE AT VDD FREE-AIR TEMPERATURE AT VDD
Figure 7. Figure 8.
spacer REVISION HISTORY
Changes from Original (August 1999) to Revision A Page
• Added Pull-up resistor value, RESET to the Recommended Operating Conditions Table .................................................. 3
Changes from Revision A (October 2010) to Revision B Page
• Changed the Pull-up resistor value, RESET To: RESET current sink during startup in the Recommended Operating
Conditions Table ................................................................................................................................................................... 3
6Copyright © 1999–2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS3809I50DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809I50DBVRG4 ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809I50DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809I50DBVTG4 ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809J25DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809J25DBVRG4 ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809J25DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809J25DBVTG4 ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809K33DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809K33DBVRG4 ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809K33DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809K33DBVTG4 ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809L30DBVR ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809L30DBVRG4 ACTIVE SOT-23 DBV 3 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809L30DBVT ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS3809L30DBVTG4 ACTIVE SOT-23 DBV 3 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 13-Jul-2012
Addendum-Page 2
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS3809I50, TPS3809J25, TPS3809K33, TPS3809L30 :
•Automotive: TPS3809I50-Q1, TPS3809J25-Q1, TPS3809K33-Q1, TPS3809L30-Q1
•Enhanced Product: TPS3809I50-EP, TPS3809K33-EP, TPS3809L30-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS3809I50DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809I50DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809J25DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809J25DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809K33DBVR SOT-23 DBV 3 3000 180.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809K33DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809K33DBVT SOT-23 DBV 3 250 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
TPS3809L30DBVR SOT-23 DBV 3 3000 178.0 9.0 3.3 3.2 1.47 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS3809I50DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809I50DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809J25DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809J25DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809K33DBVR SOT-23 DBV 3 3000 182.0 182.0 20.0
TPS3809K33DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
TPS3809K33DBVT SOT-23 DBV 3 250 180.0 180.0 18.0
TPS3809L30DBVR SOT-23 DBV 3 3000 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 13-Aug-2012
Pack Materials-Page 2
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