CREAT BY ART
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
22L 23L 24L 25L 26L 29L 20L 2AL
V
RRM
20 30 40 50 60 90 100 150 V
V
RMS
14 21 28 35 42 63 70 105 V
V
DC
20 30 40 50 60 90 100 150 V
I
F(AV)
A
dV/dt V/μs
T
JO
C
T
STG O
C
Document Number: DS_D1308031 Version: L13
- 55 to +125 - 55 to +150
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=100 ℃
T
J
=125 ℃
I
R
0.4 0.1
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Voltage rate of change (Rated V
R
)10000
Typical thermal resistance R
θJL
R
θJA
17
75
O
C/W
Operating junction temperature range
mA-
5
A
0.50
15 10
--
Maximum instantaneous forward voltage (Note 1)
@ 2A V
F
0.70 0.85 0.95 V
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current 2
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
50
SS
29L
SS
210L
SS
215L UNIT
Marking code
Maximum repetitive peak reverse voltage
Polarity: Indicated by cathode band
Weight: 0.019 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL SS
22L
SS
23L
SS
24L
SS
25L
SS
26L
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: Sub SMA Sub SMA
SS22L thru SS215L
Taiwan Semiconductor
Surface Mount Schottk
y
Barrier Rectifier
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
PART NO.
PART NO.
SS26L
SS26L
SS26L
(TA=25℃ unless otherwise noted)
Document Number: DS_D1308031 Version: L13
GREEN COMPOUND
CODE
RU
RU AEC-Q101 qualified
RU
R3
RH Sub SMA 10,000 / 13" Paper reel (12mm tape)
G Green compound
Sub SMA 10,000 / 13" Plastic reel (12mm tape)
AEC-Q101
QUALIFIED PACKING CODE
Sub SMA 7,500 / 13" Paper reel (12mm tape)
M2 Sub SMA 7,500 / 13" Plastic reel (12mm tape)
R2
7,500 / 13" Plastic reel (8mm tape)
RQ Sub SMA 10,000 / 13" Paper reel (8mm tape)
MQ Sub SMA 10,000 / 13" Plastic reel (8mm tape)
MH
PACKING
CODE
GREEN COMPOUND
CODE
PACKAGE PACKING
Prefix "H"
RU
Suffix "G"
Sub SMA 1,800 / 7" Plastic reel (8mm tape)
RATINGS AND CHARACTERISTICS CURVES
SS26L RU
SS26L RUG
Note 1: "x" defines voltage from 20V (SS22L) to 150V (SS215L)
EXAMPLE
PREFERRED P/N DESCRIPTION
SS26LHRU H
Sub SMA 1,800 / 7" Plastic reel (12mm tape)
Sub SMA 3,000 / 7" Plastic reel (8mm tape)RV
RT Sub SMA 7,500 / 13" Paper reel (8mm tape)
MT Sub SMA
SS2XL
(Note 1)
SS22L thru SS215L
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
RF Sub SMA 3,000 / 7" Plastic reel (12mm tape)
0
0.5
1
1.5
2
2.5
50 60 70 80 90 100 110 120 130 140 150 160 170
AVERAGE FORWARD CURRENT (A
LEAD TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
SS22L-SS24L SS25L-SS215L
RESISTIVE OR
INDUCTIVE LOAD
0
10
20
30
40
50
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine-Wave
JEDEC Method
0.001
0.01
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE A
CURRENT (mA)
PERCENT OF RATED PEAK REVERSE VOLYAGE(%)
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=75℃
TJ=125℃
SS22L-SS24L
SS25L-SS215L
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
INSTANTANEOUS FORWARD A
CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
SS22L-SS24L
SS25L-SS26L
SS215L
SS29L-SS210L
Min Max Min Max
B 1.70 1.90 0.067 0.075
C 2.70 2.90 0.106 0.114
D 0.16 0.30 0.006 0.012
E 1.23 1.43 0.048 0.056
F 0.80 1.20 0.031 0.047
G 3.40 3.80 0.134 0.150
H 2.45 2.60 0.096 0.102
I 0.35 0.85 0.014 0.033
J 0.00 0.10 0.000 0.004
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1308031 Version: L13
E4.3
B1.2
Unit (inch)
0.055
0.047
MARKING DIAGRAM
C3.1
D1.9
Unit (inch)
SUGG ESTED PAD LAY OUT
Symbol Unit (mm)
A1.4
0.122
0.075
0.169
SS22L thru SS215L
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm)
10
100
1000
0.1 1 10 100
JUNCTION CAPACITANCE (pF) a
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vslg=50mVp-p
0.1
1
10
100
0.01 0.1 1 10 100
TRANSIENT THERMAL IMPEDANCE (℃/W)
T-PULSE DURATION(S)
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1308031 Version: L13
SS22L thru SS215L
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
