REVISIONS
LTR DESCRIPTION DATE (YR-MO-DA) APPROVED
A
Add case outline 2 for device types 01 and 02. Update format. Editorial
changes throughout.
89-11-07
M. A . Frye
B
Changes to large-signal voltage gain test and to the output voltage swing test.
Changes IAW NOR 5962-R193-93.
93-08-26
M. A . Frye
C
Add case outline K. Change boilerplate to add one-part part numbers. Add
delta test limits. Redrawn.
96-11-25
R. Monnin
D
Add radiation hardness requirem ents. Update boilerpl ate. -rrp
98-06-19
R. Monnin
E
Change to the slew rate test condition AVCL in table I. -rrp
00-10-04
R. Monnin
F
Add case outline D. Remove radiation exposure circ uit. Changes made to
1.2.4, 1.3, 3.2.3, fi gure 1, and table IIA. Update boilerplat e to reflect current
requirements . -rrp
03-03-19
R. Monnin
G
Update drawing to current requirem ents. Deleted unused group E boilerplate
paragraphs. –rrp
11-04-06
C. Saffle
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS REV G G G G G G G G G G G
OF SHE ETS SHEET 1 2 3 4 5 6 7 8 9 10 11
PMIC N/A PREPARED BY
Gary Zahn
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPRO V ED BY
Mi chael A. Frye
MICROCIRCUI T, LINEAR, RADIATION
HARDENED, LOW NOISE, QUAD OPERATIONAL
AMPLIFIER, MONOLITHIC SILICON
DRAWING APPROVAL DATE
88-08-18
AMSC N/A
REVISION LEVEL
G SIZE
A CAGE CODE
67268
5962-88565
SHEET 1 OF 11
DSCC FORM 2233
APR 97 5962-E269-11
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 2
DSCC FORM 2234
APR 97
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
88565
01
C
A
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ /
\/
Drawing number
For device class V:
5962
R
88565
01
V
C
A
Federal
stock class
designator
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\ /
(see 1.2.3)
\/
Drawing number
1.2.1 RHA des ign ator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, append ix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Dev ice ty pe(s). The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 OP-470A Very low noise, quad, operational amplifier
02 OP-471A High speed, low noise, quad, operational
amplifier
1.2.3 Dev ice cl as s designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Devi ce class Device requireme nts doc umentation
M Vendor self-cer tification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Q or V Certification and qualification to MIL-PRF-38535
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 3
DSCC FORM 2234
APR 97
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
2 CQCC1-N20 20 Square leadless chip carrier
3 CQCC1-N28 28 Square leadless chip carrier
K GDFP2-F24 or CDFP3-F24 24 Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absol ute maximum rating s. 1/
Supply voltage (VCC) ....................................................... ±18 V dc
Differential input voltage ................................................. ±1 V dc 2/
Different ial input curre nt ................................................. ±25 mA 2/
Input voltage ................................................................... Supply voltage
Output short circuit duration ............................................ Continuous
Storage temperature range ............................................. -65°C to +150°C
Lead temperature (soldering, 60 seconds) ..................... +300°C
Power dissipation (PD):
Cases C and 2 ............................................................ 800 mW
Case D ........................................................................ 550 mW
Case 3 ......................................................................... 500 mW
Case K ........................................................................ 440 m W
Maximum junction temperature (TJ) ................................ +150°C
Thermal resistance, junction-to-case (θJC) ...................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Cases C and 2 ............................................................ 100°C/W
Case D ........................................................................ 140°C/W
Case 3 ......................................................................... 110°C/W
Case K ........................................................................ 69°C/W
1.4 Recom mended operating cond itio ns.
Ambient operating temperature range (TA) ..................... -55°C to +125 °C
Supply voltage (VCC) ....................................................... ±15 V
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .................. 100 Krads(Si) 3/
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds ±1 V, the input current should be limited to ±25 mA.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
Method 1019, condition A.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 4
DSCC FORM 2234
APR 97
2. APPLICABLE DOCUMENTS
2.1 Government specification, s tandards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unl ess otherwise specified, the issues of these documents are those cited in the
solicitati on or contr ac t.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of prece den ce. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements . The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appen dix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical di mensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for devic e classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein .
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part s hall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certificati on/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test Symbol Conditions 1/ 2/
-55°C ≤ TA ≤+125°C
unless otherw ise speci fied
Group A
subgroups
Device
type
Limits Unit
Min
Max
Input offset volt age
VIO 1 01 ±0.4 mV
2, 3
±0.6
M,D,P,L,R
1
±0.6
1 02 ±0.8
2, 3
±1.2
M,D,P,L,R 1 ±1.0
Input offset current
I
IO
V
CM
= 0 V
1
All
±10
nA
2, 3 ±20
M,D,P,L,R
1
50
Input bias current
IIB VCM = 0 V 1 All ±25 nA
2, 3
±50
M,D,P,L,R
1
±500
Input noise voltage
E
n
f
O
= 1 Hz to 100 Hz
TA = +25°C 3/
7
01
110
nV
RMS
02
265
Large-signal voltage gain
A
VS
VO = ±10 V,
RL = 10 kΩ
4
01
1000
V/mV
5, 6
750
M,D,P,L,R
4
100
VO = ±10 V,
RL = 2 kΩ 3/ 4 500
5, 6
400
VO = ±10 V,
RL = 10 kΩ 4 02 500
5, 6
375
M,D,P,L,R 4 50
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics – Continued.
Test Symbol Conditions 1/ 2/
-55°C ≤ TA ≤+125°C
unless otherw ise speci fied
Group A
subgroups
Device
type
Limits Unit
Min
Max
Large-signal voltage gain
AVS VO = ±10 V,
RL = 2 kΩ 3/ 4 02 350 V/mV
5, 6
250
Output voltage swing
VOP RL = 2 kΩ 3/ 4, 5, 6 All ±12 V
Supply current 4/
I
S
No load
1, 2, 3
All
11
mA
M,D,P,L,R 1 11
Slew rate
SR
AVCL = +21, RL = 10 kΩ,
TA = +25°C 3/
7
01
1.4
V/µs
02 6.5
Common-mode rejection
CMR
VCM = IVR = ±11 V 3/ 5/
1
01
110
dB
2, 3
100
1
02
105
2, 3
100
Power supply rejection ratio
PSRR VCC = ±4.5 V to ±18 V 3/ 1 01 1.8 µV/V
2, 3
5.6
1 02 5.6
2, 3
10
1/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, R of irradiation. However, this
device is only tested at the “R” level. Pre and Post irradiation values are identical unless otherwise specified in table I.
When performing post irradiation electrical measurements for any RHA level, TA = +25°C. VCC = ±15 V, RS = 50 Ω.
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed onl y for the conditions specified in MIL-STD-883, method
1019, condition A.
3/ This parameter is not tested post-irradiation.
4/ IS limit equals the total of all amplifiers.
5/ IVR is defined as the VCM range used for the CMR test.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 7
DSCC FORM 2234
APR 97
Device types
01 and 02
Case outlines
C and D
2
3
K
Terminal
number
Terminal symbol
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
OUT A
-IN A
+IN A
+VCC
+IN B
-IN B
OUT B
OUT C
-IN C
+IN C
-VCC
+IN D
-IN D
OUT D
-----
-----
-----
-----
-----
-----
-----
-----
-----
-----
-----
-----
-----
-----
NC
OUT A
-IN A
+IN A
NC
+VCC
NC
+IN B
-IN B
OUT B
NC
OUT C
-IN C
+IN C
NC
-VCC
NC
+IN D
-IN D
OUT D
-----
-----
-----
-----
-----
-----
-----
-----
NC
OUT A
-IN A
NC
NC
+IN A
NC
+VCC
NC
+IN B
NC
NC
-IN B
OUT B
NC
OUT C
-IN C
NC
NC
+IN C
NC
-VCC
NC
+IN D
NC
NC
-IN D
OUT D
OUT A
-IN A
NC
NC
+IN A
+VCC
+IN B
NC
NC
NC
-IN B
OUT B
OUT C
-IN C
NC
NC
NC
+IN C
-VCC
+IN D
NC
NC
-IN D
OUT D
----
----
----
----
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 8
DSCC FORM 2234
APR 97
3.6 Certif i cate of compli an ce. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The cert ifi cate o f compl ian ce sub mitt ed to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certif i cate of conform anc e . A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or f or
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcirc uits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and M ar itime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime 's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microc ir c uit group assi gn ment for dev ice clas s M . Device class M devices covered by this drawing shall be in
microcircuit group number 49 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling an d inspection . For device classes Q and V, sampling and ins pection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affec t the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance wi th MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and tec hnology conformance inspection. For device class M, sc reening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revis ion lev el control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circ ui t shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table IIA herein.
c. Additional screeni ng for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 9
DSCC FORM 2234
APR 97
TABLE IIA. Electrical test requi rements.
Test requirements
Subgroups
(in accordanc e with
MIL-STD-883,
method 5005, table I)
Subgroups
(in accordanc e with
MIL-PRF-38535, table III)
Device
class M
Device
class Q
Device
class V
Interim electrical
parameter s (see 4.2) 1 1 1
Final electrical
parameter s (see 4.2)
1,2,3,4,5,6 1/
1,2,3,4,5,6 1/
1,2,3,4, 1/ 2/
5,6
Group A test
requirements (see 4.4)
1,2,3,4,5,6,7
1,2,3,4,5,6,7
1,2,3,4,5,6,7
Group C end-point electrical
parameter s (see 4.4) 1 1 1 2/
Group D end-point electrical
parameter s (see 4.4)
1
1
1
Group E end-point electri cal
parameter s (see 4.4)
----
----
1, 4
1/ PDA applies to subgroup 1.
2/ Delta limits as specified in table IIB shall be required where specified, and the delta limits
shall be computed with reference to the previous interim electrical parameters.
Table IIB. 240 hour burn-in and group C end-point ele ctri cal para meter s.
Parameter
Device type
Limit
Delta
Min
Max
Min
Max
VOS
01
0.4 mV
100 µV
02
0.8 mV
250 µV
IOS
01
10 nA
5 nA
02
10 nA
5 nA
IB
01
±25 nA
5 nA
02
±25 nA
5 nA
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified i n MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E ins pections and as specified. Quality conformance inspection for device
class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for
device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 10
DSCC FORM 2234
APR 97
4.4.1 Gro up A inspe ctio n.
a. Tests shall be as specif ied in table IIA herein.
b. Subgroups 8, 9, 10, and 11 in table I, method 5005 of M IL-STD-883 shall be omitted.
4.4.2 Gro up C inspec tion . The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a. Test condition A, B, C, or D. The test circuit s hall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outpu ts, biases, and power dissipation, as applicable, in accordance wi th the intent specified in method 1005 of
MIL-STD-883.
b. TA = +125°C, minimum .
c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be mai ntained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circ ui t shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Gro up D inspec tion . The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Gro up E inspe ction. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a. End-point electr ic al para meters shall be as specified in table I IA herein.
b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hard nes s ass ured te sts as spe cif ied in MI L-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at
TA = +25°C ±5°C, after exposure, to the subgroups specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883
method 1019, c ondition A and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Inten ded use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equ ipm ent), des ign applications, and logistics purpo ses.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-88565
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990 REVISION LEVEL
G SHEET 11
DSCC FORM 2234
APR 97
6.3 Record of user s. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) sho uld co ntact DLA Land and Maritime-VA, telephone (614) 692-0544.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviatio ns, sy mbo ls, and defi nit ion s us ed herein ar e defin ed in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are l isted in QML-38535.
The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DLA Land and Maritime-VA and
have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in M IL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 11-04-06
Approved sources of supply for SMD 5962-88565 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the add it io n or deletio n of sour ces. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
ma intains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/.
See footnotes at end of table.
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Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-8856501CA
24355 (2)
OP-470AY/883C
5962-88565012A
24355 (2)
OP-470ARC/883C
5962-88565013A
3/
OP-470ATC/883C
5962-8856502CA
24355 (2)
OP-471AY/883C
5962-88565022A
24355 (2)
OP-471ARC/883C
5962-88565023A
24355 (2)
OP-471ATC/883C
5962-8856501VCA
24355 (4)
OP470AY/QMLV
5962-8856501V2A
24355 (4)
OP470ARC/QMLV
5962-8856501VKA
24355 (4)
OP470AN/QMLV
5962-8856502VCA
24355 (4)
OP471AY/QMLV
5962-8856502VDA
24355 (4)
OP471AM/QMLV
5962-8856502V2A
3/
OP471ARC/QMLV
5962-8856502VKA
24355 (4)
OP471AN/QMLV
STANDARD MICROCIRCUIT DRAWING BULLETIN - CONTINUED
DATE: 11-04-06
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R8856501VCA
24355 (4)
OP470AY/QMLR
5962R8856501V2A
24355 (4)
OP470ARC/QMLR
5962R8856501VKA
24355(4)
OP470AN/QMLR
5962R8856502VCA
24355 (4)
OP471AY/QMLR
5962R8856502VDA
24355 (4)
OP471AM/QMLR
5962R8856502V2A
3/
OP471ARC/QMLR
5962R8856502VKA
24355 (4)
OP471AN/QMLR
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufac turer lis ted f o r that part. If the
desired lead finish is not listed contact the vendor
to determine its av aila bil ity .
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE Vendor name
number and address
24355 Analog Devices (2)
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 804 Woburn Street
Wilmington, MA 01887-3462
24355 Analog Devices (4)
RT 1 Industrial Park
PO Box 9106
Norwood, MA 02062
Point of contact: 7910 Triad Center Drive
Greensboro, NC 27409-9605
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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