Ver 201208
FEATURES
APPLICATION
DIMENSION
Type Dimension [mm]
L W t d
31 3.2±0.2 1.6±0.2 1.1±0.2 0.5+0.2
-0.3
DESCRIPTION
Chip
ChipChip
Chip Bead
BeadBead
Bead
For
ForFor
For EMI
EMIEMI
EMI Suppression
SuppressionSuppression
Suppression
RECOMMENDED LAND PATTERN
CIB/CIM31 Series (3216/ EIA 1206)
Perfect shape for automatic mounting, with no directionality.
Excellent solderability and high heat resistance for either flow
or reflow soldering
Monolithic inorganic material construction for high reliability
Closed magnetic circuit configuration avoids crosstalk and is
suitable for high density PCBs.
Part no. Thickness
(mm) Impedance
(Ω)±25%@100MHz DC Resistance
(Ω)Max. Rated Current
(mA) Max.
CIB31P260 1.1±0.2 26 0.05 2000
CIB31P310 1.1±0.2 31 0.05 2000
CIB31P500 1.1±0.2 50 0.05 2000
CIB31P600 1.1±0.2 60 0.05 1500
CIB31P700 1.1±0.2 70 0.10 1500
CIM31U101 1.1±0.2 100 0.15 500
CIM31U601 1.1±0.2 600 0.30 400
CIM31J151 1.1±0.2 150 0.20 600
CIM31J221 1.1±0.2 220 0.20 600
CIM31J301 1.1±0.2 300 0.25 600
CIM31J601 1.1±0.2 600 0.30 600
CIM31J801 1.1±0.2 800 0.40 500
CIM31J102 1.1±0.2 1000 0.45 500
CIM31J152 1.1±0.2 1500(at 70MHz) 0.55 300
High frequency EMI prevention application to computers, printers,
VCRs, TVs and mobile phones.
0.6~1.5mm 0.6~1.5mm
1.8~2.5mm
1.2~2.0mm
Ver 201208
CHARACTERISTIC DATA
Ver 201208
CI M 31 J 221 N E
(1) (2) (3) (4) (5) (6) (7)
(1) Chip Beads (2) M: Multi-layer type B:Mono-layer type
(3) Dimension (4) Material Code
(5) Nominal impedance (700:70Ω, 221:220Ω)
(6) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard)
(7) Packaging(C:paper tape, E:embossed tape)
PACKAGING
Packaging Style Quantity(pcs/reel)
Card Board Taping 3,000
RECOMMENDED SOLDERING CONDITION
PRODUCT IDENTIFICATION
■NOTICE :All specifications are subject to change without previous notice. Please contact with
product representatives or engineers to check specifications.
REFLOW SOLDERING FLOW SOLDERING
