2009 - 2015 Microchip Technology Inc. DS00002005A-page 1
General Description
The Microchip USB2250/50i/51/51i i s a USB 2.0 com-
pliant, Hi-S peed mass storage class peripheral control-
ler intended for reading and writing to more than 24
popular flash media formats from the CompactFlash®
(CF), SmartMediaTM (SM), xD-Picture CardTM (xD)1,
Memory S tick® (MS), Secure Digital (SD), and MultiMe-
diaCardTM (MMC) families.
The USB2250/50i/51/51i is a fully integrated, single
chip solution capable of ultra high performan ce opera-
tion. Average sustained transfer rates exceeding 35
MB/s are possible if the media and host can support
those rates.
Highlights
• 128-pin VTQFP (14x14 mm) RoHS compliant
package
• Targeted for applications in which single or
"combo" media sockets are used
• Supports multiple simultaneous card insertions
• Flexible assignment of number of LUNs and how
card types are associated with the LUNs
• Hardware-controlled data flow architecture for all
self-mapped media
• Pipelined hardware support for access to non-
self-mapped media
• Order number with “i” denotes the version that
supports the industrial temperature range of -40ºC
to 85ºC
Hardware Features
• Single chip flash media controller with non-multi-
plexed interface for independent card sockets
• Flash Media Specification Revision Compliance
- CompactFlash 4.1
- Secure Digital 2.0
- Mul tiMediaCard 4.2
• MMC Streaming Mode support
- Memory Stick 1.43
- Memory Stick Pro Format 1.02
- Memory Stick Duo Format 1.10
- Memory Stick Pro-HG Duo Format 1.01
- xD-Picture Card 1.2
- SmartMedia 1.3
• Extended configuration options
- xD player mode operation
- Socket switch polarities, etc.
• Media Activity LED
• On board 24 MHz crystal driver circuit
• Optional external 24 MHz clock input
- 4 Indepe ndent internal card power FETs
- 200 mA each
- "Fold-back" short circuit protection
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM | 14 KB RAM
• Internal regulator for 1.8 V core operation
• Optimized pinout improves signal routing which
eases implementation for improved signal integ-
rity
OEM Selectable
• Vendor, product, and language IDs
• Manufacturer ID and product strings (28 charac-
ter)
• Serial number string (12h digit max)
• Customizable vendor spe ci fic data by optional
use of external serial EEPROM
• Bus- or self-powered selection
• LED blink interval or duration
• Internal power FET configuration
Software Features
• Optimized for low latency interrupt handling
• Reduced memory footprint
• Device Firmware Upgrade (DFU) support of exter-
nal EEPROM or External Flash
- Assembly line support
- End user field up grade support
- DFU Package consists of driver, firmware,
sample DFU application and source code,
DFU driver API
• Optional custom firmware with up to 128 KB
external ROM
Applications
• Flash Media Card Reader/Writer
• Printers
• Desktop and Mobile PCs
• Consumer A/V
• Media Players/Viewers
• Vista ReadyBoostTM
1.) xD-Picture Card not applicable to USB2251.
USB2250/50i/51/51i
Ultra Fast USB 2.0 Multi-Slot Flash Media Controller
USB2250/50i/51/51i
DS00002005A-page 2 2009 - 2015 Microchip Technology Inc.
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communication s Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differe nces from the data sheet an d recommende d workarounds, may exist for cur-
rent devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, plea se check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see las t page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
using.
Customer Notific at ion Syst em
Register on our web site at www.microchip.com to receive the most current information on all of our products.
2009 - 2015 Microchip Technology Inc. DS00002005A-page 3
USB2250/50i/51/51i
Table of Contents
1.0 Introduction ..................................................................................................................................................................................... 4
2.0 Pin Configuration ............................................................................................................................................................................ 6
3.0 Block Diagram ................................................................................................................................................................................. 7
4.0 Pin Table ......................................................................................................................................................................................... 8
5.0 Pin Descriptions ............................................................................................................................................................................ 10
6.0 Pin Reset State Table ................................................................................................................................................................... 17
7.0 Configuration Options ................................................................................................................................................................... 21
8.0 AC Specifications .......................................................................................................................................................................... 32
9.0 DC Parameters ............................................................................................................................................................................. 34
10.0 Package Outline ........................................................................................... ............................................................................... 38
Appendix A: Data Sheet Revision History ........................................................................................................................................... 39
Product Identification System ............................................................................................................................................................. 40
The Microchip Web Site ...................................................................................................................................................................... 41
Customer Change Notification Service ............................................................................................................................................... 41
Customer Support ............................................................................................................................................................................... 41
2009 - 2015 Microchip Technology Inc. DS00002005A-page 4
USB2250/50i/51/51i
1.0 INTRODUCTION
The Microchip USB2250/50i/51/51i is a flash media card reader solution fully compliant with the USB 2.0 specification.
All required resistors on the USB ports are integrated into the device. This includes al l series termination resistors on
D+ and D– pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream fac-
ing ports have internal pull-up resistors.
Hardware Features
• Single chip flash media controller
• USB2250/USB2251 supports the commercial temperature range of 0°C to +70°C
• USB2250i/USB2251i supports the industrial temperature range of -40°C to +85°C
• 8051 8-bit microprocessor
- 60 MHz - single cycle execution
- 64 KB ROM |14 KB RAM
• Integrated regulator for 1.8 V core operation
•Flash Media Card Specification Revision Compliance
• Compact Flash 4.1
- CF UDMA Modes 0-4
- CF PIO Modes 0-6
• Secure Digital 2.0
- HS-SD and HC-SD
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• Smart Media 1.3
• xD-Picture Card 1.2
Software Features
• If the OEM is using an external EEPROM, the following feature s are available:
- Customizable vendor, product, and device ID’s
- 12-hex digits maximum for the serial number string
- 28-character manufacturer ID and product strings for the flash media reader/writer
USB2250/50i/51/51i
DS00002005A-page 5 2009 - 2015 Microchip Technology Inc.
1.1 Acronyms
ATA: Advanced Technology Attachment
CFC: Compact Flash Controller
FET: Field Effect Transistor
LUN: Logical Unit Number
MMC: MultiMediaCard
MSC: Memory Stick Controller
PLL: Phase-Locked Loop
RoHS: Restriction of Hazardous Substances Directiv e
RXD: Received eXchange Data
SDC: Secure Digital Controller
SIE: Serial Interface Engin e
SMC: SmartMedia Controller
True IDE Mode: True In tegrated Drive Electronics Mode
TXD: Transmit eXchange Data
UART: Universal Asynchronous Receiver-Transmitter
UCHAR: Unsigned Character
UINT: Unsigned Integer
VTQFP: Very Thin Quad Flat Package
2009 - 2015 Microchip Technology Inc. DS00002005A-page 6
USB2250/50i/51/51i
2.0 PIN CONFIGURATION
FIGURE 2-1: 128-PIN VTQFP DIAGRAM
97
MS_D6
99
MS_D3 100
MS_D7 101
MS_SCLK 102
VSS 103
TEST 104
VDD33
106
MA7 107
MA13 108
MA6 109
MA8 110
MA5 111
MA9 112
MA4 113
MA11 114
MA3 115
nMRD 116
MA2 117
CF_DMARQ / RXD
SCL / xD_ID
CF_DMACK 120
LED 121
VBUS_DET 122
VSS 123
XTAL2 124
XTAL1 (CLKIN) 125
VDD18PLL 126
VSS 127
RBIAS 128
VDD33
64 nRESET
63 CF_D5
62 CF_D12
61 CF_D4
60 CF_D11
59 CF_D3
58 CF_nCD
57 SM_nCD
56 SM_nB/R
55 SM_nRE
54 SM_nCE
53 SM_CLE
52 SM_ALE
51 VSS
50 VDD33
49 VDD18
48 SM_nWE
47 SM_nWP
46 SM_D0
45 SM_D1
44 SM_D2
43 SM_D3
42 SM_D4
41 SM_D5
40 SM_D6
39 SM_D7
38 SM_nWPS
37 MD0
36 MD1
35 MD2
34 MD3
33 MD7
96 MS_D2
95 MS_D4
94 MS_D0 / MS_SDIO
93 MS_D5
92 MS_D1
91 MS_BS
90 CF_D10
89 CF_D9
88 CF_D2
87 CF_D8
86 CF_D1
85 CF_D0
84 CF_SA0
83 CF_SA1
82 CF_SA2
81 VSS
80 CF_IORDY
79 CF_nRESET
78 CRD_PWR1
77 VDD33
76 CRD_PWR2
75 VSS
74 CF_IRQ
73 CF_nIOW
72 CF_nIOR
71 CF_nCS0
70 CF_D15
69 CF_D7
68 CF_D14
67 CF_D6
66 CF_D13
65 VDD33
USB225X
128 VTQ FP
(Top Vie w )
1
MA12 2
MA15 3
nMWR 4
MA14 5
SDA 6
REG_EN 7
USB+ 8
USB- 9
VSS 10
SD_D1 11
SD_D6 12
SD_D0 13
SD_D7
15
VDD33 16
17
VSS 18
SD_CLK 19
SD_D5 20
SD_CMD 21
SD_D4 22
SD_D3 23
SD_D2 24
MA10 25
MA1 / CLK_SEL1 26
nMCE 27
MA0 / CLK_SEL0 28
MA16 29
MD6 30
MD5 31
MD4
SD_nCD
14
CRD_PWR0
118
CRD_PWR3
119
32
98
MS_INS
105
SD_WP
2009 - 2015 Microchip Technology Inc. DS00002005A-page 7
USB2250/50i/51/51i
3.0 BLOCK DIAGRAM
FIGURE 3-1: USB2250/50I/51/51I BLOCK DIAGRAM
FMDU
CTL
8051
PROCESSOR
SFR
RAM
CF/
GPIO (16)
MS
SM
RAM
USB
Host
AUTO_CBW
PROC
PHY FMI
XDATA BRIDGE
+ BUS ARBITER
BUS
INTFC BUS
INTFC
BUS
INTFC
EP0 TX
EP0 RX
EP2 TX
EP2 RX
EP1 RX
EP1 TX
ROM
64 KB
RAM
10 KB ADDR
MAP
PWR_FET1
PWR_FET3
CRD_PWR0
CRD_PWR1
CRD_PWR3
Clock
Generation and
Control
CRD_PWR2
SD/
MMC
4K
total
PWR_FET0
PWR_FET2
GPIOs
Program Memory I/O Bus
3.3 V
1.8 V Reg
VDD18
3.3 V
VDD18PLL
PLL
24 MHz
Crystal
SIE
CTL
1.8 V Reg
USB2250 / USB2251
2009 - 2015 Microchip Technology Inc. DS00002005A-page 8
USB2250/50i/51/51i
4.0 PIN TABLE
4.1 128-Pin Package
TABLE 4-1: 128-PIN VTQFP PACKAGE
COMPACT FLASH INTERFACE (28 PINS)
CF_D0 CF_D1 CF_D2 CF_D3
CF_D4 CF_D5 CF_D6 CF_D7
CF_D8 CF_D9 CF_D10 CF_D11
CF_D12 CF_D13 CF_D14 CF_D15
CF_nIOR CF_nIOW CF_IRQ CF_nRESET
CF_IORDY CF_nCS0 CF_DMACK CF_SA0
CF_SA1 CF_SA2 CF_nCD CF_DMARQ
SMARTMEDIA INTERFACE (17 PINS)
SM_D0 SM_D1 SM_D2 SM_D3
SM_D4 SM_D5 SM_D6 SM_D7
SM_ALE SM_CLE SM_nRE SM_nWE
SM_nWP SM_nB/R SM_nCE SM_nCD
SM_nWPS
MEMORY STICK INTERFACE (11 PINS)
MS_BS MS_D0 / MS_SDIO MS_SCLK MS_INS
MS_D1 MS_D2 MS_D3 MS_D4
MS_D5 MS_D6 MS_D7
SECURE DIGITAL / MULTIMEDIACARD INTERFACE (12 PINS)
SD_CMD SD_CLK SD_D0 SD_D1
SD_D2 SD_D3 SD_WP SD_nCD
SD_D4 SD_D5 SD_D6 SD_D7
USB INTERFACE (6 PINS)
USB+ USB- RBIAS
XTAL2 XTAL1 (CLKIN) REG_EN
USB2250/50i/51/51i
DS00002005A-page 9 2009 - 2015 Microchip Technology Inc.
MEMORY/IO INTERFACE (28 PINS)
MA0 / CLK_SEL0 MA1 / CLK_SEL1 MA2 MA3
MA4 MA5 MA6 MA7
MA8 MA9 MA10 MA11
MA12 MA13 MA14 MA15
MA16 MD0 MD1 MD2
MD3 MD4 MD5 MD6
MD7 nMRD nMWR nMCE
MISC (10 PINS)
nRESET VBUS_DET SCL / xD_ID SDA
LED CRD_PWR0 CRD_PWR1 CRD_PWR2
CRD_PWR3 TEST
DIGITAL, POWER (16 PINS)
(6) VDD33 (8) VSS VDD18 VDD18PLL
TO TA L 1 2 8
TABLE 4-1: 128-PIN VTQFP PACKAGE (CONTINUED)
2009 - 2015 Microchip Technology Inc. DS00002005A-page 10
USB2250/50i/51/51i
5.0 PIN DESCRIPTIONS
This section provides a detailed description o f each si gnal. The signals are a rra nged in function al gr oups according to
their associated inte rface. The pi n descriptions are ap plied when using the inte rnal default firmware and can be refer-
enced in Section 7.0, "Co nfigurati on Options," o n page 21. Plea se reference Section 1.1, "Acronyms," on page 5 for a
list of the acronyms used.
The “n” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage
level. When “n” is not present in the signa l name, the signal is asserted at the high voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of
“active low” and “active high” signals. The term assert, or assertion, indicates that a signal is active, independent of
whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inac-
tive.
5.1 128-Pin VTQFP Pin Descriptions
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS
Name Symbol 128-Pin
VTQFP Buffer
Type Description
COMPACT FLASH (CF) INTERFACE
CF Chip Select 0 CF_nCS0 71 O12PU This pin is the acti ve lo w chip select 0 signal for
the task file registers of the CF ATA device in
True IDE mode. This pin has a weak internal
pull-up resistor.
CF Register
Address CF_SA[2:0] 82
83
84
I/O12 These pins are the register select address bits
for the CF ATA device.
CF Interrupt CF_IRQ 74 IPD This is the active high interrupt request signal
from the CF device. This pin has a weak internal
pull-down resistor.
CF Data 15-8 CF_D[15:8] / 70
68
66
62
60
90
89
87
I/O12PD CF_D[15:8]: These pins are the bi-directional
data signals CF_D15 - CF_D8 in T rue IDE mode
data transfer.
In True IDE mode, all task file register
operations occur on CF_D[7:0], while data
transfer occurs on CF_D[15:0].
These bi-directional data signals have weak
internal pull-down resistors.
CF Data 7-0 CF_D[7:0] 69
67
63
61
59
88
86
85
I/O12PD CF_D[7:0]: These pins are the bi-directional
data signals CF_D7 - CF_D0 in Tr ue IDE mode
data transfer. In True IDE mode, all of the task
file register operations occur on CF_D[7:0],
while data transfer occurs on CF_D[15:0].
These bi-directional data signals have weak
internal pull-down resistors.
IO Ready CF_IORDY 80 IPU This pin is the active high input signal for
IORDY. This pin has a weak internal pull-up
resistor.
CF Card
Detection1 CF_nCD 58 I/O12 Designates as the Compact Flash card
detection pin.
CF Hardware
Reset CF_RESET_N 79 O12 This pin is an active low hardware reset signal
to the CF device.
CF IO Read CF_nIOR 72 O12 This pin is an active low read strobe signal for
the CF device.
CF IO Write
Strobe CF_nIOW 73 O12 This pin is an active low write strobe signal for
the CF device.
USB2250/50i/51/51i
DS00002005A-page 11 2009 - 2015 Microchip Technology Inc.
CF DMA request CF_DMARQ /
RXD
117 I CF_DMARQ: This pin is the DMA request from
the device to the CF controller.
RXD: The signal can be used as input to the
RXD of UART in the device. Custom firmware is
required to activate this function.
CF DMA
acknowledge CF_DMACK 119 O12 CF_nDMACK: This pin is an active low DMA
acknowledge signal for the CF device.
SMARTMEDIA (SM) INTERFACE
SM Write Protect SM_nWP 47 O12PD This pin is an active low write protect signal fo r
the SM device and has a weak pull-down
resistor that is permanently enabled.
SM Address
Strobe SM_ALE 52 O12PD This pin is an active high Address Latch Enable
signal for the SM device and has a weak pull-
down resistor that is permanently enabled.
SM Command
Strobe SM_CLE 53 O12PD This pin is an active high Command Latch
Enable signal for the SM device and has a weak
pull-down resistor that is permanently enabled.
SM Data 7-0 SM_D[7:0] 39
40
41
42
43
44
45
46
I/O12PD These pins are the bi-directional data signals
SM_D7-SM_D0 and have weak internal pull-
down resistors.
SM Read Enable SM_nRE 55 O12PU This pin is an active low read strobe signal for
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Write Enable SM_nWE 48 O12PU This pin is an active low write strobe signal for
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Write Protect
Switch SM_nWPS 38 IPU A write-protect seal is detected when this pin is
low. This pin has a weak internal pull-up resistor.
SM Busy or Data
Ready SM_nB/R 56 IPU This pin is connected to the BSY/RDY pin of the
SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
2009 - 2015 Microchip Technology Inc. DS00002005A-page 12
USB2250/50i/51/51i
SM Chip Enable SM_nCE 54 O12PU This pin is the active low chip enable signal to
the SM device.
When using the internal FET, this pin has a
weak internal pull-up resistor that is tied to the
output of the internal power FET.
If an external FET is used (internal FET is
disabled), then the internal pull-up is not
available (external pull-ups must be used).
SM Card
Detection SM_nCD 57 I/O12 Designates as the Smart Media card detection
pin.
MEMORY STICK (MS) INTERFACE
MS Bus State MS_BS 91 O12 This pin is connected to the bus state pin of the
MS device.
It is used to control th e bus states 0, 1, 2 and 3
(BS0, BS1, BS2 and BS3) of the MS device.
MS Card Insertion MS_INS 98 IPU Designates as the Memo ry Stick card detection
pin.
MS System CLK MS_SCLK 101 O12 This pin is an output clock signal to the MS
device. The clock frequency is software
configurable.
MS System Data
In/Out MS_D[7:1] 100
97
93
95
99
96
92
I/O12PD MS_D[7:1]: These pins are the bi-directional
data signals for the MS device.
MS_D2 and MS_D3 have weak pull-down
resistors. MS_D1 has a pull-dow n resistor if it is
in parallel mode, otherwise it is disabled.
In 4- or 8-bit parallel mode, each MS_D7:1
signal has a weak pull-down resistor.
MS System Data
In/Out MS_D0 / 94 I/O12PD MS_D0: This pin is one of the bi-directional data
signals for the MS device.
In serial mode, the most significan t bit (MSB) of
each byte is transmitted first by either MSC or
the MS device on MS_D0, MS_D2, a nd MS_D3
(which have weak pull-down resistors). If
MS_D1 is in parallel mode, it has a pull-down
resistor; Otherwise, it is disabled.
In 4- or 8-bit parallel mode, the MS_D0 signal
has a weak pull-down resistor.
SECURE DIGITAL (SD) / MULTIMEDIACARD (MMC) INTERFACE
SD Data 7-0 SD_D[7:0] 13
11
19
21
22
23
10
12
I/O12PU These pins are bi-directional data signals
SD_D0 - SD_D7 and have weak pull-up
resistors.
SD Clock SD_CLK 18 O12 This is an output clock signal to the SD/MMC
device.
The clock frequency is software configurable.
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
USB2250/50i/51/51i
DS00002005A-page 13 2009 - 2015 Microchip Technology Inc.
SD Command SD_CMD 20 I/O12PU This is a bi-directional signal that connects to
the CMD signal of the SD/MMC device and has
a weak internal pull-up resistor.
SD Write
Protected SD_WP 105 I/O12 Designates as the Secure Digital card
mechanical write detect pin.
SD Card Detect SD_nCD 32 I/O12 Designates as the Secure Digital card detection
pin.
USB INTERFACE
USB Bus Data USB+
USB- 7
8I/O-U These pins connect to the USB bus data
signals.
USB Transceiver
Bias RBIAS 127 I-R A 12.0 k, ±1.0% resistor is attached from VSS
to this pin in order to set the transceiver's
internal bias currents.
24 MHz Crystal
Input (External
Clock Input)
XTAL1
(CLKIN) 124 ICLKx This pin can be connected to one terminal of the
crystal or it can be connected to an external
24/48 MHz clock when a crystal is not used.
The MA[1:0] pins will be sampled while
RESET_N is asserted, and the value will be
latched upon RESET_N negation. This will
determine the clock source and value.
24 MHz Crystal
Output XTAL2 123 OCLKx This is the other terminal of the crystal, or it is
left open when an external clock source is used
to drive XTAL1(CLKIN). It may not be used to
drive any external circuitry other than the crystal
circuit.
MEMORY / IO INTERFACE
Memory
Data Bus MD[7:0] 33
29
30
31
34
35
36
37
I/O12PU These signals are used to transfer data between
the internal CPU and the external program
memory and have weak internal pull-up
resistors.
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
2009 - 2015 Microchip Technology Inc. DS00002005A-page 14
USB2250/50i/51/51i
Memory
Address Bus MA16 28 O12 These signals address memory locations with in
the external memory.
MA[15:2] 2
4
107
1
113
24
111
109
106
108
110
112
114
116
O12 These signals address memory lo cations within
the external memory.
MA[1:0] /
CLK_
SEL[1:0]
25
27
O12 MA[1:0]: These signals address memory
locations within the external memory.
I/O12PD CLK_SEL[1:0]: During RESET_N assertion,
these pins will select the operating fre quency of
the external clock, and the corresponding weak
pull-down resistors are enabled.
When RESET_N is neg ated, the va lue on the se
pins will be latched internal ly and these p ins wi ll
revert to MA[1:0] functionality; the internal pull-
downs will be disabled.
CLK_SEL[1:0] = '00'. 24 MHz
CLK_SEL[1:0] = '01'. RESERVED
CLK_SEL[1:0] = '10'. RESERVED
CLK_SEL[1:0] = '11'. 48 MHz
If the latched value is '1', the corre sponding MA
pin is tri-stated when the chip is in power down
state.
If the latched value is '0', the corre sponding MA
pin will function identically to MA[15:3] pins at all
times (other than during RESET_N assertion).
Memory Write
Strobe nMWR 3 O12 This pin is the active low program Memory Write
strobe signal.
Memory Read
Strobe nMRD 115 O12 This pin is the active low program Memory Read
strobe signal.
Memory Chip
Enable nMCE 26 O12 This pin is the active low p rogram Memory Chip
Enable strobe signal.
This signal is asserted when any external
access is being done by the processor.
This signal is held to the logic 'high' while
RESET_N is asserted.
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
USB2250/50i/51/51i
DS00002005A-page 15 2009 - 2015 Microchip Technology Inc.
MISC
General Purpose
Input/Output LED 120 I/O12 LED: It can be used as an LED output.
VBUS_DET 121 I/O12 VBUS is a 3.3 volt input. A resistor divider must
be used if connecting to 5 volts of USB power.
SCL /
xD_ID
118 O12 SCL: This is the clock output when used with an
external EEPROM.
I/O12 xD_ID: This is the xD-Picture Card detection pin
only applicable to USB2250/USB2250i.
SDA 5 I/O12 SDA: This is the data pin when used with an
external serial EEPROM.
CRD_PWR0 14 I/O12 CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
I/O200
CRD_PWR1 78 I/O12 CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
I/O200
CRD_PWR2 76 I/O200 CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
Requirement: This must be the only FET used
to power SM devices. Failure to do this will
violate SM voltage specification on SM device
pins.
CRD_PWR3 16 I/O200 CRD_PWR: Card power drive of 3.3 V at either
100 mA or 200 mA.
Requirement: This must be the only FET used
to power SM devices. Failure to do this will
violate SM voltage specification on SM device
pins.
RESET Input RESET_N 64 IS This active low signal is used by the system to
reset the chip. The active low pulse should be
at least 1s wide.
TEST Input TEST 103 I Tie this pin to ground for normal operation.
Regulator Enable REG_EN 6 IPU This signal is used to enable the internal
1.8 V regulator.
DIGITAL POWER, and GROUND
1.8 V Digital Core
Power VDD18 49 If the internal regulator is enabled, then this pin
must have a 1.0 F (or greater) ±20% (ESR
<0.1 ) capacitor to VSS.
1.8 V PLL Power V DD18PLL 125 If the internal regulator is enabled, then this pin
must have a 1.0 F (or greater) ±20% (ESR
<0.1 ) capacitor to VSS.
3.3 V Power and
Voltage Regulator
Input
VDD33 15
50
65
77
104
128
If the internal regulator is enabled, pins 50 and
128 each require an external bypass capacitor
of 4.7 F minimum.
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
2009 - 2015 Microchip Technology Inc. DS00002005A-page 16
USB2250/50i/51/51i
Note 5-1 Hot-insertion capable card connectors are required for all flash media. It is required for the SD
connector to have a Write Protect switch. This allows the chip to detect the MMC card.
Note 5-2 nMCE is normally asserted except when the 8051 is in standby mode.
5.2 Buffer Type Descriptions
Ground VSS 9
17
51
75
81
102
122
126
Ground Reference
TA BLE 5-2: BUFFER TYPE DESCRIPTIONS
BUFFER DESCRIPTION
I Input.
IPU Input with internal weak pull-up resistor.
IPD Input with internal weak pull-down resistor.
IS Input with Schmitt trigger.
I/O12 Input/Output buffer with 12 mA sink and 12 mA source.
I/O200 Input/Output buffer 12 mA with FET disabled, 100/200 mA source only when the FET
is enabled.
I/O12PD Input/Output buffer with 12 mA sink and 12 mA source with an internal weak pull-d own
resistor.
I/O12PU Input/Output buffer with 12 mA sink and 12 mA source with a pull-up resistor.
O12 Output buffer with 12 mA source.
O12PU Output buffer with 12 mA sink and 12 mA source, with a pull-up resistor.
O12PD Output buffer with 12 mA sink and 12 mA source, with a pull-down resistor.
ICLKx XTAL clock input.
OCLKx XTAL clock output.
I/O-U Analog Input/Output as defined in the USB 2.0 Specification.
I-R RBIAS.
TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED)
Name Symbol 128-Pin
VTQFP Buffer
Type Description
2009 - 2015 Microchip Technology Inc. DS00002005A-page 17
USB2250/50i/51/51i
6.0 PIN RESET STATE TABLE
FIGURE 6-1: PIN RESET STATES
TABLE 6-1: LEGEND FOR PIN RESET STATES TABLE
Symbol Description
0 Output driven low
1 Output driven high
IP Input enabled
PU Hardware enables pull-up
PD Hardware enables pull-down
-- Hardware disables function
Z Hardware disables pad. Both output driver and
input buffers are disabled.
Voltage
Signal
(v)
Time
(t)
RESET
RESET
Hardware
Initialization Firmware
Operational
VDD33
VSS
USB2250/50i/51/51i
DS00002005A-page 18 2009 - 2015 Microchip Technology Inc.
6.1 128-Pin Reset States
6.2 128-Pin Reset States
TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES
Reset State Reset State
Pin Pin Name Function Input/
Out-
put
PU/
PD Pin Pin Name Function Input/
Out-
put
PU/
PD
85 CF_D0 None z -- 58 CF_nCD None IP pu
86 CF_D1 None z -- 46 SM_D0 SM zpd
88 CF_D2 None z -- 45 SM_D1 SM zpd
59 CF_D3 None z -- 44 SM_D2 SM zpd
61 CF_D4 None z -- 43 SM_D3 SM zpd
63 CF_D5 None z -- 42 SM_D4 SM zpd
67 CF_D6 None z -- 41 SM_D5 SM zpd
69 CF_D7 None z -- 40 SM_D6 SM zpd
87 CF_D8 None z -- 39 SM_D7 SM zpd
89 CF_D9 None z -- 52 SM_ALE SM zpd
90 CF_D10 None z -- 53 SM_CLE SM zpd
60 CF_D11 None z -- 47 SM_nWP SM zpd
62 CF_D12 None z -- 38 SM_nWPS SM z--
66 CF_D13 None z -- 57 SM_nCD None IP pu
68 CF_D14 None z -- 91 MS_BS MS zpd
70 CF_D15 None z-- 101 MS_SCLK MS zpd
72 CF_nIOR CF z -- 94 MS_D0 / MS_SDIO MS zpd
73 CF_nIOW CF z -- 92 MS_D1 MS zpd
74 CF_nIRQ CF z -- 96 MS_D2 MS zpd
79 CF_nRESET CF z -- 99 MS_D3 MS zpd
80 CF_IORDY CF z -- 95 MS_D4 MS zpd
71 CF_nCS0 CF z -- 93 MS_D5 MS zpd
84 CF_SA0 CF z -- 97 MS_D6 MS zpd
83 CF_SA1 CF z -- 100 MS_D7 MS zpd
82 CF_SA2 CF z-- 98 MS_INS None IP pu
2009 - 2015 Microchip Technology Inc. DS00002005A-page 19
USB2250/50i/51/51i
119 CF_DMACK None 0-- 20 SD_CMD SD z--
117 CF_DMARQ None 0-- 34 MD3 MA zpu
12 SD_D0 SD z-- 18 SD_CLK SD z--
10 SD_D1 SD z-- 31 MD4 MA zpu
23 SD_D2 SD z-- 30 MD5 MA zpu
22 SD_D3 SD z-- 29 MD6 MA zpu
21 SD_D4 SD z-- 33 MD7 MA zpu
19 SD_D5 SD z-- 115 nMRD MA 1--
11 SD_D6 SD z-- 26 nMCE MA 1--
13 SD_D7 SD z-- 120 LED None 0--
105 SD_WP None 0-- 118 S C L / x D _ ID N on e 0--
32 SD_nCD None IP pu 14 CRD_PWR0 None z--
27 MA0 / CLK_SEL0 MA IP pd 78 CRD_PWR1 None z--
25 MA1 / CLK_SEL1 MA IP pd 76 CRD_PWR2 None z--
116 MA2 MA IP pd 16 CRD_PWR3 None z--
114 MA3 MA IP pd 103 TEST TEST IP --
112 MA4 MA 0-- 64 nRESET nRESET IP --
110 MA5 MA 0-- 1MA12 MA
0--
108 MA6 MA 0-- 4MA14 MA
0--
106 MA7 MA 0-- 2MA15 MA
0--
109 MA8 MA 0-- 3nMWR MA
1--
111 MA9 MA 0-- 121 VBUS_DET None IP --
24 MA10 MA 0-- 5 SDA None 0pu
113 MA11 MA 0-- 55 SM_nRE SM z--
107 MA13 MA 0-- 48 SM_nWE SM z--
28 MA16 MA 0-- 56 SM_nB/R SM z--
37 MD0 MA zpu 54 SM_nCE SM z--
TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED)
Reset State Reset State
Pin Pin Name Function Input/
Out-
put
PU/
PD Pin Pin Name Function Input/
Out-
put
PU/
PD
USB2250/50i/51/51i
DS00002005A-page 20 2009 - 2015 Microchip Technology Inc.
36 MD1 MA zpu 7 USB+ USB+ z--
35 MD2 MA zpu 8 USB- USB- z--
TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED)
Reset State Reset State
Pin Pin Name Function Input/
Out-
put
PU/
PD Pin Pin Name Function Input/
Out-
put
PU/
PD
2009 - 2015 Microchip Technology Inc. DS00002005A-page 21
USB2250/50i/51/51i
7.0 CONFIGURATION OPTIONS
7.1 Card Reader
The Microchip USB22 50/50i/51/51i is fully complia nt with the following flash media card reader specifications:
• Compact Flash 4.1
- CF UDMA Modes 0-4
- CF PIO Modes 0-6
• Secure Digital 2.0
- HS-SD and HC-SD
- TransFlash™ and reduced form factor media
• MultiMediaCard 4.2
- 1/4/8 bit MMC
• Memory Stick 1.43
• Memory Stick Pro Format 1.02
• Memory Stick Pro-HG Duo Format 1.01
- Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro
• Memory Stick Duo 1.10
• Smart Media 1.3
• xD-Picture Card 1.2
7.1.1 VBUS DETECT
According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or D- pull-up resistors
unless the upstream port’s VBUS is in the asserted (powered) state. The VBUS_DET pin on the device mo nitors the
state of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from an active
to an inactive state (not powered), the device will remove power from the D+ pull-up resistor within 10 seconds.
7.2 System Configurations
7.2.1 EEPROM
The USB2250/50i/51/51i can be configured via a 2-wire (I2C) EEPROM (512x8) flash device containing the options for
the USB2250/50i/51/51i. If an external configuration device does not exist the internal default values will be used. If one
of the external devices is used for configuration, the OEM can update the values through the USB interface. The device
will then “attach” to the upstream USB host.
The USBDM tool set is availabl e in the USB225x Card Reader software release package. To downlo ad the software
package from Microchip's website, please visit:
http://www.microchip.com/SWLibraryWeb/producttc.aspx?product=OBJ%20files%20for%20USB2250
to go to the OBJ Card Reader Software Download Agreement. Review the license, and if you agree, check the "I agree"
box and then select “Confirm”. You will then be able to download the USB225x Card reader combo release package zip
files containing the USBDM tool set. Please note that the following applies to the system values and descriptions when
used:
• N/A = Not applicable to this part
• Reserved = For internal use
USB2250/50i/51/51i
DS00002005A-page 22 2009 - 2015 Microchip Technology Inc.
7.2.2 EEPROM DATA DESCRIPTOR
TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS
Address Register Nam e Description Internal Default Value
00h USB_SER_LEN USB Serial String
Descriptor Length 1Ah
01h USB_SER_TYP USB Serial String
Descriptor Type 03h
02h-19h USB_SER_NUM USB Serial Number "000000225001"
(See Note 7-1 )
1Ah-1Bh USB_VID USB Vendor Identifier 0424
1Ch-1Dh USB_PID USB Product Identifier 2250
1Eh USB_LANG_LEN USB Language String Descriptor
Length 04h
1Fh USB_LANG_TYP USB Language String Descriptor
Type 03h
20h USB_LANG_ID_LSB USB Language Identifier
Least Significant Byte 09h
(See Note 7-2 )
21h USB_LANG_ID_MSB USB Language Identifier
Most Significant Byte 04h
(See Note 7-2 )
22h USB_MFR_STR_LEN USB Manufacturer String
Descriptor Length 10h
23h USB_MFR_STR_TYP USB Manufacturer String
Descriptor Type 03h
24h-31h USB_MFR_STR USB Manufacturer String “Generic”
(See Note 7-1 )
32h-5Dh Reserved - 00h
5Eh USB_PRD_STR_LEN USB Product String
Descriptor Length 24h
5Fh USB_PRD_STR_TYP USB Product String
Descriptor Type 03h
60h-99h USB_PRD_STR USB Product String "Flash Card Reader"
(See Note 7-1 )
9Ah USB_BM_ATT USB BmAttribute 80h
9Bh USB_MAX_PWR USB Max Power 30h (96 mA)
9Ch ATT_LB Attribute Lo byte 40h (Reverse SD_WP only)
9Dh ATT_HLB Attribute Hi Lo byte 00h
9Eh ATT_LHB Attribute Lo Hi byte 00h
9Fh ATT_HB Attribute Hi byte 00h
A0h MS_PWR_LB Memory Stick Device
Power Lo byte 08h
A1h MS_PWR_HB Memory Stick Device
Power Hi byte 00h
A2h CF_PWR_LB Compact Flash Device
Power Lo byte 80h
A3h CF_PWR_HB Compact Flash Device
Power Hi byte 00h
A4h SM_PWR_LB Smart Media Device
Power Lo byte 00h
A5h SM_PWR_HB Smart Media Device
Power Hi byte 08h
A6h SD_PWR_LB Secure Digital Device
Power Lo byte 00h
2009 - 2015 Microchip Technology Inc. DS00002005A-page 23
USB2250/50i/51/51i
Note 7-1 This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification
(Revision 2.0, 2000). Values in double quotations without this note are ASCII values.
Note 7-2 For a list of the most current 16-bit language ID’s defined by the USB-IF, please visit
http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version
4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts.
7.2.3 EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS
7.2.3.1 00h: USB Serial String Descriptor Length
7.2.3.2 01h: USB Serial String Descriptor Type
7.2.3.3 02h-19h: USB S eri al Num b er Opt ion
7.2.3.4 1Ah-1Bh: USB Vendor ID Option
A7h SD_PWR_HB Secure Digital Device
Power Hi byte 80h
A8h LED_BLK_INT LED Blink Interval 02h
A9h LED_BLK_DUR LED Blink After Access 28h
AAh - B0h DEV0_ID_STR Device 0 Identifier String “CF”
B1h - B7h DEV1_ID_STR Device 1 Identifier String “MS”
B8h - BEh DEV2_ID_STR Device 2 Identifier String “SM”
BFh - C5h DEV3_ID_STR Device 3 Identifier String “SD/MMC”
C6h - CDh INQ_VEN_STR Inquiry Vendor String “Generic”
CEh-D2h INQ_PRD_STR Inquiry Product String 2250
D3h DYN_NUM_LUN Dynamic Number of LUNs FFh
D4h - D7h DEV_LUN_MAP Device to LUN Mapping FFh, FFh, FFh, FFh
D8h - DAh MS_BUS_TIMINGReserved - 00h, 03h, 07h
DBh - DDh MS_BUS_TIMINGReserved - 5Ch, 56h, 97h
DEh-FBh Not Applicable - 00h
FCh-FFh NVSTORE_SIG Non-Volatile Storage Signature “ATA2”
Byte Name Description
0 USB_SER_LEN USB serial string descriptor l ength as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the string descriptor (in bytes).
Byte Name Description
1 USB_SER_TYP USB serial string descriptor type as defined by Section 9.6.7 “String” of the
USB 2.0 Specification (Revisio n 2.0, 2000). This fiel d is the “bDescrip torTy pe”
which is a constant value associated with a string descriptor type.
Byte Name Description
25:2 USB_SER_NUM Maximum string length is 12 hex digits. Must be unique to each device.
Byte Name Description
1:0 USB_VID This ID is unique for every vendor. The vendor ID is assigned by the USB
Implementer’s Forum.
TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED)
Address Register Name Description Internal Default Value
USB2250/50i/51/51i
DS00002005A-page 24 2009 - 2015 Microchip Technology Inc.
7.2.3.5 1Ch-1Dh: USB Product ID Option
7.2.3.6 1Eh: USB Language Identifier Descriptor Length
7.2.3.7 1Fh: USB Language Identifier Descriptor Type
7.2.3.8 2 0h: USB Language Identifier Least Significant Byte
7.2.3.9 21h: USB Language Identifier Most Significant Byte
7.2.3.10 22h: USB Manufacturer String Descriptor Length
7.2.3.11 23h: USB Manufacturer String Descri ptor Type
7.2.3.12 24h-31h: USB Manufacturer String Option
Byte Name Description
1:0 USB_PID This ID is unique for every product. The product ID is assigned by the vendor.
Byte Name Description
0 USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
Byte Name Description
1 USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 “String” o f
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
Byte Name Description
2 USB_LANG_ID
_LSB English language code = ‘0409’. See Note 7-2 to reference additi onal language
ID’s defined by the USB-IF.
Byte Name Description
3 USB_LANG_ID
_MSB English language code = ‘0409’. See Note 7-2 to reference additional language
ID’s defined by the USB-IF.
Byte Name Description
0 USB_MFR_STR
_LEN USB manufacturer string descriptor length as defined by Section 9.6.7 “String”
of the USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength”
which describes the size of the string descriptor (in bytes).
Byte Name Description
1 USB_MFR_STR
_TYP USB manufacturer string descriptor type as defined by Section 9.6.7 “String” of
the USB 2.0 Specification (Revision 2.0, 2000). This field is the
“bDescriptorType” which is a constant value associated with a string descriptor
type.
Byte Name Description
15:2 USB_MFR_STR Maximum string length is 29 characters.
2009 - 2015 Microchip Technology Inc. DS00002005A-page 25
USB2250/50i/51/51i
7.2.3.13 32h-5Dh: Reserved
7.2.3.14 5Eh: USB Product S tring Descriptor Length
7.2.3.15 5Fh: USB Product String Descriptor Type
7.2.3.16 60h-99h : USB P ro du ct String Option
7.2.3.17 9Ah: USB BmAttribute (1 byte)
7.2.3.18 9Bh: USB MaxPo we r (1 byte )
Byte Name Description
59:16 Reserved Reserved.
Byte Name Description
0 USB_PRD_STR
_LEN USB product string descriptor length as defined by Section 9.6.7 “S tring” of the
USB 2.0 Specification (Revision 2.0, 2000). This field is the “bLength” which
describes the size of the strin g descriptor (in bytes). Maximum string length is
29 characters
Byte Name Description
1 USB_PRD_STR
_TYP USB product string descriptor type as defin ed by Section 9.6.7 “String” of the
USB 2.0 Specification (Revision 2.0, 2 000) . This field is the “bDe scripto rTy pe”
which is a constant value associated with a string descriptor type.
Byte Name Description
59:2 USB_PRD_STR This string will be used during the USB enumeration process in the Windows®
operating system. Maximum string length is 29 characters.
Byte Name Description
7:0 USB_BM_ATT Self- or Bus-Power: Selects between self- and bus-powered operation.
The hub is either self-powered (draws less than 2 mA) or bus-powered (limited
to 100 mA maximum power prior to being configured by the host controller).
When configured as a bus-powered device, the Microchip device consumes
less than 100 mA of current prio r to being configured. After configuration, th e
bus-powered Microchip device (al ong with all associated device circui try, an y
embedded devices if part of a compound device, and 100 mA per externally
available downstream port) must consume no more than 500 mA of current.
The current consumption is system dependent, and the OEM must ensure that
the USB 2.0 Specification is not violated.
When configured as a self-powered device, <1 mA of current is consumed and
all ports are available, with each port being capable of sourcing 500 mA of
current.
80 = Bus-powered operation (default)
C0 = Self-powered operation
A0 = Bus-powered operation with remote wake-up
E0 = Self-powered operation with remote wake-up
Byte Name Description
7:0 USB_MAX_PWR USB Max Power per the USB 2.0 Specification. Do NOT set th is value greater
than 100 mA.
USB2250/50i/51/51i
DS00002005A-page 26 2009 - 2015 Microchip Technology Inc.
7.2.3.19 9Ch-9Fh: Attribute Byte Descriptions
7.2.4 A0H-A7H: DEVICE POWER CONFIGURATION
The USB2250/50i/51/51i has four internal FETs which can be utilized for card power . This section describes the default
internal configuration. The settings are stored in NVSTORE and provide the following features:
1. A card can be powered by an external FET or by an internal FET.
2. The power li mit can be set to 100 mA or 200 mA (Default) for the internal FET.
Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power
FET options. For internal F ET card power control, bits 0 through 2 are used to set the power limit. The “Device Power
Configuration” bits are ignored unless the “Enable Device Power Configuration” bit is set. See Secti on 7.2.3.19, "9 Ch-
9Fh: Attribute Byte Descriptions," on page 2 6 .
Byte Byte Name Bit Description
0 ATT_LB 3:0 Always reads ‘0’.
4 Inquire Manufacturer and Product ID Strings
‘1’ - Use the Inquiry Manufacturer and Product ID Strings.
‘0’ (default) - Use the USB Descriptor Manufacturer and Product ID Strings.
5 Always reads ‘0’.
6 Reverse SD Card Write Protect Sense
‘1’ (default) - SD cards will be write protected when SW_nWP is high, and
writable when SW_nWP is low.
‘0’ - SD cards will be write protected when SW_nWP is low, and writable
when SW_nWP is high.
7 Reserved.
1 ATT_HLB 3:0 Always reads ‘0’.
4 Activity LED True Polarity
‘1’ - Activity LED to Low True.
‘0’ (default) - Activity LED polarity to High True.
5 Common Media Insert / Media Activity LED
‘1’ - The activity LED will function as a common media inserted/media access
LED.
‘0’ (default) - The activity LED will remain in its idle state until media is
accessed.
6 Always reads ‘0’.
7 Reserved.
2 ATT_LHB 0 Attach on Card Insert / Detach on Card Removal
‘1’ - Attach on Insert is enabled.
‘0’ (default) - Attach on Insert is disabled.
1 Always reads ‘0’.
2 Enable Device Power Configuration
‘1’ - Custom Device Power Configuration stored in the NVSTORE is used.
‘0’ (default) - Default Device Power Configuration is used.
7:3 Always reads ‘0’.
3 ATT_HB 6:0 Always reads ‘0’.
7 xD Player Mode
2009 - 2015 Microchip Technology Inc. DS00002005A-page 27
USB2250/50i/51/51i
7.2.4.1 A0h-A1h : Me m or y Stick Device Power Configuration
7.2.4.2 A2h-A3h: Compact Flash Device Power Configuration
7.2.4.3 A4h-A5h: Smart Media Device Power Configuration
7.2.4.4 A6h-A7h: Sec ur e Digital Device Po wer Con fig ur at ion
FET Type Bits Bit Type Description
0 FET Lo Byte
MS_PWR_LB 3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
MS_PWR_HB 3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
FET Type Bits Bit Type Description
0 FET Lo Byte
CF_PWR_LB 3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
CF_PWR_HB 3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
FET Type Bits Bit Type Description
0 FET Lo Byte
SM_PWR_LB 3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
SM_PWR_HB 3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
FET Type Bits Bit Type Description
0 FET Lo Byte
SD_PWR_LB 3:0 Low Nibble 0000b Disabled
1 7:4 High Nibble
2 FET Hi Byte
SD_PWR_HB 3:0 Low Nibble 0000b Disabled
0001b External FET enabled
1000b Internal FET with 100 mA power limit
1010b Internal FET with 200 mA power limit
3 7:4 High Nibble 0000b Disabled
USB2250/50i/51/51i
DS00002005A-page 28 2009 - 2015 Microchip Technology Inc.
7.2.4.5 A8h: LED Blink Interval
7.2.4.6 A9h: LED Blink Duration
7.2.5 DEVICE ID STRINGS
These bytes are used to specify the LUN descrip tor returned by the de vice. These bytes are used in combination with
the device to LUN mapping b ytes in applications where the OEM wishes to reorde r and rename the LUNs. If multiple
devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_ STR will be used to na me the COMBO
LUN instead of the individual device stri ngs. When applicable, th e "SM" value will be overridden with xD once an xD-
Picture Card has been identified.
7.2.5.1 AAh-B0h: Device 0 Identifier String
7.2.5.2 B1h-B7h: Device 1 Identifier String
7.2.5.3 B8h-BEh: Device 2 Identifier String
7.2.5.4 BFh-C5h: Device 3 Identifier String
7.2.5.5 C6h-CDh: Inquiry Vendor String
Byte Name Description
0 LED_BLK_INT The blink rate is programmable in 50 ms intervals. The high bit (7) indicates
an idle state:
‘0’ - Off
‘1’ - On
The remaining bits (6:0) are used to determine the blink interval up to a max
of 63 x 50 ms.
Byte Name Description
1 LED_BLK_DUR LED Blink After Access. This byte is used to designate the number of seconds
that the LED will continue to blink after a drive access. Setting this byte to "05"
will cause the LED to blink for 5 seconds after a drive access.
Byte Name Description
6:0 DEV0_ID_STR Not applicable.
Byte Name Description
6:0 DEV1_ID_STR This ID string is associated with the Memory Stick device.
Byte Name Description
6:0 DEV2_ID_STR This ID string is associated with the Smart Media device.
Byte Name Description
6:0 DEV3_ID_STR This ID string is associated with the Secure Digital / MultiMediaCard device.
Byte Name Description
7:0 INQ_VEN_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
2009 - 2015 Microchip Technology Inc. DS00002005A-page 29
USB2250/50i/51/51i
7.2.5.6 CEh-D2h: Inquiry Product String
7.2.5.7 D3h: Dynamic Number of LUNs
7.2.5.8 D4h-D7h: Device to LUN Mapping
7.2.5.9 D8h-FBh: Not Applicable
7.2.5.10 FCh-FFh: Non-Volatile Storage Signature
Byte Name Description
4:0 INQ_PRD_STR If bit 4 of the 1st attribute byte is set, the device will use these strings in
response to a USB inquiry command, instead of the USB descriptor
manufacturer and product ID strings.
Byte Name Description
7:0 DYN_NUM_LUN These bytes are used to specify the number of LUNs the device exposes to
the host. These bytes are also used for icon sharing b y assigning more than
one LUN to a single icon. This is used in applications where the device utilizes
a combo socket and th e OEM wishes to have only a single icon d isplayed fo r
one or more interfaces.
If this field is set to "FF", the program assumes that you are using the default
value and icons will be configured per the default configuration.
Byte Name Description
3:0 DEV_ LUN_MAP These registers map a device c ontroller (SD/MMC, SM, and MS) to a Logical
Unit Number (LUN). Th e device reports the mapped LUN s to the USB host i n
the USB descriptor during enumeration. The icon installer associates custom
icons with the LUNs specified in these fields.
Setting a register to "FF" indicates that the device is not mapped. Setting all
of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the
default mapping configuration. Not all configurations are valid. Valid
configurations depend on the hardware, packaging, and OEM board layout.
The number of unique LUNs mapped must match the value in the Section
7.2.5.7, "D3h: Dynamic Number of LUNs," on page 29.
Byte Name Description
35:0 Not Applicable Not Applicable.
Byte Name Description
3:0 NVSTORE_SIG This signature is used to verify the validity of the data in the first 256 bytes of
the configuration area. The signature must be set to ‘ATA2’ for
USB2250/50i/51/51i.
USB2250/50i/51/51i
DS00002005A-page 30 2009 - 2015 Microchip Technology Inc.
7.3 Default Configuration Option
The Microchip device can be configured via its internal default configuration. Please see Section 7.2.2, "EEPROM Data
Descriptor" for specific details on how to enable default configura tion. Please re fer to Table 7-1 for the inte rnal default
values that are loaded when this option is selected.
7.3.1 EXTERNAL HARDWARE NRESET
A valid hardware reset is defined as assertion of nRESET for a minimum of 1 s af ter all power supplies are within oper-
ating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 A of
current.
Assertion of nRESET (external pin) causes the following:
1. The PHY is disabled and the differential pair will be in a high-impedance state.
2. All transactions immediately te rminate; no states are saved.
3. All internal registers return to the default state.
4. The external crystal oscillator is halted.
5. The PL L is halted.
6. The processor is reset.
7. All media interfaces are reset.
7.3.1.1 nRESET for EEPROM Configuration
FIGURE 7-1: NRESET TIMING FOR EEPROM MODE
TABLE 7-2: NRESET TIMING FOR EEPROM MODE
Name Description MIN TYP MAX Units
t1 nRESET asserted 1 sec
t2 Device recovery/stabilization 500 sec
t3 8051 programs device configuration 20 50 msec
t4 USB attach 100 msec
t5 Host acknowledges attach and signals USB reset 100 msec
t6 USB idle Undefined msec
t7 Ready to handle requests (with or without data) 5 msec
Note: All power supplies must have reached the operating levels mandated in Section 9.0, "DC Parameters",
prior to (or coincident with) the assertion of nRESET.
t1 t2 t4 t5 t6 t7
nRESET
VSS
Hardware
re se t
asserted
Device
Recovery/
Stabilization
8051 Sets
Configuration
Registers
Attach
USB
Upstream
USB Reset
recovery Idle
Start
com pletion
request
response
t3
2009 - 2015 Microchip Technology Inc. DS00002005A-page 31
USB2250/50i/51/51i
7.3.2 USB BUS RESET
In response to the upstream port signaling a re set to the device, the device does the following:
1. Sets default address to ‘0’.
2. Sets configuration to: Unconfigured.
3. All transactions are stopped.
4. Processor reinitializes and restarts.
5. All media interfaces are disabled.
2009 - 2015 Microchip Technology Inc. DS00002005A-page 32
USB2250/50i/51/51i
8.0 AC SPECIFICATIONS
8.1 Oscillator/Crystal
Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm.
Note 8-1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should
be set to ‘0’ for use in the calculation of the capacitance formulas in Figure 8-2, "Capacitance
Formulas". However, the OEM PCB itself may present a parasitic capacitance between XTAL1 and
XTAL2. For an accurate calculation of C1 and C2, take the parasitic capacitance between traces
XTAL1 and XTAL2 into account.
Note 8-2 Each of these capacitance values is typically approximately 18 pF.
FIGURE 8-1: TYPICAL CRYSTAL CIRCUIT
TABLE 8-1: CRYSTAL CIRCUIT LEGEND
Symbol Description In Accordance With
C0Crystal shunt capacitance Crystal manufacturer’s specification (See Note 8-1)
CLCrystal load capacitance
CBTotal board or trace capacitance OEM board design
CSStray capacitance Microchip IC and OEM board design
CXTAL XTAL pin input capacitance Microchip IC
C1Load capacitors installed on OEM
board Calculated values based on Figure 8-2, "Capacitance
Formulas" (See Note 8-2)
C2
FIGURE 8-2: CAPACITANCE FORMULAS
XTAL1
(CS1 = CB1 + CXTAL1 )
XTAL2
(CS2 = CB2 + CXTAL2 )
C1
C2
CL1 M
Crystal
C0
C1 = 2 x (CL – C0) – C S1
C2 = 2 x (CL – C0) – CS2
USB2250/50i/51/51i
DS00002005A-page 33 2009 - 2015 Microchip Technology Inc.
8.2 Ceramic Resonator
24 MHz 350 ppm
8.3 External Clock
50% Duty cycle 10%, 24/48 MHz 350 ppm, Jitter < 100 ps rms.
The external clock is recommended to conform to the signa ling level designated in the JESD76-2 specificati on on 1.8
V CMOS Logic. XTAL2 should be treated as a no connect.
FIGURE 8-3: CERAMIC RESONATOR USAGE WITH MICROCHIP IC
XTAL1
XTAL2
1 M
24 MHz
Ceramic
Resonator
2009 - 2015 Microchip Technology Inc. DS00002005A-page 34
USB2250/50i/51/51i
9.0 DC PARAMETERS
9.1 Maximum Ratings
Note 9-1 Stresses above the specified parameters may cause permanent damage to the device. This is a
stress rating only and functional operation of the de vice at any condition ab ove those indicated in the
operation sections of this specification is not implied.
Note 9-2 When powe ring this device fro m laborato ry or system power supplies, it is important that the absolute
maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage
spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on
the AC power line may appear on the DC output. When this possibility exists, it is suggested that a
clamp circuit be used.
Parameter Symbol MIN MAX Units Comments
Storage
Temperature TA-55 150 °C
Lead
Temperature °C Please refer to JEDEC
specification J-STD-020D.
3.3 V supply
voltage VDD33 -0.5 4.0 V
Voltage on
USB+ and USB-
pins
-0.5 (3.3 V supply voltage + 2) 6V
Voltage on
CRD_PWR0,
CRD_PWR1,
CRD_PWR2 and
CRD_PWR3
-0.5 VDD33 + 0.3 V When internal power FET
operation of these pins are
enabled, these pins may be
simultaneously shorted to
ground or any voltage up to 3.63
V indefinitely, without damage to
the device as long as VDD33 is
less than 3.63 V and TA is less
than 70oC.
Voltage on any
signal pin -0.5 VDD33 + 0.3 V
Voltage on
XTAL1 -0.5 3.6 V
Voltage on
XTAL2 -0.5 VDD18 + 0.3 V
FIGURE 9-1: SUPPLY RISE TIME MODEL
t10%
10%
90%
Voltage tRT
t90% Time
100%
3.3 V
VSS
VDD33
USB2250/50i/51/51i
DS00002005A-page 35 2009 - 2015 Microchip Technology Inc.
Note 9-3 When p owering the device, the maximum power su pply ramp time should be se t at a rate faster than
400 s. This speed is important to ensure that the device resets properly. Measure rise time at 10%
and 90%.
9.2 Operating Conditions
Note 9-4 A 3.3 V regulator with an output tolerance of 1% must be used if the output of the internal power
FET’s must support a 5% tolerance.
9.3 DC Electrical Characteristics
Parameter Symbol MIN MAX Units Comments
Operating
Temperature
Commercial Part
Industrial Part
TA
TA
0
-40
70
85
°C
°C
Ambient temperature in still air.
3.3 V supply voltage VDD33 3.0 3.6 V (Note 9-4)
3.3 V supply rise time tRT 0 400 s (See Figure 9-1 and Note 9-3)
Voltage on
USB+ and USB- pins -0.3 5.5 V If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5 5.5
Voltage on any signal
pin -0.3 VDD33 V
Voltage on XTAL1 -0.3 VDD33 V
Voltage on XTAL2 -0.3 VDD18 V
Parameter Symbol MIN TYP MAX Units Comments
I, IPU, IPD Type Input Buffer
Low Input Level
High Input Level
Pull Down
Pull Up
VILI
VIHI
PD
PU
2.0
72
58
0.8 V
V
A
A
TTL Levels
IS Type Input Buffer
Low Input Level
High Input Level
Hysteresis
VILI
VIHI
VHYSI
2.0
420
0.8 V
V
mV
TTL Levels
ICLK Input Buffer
Low Input Level
High Input Level
Input Leakage
VILCK
VIHCK
IIL
1.4
-10
0.5
+10
V
V
AVIN = 0 to VDD33
2009 - 2015 Microchip Technology Inc. DS00002005A-page 36
USB2250/50i/51/51i
Input Leakage
(All I and IS buffers)
Low Input Leakage
High Input Leakage
IIL
IIH
-10
-10
+10
+10
A
A
VIN = 0
VIN = VDD33
O12 Type Buffer
Low Output Level
High Output Level
Output Leakage
VOL
VOH
IOL
VDD33
- 0.4
-10
0.4
+10
V
V
A
IOL = 12 mA @
VDD33= 3.3 V
IOH = -12 mA @
VDD33= 3.3 V
VIN = 0 to VDD33
(Note 9-5)
I/O12, I/O12PU & I/O12PD Type
Buffer
Low Output Level
High Output Level
Output Leakage
Pull Down
Pull Up
VOL
VOH
IOL
PD
PU
VDD33
- 0.4
-10
72
58
0.4
+10
V
V
A
A
A
IOL = 12 mA @
VDD33= 3.3 V
IOH = -12 mA @
VDD33= 3.3 V
VIN = 0 to VDD33
(Note 9-5)
IO-U
(Note 9-6)
I-R
(Note 9-7)
I/O200
Integrated Power FET for
CRD_PWR0, CRD_PWR1,
CRD_PWR2 and CRD_PWR3
High Output Current Mode
Low Output Current Mode
(Note 9-8)
On Resistance
(Note 9-8)
Output Voltage Rise Time
IOUT
IOUT
RDSON
tDSON
200
100
2.1
800
mA
mA
s
VdropFET = 0.46 V
VdropFET = 0.23 V
IFET = 70 mA
CLOAD = 10 F
Supply Current Unconfigured ICCINIT 80 90 mA
Parameter Symbol MIN TYP MAX Units Comments
USB2250/50i/51/51i
DS00002005A-page 37 2009 - 2015 Microchip Technology Inc.
Note 9-5 Output leakage is measured with the current pins in high impedance.
Note 9-6 See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
Note 9-7 RBIAS is a 3.3 V tolerant analog pin.
Note 9-8 Output current range is controlled by program software, software disables FET during short circuit
condition.
9.4 Capacitance
TA = 25°C; fc = 1 MHz; VDD, VDDP = 1.8 V
9.5 Package Thermal Specification
Note 9-9 Thermal parameters are measured or estimated fo r devi ces with the expose d pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
Supply Current Active
Full Speed
High Speed
ICC
ICC
110
135
140
165
mA
mA
VDD33 = 3.3 V
Supply Current Suspend ICSBY 350 750 AV
DD33, V = 3.3 V
Industrial Temperature Suspend ICSBYI 350 950 A
Parameter Symbol Limits Unit Te st Condition
MIN TYP MAX
Clock Input Capacitance CXTAL 2 pF All pins (except USB pins and
pins under test) are tied to AC
ground.
Input Capacitance CIN 10 pF
Output Capacitance COUT 20 pF
TABLE 9-1: 128-PIN VTQFP PACKAGE THERMAL PARAMETERS
Parameter Velocity
(meters/sec) Symbol Value Unit
Thermal Resistance 0
JA
55 °C/W148
245
Junction-to-Top-of-Package 0
JT
18 °C/W118
218
Parameter Symbol MIN TYP MAX Units Comments
2009 - 2015 Microchip Technology Inc. DS00002005A-page 38
USB2250/50i/51/51i
10.0 PACKAGE OUTLINE
FIGURE 10-1: 128-PIN VTQFP, 14X14X1.0 MM BODY, 2.0 MM PITCH
Note: For the most current package drawings,
see the Microchip Packaging Specification at
http://www.microchip.com/packaging
2009 - 2015 Microchip Technology Inc. DS00002005A-page 39
USB2250/50i/51/51i
APPENDIX A: DATA SHEET REVISION HISTORY
TABLE A-1: REVISION HISTORY
REVISION LEVEL & DATE SECTION/FIGURE/ENTRY CORRECTION
DS00002005A (10-22-15) Replaces previous SMSC version Rev. 2.0 (09-29-09)
2009 - 2015 Microchip Technology Inc. DS00002005A-page 40
USB2250/50i/51/51i
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
2009 - 2015 Microchip Technology Inc. DS00002005A-page 41
USB2250/50i/51/51i
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser , the web site con-
tains the following information:
•Product Support – Data she ets and errata, applicatio n notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
•General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
groups, Microchip consultant program member listing
•Business of Mic r oc hi p – Product selector and ordering guides, latest Microchip press releases, listing of semi-
nars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive
e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or
development tool of interest.
To register, access the Mi croc hip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
cation” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is i ncluded in the back of this docu-
ment.
Technical support is available through the web site at: http://www.microchip.com/support
2009 - 2015 Microchip Technology Inc. DS00002005A-page 42
USB2250/50i/51/51i
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be super-
seded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REP-
RESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELA TED TO THE INFORMA TION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANT ABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Micro-
chip devices in life support and/or safety applications is entirely at the buyer ’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all dam ages, claims, suits, or expenses result ing from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC , FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoL yzer , PIC, PICSTART, PIC32 logo, RightTouch, S pyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity , KleerNet, KleerNet logo, MiWi, motorBench, MP ASM, MPF , MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE,
SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2009 - 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781632777751
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts
allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act .
Microchip received ISO/TS-16949:200 9 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and
analog product s. In addition, Microchip ’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
2009 - 2015 Microchip Technology Inc. DS00002005A-page 43
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5 800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15