USB2250/50i/51/51i Ultra Fast USB 2.0 Multi-Slot Flash Media Controller General Description The Microchip USB2250/50i/51/51i is a USB 2.0 compliant, Hi-Speed mass storage class peripheral controller intended for reading and writing to more than 24 popular flash media formats from the CompactFlash(R) (CF), SmartMediaTM (SM), xD-Picture CardTM (xD)1, Memory Stick(R) (MS), Secure Digital (SD), and MultiMediaCardTM (MMC) families. The USB2250/50i/51/51i is a fully integrated, single chip solution capable of ultra high performance operation. Average sustained transfer rates exceeding 35 MB/s are possible if the media and host can support those rates. Highlights * 128-pin VTQFP (14x14 mm) RoHS compliant package * Targeted for applications in which single or "combo" media sockets are used * Supports multiple simultaneous card insertions * Flexible assignment of number of LUNs and how card types are associated with the LUNs * Hardware-controlled data flow architecture for all self-mapped media * Pipelined hardware support for access to nonself-mapped media * Order number with "i" denotes the version that supports the industrial temperature range of -40C to 85C Hardware Features * Single chip flash media controller with non-multiplexed interface for independent card sockets * Flash Media Specification Revision Compliance - CompactFlash 4.1 - Secure Digital 2.0 - MultiMediaCard 4.2 * MMC Streaming Mode support - Memory Stick 1.43 - Memory Stick Pro Format 1.02 - Memory Stick Duo Format 1.10 - Memory Stick Pro-HG Duo Format 1.01 - xD-Picture Card 1.2 - SmartMedia 1.3 1.) xD-Picture Card not applicable to USB2251. 2009 - 2015 Microchip Technology Inc. * Extended configuration options - xD player mode operation - Socket switch polarities, etc. * Media Activity LED * On board 24 MHz crystal driver circuit * Optional external 24 MHz clock input - 4 Independent internal card power FETs - 200 mA each - "Fold-back" short circuit protection * 8051 8-bit microprocessor - 60 MHz - single cycle execution - 64 KB ROM | 14 KB RAM * Internal regulator for 1.8 V core operation * Optimized pinout improves signal routing which eases implementation for improved signal integrity OEM Selectable * Vendor, product, and language IDs * Manufacturer ID and product strings (28 character) * Serial number string (12h digit max) * Customizable vendor specific data by optional use of external serial EEPROM * Bus- or self-powered selection * LED blink interval or duration * Internal power FET configuration Software Features * Optimized for low latency interrupt handling * Reduced memory footprint * Device Firmware Upgrade (DFU) support of external EEPROM or External Flash - Assembly line support - End user field upgrade support - DFU Package consists of driver, firmware, sample DFU application and source code, DFU driver API * Optional custom firmware with up to 128 KB external ROM Applications * * * * * * Flash Media Card Reader/Writer Printers Desktop and Mobile PCs Consumer A/V Media Players/Viewers Vista ReadyBoostTM DS00002005A-page 1 USB2250/50i/51/51i TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: * Microchip's Worldwide Web site; http://www.microchip.com * Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS00002005A-page 2 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i Table of Contents 1.0 Introduction ..................................................................................................................................................................................... 4 2.0 Pin Configuration ............................................................................................................................................................................ 6 3.0 Block Diagram ................................................................................................................................................................................. 7 4.0 Pin Table ......................................................................................................................................................................................... 8 5.0 Pin Descriptions ............................................................................................................................................................................ 10 6.0 Pin Reset State Table ................................................................................................................................................................... 17 7.0 Configuration Options ................................................................................................................................................................... 21 8.0 AC Specifications .......................................................................................................................................................................... 32 9.0 DC Parameters ............................................................................................................................................................................. 34 10.0 Package Outline .......................................................................................................................................................................... 38 Appendix A: Data Sheet Revision History ........................................................................................................................................... 39 Product Identification System ............................................................................................................................................................. 40 The Microchip Web Site ...................................................................................................................................................................... 41 Customer Change Notification Service ............................................................................................................................................... 41 Customer Support ............................................................................................................................................................................... 41 2009 - 2015 Microchip Technology Inc. DS00002005A-page 3 USB2250/50i/51/51i 1.0 INTRODUCTION The Microchip USB2250/50i/51/51i is a flash media card reader solution fully compliant with the USB 2.0 specification. All required resistors on the USB ports are integrated into the device. This includes all series termination resistors on D+ and D- pins and all required pull-down and pull-up resistors. The over-current sense inputs for the downstream facing ports have internal pull-up resistors. Hardware Features * * * * * * * * * * * * * * * Single chip flash media controller USB2250/USB2251 supports the commercial temperature range of 0C to +70C USB2250i/USB2251i supports the industrial temperature range of -40C to +85C 8051 8-bit microprocessor - 60 MHz - single cycle execution - 64 KB ROM |14 KB RAM Integrated regulator for 1.8 V core operation Flash Media Card Specification Revision Compliance Compact Flash 4.1 - CF UDMA Modes 0-4 - CF PIO Modes 0-6 Secure Digital 2.0 - HS-SD and HC-SD - TransFlashTM and reduced form factor media MultiMediaCard 4.2 - 1/4/8 bit MMC Memory Stick 1.43 Memory Stick Pro Format 1.02 Memory Stick Pro-HG Duo Format 1.01 - Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro Memory Stick Duo 1.10 Smart Media 1.3 xD-Picture Card 1.2 Software Features * If the OEM is using an external EEPROM, the following features are available: - Customizable vendor, product, and device ID's - 12-hex digits maximum for the serial number string - 28-character manufacturer ID and product strings for the flash media reader/writer 2009 - 2015 Microchip Technology Inc. DS00002005A-page 4 USB2250/50i/51/51i 1.1 Acronyms ATA: Advanced Technology Attachment CFC: Compact Flash Controller FET: Field Effect Transistor LUN: Logical Unit Number MMC: MultiMediaCard MSC: Memory Stick Controller PLL: Phase-Locked Loop RoHS: Restriction of Hazardous Substances Directive RXD: Received eXchange Data SDC: Secure Digital Controller SIE: Serial Interface Engine SMC: SmartMedia Controller True IDE Mode: True Integrated Drive Electronics Mode TXD: Transmit eXchange Data UART: Universal Asynchronous Receiver-Transmitter UCHAR: Unsigned Character UINT: Unsigned Integer VTQFP: Very Thin Quad Flat Package DS00002005A-page 5 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 2.0 PIN CONFIGURATION 128-PIN VTQFP DIAGRAM 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 97 98 99 100 101 102 103 104 105 64 63 62 61 60 59 58 57 56 106 107 108 109 110 111 112 113 114 115 116 117 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 USB225X 128 VTQFP 118 119 (Top View) 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 nRESET CF_D5 CF_D12 CF_D4 CF_D11 CF_D3 CF_nCD SM_nCD SM_nB/R SM_nRE SM_nCE SM_CLE SM_ALE VSS VDD33 VDD18 SM_nWE SM_nWP SM_D0 SM_D1 SM_D2 SM_D3 SM_D4 SM_D5 SM_D6 SM_D7 SM_nWPS MD0 MD1 MD2 MD3 MD7 MA12 MA15 nMWR MA14 SDA REG_EN USB+ USBVSS SD_D1 SD_D6 SD_D0 SD_D7 CRD_PWR0 VDD33 CRD_PWR3 VSS SD_CLK SD_D5 SD_CMD SD_D4 SD_D3 SD_D2 MA10 MA1 / CLK_SEL1 nMCE MA0 / CLK_SEL0 MA16 MD6 MD5 MD4 SD_nCD 2 120 121 122 123 124 125 126 127 128 1 MS_D6 MS_INS MS_D3 MS_D7 MS_SCLK VSS TEST VDD33 SD_WP MA7 MA13 MA6 MA8 MA5 MA9 MA4 MA11 MA3 nMRD MA2 CF_DMARQ / RXD SCL / xD_ID CF_DMACK LED VBUS_DET VSS XTAL2 XTAL1 (CLKIN) VDD18PLL VSS RBIAS VDD33 95 96 MS_D2 MS_D4 MS_D0 / MS_SDIO MS_D5 MS_D1 MS_BS CF_D10 CF_D9 CF_D2 CF_D8 CF_D1 CF_D0 CF_SA0 CF_SA1 CF_SA2 VSS CF_IORDY CF_nRESET CRD_PWR1 VDD33 CRD_PWR2 VSS CF_IRQ CF_nIOW CF_nIOR CF_nCS0 CF_D15 CF_D7 CF_D14 CF_D6 CF_D13 VDD33 FIGURE 2-1: 2009 - 2015 Microchip Technology Inc. DS00002005A-page 6 USB2250/50i/51/51i 3.0 BLOCK DIAGRAM FIGURE 3-1: USB2250/50I/51/51I BLOCK DIAGRAM USB2250 / USB2251 SD/ MMC AUTO_CBW PROC CF/ USB Host SIE CTL PHY BUS INTFC BUS FMDU INTFC CTL GPIO (16) FMI MS SM 3.3 V EP0 TX EP0 RX 1.8 V Reg BUS INTFC VDD18 RAM 4K total EP1 RX EP1 TX EP2 RX EP2 TX 24 MHz Crystal PLL XDATA BRIDGE + BUS ARBITER VDD18PLL 3.3 V PWR_FET0 PWR_FET1 PWR_FET2 PWR_FET3 1.8 V Reg CRD_PWR0 CRD_PWR1 CRD_PWR2 CRD_PWR3 GPIOs RAM 10 KB ROM 64 KB ADDR MAP Program Memory I/O Bus Clock Generation and Control 8051 PROCESSOR 2009 - 2015 Microchip Technology Inc. SFR RAM DS00002005A-page 7 USB2250/50i/51/51i 4.0 PIN TABLE 4.1 128-Pin Package TABLE 4-1: 128-PIN VTQFP PACKAGE COMPACT FLASH INTERFACE (28 PINS) CF_D0 CF_D1 CF_D2 CF_D3 CF_D4 CF_D5 CF_D6 CF_D7 CF_D8 CF_D9 CF_D10 CF_D11 CF_D12 CF_D13 CF_D14 CF_D15 CF_nIOR CF_nIOW CF_IRQ CF_nRESET CF_IORDY CF_nCS0 CF_DMACK CF_SA0 CF_SA1 CF_SA2 CF_nCD CF_DMARQ SMARTMEDIA INTERFACE (17 PINS) SM_D0 SM_D1 SM_D2 SM_D3 SM_D4 SM_D5 SM_D6 SM_D7 SM_ALE SM_CLE SM_nRE SM_nWE SM_nWP SM_nB/R SM_nCE SM_nCD SM_nWPS MEMORY STICK INTERFACE (11 PINS) MS_BS MS_D0 / MS_SDIO MS_SCLK MS_INS MS_D1 MS_D2 MS_D3 MS_D4 MS_D5 MS_D6 MS_D7 SECURE DIGITAL / MULTIMEDIACARD INTERFACE (12 PINS) SD_CMD SD_CLK SD_D0 SD_D1 SD_D2 SD_D3 SD_WP SD_nCD SD_D4 SD_D5 SD_D6 SD_D7 USB INTERFACE (6 PINS) USB+ USB- RBIAS XTAL2 XTAL1 (CLKIN) REG_EN 2009 - 2015 Microchip Technology Inc. DS00002005A-page 8 USB2250/50i/51/51i TABLE 4-1: 128-PIN VTQFP PACKAGE (CONTINUED) MEMORY/IO INTERFACE (28 PINS) MA0 / CLK_SEL0 MA1 / CLK_SEL1 MA2 MA3 MA4 MA5 MA6 MA7 MA8 MA9 MA10 MA11 MA12 MA13 MA14 MA15 MA16 MD0 MD1 MD2 MD3 MD4 MD5 MD6 MD7 nMRD nMWR nMCE MISC (10 PINS) nRESET VBUS_DET SCL / xD_ID SDA LED CRD_PWR0 CRD_PWR1 CRD_PWR2 CRD_PWR3 TEST DIGITAL, POWER (16 PINS) (6) VDD33 (8) VSS VDD18 VDD18PLL TOTAL 128 DS00002005A-page 9 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 5.0 PIN DESCRIPTIONS This section provides a detailed description of each signal. The signals are arranged in functional groups according to their associated interface. The pin descriptions are applied when using the internal default firmware and can be referenced in Section 7.0, "Configuration Options," on page 21. Please reference Section 1.1, "Acronyms," on page 5 for a list of the acronyms used. The "n" symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. When "n" is not present in the signal name, the signal is asserted at the high voltage level. The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of "active low" and "active high" signals. The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive. 5.1 128-Pin VTQFP Pin Descriptions TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS Name Symbol 128-Pin VTQFP Buffer Type Description COMPACT FLASH (CF) INTERFACE CF Chip Select 0 CF_nCS0 71 O12PU This pin is the active low chip select 0 signal for the task file registers of the CF ATA device in True IDE mode. This pin has a weak internal pull-up resistor. CF Register Address CF_SA[2:0] 82 83 84 I/O12 These pins are the register select address bits for the CF ATA device. CF Interrupt CF_IRQ 74 IPD This is the active high interrupt request signal from the CF device. This pin has a weak internal pull-down resistor. CF_D[15:8] / 70 68 66 62 60 90 89 87 I/O12PD CF_D[15:8]: These pins are the bi-directional data signals CF_D15 - CF_D8 in True IDE mode data transfer. 69 67 63 61 59 88 86 85 I/O12PD CF Data 15-8 CF Data 7-0 CF_D[7:0] In True IDE mode, all task file register operations occur on CF_D[7:0], while data transfer occurs on CF_D[15:0]. These bi-directional data signals have weak internal pull-down resistors. CF_D[7:0]: These pins are the bi-directional data signals CF_D7 - CF_D0 in True IDE mode data transfer. In True IDE mode, all of the task file register operations occur on CF_D[7:0], while data transfer occurs on CF_D[15:0]. These bi-directional data signals have weak internal pull-down resistors. IO Ready CF_IORDY 80 IPU CF Card Detection1 CF_nCD 58 I/O12 Designates as the Compact Flash card detection pin. CF Hardware Reset CF_RESET_N 79 O12 This pin is an active low hardware reset signal to the CF device. CF IO Read CF_nIOR 72 O12 This pin is an active low read strobe signal for the CF device. CF IO Write Strobe CF_nIOW 73 O12 This pin is an active low write strobe signal for the CF device. 2009 - 2015 Microchip Technology Inc. This pin is the active high input signal for IORDY. This pin has a weak internal pull-up resistor. DS00002005A-page 10 USB2250/50i/51/51i TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Name CF DMA request Symbol 128-Pin VTQFP Buffer Type CF_DMARQ / 117 I CF_DMACK CF_DMARQ: This pin is the DMA request from the device to the CF controller. RXD: The signal can be used as input to the RXD of UART in the device. Custom firmware is required to activate this function. RXD CF DMA acknowledge Description 119 O12 CF_nDMACK: This pin is an active low DMA acknowledge signal for the CF device. SMARTMEDIA (SM) INTERFACE SM Write Protect SM_nWP 47 O12PD This pin is an active low write protect signal for the SM device and has a weak pull-down resistor that is permanently enabled. SM Address Strobe SM_ALE 52 O12PD This pin is an active high Address Latch Enable signal for the SM device and has a weak pulldown resistor that is permanently enabled. SM Command Strobe SM_CLE 53 O12PD This pin is an active high Command Latch Enable signal for the SM device and has a weak pull-down resistor that is permanently enabled. SM_D[7:0] 39 40 41 42 43 44 45 46 I/O12PD These pins are the bi-directional data signals SM_D7-SM_D0 and have weak internal pulldown resistors. SM_nRE 55 O12PU This pin is an active low read strobe signal for the SM device. SM Data 7-0 SM Read Enable When using the internal FET, this pin has a weak internal pull-up resistor that is tied to the output of the internal power FET. If an external FET is used (internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used). SM Write Enable SM_nWE 48 O12PU This pin is an active low write strobe signal for the SM device. When using the internal FET, this pin has a weak internal pull-up resistor that is tied to the output of the internal power FET. If an external FET is used (internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used). SM Write Protect Switch SM_nWPS 38 IPU A write-protect seal is detected when this pin is low. This pin has a weak internal pull-up resistor. SM Busy or Data Ready SM_nB/R 56 IPU This pin is connected to the BSY/RDY pin of the SM device. When using the internal FET, this pin has a weak internal pull-up resistor that is tied to the output of the internal power FET. If an external FET is used (internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used). DS00002005A-page 11 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Name SM Chip Enable Symbol 128-Pin VTQFP Buffer Type Description SM_nCE 54 O12PU This pin is the active low chip enable signal to the SM device. When using the internal FET, this pin has a weak internal pull-up resistor that is tied to the output of the internal power FET. If an external FET is used (internal FET is disabled), then the internal pull-up is not available (external pull-ups must be used). SM Card Detection SM_nCD 57 I/O12 Designates as the Smart Media card detection pin. MEMORY STICK (MS) INTERFACE MS Bus State MS_BS 91 O12 This pin is connected to the bus state pin of the MS device. It is used to control the bus states 0, 1, 2 and 3 (BS0, BS1, BS2 and BS3) of the MS device. MS Card Insertion MS_INS 98 IPU Designates as the Memory Stick card detection pin. MS System CLK MS_SCLK 101 O12 This pin is an output clock signal to the MS device. The clock frequency is software configurable. MS System Data In/Out MS_D[7:1] 100 97 93 95 99 96 92 I/O12PD MS_D[7:1]: These pins are the bi-directional data signals for the MS device. MS_D2 and MS_D3 have weak pull-down resistors. MS_D1 has a pull-down resistor if it is in parallel mode, otherwise it is disabled. In 4- or 8-bit parallel mode, each MS_D7:1 signal has a weak pull-down resistor. MS System Data In/Out MS_D0 / 94 I/O12PD MS_D0: This pin is one of the bi-directional data signals for the MS device. In serial mode, the most significant bit (MSB) of each byte is transmitted first by either MSC or the MS device on MS_D0, MS_D2, and MS_D3 (which have weak pull-down resistors). If MS_D1 is in parallel mode, it has a pull-down resistor; Otherwise, it is disabled. In 4- or 8-bit parallel mode, the MS_D0 signal has a weak pull-down resistor. SECURE DIGITAL (SD) / MULTIMEDIACARD (MMC) INTERFACE SD Data 7-0 SD Clock SD_D[7:0] 13 11 19 21 22 23 10 12 I/O12PU SD_CLK 18 O12 These pins are bi-directional data signals SD_D0 - SD_D7 and have weak pull-up resistors. This is an output clock signal to the SD/MMC device. The clock frequency is software configurable. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 12 USB2250/50i/51/51i TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Symbol 128-Pin VTQFP Buffer Type SD_CMD 20 I/O12PU SD Write Protected SD_WP 105 I/O12 Designates as the Secure Digital card mechanical write detect pin. SD Card Detect SD_nCD 32 I/O12 Designates as the Secure Digital card detection pin. Name SD Command Description This is a bi-directional signal that connects to the CMD signal of the SD/MMC device and has a weak internal pull-up resistor. USB INTERFACE USB Bus Data USB+ USB- 7 8 I/O-U USB Transceiver Bias RBIAS 127 I-R A 12.0 k, 1.0% resistor is attached from VSS to this pin in order to set the transceiver's internal bias currents. XTAL1 (CLKIN) 124 ICLKx This pin can be connected to one terminal of the crystal or it can be connected to an external 24/48 MHz clock when a crystal is not used. 24 MHz Crystal Input (External Clock Input) These pins connect to the USB bus data signals. The MA[1:0] pins will be sampled while RESET_N is asserted, and the value will be latched upon RESET_N negation. This will determine the clock source and value. 24 MHz Crystal Output XTAL2 123 OCLKx This is the other terminal of the crystal, or it is left open when an external clock source is used to drive XTAL1(CLKIN). It may not be used to drive any external circuitry other than the crystal circuit. MEMORY / IO INTERFACE Memory Data Bus DS00002005A-page 13 MD[7:0] 33 29 30 31 34 35 36 37 I/O12PU These signals are used to transfer data between the internal CPU and the external program memory and have weak internal pull-up resistors. 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i TABLE 5-1: Name Memory Address Bus USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Symbol 128-Pin VTQFP Buffer Type MA16 28 O12 These signals address memory locations within the external memory. MA[15:2] 2 4 107 1 113 24 111 109 106 108 110 112 114 116 O12 These signals address memory locations within the external memory. MA[1:0] / 25 O12 MA[1:0]: These signals address memory locations within the external memory. CLK_ SEL[1:0] 27 I/O12PD Description CLK_SEL[1:0]: During RESET_N assertion, these pins will select the operating frequency of the external clock, and the corresponding weak pull-down resistors are enabled. When RESET_N is negated, the value on these pins will be latched internally and these pins will revert to MA[1:0] functionality; the internal pulldowns will be disabled. CLK_SEL[1:0] CLK_SEL[1:0] CLK_SEL[1:0] CLK_SEL[1:0] = = = = '00'. 24 MHz '01'. RESERVED '10'. RESERVED '11'. 48 MHz If the latched value is '1', the corresponding MA pin is tri-stated when the chip is in power down state. If the latched value is '0', the corresponding MA pin will function identically to MA[15:3] pins at all times (other than during RESET_N assertion). Memory Write Strobe nMWR 3 O12 This pin is the active low program Memory Write strobe signal. Memory Read Strobe nMRD 115 O12 This pin is the active low program Memory Read strobe signal. Memory Chip Enable nMCE 26 O12 This pin is the active low program Memory Chip Enable strobe signal. This signal is asserted when any external access is being done by the processor. This signal is held to the logic 'high' while RESET_N is asserted. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 14 USB2250/50i/51/51i TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Name Symbol 128-Pin VTQFP Buffer Type LED 120 I/O12 LED: It can be used as an LED output. VBUS_DET 121 I/O12 VBUS is a 3.3 volt input. A resistor divider must be used if connecting to 5 volts of USB power. SCL / 118 O12 SCL: This is the clock output when used with an external EEPROM. I/O12 xD_ID: This is the xD-Picture Card detection pin only applicable to USB2250/USB2250i. I/O12 SDA: This is the data pin when used with an external serial EEPROM. I/O12 CRD_PWR: Card power drive of 3.3 V at either 100 mA or 200 mA. Description MISC General Purpose Input/Output xD_ID SDA 5 CRD_PWR0 14 I/O200 CRD_PWR1 78 I/O12 I/O200 CRD_PWR2 76 I/O200 CRD_PWR: Card power drive of 3.3 V at either 100 mA or 200 mA. CRD_PWR: Card power drive of 3.3 V at either 100 mA or 200 mA. Requirement: This must be the only FET used to power SM devices. Failure to do this will violate SM voltage specification on SM device pins. CRD_PWR3 16 I/O200 CRD_PWR: Card power drive of 3.3 V at either 100 mA or 200 mA. Requirement: This must be the only FET used to power SM devices. Failure to do this will violate SM voltage specification on SM device pins. RESET Input RESET_N 64 IS TEST 103 I Regulator Enable REG_EN 6 IPU 1.8 V Digital Core Power VDD18 49 If the internal regulator is enabled, then this pin must have a 1.0 F (or greater) 20% (ESR <0.1 ) capacitor to VSS. 1.8 V PLL Power VDD18PLL 125 If the internal regulator is enabled, then this pin must have a 1.0 F (or greater) 20% (ESR <0.1 ) capacitor to VSS. 3.3 V Power and Voltage Regulator Input VDD33 15 50 65 77 104 128 If the internal regulator is enabled, pins 50 and 128 each require an external bypass capacitor of 4.7 F minimum. TEST Input This active low signal is used by the system to reset the chip. The active low pulse should be at least 1s wide. Tie this pin to ground for normal operation. This signal is used to enable the internal 1.8 V regulator. DIGITAL POWER, and GROUND DS00002005A-page 15 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i TABLE 5-1: USB2250/50I/51/51I 128-PIN VTQFP PIN DESCRIPTIONS (CONTINUED) Name Symbol Ground VSS 128-Pin VTQFP Buffer Type 9 17 51 75 81 102 122 126 Description Ground Reference Note 5-1 Hot-insertion capable card connectors are required for all flash media. It is required for the SD connector to have a Write Protect switch. This allows the chip to detect the MMC card. Note 5-2 nMCE is normally asserted except when the 8051 is in standby mode. 5.2 Buffer Type Descriptions TABLE 5-2: BUFFER TYPE DESCRIPTIONS BUFFER DESCRIPTION I Input. IPU Input with internal weak pull-up resistor. IPD Input with internal weak pull-down resistor. IS Input with Schmitt trigger. I/O12 Input/Output buffer with 12 mA sink and 12 mA source. I/O200 Input/Output buffer 12 mA with FET disabled, 100/200 mA source only when the FET is enabled. I/O12PD Input/Output buffer with 12 mA sink and 12 mA source with an internal weak pull-down resistor. I/O12PU Input/Output buffer with 12 mA sink and 12 mA source with a pull-up resistor. O12 Output buffer with 12 mA source. O12PU Output buffer with 12 mA sink and 12 mA source, with a pull-up resistor. O12PD Output buffer with 12 mA sink and 12 mA source, with a pull-down resistor. ICLKx XTAL clock input. OCLKx XTAL clock output. I/O-U Analog Input/Output as defined in the USB 2.0 Specification. I-R RBIAS. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 16 USB2250/50i/51/51i 6.0 PIN RESET STATE TABLE FIGURE 6-1: PIN RESET STATES Hardware Initialization Voltage Signal (v) RESET RESET VDD33 Time (t) VSS TABLE 6-1: Firmware Operational LEGEND FOR PIN RESET STATES TABLE Symbol Description 0 Output driven low 1 Output driven high IP Input enabled PU Hardware enables pull-up PD Hardware enables pull-down -- Hardware disables function Z Hardware disables pad. Both output driver and input buffers are disabled. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 17 USB2250/50i/51/51i 6.1 128-Pin Reset States 6.2 128-Pin Reset States TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES Reset State Reset State Pin Pin Name Function Input/ Output PU/ PD Pin Pin Name Function 85 CF_D0 None z -- 58 CF_nCD None IP pu 86 CF_D1 None z -- 46 SM_D0 SM z pd 88 CF_D2 None z -- 45 SM_D1 SM z pd 59 CF_D3 None z -- 44 SM_D2 SM z pd 61 CF_D4 None z -- 43 SM_D3 SM z pd 63 CF_D5 None z -- 42 SM_D4 SM z pd 67 CF_D6 None z -- 41 SM_D5 SM z pd 69 CF_D7 None z -- 40 SM_D6 SM z pd 87 CF_D8 None z -- 39 SM_D7 SM z pd 89 CF_D9 None z -- 52 SM_ALE SM z pd 90 CF_D10 None z -- 53 SM_CLE SM z pd 60 CF_D11 None z -- 47 SM_nWP SM z pd 62 CF_D12 None z -- 38 SM_nWPS SM z -- 66 CF_D13 None z -- 57 SM_nCD None IP pu 68 CF_D14 None z -- 91 MS_BS MS z pd 70 CF_D15 None 101 MS_SCLK MS z pd 72 CF_nIOR CF z -- 94 MS_D0 / MS_SDIO MS z pd 73 CF_nIOW CF z -- 92 MS_D1 MS z pd 74 CF_nIRQ CF z -- 96 MS_D2 MS z pd 79 CF_nRESET CF z -- 99 MS_D3 MS z pd 80 CF_IORDY CF z -- 95 MS_D4 MS z pd 71 CF_nCS0 CF z -- 93 MS_D5 MS z pd 84 CF_SA0 CF z -- 97 MS_D6 MS z pd 83 CF_SA1 CF z -- 100 MS_D7 MS z pd 82 CF_SA2 CF 98 MS_INS None IP pu DS00002005A-page 18 z z -- -- Input/ Output PU/ PD 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED) Reset State Input/ Output Pin Pin Name Function 119 CF_DMACK None 0 117 CF_DMARQ None 12 SD_D0 10 Reset State PU/ PD Input/ Output PU/ PD Pin Pin Name Function -- 20 SD_CMD SD z -- 0 -- 34 MD3 MA z pu SD z -- 18 SD_CLK SD z -- SD_D1 SD z -- 31 MD4 MA z pu 23 SD_D2 SD z -- 30 MD5 MA z pu 22 SD_D3 SD z -- 29 MD6 MA z pu 21 SD_D4 SD z -- 33 MD7 MA z pu 19 SD_D5 SD z -- 115 nMRD MA 1 -- 11 SD_D6 SD z -- 26 nMCE MA 1 -- 13 SD_D7 SD z -- 120 LED None 0 -- 105 SD_WP None 0 -- 118 SCL / xD_ID None 0 -- 32 SD_nCD None IP pu 14 CRD_PWR0 None z -- 27 MA0 / CLK_SEL0 MA IP pd 78 CRD_PWR1 None z -- 25 MA1 / CLK_SEL1 MA IP pd 76 CRD_PWR2 None z -- 116 MA2 MA IP pd 16 CRD_PWR3 None z -- 114 MA3 MA IP pd 103 TEST TEST IP -- 112 MA4 MA 0 -- 64 nRESET nRESET IP -- 110 MA5 MA 0 -- 1 MA12 MA 0 -- 108 MA6 MA 0 -- 4 MA14 MA 0 -- 106 MA7 MA 0 -- 2 MA15 MA 0 -- 109 MA8 MA 0 -- 3 nMWR MA 1 -- 111 MA9 MA 0 -- 121 VBUS_DET None IP -- 24 MA10 MA 0 -- 5 SDA None 0 pu 113 MA11 MA 0 -- 55 SM_nRE SM z -- 107 MA13 MA 0 -- 48 SM_nWE SM z -- 28 MA16 MA 0 -- 56 SM_nB/R SM z -- 37 MD0 MA z pu 54 SM_nCE SM z -- 2009 - 2015 Microchip Technology Inc. DS00002005A-page 19 USB2250/50i/51/51i TABLE 6-2: USB2250/50I/51/51I 128-PIN RESET STATES (CONTINUED) Reset State Input/ Output Pin Pin Name Function 36 MD1 MA z 35 MD2 MA z DS00002005A-page 20 Reset State PU/ PD Input/ Output PU/ PD Pin Pin Name Function pu 7 USB+ USB+ z -- pu 8 USB- USB- z -- 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 7.0 CONFIGURATION OPTIONS 7.1 Card Reader The Microchip USB2250/50i/51/51i is fully compliant with the following flash media card reader specifications: * Compact Flash 4.1 - CF UDMA Modes 0-4 - CF PIO Modes 0-6 * Secure Digital 2.0 - HS-SD and HC-SD - TransFlashTM and reduced form factor media * MultiMediaCard 4.2 - 1/4/8 bit MMC * Memory Stick 1.43 * Memory Stick Pro Format 1.02 * Memory Stick Pro-HG Duo Format 1.01 - Memory Stick, MS Duo, HS-MS, MS Pro-HG, MS Pro * Memory Stick Duo 1.10 * Smart Media 1.3 * xD-Picture Card 1.2 7.1.1 VBUS DETECT According to Section 7.2.1 of the USB 2.0 Specification, a device cannot provide power to its D+ or D- pull-up resistors unless the upstream port's VBUS is in the asserted (powered) state. The VBUS_DET pin on the device monitors the state of the upstream VBUS signal and will not pull-up the D+ resistor if VBUS is not active. If VBUS goes from an active to an inactive state (not powered), the device will remove power from the D+ pull-up resistor within 10 seconds. 7.2 7.2.1 System Configurations EEPROM The USB2250/50i/51/51i can be configured via a 2-wire (I2C) EEPROM (512x8) flash device containing the options for the USB2250/50i/51/51i. If an external configuration device does not exist the internal default values will be used. If one of the external devices is used for configuration, the OEM can update the values through the USB interface. The device will then "attach" to the upstream USB host. The USBDM tool set is available in the USB225x Card Reader software release package. To download the software package from Microchip's website, please visit: http://www.microchip.com/SWLibraryWeb/producttc.aspx?product=OBJ%20files%20for%20USB2250 to go to the OBJ Card Reader Software Download Agreement. Review the license, and if you agree, check the "I agree" box and then select "Confirm". You will then be able to download the USB225x Card reader combo release package zip files containing the USBDM tool set. Please note that the following applies to the system values and descriptions when used: * N/A = Not applicable to this part * Reserved = For internal use 2009 - 2015 Microchip Technology Inc. DS00002005A-page 21 USB2250/50i/51/51i 7.2.2 EEPROM DATA DESCRIPTOR TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS Address Register Name Description Internal Default Value 00h USB_SER_LEN USB Serial String Descriptor Length 1Ah 01h USB_SER_TYP USB Serial String Descriptor Type 03h 02h-19h USB_SER_NUM USB Serial Number "000000225001" (See Note 7-1) 1Ah-1Bh USB_VID USB Vendor Identifier 0424 1Ch-1Dh USB_PID USB Product Identifier 2250 1Eh USB_LANG_LEN USB Language String Descriptor Length 04h 1Fh USB_LANG_TYP USB Language String Descriptor Type 03h 20h USB_LANG_ID_LSB USB Language Identifier Least Significant Byte 09h (See Note 7-2) 21h USB_LANG_ID_MSB USB Language Identifier Most Significant Byte 04h (See Note 7-2) 22h USB_MFR_STR_LEN USB Manufacturer String Descriptor Length 10h 23h USB_MFR_STR_TYP USB Manufacturer String Descriptor Type 03h 24h-31h USB_MFR_STR USB Manufacturer String "Generic" (See Note 7-1) 32h-5Dh Reserved - 00h 5Eh USB_PRD_STR_LEN USB Product String Descriptor Length 24h 5Fh USB_PRD_STR_TYP USB Product String Descriptor Type 03h 60h-99h USB_PRD_STR USB Product String "Flash Card Reader" (See Note 7-1) 9Ah USB_BM_ATT USB BmAttribute 80h 9Bh USB_MAX_PWR USB Max Power 30h (96 mA) 9Ch ATT_LB Attribute Lo byte 40h (Reverse SD_WP only) 9Dh ATT_HLB Attribute Hi Lo byte 00h 9Eh ATT_LHB Attribute Lo Hi byte 00h 9Fh ATT_HB Attribute Hi byte 00h A0h MS_PWR_LB Memory Stick Device Power Lo byte 08h A1h MS_PWR_HB Memory Stick Device Power Hi byte 00h A2h CF_PWR_LB Compact Flash Device Power Lo byte 80h A3h CF_PWR_HB Compact Flash Device Power Hi byte 00h A4h SM_PWR_LB Smart Media Device Power Lo byte 00h A5h SM_PWR_HB Smart Media Device Power Hi byte 08h A6h SD_PWR_LB Secure Digital Device Power Lo byte 00h DS00002005A-page 22 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i TABLE 7-1: INTERNAL FLASH MEDIA CONTROLLER CONFIGURATIONS (CONTINUED) Address Register Name Description Internal Default Value A7h SD_PWR_HB Secure Digital Device Power Hi byte 80h A8h LED_BLK_INT LED Blink Interval 02h A9h LED_BLK_DUR LED Blink After Access 28h AAh - B0h DEV0_ID_STR Device 0 Identifier String "CF" B1h - B7h DEV1_ID_STR Device 1 Identifier String "MS" B8h - BEh DEV2_ID_STR Device 2 Identifier String "SM" BFh - C5h DEV3_ID_STR Device 3 Identifier String "SD/MMC" C6h - CDh INQ_VEN_STR Inquiry Vendor String "Generic" 2250 CEh-D2h INQ_PRD_STR Inquiry Product String D3h DYN_NUM_LUN Dynamic Number of LUNs FFh D4h - D7h DEV_LUN_MAP Device to LUN Mapping FFh, FFh, FFh, FFh D8h - DAh MS_BUS_TIMINGReserved - 00h, 03h, 07h DBh - DDh MS_BUS_TIMINGReserved - 5Ch, 56h, 97h DEh-FBh Not Applicable - 00h NVSTORE_SIG Non-Volatile Storage Signature "ATA2" FCh-FFh Note 7-1 This value is a UNICODE UTF-16LE encoded string value that meets the USB 2.0 specification (Revision 2.0, 2000). Values in double quotations without this note are ASCII values. Note 7-2 For a list of the most current 16-bit language ID's defined by the USB-IF, please visit http://www.unicode.org or consult The Unicode Standard, Worldwide Character Encoding, (Version 4.0), The Unicode Consortium, Addison-Wesley Publishing Company, Reading, Massachusetts. 7.2.3 EEPROM DATA DESCRIPTOR REGISTER DESCRIPTIONS 7.2.3.1 00h: USB Serial String Descriptor Length Byte Name Description 0 USB_SER_LEN USB serial string descriptor length as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bLength" which describes the size of the string descriptor (in bytes). 7.2.3.2 01h: USB Serial String Descriptor Type Byte Name Description 1 USB_SER_TYP USB serial string descriptor type as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bDescriptorType" which is a constant value associated with a string descriptor type. 7.2.3.3 02h-19h: USB Serial Number Option Byte Name 25:2 USB_SER_NUM 7.2.3.4 Description Maximum string length is 12 hex digits. Must be unique to each device. 1Ah-1Bh: USB Vendor ID Option Byte Name 1:0 USB_VID 2009 - 2015 Microchip Technology Inc. Description This ID is unique for every vendor. The vendor ID is assigned by the USB Implementer's Forum. DS00002005A-page 23 USB2250/50i/51/51i 7.2.3.5 1Ch-1Dh: USB Product ID Option Byte Name Description 1:0 USB_PID This ID is unique for every product. The product ID is assigned by the vendor. 7.2.3.6 1Eh: USB Language Identifier Descriptor Length Byte Name Description 0 USB_LANG_LEN USB language ID string descriptor length as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bLength" which describes the size of the string descriptor (in bytes). 7.2.3.7 1Fh: USB Language Identifier Descriptor Type Byte Name Description 1 USB_LANG_TYP USB language ID string descriptor type as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bDescriptorType" which is a constant value associated with a string descriptor type. 7.2.3.8 20h: USB Language Identifier Least Significant Byte Byte Name Description 2 USB_LANG_ID _LSB English language code = `0409'. See Note 7-2 to reference additional language ID's defined by the USB-IF. 7.2.3.9 21h: USB Language Identifier Most Significant Byte Byte Name Description 3 USB_LANG_ID _MSB English language code = `0409'. See Note 7-2 to reference additional language ID's defined by the USB-IF. 7.2.3.10 22h: USB Manufacturer String Descriptor Length Byte Name Description 0 USB_MFR_STR _LEN USB manufacturer string descriptor length as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bLength" which describes the size of the string descriptor (in bytes). 7.2.3.11 23h: USB Manufacturer String Descriptor Type Byte Name Description 1 USB_MFR_STR _TYP USB manufacturer string descriptor type as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bDescriptorType" which is a constant value associated with a string descriptor type. 7.2.3.12 24h-31h: USB Manufacturer String Option Byte Name 15:2 USB_MFR_STR DS00002005A-page 24 Description Maximum string length is 29 characters. 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 7.2.3.13 32h-5Dh: Reserved Byte Name 59:16 Reserved 7.2.3.14 Description Reserved. 5Eh: USB Product String Descriptor Length Byte Name Description 0 USB_PRD_STR _LEN USB product string descriptor length as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bLength" which describes the size of the string descriptor (in bytes). Maximum string length is 29 characters 7.2.3.15 5Fh: USB Product String Descriptor Type Byte Name Description 1 USB_PRD_STR _TYP USB product string descriptor type as defined by Section 9.6.7 "String" of the USB 2.0 Specification (Revision 2.0, 2000). This field is the "bDescriptorType" which is a constant value associated with a string descriptor type. 7.2.3.16 60h-99h: USB Product String Option Byte Name Description 59:2 USB_PRD_STR This string will be used during the USB enumeration process in the Windows(R) operating system. Maximum string length is 29 characters. 7.2.3.17 9Ah: USB BmAttribute (1 byte) Byte Name 7:0 USB_BM_ATT Description Self- or Bus-Power: Selects between self- and bus-powered operation. The hub is either self-powered (draws less than 2 mA) or bus-powered (limited to 100 mA maximum power prior to being configured by the host controller). When configured as a bus-powered device, the Microchip device consumes less than 100 mA of current prior to being configured. After configuration, the bus-powered Microchip device (along with all associated device circuitry, any embedded devices if part of a compound device, and 100 mA per externally available downstream port) must consume no more than 500 mA of current. The current consumption is system dependent, and the OEM must ensure that the USB 2.0 Specification is not violated. When configured as a self-powered device, <1 mA of current is consumed and all ports are available, with each port being capable of sourcing 500 mA of current. 80 = Bus-powered operation (default) C0 = Self-powered operation A0 = Bus-powered operation with remote wake-up E0 = Self-powered operation with remote wake-up 7.2.3.18 9Bh: USB MaxPower (1 byte) Byte Name Description 7:0 USB_MAX_PWR USB Max Power per the USB 2.0 Specification. Do NOT set this value greater than 100 mA. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 25 USB2250/50i/51/51i 7.2.3.19 9Ch-9Fh: Attribute Byte Descriptions Byte Byte Name Bit 0 ATT_LB 3:0 4 Description Always reads `0'. Inquire Manufacturer and Product ID Strings `1' - Use the Inquiry Manufacturer and Product ID Strings. `0' (default) - Use the USB Descriptor Manufacturer and Product ID Strings. 5 Always reads `0'. 6 Reverse SD Card Write Protect Sense `1' (default) - SD cards will be write protected when SW_nWP is high, and writable when SW_nWP is low. `0' - SD cards will be write protected when SW_nWP is low, and writable when SW_nWP is high. 7 1 ATT_HLB 3:0 4 Reserved. Always reads `0'. Activity LED True Polarity `1' - Activity LED to Low True. `0' (default) - Activity LED polarity to High True. 5 Common Media Insert / Media Activity LED `1' - The activity LED will function as a common media inserted/media access LED. `0' (default) - The activity LED will remain in its idle state until media is accessed. 2 ATT_LHB 6 Always reads `0'. 7 Reserved. 0 Attach on Card Insert / Detach on Card Removal `1' - Attach on Insert is enabled. `0' (default) - Attach on Insert is disabled. 1 Always reads `0'. 2 Enable Device Power Configuration `1' - Custom Device Power Configuration stored in the NVSTORE is used. `0' (default) - Default Device Power Configuration is used. 3 7.2.4 ATT_HB 7:3 Always reads `0'. 6:0 Always reads `0'. 7 xD Player Mode A0H-A7H: DEVICE POWER CONFIGURATION The USB2250/50i/51/51i has four internal FETs which can be utilized for card power. This section describes the default internal configuration. The settings are stored in NVSTORE and provide the following features: 1. 2. A card can be powered by an external FET or by an internal FET. The power limit can be set to 100 mA or 200 mA (Default) for the internal FET. Each media uses two bytes to store its device power configuration. Bit 3 selects between internal or external card power FET options. For internal FET card power control, bits 0 through 2 are used to set the power limit. The "Device Power Configuration" bits are ignored unless the "Enable Device Power Configuration" bit is set. See Section 7.2.3.19, "9Ch9Fh: Attribute Byte Descriptions," on page 26. DS00002005A-page 26 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 7.2.4.1 A0h-A1h: Memory Stick Device Power Configuration FET Type Bits 0 FET Lo Byte MS_PWR_LB 3:0 Low Nibble 7:4 High Nibble 3:0 Low Nibble 0000b 0001b 1000b 1010b 7:4 High Nibble 0000b Disabled 1 2 FET Hi Byte MS_PWR_HB 3 7.2.4.2 Bit Type Type Bits 0 FET Lo Byte CF_PWR_LB 3:0 Low Nibble 2 FET Hi Byte CF_PWR_HB 3 7.2.4.3 0000b Disabled Disabled External FET enabled Internal FET with 100 mA power limit Internal FET with 200 mA power limit A2h-A3h: Compact Flash Device Power Configuration FET 1 Description Bit Type Description 0000b Disabled 7:4 High Nibble 3:0 Low Nibble 0000b 0001b 1000b 1010b 7:4 High Nibble 0000b Disabled Disabled External FET enabled Internal FET with 100 mA power limit Internal FET with 200 mA power limit A4h-A5h: Smart Media Device Power Configuration FET Type Bits 0 FET Lo Byte SM_PWR_LB 3:0 Low Nibble 7:4 High Nibble 3:0 Low Nibble 0000b 0001b 1000b 1010b 7:4 High Nibble 0000b Disabled 1 2 FET Hi Byte SM_PWR_HB 3 7.2.4.4 Bit Type Description 0000b Disabled Disabled External FET enabled Internal FET with 100 mA power limit Internal FET with 200 mA power limit A6h-A7h: Secure Digital Device Power Configuration FET Type Bits 0 FET Lo Byte SD_PWR_LB 3:0 Low Nibble 7:4 High Nibble 3:0 Low Nibble 0000b 0001b 1000b 1010b 7:4 High Nibble 0000b Disabled 1 2 3 FET Hi Byte SD_PWR_HB 2009 - 2015 Microchip Technology Inc. Bit Type Description 0000b Disabled Disabled External FET enabled Internal FET with 100 mA power limit Internal FET with 200 mA power limit DS00002005A-page 27 USB2250/50i/51/51i 7.2.4.5 A8h: LED Blink Interval Byte Name Description 0 LED_BLK_INT The blink rate is programmable in 50 ms intervals. The high bit (7) indicates an idle state: `0' - Off `1' - On The remaining bits (6:0) are used to determine the blink interval up to a max of 63 x 50 ms. 7.2.4.6 A9h: LED Blink Duration Byte Name Description 1 LED_BLK_DUR LED Blink After Access. This byte is used to designate the number of seconds that the LED will continue to blink after a drive access. Setting this byte to "05" will cause the LED to blink for 5 seconds after a drive access. 7.2.5 DEVICE ID STRINGS These bytes are used to specify the LUN descriptor returned by the device. These bytes are used in combination with the device to LUN mapping bytes in applications where the OEM wishes to reorder and rename the LUNs. If multiple devices are mapped to the same LUN (a COMBO LUN), then the CLUN#_ID_STR will be used to name the COMBO LUN instead of the individual device strings. When applicable, the "SM" value will be overridden with xD once an xDPicture Card has been identified. 7.2.5.1 AAh-B0h: Device 0 Identifier String Byte Name 6:0 DEV0_ID_STR 7.2.5.2 Name 6:0 DEV1_ID_STR Description This ID string is associated with the Memory Stick device. B8h-BEh: Device 2 Identifier String Byte Name 6:0 DEV2_ID_STR 7.2.5.4 Not applicable. B1h-B7h: Device 1 Identifier String Byte 7.2.5.3 Description Description This ID string is associated with the Smart Media device. BFh-C5h: Device 3 Identifier String Byte Name Description 6:0 DEV3_ID_STR This ID string is associated with the Secure Digital / MultiMediaCard device. 7.2.5.5 C6h-CDh: Inquiry Vendor String Byte Name 7:0 INQ_VEN_STR DS00002005A-page 28 Description If bit 4 of the 1st attribute byte is set, the device will use these strings in response to a USB inquiry command, instead of the USB descriptor manufacturer and product ID strings. 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 7.2.5.6 CEh-D2h: Inquiry Product String Byte Name 4:0 INQ_PRD_STR 7.2.5.7 Description If bit 4 of the 1st attribute byte is set, the device will use these strings in response to a USB inquiry command, instead of the USB descriptor manufacturer and product ID strings. D3h: Dynamic Number of LUNs Byte Name Description 7:0 DYN_NUM_LUN These bytes are used to specify the number of LUNs the device exposes to the host. These bytes are also used for icon sharing by assigning more than one LUN to a single icon. This is used in applications where the device utilizes a combo socket and the OEM wishes to have only a single icon displayed for one or more interfaces. If this field is set to "FF", the program assumes that you are using the default value and icons will be configured per the default configuration. 7.2.5.8 D4h-D7h: Device to LUN Mapping Byte Name Description 3:0 DEV_LUN_MAP These registers map a device controller (SD/MMC, SM, and MS) to a Logical Unit Number (LUN). The device reports the mapped LUNs to the USB host in the USB descriptor during enumeration. The icon installer associates custom icons with the LUNs specified in these fields. Setting a register to "FF" indicates that the device is not mapped. Setting all of the DEV_LUN_MAP registers for all devices to "FF" forces the use of the default mapping configuration. Not all configurations are valid. Valid configurations depend on the hardware, packaging, and OEM board layout. The number of unique LUNs mapped must match the value in the Section 7.2.5.7, "D3h: Dynamic Number of LUNs," on page 29. 7.2.5.9 D8h-FBh: Not Applicable Byte Name 35:0 Not Applicable 7.2.5.10 Description Not Applicable. FCh-FFh: Non-Volatile Storage Signature Byte Name Description 3:0 NVSTORE_SIG This signature is used to verify the validity of the data in the first 256 bytes of the configuration area. The signature must be set to `ATA2' for USB2250/50i/51/51i. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 29 USB2250/50i/51/51i 7.3 Default Configuration Option The Microchip device can be configured via its internal default configuration. Please see Section 7.2.2, "EEPROM Data Descriptor" for specific details on how to enable default configuration. Please refer to Table 7-1 for the internal default values that are loaded when this option is selected. 7.3.1 EXTERNAL HARDWARE NRESET A valid hardware reset is defined as assertion of nRESET for a minimum of 1 s after all power supplies are within operating range. While reset is asserted, the device (and its associated external circuitry) consumes less than 500 A of current. Assertion of nRESET (external pin) causes the following: 1. 2. 3. 4. 5. 6. 7. The PHY is disabled and the differential pair will be in a high-impedance state. All transactions immediately terminate; no states are saved. All internal registers return to the default state. The external crystal oscillator is halted. The PLL is halted. The processor is reset. All media interfaces are reset. 7.3.1.1 nRESET for EEPROM Configuration FIGURE 7-1: NRESET TIMING FOR EEPROM MODE Hardware reset asserted Device Recovery/ Stabilization 8051 Sets Configuration Registers Attach USB Upstream USB Reset recovery Start completion request response Idle t4 t1 t2 t6 t5 t3 t7 nRESET VSS TABLE 7-2: NRESET TIMING FOR EEPROM MODE Name t1 Description nRESET asserted t2 Device recovery/stabilization t3 8051 programs device configuration t4 USB attach t5 Host acknowledges attach and signals USB reset t6 USB idle t7 Ready to handle requests (with or without data) Note: MIN TYP MAX Units sec 1 20 500 sec 50 msec 100 100 msec msec Undefined msec 5 msec All power supplies must have reached the operating levels mandated in Section 9.0, "DC Parameters", prior to (or coincident with) the assertion of nRESET. DS00002005A-page 30 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 7.3.2 USB BUS RESET In response to the upstream port signaling a reset to the device, the device does the following: 1. 2. 3. 4. 5. Sets default address to `0'. Sets configuration to: Unconfigured. All transactions are stopped. Processor reinitializes and restarts. All media interfaces are disabled. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 31 USB2250/50i/51/51i 8.0 AC SPECIFICATIONS 8.1 Oscillator/Crystal Parallel Resonant, Fundamental Mode, 24 MHz 350 ppm. FIGURE 8-1: TYPICAL CRYSTAL CIRCUIT XTAL1 (CS1 = CB1 + CXTAL1 ) C1 C0 Crystal 1M CL C2 TABLE 8-1: Symbol XTAL2 (CS2 = CB2 + CXTAL2 ) CRYSTAL CIRCUIT LEGEND Description In Accordance With C0 Crystal shunt capacitance CL Crystal load capacitance CB Total board or trace capacitance OEM board design CS Stray capacitance Microchip IC and OEM board design CXTAL XTAL pin input capacitance Microchip IC C1 Load capacitors installed on OEM board Calculated values based on Figure 8-2, "Capacitance Formulas" (See Note 8-2) C2 FIGURE 8-2: Crystal manufacturer's specification (See Note 8-1) CAPACITANCE FORMULAS C1 = 2 x (CL - C0) - CS1 C2 = 2 x (CL - C0) - CS2 Note 8-1 C0 is usually included (subtracted by the crystal manufacturer) in the specification for CL and should be set to `0' for use in the calculation of the capacitance formulas in Figure 8-2, "Capacitance Formulas". However, the OEM PCB itself may present a parasitic capacitance between XTAL1 and XTAL2. For an accurate calculation of C1 and C2, take the parasitic capacitance between traces XTAL1 and XTAL2 into account. Note 8-2 Each of these capacitance values is typically approximately 18 pF. 2009 - 2015 Microchip Technology Inc. DS00002005A-page 32 USB2250/50i/51/51i 8.2 Ceramic Resonator 24 MHz 350 ppm FIGURE 8-3: CERAMIC RESONATOR USAGE WITH MICROCHIP IC XTAL1 24 MHz Ceramic Resonator 1M XTAL2 8.3 External Clock 50% Duty cycle 10%, 24/48 MHz 350 ppm, Jitter < 100 ps rms. The external clock is recommended to conform to the signaling level designated in the JESD76-2 specification on 1.8 V CMOS Logic. XTAL2 should be treated as a no connect. DS00002005A-page 33 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 9.0 DC PARAMETERS 9.1 Maximum Ratings Parameter Symbol Storage Temperature MIN -55 TA MAX Units 150 C Lead Temperature C 3.3 V supply voltage VDD33 Comments -0.5 4.0 V Voltage on USB+ and USBpins -0.5 (3.3 V supply voltage + 2) 6 V Voltage on CRD_PWR0, CRD_PWR1, CRD_PWR2 and CRD_PWR3 -0.5 VDD33 + 0.3 V Voltage on any signal pin -0.5 VDD33 + 0.3 V Voltage on XTAL1 -0.5 3.6 V Voltage on XTAL2 -0.5 VDD18 + 0.3 V Please refer to JEDEC specification J-STD-020D. When internal power FET operation of these pins are enabled, these pins may be simultaneously shorted to ground or any voltage up to 3.63 V indefinitely, without damage to the device as long as VDD33 is less than 3.63 V and TA is less than 70oC. Note 9-1 Stresses above the specified parameters may cause permanent damage to the device. This is a stress rating only and functional operation of the device at any condition above those indicated in the operation sections of this specification is not implied. Note 9-2 When powering this device from laboratory or system power supplies, it is important that the absolute maximum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. When this possibility exists, it is suggested that a clamp circuit be used. FIGURE 9-1: SUPPLY RISE TIME MODEL Voltage tRT VDD33 3.3 V 100% 90% VSS 10% t10% 2009 - 2015 Microchip Technology Inc. t90% Time DS00002005A-page 34 USB2250/50i/51/51i Note 9-3 9.2 When powering the device, the maximum power supply ramp time should be set at a rate faster than 400 s. This speed is important to ensure that the device resets properly. Measure rise time at 10% and 90%. Operating Conditions Parameter Symbol MIN MAX Units Operating Temperature Commercial Part Comments Ambient temperature in still air. TA 0 Industrial Part TA -40 85 C 3.3 V supply voltage VDD33 3.0 3.6 V (Note 9-4) 3.3 V supply rise time tRT 0 400 s (See Figure 9-1 and Note 9-3) -0.3 5.5 V If any 3.3 V supply voltage drops below 3.0 V, then the MAX becomes: Voltage on USB+ and USB- pins 70 C (3.3 V supply voltage) + 0.5 5.5 Voltage on any signal pin -0.3 VDD33 V Voltage on XTAL1 -0.3 VDD33 V Voltage on XTAL2 -0.3 VDD18 V Note 9-4 A 3.3 V regulator with an output tolerance of 1% must be used if the output of the internal power FET's must support a 5% tolerance. 9.3 DC Electrical Characteristics Parameter Symbol MIN TYP MAX Units 0.8 V Comments I, IPU, IPD Type Input Buffer Low Input Level VILI High Input Level VIHI Pull Down PD 72 A Pull Up PU 58 A 2.0 TTL Levels V IS Type Input Buffer Low Input Level VILI High Input Level VIHI Hysteresis 0.8 2.0 VHYSI V TTL Levels V 420 mV ICLK Input Buffer Low Input Level VILCK High Input Level VIHCK 1.4 IIL -10 Input Leakage DS00002005A-page 35 0.5 V V +10 A VIN = 0 to VDD33 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i Parameter Symbol MIN Low Input Leakage IIL High Input Leakage IIH TYP MAX Units Comments -10 +10 A VIN = 0 -10 +10 A VIN = VDD33 0.4 V IOL = 12 mA @ VDD33= 3.3 V V IOH = -12 mA @ VDD33= 3.3 V +10 A VIN = 0 to VDD33 (Note 9-5) 0.4 V IOL = 12 mA @ VDD33= 3.3 V V IOH = -12 mA @ VDD33= 3.3 V A VIN = 0 to VDD33 (Note 9-5) Input Leakage (All I and IS buffers) O12 Type Buffer Low Output Level VOL High Output Level VOH VDD33 - 0.4 Output Leakage IOL -10 I/O12, I/O12PU & I/O12PD Type Buffer Low Output Level VOL High Output Level VOH VDD33 - 0.4 Output Leakage IOL -10 Pull Down PD 72 A Pull Up PU 58 A +10 IO-U (Note 9-6) I-R (Note 9-7) I/O200 Integrated Power FET for CRD_PWR0, CRD_PWR1, CRD_PWR2 and CRD_PWR3 High Output Current Mode IOUT 200 mA VdropFET = 0.46 V Low Output Current Mode (Note 9-8) IOUT 100 mA VdropFET = 0.23 V On Resistance (Note 9-8) RDSON Output Voltage Rise Time tDSON Supply Current Unconfigured ICCINIT 2009 - 2015 Microchip Technology Inc. IFET = 70 mA 800 s CLOAD = 10 F 90 mA 2.1 80 DS00002005A-page 36 USB2250/50i/51/51i Parameter Symbol MIN TYP MAX Units ICC 110 140 mA ICC 135 165 mA Supply Current Suspend ICSBY 350 750 A Industrial Temperature Suspend ICSBYI 350 950 A Comments Supply Current Active Full Speed High Speed VDD33 = 3.3 V VDD33, V = 3.3 V Note 9-5 Output leakage is measured with the current pins in high impedance. Note 9-6 See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics Note 9-7 RBIAS is a 3.3 V tolerant analog pin. Note 9-8 Output current range is controlled by program software, software disables FET during short circuit condition. 9.4 Capacitance TA = 25C; fc = 1 MHz; VDD, VDDP = 1.8 V Limits Parameter Symbol MIN Clock Input Capacitance Input Capacitance Output Capacitance 9.5 TYP Unit Test Condition All pins (except USB pins and pins under test) are tied to AC ground. MAX CXTAL 2 pF CIN 10 pF COUT 20 pF Package Thermal Specification TABLE 9-1: 128-PIN VTQFP PACKAGE THERMAL PARAMETERS Parameter Thermal Resistance Velocity (meters/sec) Symbol Value JA 48 55 0 1 2 Junction-to-Top-of-Package 2 Note 9-9 C/W 45 0 1 Unit 18 JT 18 C/W 18 Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the ambient air. DS00002005A-page 37 2009 - 2015 Microchip Technology Inc. USB2250/50i/51/51i 10.0 PACKAGE OUTLINE 128-PIN VTQFP, 14X14X1.0 MM BODY, 2.0 MM PITCH Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging FIGURE 10-1: 2009 - 2015 Microchip Technology Inc. DS00002005A-page 38 USB2250/50i/51/51i APPENDIX A: TABLE A-1: DATA SHEET REVISION HISTORY REVISION HISTORY REVISION LEVEL & DATE DS00002005A (10-22-15) SECTION/FIGURE/ENTRY CORRECTION Replaces previous SMSC version Rev. 2.0 (09-29-09) 2009 - 2015 Microchip Technology Inc. DS00002005A-page 39 USB2250/50i/51/51i PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device [X] Temperature Range XXX - Package - [X] Examples: 1. Internal Microchip Code 2. Device: USB2250, USB2250i, USB2251, USB2251i Temperature Range: Blank i = 0C to +70C (Commercial) = -40C to+85C (Industrial) Package: NU = 128-pin VTQFN 3. 4. 5. 2009 - 2015 Microchip Technology Inc. USB2250-NU-06 128-pin VTQFN RoHS Compliant age, Commercial Temp, Tray USB2250-NU-05 128-pin VTQFN RoHS Compliant age, Commercial Temp, Tray USB2251-NU-06 128-pin VTQFN RoHS Compliant age, Commercial Temp, Tray USB2251-NU-05 128-pin VTQFN RoHS Compliant age, Commercial Temp, Tray USB2250i-NU-06 128-pin VTQFN RoHS Compliant age, Industrial Temp, Tray pack- pack- pack- pack- pack- DS00002005A-page 40 USB2250/50i/51/51i THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under "Support", click on "Customer Change Notification" and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support 2009 - 2015 Microchip Technology Inc. DS00002005A-page 41 USB2250/50i/51/51i Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2009 - 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781632777751 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2009 - 2015 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00002005A-page 42 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 07/14/15 2009 - 2015 Microchip Technology Inc. DS00002005A-page 43