AQ-H
4
8. The following shows the packaging format
mm inch
1) Tape and reel
Type Tape dimensions Dimensions of paper tape reel
8-pin SMD type
(1) When picked from 1/2/3/4-pin side: Part No. AQH❍❍❍❍AX (Shown above)
(2) When picked from 5/6/8-pin side: Part No. AQH❍❍❍❍AZ
1.5 dia.
.059 dia.
+0.1
–0+.004
–0
0.3±0.05
.012±.002
Tractor feed holes
Device mounted
on tape
Direction of picking
1.55±0.1 dia.
.061±.004 dia.
4.5±0.3
.177±.012
2±0.1
.079±.004
10.1±0.1
.400±.004
4±0.1
.157±.004 1.75±0.1
.069±.004
10.2±0.1
.402±.004
12±0.1
.472±.004
7.5±0.1
.295±.004
16±0.3
.630±.012
21±0.8
.827±.031
80±1 dia.
3.150±.039 dia.
13±0.5 dia.
.512±.020 dia. 17.5±2.0
.689±.079 2±0.5
.079±.020
2±0.5
.079±.020
80±1 dia.
3.150±.039 dia.
300±2 dia.
11.811±.079 dia.
CAUTIONS FOR USE
1. For cautions regarding use, please
refer to ’03-’04 Solid State Relays
catalog.
2. The internal IC could be damaged if
a short forms between the I/O
terminals while the solid state relay is
powered.
3. Output spike voltages
1) The figure below shows an ordinary
circuit. Please add a snubber circuit or
varistor, as noise/surge on the load side
could damage the unit or cause
malfunctions.
Note) Connection of an external resister, etc.,
to terminal No. 5 (gate) is not necessary.
2) Even if spik e v oltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance . Keep wires as short
as possible to minimize inductance.
4. Ripple in the input power supply
1) For LED operate current at E
min
,
maintain min. 10 mA
2) Keep the LED operate current at 50 mA
or less at E
max
.
5. When soldering terminals, keep
soldering time to within 10s at 260
°
C
500
°
F
6. Cleaning
The solid state relay forms an optical path
by coupling a light-emitting diode (LED)
and photodiode via transparent silicon
resin.
For this reason, avoid ultrasonic cleansing
if at all possible.
W e recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output: No greater than 0.25
W/cm
2
• Cleaning time: No longer than 30
seconds
• Cleanser used: Asahiklin AK-225
• Other: Submerge in solvent in order to
prevent the PCB and elements from being
contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
7. Soldering
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260
°
C 500
°
F.
2) When soldering surface-mount
terminals, the following conditions are
recommended.
(1) IR (Infrared reflow) soldering method
(2) Vapor phase soldering method
(3) Double wave soldering method
(4) Soldering iron method
Tip temperature: 280 to 300
°
C 536 to
572
°
F
Wattage: 30 to 60 W
Soldering time: within 5 seconds
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
• The temperature profile indicates the
temperature of the soldered terminal on
the surf ace of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
• The conditions for the infrared reflow
soldering apply when preheating using
the VPS method.
18
4
3
2
5
6
Load
VL(AC)
Emin. Emax.
T1
T2
T3
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
t1t2
T2
T1
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 90 s or less (40 s: SOP type)
T2
T1
t1t2t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less