MMBFJ175LT1/D - ON Semiconductor

Motorola Small–Signal Transistors, FETs and Diodes Device Data

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P–Channel — Depletion

MAXIMUM RATINGS

Rating Symbol Value Unit

Drain–Gate Voltage VDG 25 V

Reverse Gate–Source Voltage VGS(r) –25 V

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Total Device Dissipation FR–5 Board(1)

TA = 25°C

Derate above 25°C

PD225

1.8

mW/°C

Thermal Resistance Junction to Ambient R

JA 556 °C/W

Junction and Storage Temperature TJ, Tstg –55 to +150 °C

DEVICE MARKING

MMBFJ175LT1 = 6W

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Gate–Source Breakdown Voltage

(VDS = 0, ID = 1.0 µA) V(BR)GSS 30 — V

Gate Reverse Current

(VDS = 0 V, VGS = 20 V) IGSS —1.0 nA

Gate–Source Cutof f Voltage

(VDS = 15, ID = 10 nA) VGS(OFF) 3.0 6.0 V

ON CHARACTERISTICS

Zero–Gate–Voltage Drain Current (2)

(VGS = 0, VDS = 15 V) IDSS 7.0 60 mA

Drain Cutoff Current

(VDS = 15 V, VGS = 10 V) ID(off) —1.0 nA

Drain Source On Resistance

(ID = 500

A) rDS(on) —125

Input Capacitance VDS = 0, VGS = 10 V Ciss —11

Reverse T ransfer Capacitance

DS ,GS

f = 1.0 MHz Crss —5.5

1. FR–5 = 1.0 x 0.75 x 0.062 in.

2. Pulse Test: Pulse Width

300

s, Duty Cycle

2.0%.

Thermal Clad is a registered trademark of the Berquist Company.

Preferred devices are Motorola recommended choices for future use and best overall value.

Order this document

by MMBFJ175LT1/D

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SEMICONDUCTOR TECHNICAL DATA

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Motorola Preferred Device

CASE 318–08, STYLE 10

SOT–23 (TO–236AB)

 Motorola, Inc. 1996

1 DRAIN

2 SOURCE

GATE

MMBFJ175LT1

2 Motorola Small–Signal Transistors, FETs and Diodes Device Data

INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOT–23

inches

0.037

0.95

0.037

0.95

0.079

2.0

0.035

0.9

0.031

0.8

SOT–23 POWER DISSIPATION

The power dissipation of the SOT–23 is a function of the

drain pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipation.

Power dissipation for a surface mount device is determined

by TJ(max), the maximum rated junction temperature of the

die, RθJA, the thermal resistance from the device junction to

ambient, and the operating temperature, TA. Using the

values provided on the data sheet for the SOT–23 package,

PD can be calculated as follows:

PD = TJ(max) – TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature T A of 25°C, one can

calculate the power dissipation of the device which in this

case is 225 milliwatts.

PD = 150°C – 25°C

556°C/W = 225 milliwatts

The 556°C/W for the SOT–23 package assumes the use

of the recommended footprint on a glass epoxy printed circuit

board to achieve a power dissipation of 225 milliwatts. There

are other alternatives to achieving higher power dissipation

from the SOT–23 package. Another alternative would be to

use a ceramic substrate or an aluminum core board such as

Thermal Clad. Using a board material such as Thermal

Clad, an aluminum core board, the power dissipation can be

doubled using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•Always preheat the device.

•The delta temperature between the preheat and

soldering should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference shall be a maximum of 10°C.

•The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the

maximum temperature gradient shall be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied during

cooling.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

MMBFJ175LT1

Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

CASE 318–08

ISSUE AE

SOT–23 (TO–236AB)

DIM

AMIN MAX MIN MAX

MILLIMETERS

0.1102 0.1197 2.80 3.04

INCHES

B0.0472 0.0551 1.20 1.40

C0.0350 0.0440 0.89 1.11

D0.0150 0.0200 0.37 0.50

G0.0701 0.0807 1.78 2.04

H0.0005 0.0040 0.013 0.100

J0.0034 0.0070 0.085 0.177

K0.0180 0.0236 0.45 0.60

L0.0350 0.0401 0.89 1.02

S0.0830 0.0984 2.10 2.50

V0.0177 0.0236 0.45 0.60

STYLE 10:

PIN 1. DRAIN

2. SOURCE

3. GATE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

MMBFJ175LT1

4 Motorola Small–Signal Transistors, FETs and Diodes Device Data

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MMBFJ175LT1/D

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