Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
1
MP
KB
2SA/SB
100U12
0 120
0V
FRD Module
A
bsolute Maximum Ra
tings
@Tc = 25
o
C (Per Le
g)
Characterist
ics
Conditions
Symbol
Rating
Unit
Repetitive Peak
Reverse Voltag
e
V
RRM
1200
V
Reverse DC Vol
tage
V
R(DC)
960
V
Average Forw
ard
Current
T
C
=25
o
C
Resistive Load
I
F(AV)
200
A
T
C
=
10
0
o
C
100
A
Surge(non-r
epetitive) Forw
ard
Current
One Half Cycle a
t 60Hz,
Peak Value
I
FSM
1400
A
I
2
t for Fusing
Value for One Cy
cle Curren
t,
t
w
= 8.3ms, T
j
= 25
℃
Start
I
2
t
8.
13
* 10
3
A
2
s
Junction
T
e
mperature
T
J
-40 ~ 150
℃
Maximum Pow
er Dissipation
P
D
290
W
Isolation
Voltage
@AC 1 minutes
V
isol
2500
V
Storage Temper
ature
T
stg
-40 ~ 125
℃
Mounting Torqu
e(M6)
-
4.0
N.m
Terminal Torque(M
5)
Typical Including
Screws
-
2.0
N.m
Weight
-
120
g
Product
Name
MPKB2SA100U120
MPKB2SB100U120
Optional
Information
Side Comm
on
& N-type
Side Comm
on
& P-type
MP
KB
2S
A
/SB100U
12
0
120
0V FRD Modu
le
General Description
Ultra-FRD module devices ar
e optimized to r
educe losses
and EMI/RFI in high frequency p
ower conditioning electr
ical
systems.
These diode modules ar
e ideally suited for po
wer converters,
motors drives and othe
r applications wher
e switching losses
are significant portion of th
e total losses.
Features
Rep
etitive Reverse V
oltage : V
RRM
=
120
0V
L
ow Forward V
oltage
: V
F
(typ.)
=
2.2V
Average Forward Current : I
F
(
Av
.)=100A
@T
C
=100
℃
Ult
ra-Fast Reverse Recovery
T
im
e : t
rr
(typ.) =
40
ns
E
xtensive Characterization of Recovery Parameters
Red
uced EMI and RFI
Is
olation T
ype Package
A
pplications
Hig
h Speed & High Power converters, Welders
V
ariou
s Switching and T
elecommunication Power Supply
5DM-1
E
301932
Ordering Information
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
2
MP
KB
2SA/SB
100U12
0 120
0V
FRD Module
Electrical Characteristics
@Tc = 25
o
C
(unle
ss otherwise
specified)
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Cathode Anode
Breakdow
n Voltage
I
R
=100uA
V
R
120
0
-
-
V
Diode Max
imum Forwar
d Voltage
I
F
=100A
T
C
=25
℃
V
FM
-
2.2
2.8
V
T
C
=100
℃
-
2.0
-
Diode Peak Rev
erse Recovery Cu
rrent
T
c
=100
℃
,
V
RRM
applied
T
C
=100
℃
I
RRM
-
-
1.0
mA
Diode Reve
rse Recovery Time
I
F
=1
A,
V
R
=30V
di/dt = -200A/uS
T
C
=
25
℃
t
rr
-
40
60
ns
Diode Reve
rse Recovery Ti
me
I
F
=
100
A,
V
R
=
6
00V
di/dt = -200A/uS
T
C
=25
℃
t
rr
-
110
-
ns
T
C
=100
℃
-
180
-
Thermal Characteristics
Characterist
ics
Conditions
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistan
ce(Isolation Typ
e)
Junction to
Case
R
th(j-c)
-
-
0.
42
℃
/W
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
3
MP
KB
2SA/SB
100U12
0 120
0V
FRD Module
Fig.1 T
ypical Forward V
oltage Drop
vs. Instantaneous Forw
ard Current
Fig.2 T
ypical Reverse R
ecovery Time
V
s.
–
di/dt
Fig.3 T
ransient T
hermal I
mpedance(Zth
jc)
Characteristics
Fig.4 Forward Cur
rent Derating Cu
rve
0
1
2
3
0
50
100
150
200
250
300
Forward Current,I
F
[A]
T
C
=25
℃
T
C
=125
℃
Forward Voltage
Drop,V
F
[V]
0
20
40
60
80
100
120
140
160
0
50
100
150
200
250
DC
Average Forward
Current,I
F(AVG)
[A]
Case Temperatute, Tc[
℃
]
100
200
300
400
500
0
30
60
90
120
150
Reverse R
ecovery Time
[ns]
di/dt[A/us]
1E-5
1E-4
1E-3
0.01
0.1
1
10
1E-4
1E-3
0.01
0.1
1
T
C
=25
℃
Thermal Response Zthjc[
℃
/W]
Rectangular Pulse Duration
Time[sec]
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
4
MP
KB
2SA/SB
100U12
0 120
0V
FRD Module
Package Dimension
5DM-1
Dimensions are in mil
limeters, un
less otherwise s
pecified
T
BD
T
BD
MA
X
23.
5
15.
0±
0
.5
Mar
.
201
3. V
ersion 2.0
MagnaC
hip Semiconducto
r Ltd
.
5
MP
KB
2SA/SB
100U12
0 120
0V
FRD Module
DISCLAIMER:
The
Products
are
not
designed
for
use
in
hostile
environments,
including,
without
l
imitation,
aircraft,
nuclear
power
generation,
medical
appliances,
and
devices
or
systems
i
n
which
m
alfunction
of
any
Product
can
reasonably
be
expected
to
result
in
a
personal
in
jury.
Seller’s
customers
using
or
selling
Seller’s
products
for
use
in
suc
h
applications do so at their own risk and agree to fully defend and indemnify
Seller.
MagnaC
hip reserves
the
right
to change
the
specifications and circuitry
without notice
at
any t
ime. MagnaChip does
not
consider responsibility
for
use
of
any
c
ircuitry
other
t
han
circuitry
entirely
included
in
a
MagnaChip
product.
is
a
registered
trademark
o
f
Magn
aChip
Semiconductor
Ltd.
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