1
Product Family Data Sheet Rev. 2.5 2018. 10.1
High Voltage LED Series
Chip on Board
LC019D – Gen.1
High efficacy COB LED package
well-suited for use in spotlight applications
Featur
es & Benefits
Chip on Board (COB) solution makes it easy to design in
Simple assembly reduces manufacturing cost
Low thermal resistance
InGaN/GaN MQW LED with long time reliability
Applications
Spotlight / Downlight
LED Retrofit Bulbs
Outdoor Illumination
2
Table of Contents
1.
Characteristics
-----------------------
3
2.
Product Code Information
-----------------------
5
3.
Typical Characteristics Graphs
-----------------------
9
4.
Outline Drawing & Dimension
-----------------------
12
5.
Reliability Test Items & Conditions
-----------------------
13
6.
Label Structure
-----------------------
14
7.
Packing Structure
-----------------------
15
8.
Precautions in Handling & Use
-----------------------
17
3
1. Characteristics
a) Absolute Maximum Rating
Item
Symbol
Rating
Condition
Ambient / Operating Temperature
Ta
-40 ~ +105
-
Storage Temperature
Tstg
-40 ~ +120
-
LED Junction Temperature
TJ
140
-
Case Temperature
Tc
105
Forward Current
IF
1380
-
Power Dissipation
PD
51.8
-
ESD (HBM)
-
±2
-
ESD (MM)
-
±0.5
-
b) Electro-optical Characteristics (IF = 540 mA, TJ = 85 ºC)
Item
Unit
Rank
Min.
Typ.
Max.
Forward Voltage (VF)
V
YZ
31.8
34.6
37.5
Color Rendering Index (Ra)
-
5
80
-
-
7
90
Thermal Resistance (junction to chip point)
ºC/W
-
1.0
-
Beam Angle
º
-
115
-
Nominal Power
W
20.3
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (TJ = TC = Ta = 85 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Refer to the derating curve, ‘3. Typical Characteristics Graph’ designed within the range.
4
c) Luminous Flux Characteristics (IF = 540 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
80
2700
J3
2335
2458
-
D1
2458
2581
-
3000
J4
2462
2592
-
D1
2592
2722
-
3500
J5
2538
2672
-
D1
2672
2805
-
4000
J5
2590
2726
-
D1
2726
2863
-
5000
J6
2618
2756
-
D1
2756
2894
-
5700
J6
2618
2756
-
D1
2756
2894
-
6500
J5
2590
2726
-
D1
2726
2863
-
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux @ TJ = 85 °C (lm)
Min.
Typ.
Max.
90
2700
H9
1999
2104
-
D1
2104
2210
-
3000
J0
2096
2207
-
D1
2207
2317
-
3500
J1
2173
2287
-
D1
2287
2402
-
4000
J2
2220
2337
-
D1
2337
2454
-
5000
J2
2222
2339
D1
2339
2456
Notes:
1) The COB is tested in pulsed operating condition at rated test current (10 ms pulse width) and rated temperature
(TJ = TC = 85 °C).
2) Samsung maintains measurement tolerance of: Luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
S
P
H
W
H
A
H
D
N
F
2
5
Y
Z
W
3
J
3
Digit
PKG Information
Code
Specification
1 2 3
Samsung Package High Power
SPH
4 5
Color
WH
White
6
Product Version
A
7 8
Form Factor
HD
COB
9
Lens Type
N
No lens
10
Wattage or Model
F
LC019D
11
Internal Code
2
12
CRI & Sorting Temperature
5
Min. 80 (85℃)
7
Min. 90 (85℃)
13 14
Forward Voltage (V)
YZ
31.8~37.5
15
CCT (K)
W
2700K
V
3000K
U
3500K
T
4000K
R
5000K
Q
5700K
P
6500K
16
MacAdam Step
2
MacAdam 2-step
3
MacAdam 3-step
17 18
Luminous Flux
H9
Min. 1900
J0
Min. 2000
J1
Min. 2100
J2
Min. 2200
J3
Min.2300
J4
Min. 2400
J5
Min. 2500
J6
Min. 2600
6
a) Binning Structure (IF = 540 mA, TJ = 85 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
80
2700
SPHWHAHDNF25YZW2J3
YZ
W2
J3
2335 ~
SPHWHAHDNF25YZW3J3
W3
SPHWHAHDNF25YZW2D1
W2
D1
2458 ~
SPHWHAHDNF25YZW3D1
W3
3000
SPHWHAHDNF25YZV24
YZ
V2
J4
2462 ~
SPHWHAHDNF25YZV3J4
V3
SPHWHAHDNF25YZV2D1
V2
D1
2592 ~
SPHWHAHDNF25YZV3D1
V3
3500
SPHWHAHDNF25YZU25
YZ
U2
J5
2538 ~
SPHWHAHDNF25YZU3J5
U3
SPHWHAHDNF25YZU2D1
U2
D1
2672 ~
SPHWHAHDNF25YZU3D1
U3
4000
SPHWHAHDNF25YZT25
YZ
T2
J5
2590 ~
SPHWHAHDNF25YZT3J5
T3
SPHWHAHDNF25YZT2D1
T2
D1
2726 ~
SPHWHAHDNF25YZT3D1
T3
5000
SPHWHAHDNF25YZR3J6
YZ
R3
J6
2618 ~
SPHWHAHDNF25YZR3D1
D1
2756 ~
5700
SPHWHAHDNF25YZQ3J6
YZ
Q3
J6
2618 ~
SPHWHAHDNF25YZQ3D1
D1
2756 ~
6500
SPHWHAHDNF25YZP3J5
YZ
P3
J5
2590 ~
SPHWHAHDNF25YZP3D1
D1
2726 ~
7
CRI (Ra)
Min.
Nominal
CCT (K)
Product Code
VF
Rank
Color
Rank
Flux
Rank
Flux Range
(Φv, lm)
90
2700
SPHWHAHDNF27YZW2H9
YZ
W2
H9
1999 ~
SPHWHAHDNF27YZW3H9
W2
SPHWHAHDNF27YZW2D1
W2
D1
2104 ~
SPHWHAHDNF27YZW3D1
W2
3000
SPHWHAHDNF27YZV2J0
YZ
V2
J0
2096 ~
SPHWHAHDNF27YZV3J0
V3
SPHWHAHDNF27YZV2D1
V2
D1
2207 ~
SPHWHAHDNF27YZV3D1
V3
3500
SPHWHAHDNF27YZU2J1
YZ
U2
J1
2173 ~
SPHWHAHDNF27YZU3J1
U3
SPHWHAHDNF27YZU2D1
U2
D1
2287 ~
SPHWHAHDNF27YZU3D1
U3
`4000
SPHWHAHDNF27YZT2J2
YZ
T2
J2
2220 ~
SPHWHAHDNF27YZT3J2
T3
SPHWHAHDNF27YZT2D1
T2
D1
2337 ~
SPHWHAHDNF27YZT3D1
T3
5000
SPHWHAHDNG27YZR3J8
YZ
R3
J8
2222 ~
SPHWHAHDNG27YZR3D1
R3
D1
2339 ~
8
b) Chromaticity Region & Coordinates (IF = 540 mA, TJ = 85 ºC)
MacAdam Ellipse (W2, W3)
MacAdam Ellipse (V2, V3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4578
0.4101
53.70
0.0054
0.0028
2-step
0.4338
0.403
53.22
0.0056
0.0027
3-step
0.4578
0.4101
53.70
0.0081
0.0042
3-step
0.4338
0.4030
53.22
0.0083
0.0041
MacAdam Ellipse (U2, U3)
MacAdam Ellipse (T2, T3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
2-step
0.4073
0.3917
54.00
0.0062
0.0028
2-step
0.3818
0.3797
53.72
0.0063
0.0027
3-step
0.4073
0.3917
54.00
0.0093
0.0041
3-step
0.3818
0.3797
53.72
0.0094
0.0040
MacAdam Ellipse (R3)
MacAdam Ellipse (Q3)
Step
CIE x
CIE y
a
b
Step
CIE x
CIE y
a
b
3-step
0.3447
0.3553
59.62
0.0082
0.0035
3-step
0.3287
0.3417
59.0950
0.0075
0.0032
MacAdam Ellipse (P3)
Step
CIE x
CIE y
a
b
3-step
0.3123
0.3282
58.5700
0.0067
0.0029
Note:
Samsung maintains measurement tolerance of: Cx, Cy = ±0.005
CIE x,y
9
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 540 mA, TJ = 85 ºC)
CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI)
CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI)
CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength(nm)
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
10
CCT: 6500 K (80 CRI)
b) Forward Current Characteristics (TJ = 85 ºC)
C) Temperature Characteristics (IF = 540mA)
0
20
40
60
80
100
400 500 600 700 800
Relative Emission Intensity(%)
Wavelength
Relative Intensity vs. Wavelength
0
100
200
300
400
0 0.3 0.6 0.9 1.2
Relative Luminous Flux(%)
Forward Current(A)
Relative luminous Flux vs. Forward Current
30
35
40
45
0 0.3 0.6 0.9 1.2
Forward Voltage(%)
Forward Current(A)
Forward Voltage vs. Forward Current
90
95
100
105
110
115
120
20 35 50 65 80 95 110
Relative Luminous Flux(%)
Tc(℃)
Relative Luminous Flux vs. Temperature
34.0
34.5
35.0
35.5
36.0
20 40 60 80 100
Forward Voltage(V)
Tc(℃)
Forward Voltage vs. Temperature
11
d) Color Shift Characteristics (TJ = 85 ºC, IF = 540mA, CRI80+)
e) Beam Angle Characteristics (IF = 540 mA, TJ = 85 ºC)
f) Derating Characteristics
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.00 0.35 0.70 1.05 1.40
△CIE x,△ CIE y
Forward Current(A)
△CIE x,△CIE y vs. Forward Current
△CIE x
△ CIE y
-0.05
-0.04
-0.03
-0.02
-0.01
0
20 40 60 80 100
△CIE x,△ CIE y
Tc(℃)
△CIEx,△CIEy vs. Temperature
ΔCIE x
ΔCIE y
0
0.2
0.4
0.6
0.8
1
1.2
-100 -80 -60 -40 -20 0 20 40 60 80 100
Relative Luminous Intensity
Angle(°)
0
500
1000
1500
020 40 60 80 100 120
If [ mA ]
Tc [ ℃ ]
Derating Curve
12
4. Outline Drawing & Dimension
Item
Dimension
Tolerance
Unit
Length
19.0
±0.15
mm
Width
19.0
±0.15
mm
Height
1.50
±0.30
mm
Light Emitting Surface (LES) Diameter
14.5
±0.30
mm
Note: Denoted product information above is only an example
( LC019D18030 : LC019D, CRI80+, 3000K )
1. Unit: mm
2. Tolerance: ± 0.3 mm
TC
LC026D29530
Model
Description
XXX.....XXXX
LOT No.
SAMSUNG
Internal Code
13
5. Reliability Test Items & Conditions
a) Test Items
Test Item
Test Condition
Test Hour / Cycle
High Temperature
Humidity Life Test
60 ºC, 90 % RH,, DC Derating, IF
1000 h
High Temperature
Life Test
85 ºC, DC Derating, IF
1000 h
Low Temperature
Life Test
-40 ºC, DC , IF = 970 mA
1000 h
Pulsed Operating Life Test
55 ℃, Pulse width 100 ㎲, duty cycle 3 %
1000 h
High Temperature
Storage
120 ºC
1000 h
Low Temperature
Storage
-40 ºC
1000 h
Temperature Humidity
Storage
60 ºC, 90% RH
1000h
Temperature Cycle
On/Off Test
-40 ºC / 85 ºC each 20 min, 30 min transfer
power on/off each 5 min, DC Derating, IF = max
100 cycles
ESD (HBM)
R1: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R1: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.2 kV
5 times
Vibration Test
20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer
4 times
Mechanical Shock Test
1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides)
5 times
Sulfur Resistance
25 °C, 75%, H2S 15 ppm
504h
b) Criteria for Judging the Damage
Item
Symbol
Test Condition
(Tc = 25 ºC)
Limit
Min.
Max.
Forward Voltage
VF
IF = 540 mA
L.S.L. * 0.9
U.S.L. * 1.1
Luminous Flux
Φv
IF = 540 mA
L.S.L * 0.7
U.S.L * 1.3
14
YZW3J3
SPHWHAHDNF25YZW3J3 YZW3J3 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
G4AZC4001 / 1001 / xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
Bin Code
Lot Number
Product Code
YZW3J3
SPHWHAHDNF25YZW3J3 YZW3J3 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
①②③④⑤⑥⑦⑧⑨
/1ⓐⓑⓒ/ xxxx pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
6. Label Structure
a) Label Structure
Note: Denoted bin code and product code above is only an example (see description on page 5)
Bin Code:
ⓐⓑ: Forward Voltage bin (refer to page 11)
ⓒⓓ: Chromaticity bin (refer to page 9-10)
ⓔⓕ: Luminous Flux bin (refer to page 6)
b) Lot Number
The lot number is composed of the following characters:
① ③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / xxxx pcs
①
: Production site (S: Giheung, Korea, G: Tianjin, China)
②
: 4 (LED)
③
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
④
: Year (Z: 2015, A: 2016, B: 2017…)
⑤
: Month (1~9, A, B, C)
⑥⑦⑧⑨
: Day (1~9, A, B~V)
ⓐⓑⓒ
: Product serial number (001 ~ 999)
ⓐⓑⓒⓓⓔⓕ
LC019D RA80 2700K
LC019D RA80 2700K
15
6. Packing Structure
Packing material
Max. quantity
in pcs of COB
Dimension(mm)
Length
Width
Height
Tolerance
Tray
20
160
180
10
1.0
Aluminum Bag
40(2 trays)
210
241
10
Inner Box
160
230
84
260
2
Outer Box
1600
476
445
272
5
a) Packing Structure
Label
Label
16
b) Tray
① Cover ② Body
c) Aluminum Vinyl Packing Bag
17
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) The thermal management is one of the most critical factors for the LED lighting system. Especially the LED junction
temperature should not exceed the absolute maximum rating while operation of LED lighting system.
For more information, please refer to Application Note ‘Mechanical & Thermal Guide for COB’.
9) In case of driving LEDs around the minimum current level (If_min), chips might exhibit different brightness due to the
variation in I-V characteristics of each one. This is normal and does not adversely affect the performance of product.
10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
11) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. inspires the world and shapes the future
with transformative ideas and technologies, redefining the worlds of TVs,
smartphones, wearable devices, tablets, cameras, digital appliances,
printers, medical equipment, network systems and semiconductors.
We are also leading in the Internet of Things space through, among others,
our Digital Health and Smart Home initiatives. We employ 307,000 people
across 84 countries. To discover more, please visit our official website at
www.samsung.com and our official blog at global.samsungtomorrow.com.
Copyright © 2015 Samsung Electronics Co., Ltd. All rights reserved.
Samsung is a registered trademark of Samsung Electronics Co., Ltd.
Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
product, service names and logos are trademarks and/or registered trademarks
of their respective owners and are hereby recognized and acknowledged.
Samsung Electronics Co., Ltd.
95, Samsung 2-ro
Giheung-gu
Yongin-si, Gyeonggi-do, 446-711
KOREA
www.samsungled.com