SFH 4787S
1Version 1.0 | 2018-10-29
Produktdatenblatt | Version 1.1
www.osram-os.com
Applications
SFH 4787S
OSLUX®
IR OSLUX (810nm) - 36° / 8° tilted
—Access Control (IRIS/Vein Scan, Face Recog-
nition)
Features:
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—IR lightsource with high eciency
—Double stack emitter
—Low thermal resistance (Max. 25 K/W)
—Centroid wavelength 810 nm
—Small package (LxWxH): 3.5mm x 3.5mm x 1.6mm
—Narrow half angle (±18°) / 8° tilted
Ordering Information
Type Radiant intensity 1) Radiant intensity 1) Ordering Code
typ.
IF = 1 A; tp = 10 ms IF = 1 A; tp = 10 ms
IeIe
SFH 4787S 815 ... 1500 mW/sr 1,000 mW/sr Q65112A2090
The optical axis is tilted by 8°
SFH 4787S
2Version 1.0 | 2018-10-29
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating temperature Top min.
max.
-40 °C
85 °C
Storage temperature Tstg min.
max.
-40 °C
85 °C
Junction temperature Tjmax. 145 °C
Forward current IFmax. 500 mA
Surge current
tp ≤ 200 µs; D = 0
IFSM max. 2 A
Reverse voltage VRmax. 1 V
Power consumption Ptot max. 1.8 W
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD max. 2 kV
For the forward current and power consumption please see “maximum
permissible forward current” diagram
SFH 4787S
3Version 1.0 | 2018-10-29
Characteristics
IF = 1000 mA; tp = 10 ms; TA = 25 °C
Parameter Symbol Values
Peak wavelength λpeak typ. 820 nm
Centroid wavelength λcentroid typ. 810 nm
Spectral bandwidth at 50% Irel,max ∆λ typ. 30 nm
Half angle φ typ. 18 °
Dimensions of active chip area L x W typ. 0.75 x 0.75
mm x mm
Rise time (10% / 90%)
IF = 1 A; RL = 50 Ω
trtyp. 8 ns
Fall time (10% / 90%)
IF = 1 A; RL = 50 Ω
tftyp. 14 ns
Forward voltage
IF = 0.5 A; tp = 100 µs
VFtyp.
max.
3.3 V
3.6 V
Forward voltage
IF = 1 A; tp = 100 µs
VFtyp.
max.
3.55 V
4 V
Reverse current 2) IRNot designed
for reverse
operation
Total radiant ux 3) Φetyp. 650 mW
Total radiant ux 3)
IF = 1 A; tp = 100 µs
Φetyp. 720 mW
Temperature coecient of voltage TCVtyp. -2 mV / K
Temperature coecient of brightness TCItyp. -0.3 % / K
Temperature coecient of wavelength TCλtyp. 0.3 nm / K
Thermal resistance junction solder point real 4) RthJS max. 25 K / W
SFH 4787S
5Version 1.0 | 2018-10-29
Forward current 5), 6)
IF = f (VF); single pulse; tp = 100 µs
OHF05652
F
I
V
A
2.5
F
V
5
5
0
10
1
10
10-1
10-2
3 3.5 4 4.5
Relative Radiant Intensity 5), 6)
Ie/Ie(1A) = f (IF); single pulse; tp = 100 µs
OHF05651
I
F
A10 510510 10 1
e(1 A)
I
e
I
-1 0
-2
10
5
10-1
5
100
101
-2
Max. Permissible Forward Current
IF,max = f (TS); RthJS = 25 K / W
0
50
0
100
200
150
250
350
300
400
550
I
F
450
mA
˚C
T
S
OHF05649
20 40 60 80 100
Permissible Pulse Handling Capability
IF = f (tp); duty cycle D = parameter; TS = 85°C
210-1-2-3-4-5 1010 1010 10
t
p
10 10s10
0
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF05648
1
0.5
0.01
0.05
0.1
0.2
0.02
0.005
D
=
0.5
1.0
1.5
2.0
2.5
SFH 4787S
8Version 1.0 | 2018-10-29
Prole Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
2 3 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the specied peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
3 6 K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulllment for the whole T-range
Taping 7)
SFH 4787S
9Version 1.0 | 2018-10-29
Tape and Reel 8)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2500
SFH 4787S
10 Version 1.0 | 2018-10-29
Barcode-Product-Label (BPL)
Dry Packing Process and Materials 7)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
SFH 4787S
11 Version 1.0 | 2018-10-29
Transportation Packing and Materials 7)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
349 ± 5 mm 349 ± 5 mm 33 ± 5 mm
SFH 4787S
12 Version 1.0 | 2018-10-29
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specied in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding eect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal lled materials including silver.
Metal lled materials can be aected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
SFH 4787S
13 Version 1.0 | 2018-10-29
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please nd the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales oce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-specic request between OSRAM OS and Buyer and/or Customer.
SFH 4787S
14 Version 1.0 | 2018-10-29
Glossary
1) Radiant intensity: Measured at a solid angle of Ω = 0.001 sr
2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause mi-
gration and damage of the device.
3) Total radiant ux: Measured with integrating sphere.
4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reect statistical gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
6) Testing temperature: TA = 25°C
7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specied with ±0.1 and
dimensions are specied in mm.
8) Tape and Reel: All dimensions and tolerances are specied acc. IEC 60286-3 and specied in mm.
SFH 4787S
15 Version 1.0 | 2018-10-29
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
